Experimental study on surface integrity and subsurface damage of fused silica in ultra-precision grinding Yaoyu Zhong, 1,2 Yifan Dai, 1,2,* Hang Xiao, 1,2,3 and Feng Shi 1,2 1 Laboratory of Science and Technology on Integrated Logistics Support, College of Intelligence Science and Technology, National University of Defense Technology, 109 Deya Road, Hunan, 410073, China 2 Hunan Key Laboratory of Ultra-Precision Machining Technology, 109 Deya Road, Hunan, 410073, China 3 Changsha University, College of mechanical and electrical engineering, 35 Hongshan Road, Hunan, China, 410022 *[email protected]Abstract: To realize low-damage ultra-precision grinding on fused silica, the surface quality and subsurface damage (SSD) distribution with fine-grained grinding wheel under different depth-of-cut and cutting speed are experimentally studied. The material removal mechanism under different grinding parameters is revealed by calculating undeformed chip thickness and observed with the help of transmission electron microscopy. The results show that brittle- ductile surfaces and ductile-like surfaces are generated during grinding. With the decrease of depth-of-cut and the increase of wheel cutting speed, the ultra-precision grinding changes to ductile-regime grinding with plastic flow removal. Besides, the surface roughness (SR) and SSD depth are reduced. The fracture defects such as fractured pits and grinding streaks on brittle-ductile surface gradually decrease. Instead, a ductile-like surface covered with grinding streaks is found. On brittle-ductile surfaces, the nonlinear relationship SSD∝SR 4/3 is no longer proper under the influence of plastic flow. Using surface roughness Ra to predict SSD depth is more accurate. When depth-of-cut is 1 μm, cutting speed is 23.4 m/s and the material removal mode is dominated by plastic flow removal, the surface Ra is improved to 2.0 nm and there is no crack but only a 3.4 nm deep plastic flow layer in subsurface after grinding. Keywords: Fused silica, ultra-precision grinding, ductile material removal, surface integrity, subsurface damage 1. Introduction Fused silica has been widely utilized in the fabrication of large laser facilities, such as inertial confinement fusion (ICF), due to its unique optical, mechanical and thermal properties [1,2]. However, when exposed to high fluences in the ultra violet range, some defects on the fused silica will evolve into damage precursor induced laser damage, which make the lifetime of fused silica decreases rapidly [3,4]. Subsurface damage (SSD) including surface microcracks and scratches are typical precursors for laser induced damage [3-6]. In order to withstand the irradiation of high-power laser, it is necessary to avoid SSD as much as possible in the machining technologies for fused silica. Ultra-precision grinding, as an efficient and economical manufacturing technology for optical elements, is one of the important technologies for processing high-precision and high-quality fused silica [7-12]. But the surface and subsurface of fused silica after ultra-precision grinding usually contains SSD. The SSD must be removed by subsequent polishing technologies, which is mandatory for ICF laser systems. So, the investigation on the surface integrity and SSD of fused silica induced by ultra- precision grinding has great importance. Lambropoulos et al. analysis the ratio of SSD to surface roughness (SR) based on indentation fracture mechanics [13,14]. S. Li et al. established a theoretical nonlinear model for an assessment of SSD depth. They investigated SSD depth and SR of ground and lapped BK7
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Experimental study on surface integrity and
subsurface damage of fused silica in ultra-precision
grinding
Yaoyu Zhong,1,2 Yifan Dai,1,2,* Hang Xiao,1,2,3 and Feng Shi1,2
1Laboratory of Science and Technology on Integrated Logistics Support, College of Intelligence Science
and Technology, National University of Defense Technology, 109 Deya Road, Hunan, 410073, China 2Hunan Key Laboratory of Ultra-Precision Machining Technology, 109 Deya Road, Hunan, 410073,
China 3Changsha University, College of mechanical and electrical engineering, 35 Hongshan Road, Hunan,
Methodology, Yaoyu Zhong and Hang Xiao; Supervision, Yifan Dai and Feng Shi; Validation,
Feng Shi and Hang Xiao; Visualization, Yaoyu Zhong; Writing, Yaoyu Zhong.
Funding: This research was funded by the National Natural Science Foundation of China
(NSFC) (No. 51991374, No. 51835013, and No. U1801259), National Key R&D Program of
China (No. SQ2020YFB200368-04), Strategic Priority Research Program of the Chinese
Academy of Sciences (No. XD25020317), the Excellent Youth Project of Educational
Committee of Hunan Province of China (No. 20B067) and the Science and Technology
Innovation Program of Hunan Province (2020JJ5617).
Competing Interests: The authors have no relevant financial or non-financial interests to
disclose.
Availability of data and materials: Not applicable.
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