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Qualification Testing Reverse Engineering
32

Fersht Inc. Electronics/Photonics Packaging

Jun 23, 2015

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Page 1: Fersht Inc. Electronics/Photonics Packaging

Qualification Testing Reverse Engineering

Page 2: Fersht Inc. Electronics/Photonics Packaging

BGA De-Layering

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PCB De-Layering

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BGA Cross Sectioning

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Cross Sectioning -

Ceramic Package

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Cross Sectioning Optical Lens

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Cross Sectioning -

Bond Wires

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Cross Sectioning-

Fiber Optics Connector

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X-Ray&

De-Cap Die

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