FinFET Thermal and Reliability Signoff - SimuTech Group€¦ · Design For Reliability is a MUST have in FinFET era Advanced FinFET Technology Reliability Challenges Problem Chip

1 © 2018 ANSYS, Inc. June 1, 2018 ANSYS Confidential

FinFET Thermal and Reliability Signoff

2 © 2018 ANSYS, Inc. June 1, 2018 ANSYS Confidential

Design For Reliability is a MUST have in FinFET era

Advanced FinFET Technology Reliability Challenges

Problem

Chip FailureImpact

Relia

bilit

y Le

vel

Stand-alone Device

INCONVENIENT

Connected Device

ANNOYING

Always-on

DANGEROUS

Cooperative Systems

On-demand

LETHAL

Collaborative Systems

Autonomous

Evolving Reliability Needs for Semiconductors

Consumer/Mobile Cloud Era Auto/IoT

Source: NEW CONCEPT ON SECURITY AND QUALITY- NXP, ISS Europe, Munich, March 6, 2017New application trends push requirements in system reliability Source: Aging Assessment and Reliability Aware Computing Platforms

- Yao Wang, Msc. Thesis, National university of Defense Technology, China

Wear-out Failures increase due to

• FinFET Aging/Stress(NBTI/PBTI/TDDB)

• Increased interconnect EM/Self-Heat

• Thermal reliability

Reliability challenges in FinFET Nodes

3 © 2018 ANSYS, Inc. June 1, 2018 ANSYS Confidential

ANSYS Reliability Platforms

Solution

Totem

AnalogIP

FoundationIP

InterfaceIP

IcePak/SiWave

✓ HBM CDM checks✓ Adv. dynamic ESD checks

ESD

Metal/via bottlenecks

Current crowding on diode fingers

EMC

✓ CECM modeling✓ Chip-aware EMI analysis

Thermal

✓ Self-heat/CTA analysis✓ Post thermal EM/FIT

Electromigration

✓ Power EM/Signal EM✓ Multistate multimode

RedHawk

IP Chip/Package System Level

4 © 2018 ANSYS, Inc. June 1, 2018 ANSYS Confidential

Integrated Thermal & Statistical EM Analysis

Integrated Power/Signal flow

Dev. ModelExtractionSimulation

Device/WireDelta T Interconnect

EM violations Failure in Time (FIT) Violations

ΔT> 20C

EM hotspot

BEOL Fail Rate

LayoutAM

PPC

VCO

Netlist Currents/Power

Device ΔT

IP Results

➢ Integrated Power/Signal analysis

➢ Multivector analysis and sign-off

➢ Adv. Reliability (post-thermal EM , FIT)

➢ Validated by multiple foundries

Totem-CTA AMS/IP level Reliability Analysis

Ad

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5 © 2018 ANSYS, Inc. June 1, 2018 ANSYS Confidential

PMIC Analyses Using Totem

Features:

✓ Simpler to setup

✓ High capacity

✓ Multithreaded

Tech/GDS map

GDS Pad locations

GDS translation

R-Extraction

RDS-ON Calculation

Device name +Device RON(per micron)

Detailed RDS-on Report

Tote

m/P

ath

Fin

der

Current/Voltage Maps

collateral

Design specific

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Current Density Map (per-layer)

6 © 2018 ANSYS, Inc. June 1, 2018 ANSYS Confidential

Vectored thermal-aware EM analysis Totem

Features:

✓ A comprehensive slew/load/frequency sweep for all timing arcs

✓ Multithreaded with distributed computing support

✓ Support for thermal aware EM sign-off

✓ Enables EM limited Max-cap tables for SOC level PnR environment

Automated Vector-based Logic Library Reliability Flow

Ad

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Includes SPICE simulation

7 © 2018 ANSYS, Inc. June 1, 2018 ANSYS Confidential

Totem GUI-driven flow setup

Usa

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Analysis wizard for designers

Wizard for CAD setup

Early to sign-off analysis flows

✓ Early analysis (P2P, layout only)

✓ Static and dynamic IR

✓ Signal EM

✓ ESD analysis w/ PathFinder

Fully customizable wizard

✓ Customer-specific flows

✓ Re-configure workflows

✓ Add addition pre-post processing

Advanced usage model support

✓ CCI flows

✓ Self-heat analysis

8 © 2018 ANSYS, Inc. June 1, 2018 ANSYS Confidential

Totem LVS Flow Using Calibre CCI Database

• Leverages LVS database for complex device recognition/net tracing

• Does not require a detailed RC netlist for signal EM analysis

• Validated by TSMC for N16, N10, N7

Technology collateralsU

sab

ility

En

ha

nce

men

tsFlow Status

Static Analysis Yes

Dynamic Analysis Yes

Power/Signal EM Yes

CMM Generation(cell, mmx, post-sim) Yes

GUI wizard/Virtuoso Integration Yes

ESD analysis No

Substrate noise analysis No

9 © 2018 ANSYS, Inc. June 1, 2018 ANSYS Confidential

Totem supports AFS simulator for data modeling

✓ Supports FSDB generated by Mentor-AFS for generating current and capacitance models

✓ Supports results from Mentor-AFS simulation w/ SPICE/spectre netlist based setup

✓ Supports device self-heat info generated by Mentor-AFS for Totem-self-heat analysis

Usa

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DSPF Netlist/Calibre-CI

Totem

GDS processing

Extraction

EMIR Transient simulation

Self-heat analysis

Tech Collaterals

Mentor-AFS

SPICE/SpectreModels

Sim Netlist/Test bench

Fsdb w/ device currents

Layout

EMIR Results

TotemAPLMMX**

Electrical Model(device current &

Decap model)

** Totem can invoke Mentor-AFS for decap modelingNote: Totem also supports other industry standard SPICE, spectre and fast SPICE simulators

10 © 2018 ANSYS, Inc. June 1, 2018 ANSYS Confidential

ANSYS RedHawk and ANSYS Totem Foundry Readiness

TSMC Samsung Intel GF ST UMC SMIC

N180 ● ●

N130 ● ● ●

N65/N55 ● ● ● ●

N40 ● ● ● ●

N32/28 ● ● ● ● ●

N22/20 ● ● ● ●

N14 ● ● ● V0.5 ● V0.5 ●

N16FF+ V1.0 ●

N16FFC V1.1 ●

N12 V1.0 ●

N10 V1.0 ● V1.0 ● ●

N7 V1.0 ● V0.5 ● V0.5 ●

N5 V0.1 ●

● Available

> RedHawk and Totem are certified and used by all major foundries> Innovative technology collaboration – 3DIC, InFO, ESD and Thermal> Collaboration across other leading foundries