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T-top800Ultra-Soft High Thermal Conductive Gap Filler
Applications-• Between CPU and heat sink.• Between a component and heat sink• Flat-panel displays• Power supplies• High speed mass storage drives• Telecommunication hardware
Typical Properties-PROPERTY TESTMETHOD UNIT
Color Purple Visual -
Surface tack 2-side/1-side 2-side weak - -
Thickness 0.5~3.0 ASTM D374 mm
Density 3.3 ASTM D792 g/cm3
Application temperature -60~150 - ℃
COMPRESSION
Deflection @10 psi 3 - %
Deflection @20 psi 15 - %
Deflection @30 psi 33 - %
Deflection @40 psi 47 - %
Deflection @50 psi 60 - %
ELECTRICAL
Dielectric breakdown 10 ASTM D149 KV/mm
Surface resistivity >1011 ASTM D257 Ohm
Volume resistivity >1010 ASTM D257 Ohm-m
THERMAL
Thermal Conductivity 8 ASTM D5470 W/m*K
Thermal impedance@10 psi 0.295 ASTM D5470 ℃-in2/W
Thermal impedance@20 psi 0.251 ASTM D5470 ℃-in2/W
Thermal impedance@30 psi 0.213 ASTM D5470 ℃-in2/W
Thermal impedance@40 psi 0.165 ASTM D5470 ℃-in2/W
Thermal impedance@50 psi 0.134 ASTM D5470 ℃-in2/W
FLAME RATING
UL Flammability class V-0 UL94 -
LiPOLY T-top800 is a high deflection gap pad, with outstanding thermal conductivity and low thermal resistance in form shape. T-top800 offers excellent compression, filling small air gaps on uneven surfaces, ensuring an efficient and consis-tent transfer of heat. T-top800 was designed for thermal modules with limited gap sizes and low compression force.
Features-• Thermal conductivity: 8.0 W/m*K • High compression rate • Low thermal impedance• Silicone compound• UL 94V-0 qualified
Specifications-• Sheet form • Die-cut parts
T-pad900Ultra-Soft High Thermal Conductive Gap Filler
Typical Properties-PROPERTY TEST METHOD UNIT Color Gray Visual -
Applications-• Between CPU and heat sink.• Between a component and heat sink• Flat-panel displays• Power supplies• High speed mass storage drives• Telecommunication hardware
LiPOLY T-pad900 is an ultra soft and highly conformable thermally conductive interface pad. With a thermal conductivity of 9.0 W/m*K and a low thermal resistance under minimal pressure, T-pad900 offers excellent performance at an extremely competitive price. A fiberglass layer in the middle provides excellent cut-throughresistance.
Reliability-
Thermal Impedance & Compression- Test method: ASTM D5470
Applications-• Between CPU and heat sink.• Between a component and heat sink.• Flat-panel displays• Power supplies• High speed mass storage drives• Telecommunication hardware
LiPOLY T-work7000 is a high performance thermally conductive interface pad. T-work7000 offers outstanding thermal conductivity at11.0 W/m*K and extremely low thermal resistance under minimal force. T-work7000 offers excellent compression, filling small air gaps and uneven surfaces, ensuring an efficient and consistent transfer of heat. T-work7000 is designed for the most demanding of applications.
Thermal Impedance & Compression-
Test method: ASTM D5470
Compression
Force(psi)
Thermal Impedance (K-in2/W) Compression (%)
1.0mm T 2.0 mm T 3.0 mm T 1.0mm T 2.0 mm T 3.0 mm T
Applications-• Between CPU and heat sink.• Between a component and heat sink.• Flat-panel displays• Power supplies• High speed mass storage drives• Telecommunication hardware
LiPOLY T-work8000 is a high performance thermally conductive interface pad. T-work8000 offers outstanding thermal conductivity at15.0 W/m*K and extremely low thermal resistance under minimal force. T-work8000 offers excellent compression, filling small air gaps and uneven surfaces, ensuring an efficient and consistent transfer of heat. T-work8000 is designed for the most demanding of applications.
Thermal Impedance & Compression-
Test method: ASTM D5470
Compression
Force(psi)
Thermal Impedance (K-in2/W) Compression (%)
1.0mm T 2.0 mm T 3.0 mm T 1.0mm T 2.0 mm T 3.0 mm T