EV Group Europe & Asia/Pacific GmbH DI Erich Thallner Strasse 1 4782 St. Florian am Inn Austria +43 7712 5311 0 Contact [email protected] www.EVGroup.com Printed on paper from sustainable sources. Data, design and specifications may not simultaneously apply; or depend on individual equipment configuration, process conditions and materials and may vary accordingly. EVG reserves the right to change data, design and specifications without prior notice. All trademarks, logos, website addresses or equipment names are registered trademarks and/or the property of EV Group or their respective owners. © EV Group (EVG). All rights reserved. V19/01 ■ Substrate size up to 300 mm ■ Lamination speed from 1 mm/s up to 10 mm/s ■ Roller pressure from 5 N/cm2 up to 50 N/cm2 ■ Heating up to 120 °C Technical Data Features ■ Room-temperature bonding ■ Encapsulation of biological materials ■ Ultra-thin adhesive layer ■ Excellent uniformity over large areas ■ Parallel processing on wafer scale ■ No alignment necessary ■ Compatible with a wide range of materials Introduction EVG®820 Lamination System Adhesive Transfer for Microfluidics Adhesive bonding found widespread use in sealing of microfluidic devices either in the form of pressure sensitive tapes or liquid UV-curable adhesives. As a room- temperature process, it allows the encapsulation of biological materials. In addition, adhesive bonding can compensate a certain surface roughness caused for example by thin-film electrodes. A challenge usually represents the selective deposition of adhesive to minimize or avoid adhesive within the microfluidic channels which otherwise can influence biological reactions. The adhesive transfer process is an elegant solution for microfluidic devices where micro-channels stay free of adhesive without the need for alignment. A liquid UV-curable adhesive is spin-coated onto an adhesive transfer foil which is then laminated onto the microstructured substrate. By releasing the transfer foil, the adhesive will remain only on the heightened structures and can be subsequently bonded by UV-curing. The EVG820 lamination system offers the adhesive transfer of ultra-thin layers in the order of a few microns thickness with excellent uniformity over large areas. Combined with EVG´s spin coating and bonding equipment, this process enables completely new possibilities for microfluidic manufacturing. 2) Transfer Adhesive 3) Detach Transfer Foil 4) Bonding (UV-curing) 5) Bonded Substrate 1) Spin-coating Adhesive on Transfer Foil Spin-on Adhesive Adhesive Transfer Foil Conventional Adhesive Bonding Adhesive Transfer Bonding
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EV Group Europe & Asia/Pacific GmbHDI Erich Thallner Strasse 14782 St. Florian am InnAustria+43 7712 5311 0
Contact
www.EVGroup.com
Prin
ted
on p
aper
from
sus
tain
able
sou
rces
. Dat
a, d
esig
n an
d sp
ecifi
catio
ns m
ay n
ot s
imul
tane
ousl
y ap
ply;
or d
epen
d on
indi
vidu
al e
quip
men
t con
figur
atio
n, p
roce
ss c
ondi
tions
and
mat
eria
ls a
nd m
ay v
ary
acco
rdin
gly.
EVG
rese
rves
the
right
to c
hang
e da
ta, d
esig
n an
d sp
ecifi
catio
ns w
ithou
t prio
r not
ice.
All
trad
emar
ks, l
ogos
, web
site
add
ress
es o
r equ
ipm
ent n
ames
are
regi
ster
ed tr
adem
arks
and
/or t
he p
rope
rty
of E
V G
roup
or t
heir
resp
ectiv
e ow
ners
. ©
EV
Gro
up (E
VG).
All
right
s re
serv
ed. V
19/0
1
■ Substrate size up to 300 mm ■ Lamination speed from 1 mm/s
up to 10 mm/s ■ Roller pressure from 5 N/cm2
up to 50 N/cm2 ■ Heating up to 120 °C
Technical Data
Features
■ Room-temperature bonding ■ Encapsulation of biological
materials ■ Ultra-thin adhesive layer ■ Excellent uniformity over large
areas ■ Parallel processing on wafer
scale ■ No alignment necessary ■ Compatible with a wide range
of materials
Introduction
EVG®820Lamination SystemAdhesive Transfer for Microfluidics
Adhesive bonding found widespread use in sealing of microfluidic devices either in the form of pressure sensitive tapes or liquid UV-curable adhesives. As a room-temperature process, it allows the encapsulation of biological materials. In addition, adhesive bonding can compensate a certain surface roughness caused for example by thin-film electrodes. A challenge usually represents the selective deposition of adhesive to minimize or avoid adhesive within the microfluidic channels which otherwise can influence biological reactions.
The adhesive transfer process is an elegant solution for microfluidic devices where micro-channels stay free of adhesive without the need for alignment. A liquid UV-curable adhesive is spin-coated onto an adhesive transfer foil which is then laminated onto the microstructured substrate. By releasing the transfer foil, the adhesive will remain only on the heightened structures and can be subsequently bonded by UV-curing.
The EVG820 lamination system offers the adhesive transfer of ultra-thin layers in the order of a few microns thickness with excellent uniformity over large areas. Combined with EVG´s spin coating and bonding equipment, this process enables completely new possibilities for microfluidic manufacturing.
2) Transfer Adhesive
3) Detach Transfer Foil
4) Bonding (UV-curing)
5) Bonded Substrate
1) Spin-coating Adhesive on Transfer Foil
Spin-on Adhesive
Adhesive Transfer Foil
ConventionalAdhesive Bonding
Adhesive TransferBonding
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