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3 4 5 6 7 8 9 2 Tooth Pretreatment 1 Post Cementation and Core Build-up * 5 Refer to the Table 3 for light-curing time. * 6 Leave PASTE more than 6 minutes after light curing when the thickness of PASTE is greater than the specified curing depth. * 4 Refer to the Table 3 for light-curing time. Flow Chart Sheet When CLEARFIL TM Universal Bond Quick and CLEARFIL TM DC CORE PLUS are used for bonding and post cementation * 3 You must start Step within 1 min. 02/2017 DUAL-CURED CORE BUILD-UP MATERIAL CLEARFIL TM DC CORE PLUS CLEARFIL TM Universal Bond Quick Legal product name Abbreviated product name Halogen 10 seconds 20 seconds 1.5 mm 2 mm 10 seconds 20 seconds 1.5 mm 2 mm Type Curing time Curing depth LED PASTE BOND Table 3 : Relationship between curing time and curing depth for each dental curing unit Table 1 : Legal product name and abbreviated product name used in this sheet 1621 Sakazu, Kurashiki, Okayama 710-0801, Japan Indications 003 1561R360R Follow the standard procedures for moisture control, preparing root canal and try-in of the post. b.Selective-etching c.Total-etching Dry by blowing mild air, and paper point until BOND does not move* 1 [1] For Glass Fiber Post Apply a phosphoric acid, rinse and dry 5sec. Post Pretreatment Choose either etching procedure [1] For Metal Post Blast with alumina powder,then ultrasonic clean and dry a.Self-etching ( Move to Step ) 10sec. 10sec. Apply BOND with a rubbing motion Light-cure* 2 Squeeze PASTE* 3 Insert the post and light-cure PASTE* 4 Place PASTE around the post Light-cure PASTE* 5, * 6 from both the lingual and the labial (buccal) sides Apply a phosphoric acid to the uncut and/ or cut enamel, then rinse and dry Apply a phosphoric acid to the entire cavity (enamel and dentin),then rinse and dry * 1 Use a vacuum aspirator to prevent BOND from scattering. No waiting time 5sec.[ 2] Apply BOND, then dry by blowing mild air 5sec. Dry The effective wavelength range of each dental curing unit must be 400-515nm. * Peak of emission spectrum:450-480nm Table 2: Dental curing unit and curing time Halogen LED Light source Type Halogen lamp More than 400 mW/cm 2 10 seconds 10 seconds 5 seconds 800-1400 mW/cm 2 More than 1500 mW/cm 2 Blue LED* Light Intensity Light-curing time * 2 Refer to the Table 2 for light-curing time. 3 7
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Follow the standard procedures for moisture …...Follow the standard procedures for moisture control, preparing root canal and try-in of the post. b.Selective-etching c.Total-etching

Jun 26, 2020

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Page 1: Follow the standard procedures for moisture …...Follow the standard procedures for moisture control, preparing root canal and try-in of the post. b.Selective-etching c.Total-etching

3 4 5

6 7 8 9

2 Tooth Pretreatment1

Post Cementation and Core Build-up

*5 Refer to the Table 3 for light-curing time. *6 Leave PASTE more than 6 minutes

after light curing when the thickness of PASTE is greater than the specified curing depth.

*4 Refer to the Table 3 for light-curing time.

Flow Chart Sheet

When CLEARFILTM Universal Bond Quick and CLEARFILTM DC CORE PLUS are used for bonding and post cementation

*3 You must start Step within 1 min.

02/2017

DUAL-CURED CORE BUILD-UP MATERIAL

CLEARFILTM

DC CORE PLUS

CLEARFILTM

Universal Bond Quick

Legal product name Abbreviatedproduct name

Halogen10 seconds

20 seconds

1.5 mm

2 mm

10 seconds

20 seconds

1.5 mm

2 mm

Type Curing time Curing depth

LED

PASTE

BOND

Table 3 : Relationship between curing time and curing depth for each dental curing unit

Table 1 : Legal product name and abbreviated product name used in this sheet

1621 Sakazu, Kurashiki, Okayama 710-0801, Japan

Indications003 1561R360R

Follow the standard procedures for moisture control, preparing root canal and try-in of the post.

b.Selective-etching

c.Total-etching

Dry by blowing mild air, and paper point until BOND does not move*1

[1]

For Glass Fiber Post

Apply a phosphoric acid, rinse and dry

5sec.

Post PretreatmentChoose either etching procedure

[1]

For Metal Post

Blast with alumina powder, then ultrasonic clean and dry

a.Self-etching ( Move to Step )

10sec.

10sec.

Apply BOND with a rubbing motion Light-cure*2

Squeeze PASTE*3 Insert the post and light-cure PASTE*4

Place PASTE around the post

Light-cure PASTE*5,*6

from both the lingual and the labial (buccal) sides

Apply a phosphoric acid to the uncut and/or cut enamel, then rinse and dry

Apply a phosphoric acid to the entire cavity (enamel and dentin),then rinse and dry

*1 Use a vacuum aspirator to prevent BOND from scattering.

No waiting time5sec.+

[2 ] Apply BOND , then dry by blowing mild air

5sec.Dry

The effective wavelength range of each dental curing unit must be 400-515nm.

* Peak of emission spectrum:450-480nm

Table 2: Dental curing unit and curing time

Halogen

LED

Lightsource

Type

Halogenlamp

More than400 mW/cm2 10 seconds

10 seconds

5 seconds

800-1400 mW/cm2

More than1500 mW/cm2

BlueLED*

Light Intensity Light-curingtime

*2 Refer to the Table 2 for light-curing time.

3

7