Facilitating NASA's use of GEIAwSTDmw0005mwIY Performance Standard · 2013-04-10 · GEIA-STD-0005-1 Performance Standard for Aerospace and High Performance Electronic Systems Containing

Facilitating NASA's use ofGEIAwSTDmw0005mwI Y Performance Standard

for Aerospace and High PerformanceElectronic Systems Containing

Lead-free Solder

Jeannette PlanteNASA Workmanship Standards Program

Quality Leadership Forum!March 2010

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https://ntrs.nasa.gov/search.jsp?R=20100023290 2020-06-01T00:39:40+00:00Z

-RoHS Movement in Europe in mid 1990's a.

-solderable surfaces and solder itself must be Pb-free

-Worldwide suppliers offer pure tin as alternative -Researchers and users are reminded of the tin whisker hazard

-Industry searches for new solder formulations SnAg3.0CuO.5 SnAg3.SCuO.7Sbo.25 SnAg3.5CuO.7 SnAg3.aCuo.7Sbo.25 SnAg3.5CuO.9 Sn3.5A9o.74Cuo.21Zn SnAg3.SCu0.7 Sn3.5A9o.S5CuOO.1 Mn SnAg3.9CuO.6 SnCuO.7

-New formulations come with known and unknown risks -Sensitivity to physical shock -Some test methods do not "translate"

SnZng

SnZnsBi3 SnAg2.5Cuo.aSbo.5 Sn I na.oAg3.58io.5 SnBi57A9 1

-Higher processing temperatures can affect boards and parts -Assemblies may mix solders -Logistics may not be set up to identify Pb-free materials -Solder joints have "dull" appearance

a. SnPb solder, b. Pb-free solder, Source: Lead Free Surface Mount Technology, Ian WiJding, Henkel Technologies, 2005

-Industry groups worked to fill void in best-practice standards-Technical basis of emerging standards questioned-New standards did not recognize supply chain issues-Part suppliers starting to advertise "whisker-free" per these standards

-ELF IPT and LEAP WG formed by engineering leaders in DoD PrimeContractor community to focus efforts in research, best practices, andpolicy. (NASA begins participation in /larch 2006)

Aerospace industries Association (AIA)-Avionics Maintenance Conference (AMC)-Government Electronics and Information Technology Association (GEIA) Lead-free Electronicsin Aerospace Project Working Group (WG)

Examples of projects.Component re-processing (BGAs, Lead Dipping)Solder joint reliability characterizationFundamentals of whisker growthMined alloys systems (original and repaired)Supply chain requirements flow downAssembly and part identification and traceabilityTraining

Photo source: "Tin Whiskers Pound on ATVC SN 0034'; DonMcCorvey, 2006

GEIA-STD-0005-1 Performance Standard for Aerospace and HighPerformance Electronic Systems Containing Lead-free Solder

GEIA-STD-0005-2 Standard for Mitigating the Effects of Tin inAerospace and High Performance Electronic Systems

GEIA-STD-0005-3 Performance Testing for Aerospace and HighPerformance Electronics Containing Lead-free Solder and Finishes

GEIA_HB-0005-1 Program Management / Systems EngineeringGuidelines for Managing the Transition to Lead-free Electronics

GEIA-HB-0005-2 Technical Guidelines for Aerospace and HighPerformance Electronic Systems containing Lead-free Solder

GEIA-HB-0005-3 Rework and Repair Handbook To Address theImplications of Lead-Free Electronics and Mixed Assemblies inAerospace and High Performance Electronic Systems

GEIA-STD-0005-1 Performance Standard forAerospace and High Performance ElectronicSystems Containing Lead-free Solder

- Communicates requirements for a Lead-free Control Plan ..F to assistsuppliers in the development of their own Plans. The Plan documents the Planowner's (supplier's) processes, assure them` customers, and all otherstakeholders that the Plan owner's productss will continue to meet theirrequirements.

- This standard does not contain tailed descriptions of the processesbe documented but listshigh-level requirementstints for such processes, andareas of concern to the AHP industries that must be addressed by the processes.

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Quality Assurance Requirements Traceability

NPD 8730.2, NASA Parts Policy

Attachment A: Criteria to Mitigate Risks Associated with Lead-Free Solder andSurface Finishes

(paraphrased)

a. Sn-Pb shall be used whenever possible. Use of Pb-free (<3% Pb) may beused by special approval on technical need and risk mitigation.

b. A GBIA-STD-0005-1 Pb-free control plan is required which addresses:design considerations manufacturing process controlstest & qualification requirements quality inspection & screeningmarking & identification maintenance & repairrisk mitigation application uniqueness's

c. GEIA-STD-0005-2 "2C" level whisker risk mitigation. "213" level allowed inspecial circumstances and with PCB approval.

d. Use of Pb-free Sn-based solders and surface finishes, in applications below13.2°C, shall be assessed for the risk of the damaging effects of tin pestformation (allotropic phase transformation of tin).

Quality Assurance Requirements TraceabilityJ-STD-oo DS. 1 Joint Industry Standard, Space Applications ElectronicHardware Addendum to J-STD-001 D Requirements for SolderedElectrical and Electronic Assemblies

1. Scope is surfaces to be soldered and solder used

2. The following are specifically prohibited withoutmeeting additional requirements:

Pb-free tin platings or metallization on external surfaces ofEEE parts, mechanical parts, including on parts inside ofmodules (e.g. MCM, Relays)

• Pb-free solder alloy except Sn96.2Ag3.7

Quality Assurance Requirements TraceabilityCont. J.,STD,-001DS. 7

3. The cases above are allowed only with a USER approved lead-free control plan (L1=CP) which accomplishes:

a. Replating or hot solder dip replacement of Pb-freesurfaces with SnPb -or-

b. Minimum of 2 other risk mitigation methods employed

4. L1=CP shall ensure functionality of hardware in intendedapplication wlrlsolder, platings, soldering processes

a. Document every incidence of useb. Minimum of two mitigation methodsc. Document special design requirements, processes,

testing, inspections, marking, repair

.. .. ......

I.. View TECHAMERICA GEIA -STD-0005 - 1 Active 06/01/2006 Performance Standard for Aerospace and High

GEIASTANDARD

Performance Standard for Aerospace and

High Perfonuance Electronic Systems

Containii^g Lead-free Solder

ease Objectives. rR{. .............r^....................-..................................................................................... ...... 4

^'`5A i1.eliabilitvy t?. ^

......... ,..<..-,...,.......m.....»....,.»...................... ....,..,....... .......... . P ....................,.., «..... u....a., ..F'

Configuration control avA product identification ...a....,x..,...,..a..,.........w„^....,.....,^...a.., «...

53 Risks mid limitations, ofwe__' ... , —, ...... ................................., .....,...........,..........A....,..... 55A Deleterious effects oftinhick- ' ................ ....« ................. ....,.................. ..

.5 Repair, reivor , maintenance. n suppol- ...........>.............,...^........,«..4^..... .i ethnic

.....................n^^Y }6 al requirements . .... .................................. ........................ ........:...... ............ ..M............... 5

6n1 Reliability—.- ... — ....... .............»........,..eu.....4.....,.............,......o..,a........e.axa.v.,...an.......s.,.. r.e 5

6«1.1 Test m awls methods _.. .....-------------------------------- ..--_.-___._...__..__.............. ._....«------------ .____,«_6.1. E Eillr*i3 Clumental and operating conditions .............6.1..E Data,« - ._..-.._. ............. ......... _ _.........__ ............. ___ ....... .- .......... ........ ._.......v__.....__........_. -.a_.. 76.1 .E Cou'version of results froin available data to applicable conditions ...__..««...

6.2 Configuration contTol wid product identification . ........... .... — ...... ___ .... .,...... ....,........r,., ,6. `x ..1 Tei imtton material and ash alloy compositions of piece parts . ----- ..... ... .......

. 2 _? Solder alloys its iii. ^e assembly process .................... ___ ....... .__+,.«... ------ ._.._. _--------.-...6.22.1 Assemblies containing a ale solder alloy ......... ____ --------------------------- ____ ----------------- .....6«2.2.2 Assemblies containnig mo re than € ne solder alloy ........ ............ ..v_...- .................. _..._..6.2.3 .Aircraft x izi ng, ..............62. Changes in solder ........... ..................... .__.,..«._,...._.,...._._............ ..P..,,...__....__^6 .2.5 Identification..._-. -----_---_ ___ .............. .............. _..... -..._ _..._......_............_....._.-._.__....-6.2.6 Fart s wnber changes ................... .... ___ ._........ ....... .------- .. ._.......«............. _... .... _-..63 Risks and limitations of use. ___ ....................... .._ ........... .............._.._.._......_.._._.___.._._,_..._ 96_3_2 1wompatible materials ........... ................... ... ---------- ___ ----....._.._.._..------ _. --- ---_ ........ .__._...._6.3 2 Liiillitatiom on systems ii e-.«_.._.... ............... ....._....__................. ___ ----------- ____ ------- .._.___._._6.3.3 Lirm' tations on environowntal conditions .... ..... ........ .... ____ .................. ._.«_.._._,....__ »-__._...6.3.4 Lin nations on maintenance. rework_ and reiiair ................«__._.........____.._.._..__. ............... .__.

SECTION

INSTRUCTIONS AND TEMPLATE FOR CREATING

A LEAD-FREE CONTROL PLAN

TABLE OF CONTENTS

1 PURPOSE AND APPUCABlUTY.. . _ __ '__',,_0<_ ___ _____ • __

2 lNSTR UCTlONS FOR USE OF THtS TErvlPLA TE _____ _

APPENDIXA TEMPLATE FOR CREATING A lEAD-FREE CONTROL PLAN

LFCP Template InstructionsTemplate has same section numbers and headings as GEIA-STa--0005-1.

Green Shading :short reminder of requirement statement from GEIA-STD-0005-7, removedby author

Blue font :fill in information on materials, reliability, configuration management,procedures, etc.

Theinstructions assume that the author access to theinformation, either through personal knowledge, or through other knowledgeablepersonnel. (- can "standard" methods be provided ?

[Supplier name) :fill in the name of the organization responsible for implementing the Lead-free Control Flan

[LFCP] :fill in supplier's formal name or doc number

[Bold Italicized] :fill in additional or custom information

Prior to review, remove the Ist section break and ailtext on pgs i through iv and remainder will be theCFCP.

LFCP Template1. Cover Page2. Table of ContentsI Configuration Management table4. Forward: 2 examples given, choose one or make your own6. Purpose and Applicability: fill in LFCP name, fill in supplier name6. Exclusions: describe exclusions from scope of the plan7. References. GEIA provided8. Terms, Definitions and Acronyms: 89 IPC and GEIA terms included9. Objectives: author is instructed to address the following:

Reliability: how will this be demonstrated?Configuration control and product identificationCaveats: remaining risks and limitations of use

- Deleterious effects of tin whiskers: how mitigated?- Repair, rework, maintenance, and support

How to prefer supplkiirs whoare using this approach.?

Summary

• PERM Consortium established standardized minimumbaseline for Pb-free control in form of GEIA (TechAmerica)document set

• NASA policy requires Pb-free control per GEIA-STD-0005-1

• where used, how used, logistics control, meets/exceedsreliability needs is emphasis

• NASA will provide a template for facilitating the use of GEIA-STD-0005-1

• Author should be process owner. one-size-fits-all may notwork for establishing the reliability piece