-
ATCA®, AdvancedTCA®, xTCA®, AdvancedMC™, MicroTCA®, CompactPCI®,
COM Express® are Trademarks of PICMG www.picmg.org VPX, VPX REDI,
OpenVPX & VMEbus are Trademarks of VITA www.vita.com
ESW is a Global Publication of e2mos www.emb-sys-world.com
January 2016
Automation - IoT - Communication - EnergyTransportation -
Medical - Video - Mil/Aero
Modular Open Systems - Boards - PlatformsChips - Software -
Tools - T&M
Covering all Embedded App’sEmbedded WorldSystemsTopics in this
issue include:n Appliance with scalable x86 CPU performance with
many off-the-shelf PCIE cards (P.2)n M&A: Intel/Altera -
NXP/Freescale - GE Embedded/Veritas/Abaco - Kontron/Ennocom (P.2)n
Functional verification productivity solutions for Automotive
Ethernet & CAN (P. 4)n Leaders launches the "S3P" Major
Collaborative Project & Alliance S3P Project for IoT (P. 7)n
Farmertronics introduces the eTrac-20, a new GREEN concept small
track tractor (P. 8)n High-performance embedded computing crucial
enabler of bistatic Radar and Sonar (P. 8)
ADLINK to present New Boardsbased-on Latest CPUs
at Embedded World 2016Feb 23-25, Hall 1, Booth 1-540
Qseven™ & SMARC™ COMs based-on latest Intel® Pentium™ &
Celeron™ CPUs
COM Express all versions
PC/104 SBC based-onVortex86DX3 System-on-Chip
Industrial ATX MotherboardMaximizing PCIe Connectivity
based-on
6th Gen Intel® Core™ Processor
VPX & CompactPCI based-onCPUIntel® Xeon® D-1500
IoT Kits - GatewaysEnd-to-End Solutions
-
Features:
• 3U by 508 mm for 19” racks• Redundant 2200W from90-264VAC or
-48VDC• Highest performance densityin 3U with 15 slots for
ArtesynSharpServer™ microservercards, with a total of 30processors
(two per card)• Redundant and hot-swappablecooling and power
supply• Cable-less internal architecturefor microserver cards•
Artesyn SharpServer Intel®Xeon® processor D microservercards• PCI
Express and Ethernetnetworking infrastructures• 4 x 2.5” drive bays
and 4x10GBaseT built-in• Designed for NEBS and ETSIcompliance•
Multiple system configurationsare possible: Any mix ofmicroservers,
Artesyn mediaprocessors and 3rd party PCIExpress cards
The Artesyn Embedded Technologies MaxCore™ platform offers a
versatile and dense architecture to achieve maximum compute and
media processing density. Through its use of Artesyn technology
microserver cards, Artesyn media processing PCI Express cards and
3rd party PCI Express cards, it offers maximum flexibility, maximum
density per rack unit (RU), and unmatched innovation in design for
both datacenter and carrier grade applications.
The MaxCore platform enables you to build an economical and
application focused appliance within a short time. Flexibility is
achieved through its capability to perfectly balance I/O, compute
and compute-associated accelerators within the same box. Economy
comes through its ability to achieve a cost-effective framework for
densely configurable content. It accelerates time to market by
leveraging the vast market of COTS PCI Express cards available
which can be used interchangeably on the MaxCore platform and other
platforms.
Within the world of platform infrastructure, the MaxCore
platform is unique in its ability to combine CPU-attached PCI
Express cards with an extremely flexible communication network
between all of the CPUs. Traditional single box server
architectures either provide a single multi-core server that can be
combined with a small number of PCI Express based I/O cards, or
they offer multiple independent server nodes with no or minimal
local I/O extension. The MaxCore platform supports both
architectures while breaking down the individual limits and
enabling any combination in-between.
MORE: Click Here
Mergers and Acquisitions (M&A) you need to knowfor the
Embedded Market
Intel Completes Acquisition of AlteraSANTA CLARA, Calif., Dec.
28, 2015 – Intel Corporation (“Intel”) today announced that it has
completed the acquisition of Altera Corporation (“Altera”), a
leading provider of field-programmable gate array (FPGA)
technology. The acquisition complements Intel’s leading-edge
product portfolio and enables new classes of products in the
high-growth data center and Internet of Things (IoT) market
segments.
NXP and Freescale Announce Completion of Merger EINDHOVEN, The
Netherlands and AUSTIN, Texas, Dec. 07, 2015 (GLOBE NEWSWIRE) --
NXP Semiconductors N.V. (NASDAQ:NXPI) and Freescale Semiconductor,
Ltd. (NYSE:FSL) today announced the completion of the merger
pursuant to the terms of the previously announced merger agreement
from March 2015. The merger has created a high performance mixed
signal semiconductor industry leader, with combined revenue of over
$10 billion. The merged entity will continue operations as NXP
Semiconductors N.V. (NASDAQ:NXPI) and has become the market leader
in automotive semiconductor solutions and in general purpose
microcontroller (MCU) products.
GE Embedded sold to Veritas Capital in 2015 is now Abaco Systems
As per official PR December 07, 2015
Kontron to sell a 49% stake of its Communication Business to
Ennoconn for US$ 57.3 million Ennoconn is a subsidiary of Foxconn
Technology Group in Taipei, Taiwan. As per official PR January 22,
2016
Contact us see page 7
Daniel DierickxCEO & co-Founder
at e2mosActing Chief Editor
Embedded Systems World - January 2016 Page 2
MaxCore™ PlatformVersatile and Dense Compute & Media
Platform
The MaxCore™ platform is a flexible appliancewith scalable x86
CPU performance in combination
with many off-the-shelf PCI Express cards
SharpServer™3U with 15 slots
SharpServer™ Intel®Xeon® Processor D
Microserver card
https://www.artesyn.com/computing/assets/maxcore_ds_11feb2016_1455248708.pdfhttps://www.abaco.com/news/abaco-systems-former-ge-embedded-technology-and-systems-business-launches-prioritizeshttp://www.kontron.com/about-kontron/news-events/detail/oaktree_adhoc-kommunikation_20160122https://newsroom.intel.com/news-releases/intel-completes-acquisition-of-altera/http://investors.nxp.com/phoenix.zhtml?c=209114&p=irol-newsArticle&ID=2120581
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VadaTech Announces Plan for Industry's Largest Portfolio of COTS
VPX Products
Henderson, NV – 18 January, 2016 – VadaTech, a leading
manufacturer of embedded boards, enabling software and
application-ready platforms, today announced a major new initiative
to bring its existing commercially-developed designs to the 3U VPX
form factor. This gives defense customers the opportunity to take
field-proven designs in another standard format with strong market
adoption. With over 300 relevant products, VadaTech could very
quickly have the largest portfolio of commercial off-the-shelf
(COTS) VPX products in the industry.
The company's initial product offerings will focus on its
strength in data acquisition and sensor processing, followed by
storage and networking. In addition, VadaTech's extensive FMC
product base is also applicable in the VPX form factor. The company
is presenting its VPX roadmap to customers and distributors in the
USA, Europe and Asia, with initial products available during the
first quarter of 2016. Preliminary datasheets for the first twelve
products will be available to lead customers from next month.
Paul Kuepfer, sales and marketing vice president, VadaTech,
said: "While VadaTech is fully committed to providing MicroTCA
product into commercial, research and defense applications, we
recognize that for some customers – especially those with military
and aerospace applications - VPX is a corporate mandate for
deployed systems. By providing designs in both AMC and VPX, we will
offer a straight-forward migration route between the standards.
Design re-use across the form factors will allow us to amortize
development over larger volumes than other defense-centric COTS
providers."
About VadaTech VadaTech provides innovative embedded computing
solutions from board-level products, chassis-level platforms, to
configurable application-ready systems. With a focus on
AdvancedTCA, MicroTCA and VPX solutions, the company offers
unmatched product selection and expertise. A unique combination of
electrical, mechanical, software, and system-level expertise,
enables VadaTech to provide customized commercial or rugged
computing solutions to meet the most complex customer requirements.
VadaTech also offers specialized product solutions for VPX/VME,
CompactPCI, and other architectures. A member of PICMG and VITA,
VadaTech has headquarters, design and manufacturing facilities in
Henderson, NV with design, support and sales offices in Europe and
Asia Pacific.
VadaTech, Inc. 198 N. Gibson Henderson, NV 89014
www.vadatech.com
Baikal « Russian Chips » joins Global Semiconductor Alliance
Moscow, Russia, December 16, 2015 — Baikal Electronics, a
Russian semiconductor company, has joined the Global Semiconductor
Alliance (GSA), the voice of the global semiconductor industry.
“Baikal Electronics has been established as Russia's first
development center for high-performance, globally competitive
microprocessors. We work hard to ensure that our products feature
top-notch technologies and the most recent interfaces. By joining
many innovative companies within the GSA, we broaden our outlook
into the world of perpetually evolving and emerging technologies,”
said Svetlana Legostaeva, CEO for Baikal Electronics.
Baikal Electronics develops energy-efficient microchips for
computer systems and industrial applications. The world's first
silicon implementation of the MIPS Warrior P-class P5600 kernel –
Baikal-T – is the result of the company's commitment to innovation
and high quality. Baikal's CPUs and SoCs will become the first
original Russian contribution to the mass IT market, boasting
highly competitive properties in terms of technology node,
performance and compatibility.
“Baikal Electronics represents an ambitious startup with an
exciting success story of advanced innovation,” said Sandro
Grigolli, EMEA Executive Director for the GSA. “We are very proud
to welcome them among our members, in the company of so many global
semiconductor market leaders. Baikal allows us to expand GSA's
footprint in a region always characterized by advanced engineering
and intellectual prowess.”
About Baikal ElectronicsBaikal Electronics is a Russian fabless
semiconductor company that develops and markets ARM-based and
MIPS-based processors and SoC. The Baikal product line of multicore
processors includes energy-efficient solutions for desktops and
industrial computers with various levels of performance and
functionality.Check the company's website for up-to-date
information at www.baikalelectronics.ru
About GSAThe Global Semiconductor Alliance (GSA) mission is to
support the global semiconductor industry and its partners by
offering a comprehensive view of the industry. This enables members
to better anticipate market opportunities and industry trends,
preparing them for technology and business shifts. It addresses the
challenges within the supply chain including IP, EDA/design, wafer
manufacturing, test and packaging to enable industry-wide
solutions. Providing a platform for meaningful global collaboration
through efficient power networking for global semiconductor leaders
and their partners, the Alliance identifies and articulates market
opportunities, encourages and supports entrepreneurship, and
provides members with comprehensive and unique market intelligence.
Members include companies throughout the supply chain representing
30 countries across the globe. www.gsaglobal.org
Embedded Systems World - January 2016 Page 3
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Avery, CAST, and Rianta Roll Together on Automotive Ethernet and
CAN FD IP and VIP solutions
Avery Design Systems Inc., an innovator in functional
verification productivity solutions, Rianta Solutions, Inc., a
Verification IP provider and System-on-Chip (SoC) integration
specialist, and CAST, Inc., a semiconductor intellectual property
(IP) provider, today announced they are combining their strengths
to develop and deliver superior solutions for the design and
verification of automotive networking systems. The resulting set of
verification IP (VIP) and IP cores for the CAN FD, LIN, and
automotive Ethernet buses will support the latest developments in
automotive industry standards and provide more complete integrated
design and verification solutions for next-generation automotive
sensors, microcontrollers, and Ethernet switch chips and
subsystems.
Modern automotive platforms employ different in-car network
domains—powertrain, chassis, Advanced Driver Assistance Systems
(ADAS), human–machine interfaces (HMI), and future “connected car”
systems—that all need to coexist and communicate. Designs are
rapidly evolving to use a shared switched Ethernet network backbone
with support for heterogeneous subnets and gateways for CAN
Flexible Data (ISO 11898-2), LIN, and FlexRay (ISO 17458-1–5) based
control systems. System designers need proven, reliable IP cores to
integrate these complex functions in an efficient and
cost-effective manner. Additionally, test and verification
requirements for conformance, interoperability, performance, and
security can be greatly enhanced through the use of commercial
verification IP models, protocol checking, and compliance testsuite
options.
About Avery Design Systemswww.avery-design.com
About Rianta Solutionswww.riantasolutions.com
About CASTww.cast-inc.com
ADLINK Extends Intel® Pentium™ & Celeron™ Processor N3000
Series Offerings to SMARC™ & Qseven™ Computer-on-Module
Lines
Company offers broadest range of processors in modules based on
SMARC form factor
San Jose, CA – January 20, 2016 – ADLINK Technology, Inc., a
leading global provider of cloud-based services, intelligent
gateways, and embedded building blocks for edge devices that enable
the Internet of Things (IoT), today announced extended offerings
based on the latest Intel® Pentium™ and Celeron™ Processor N3000
Series (codename Braswell) to include SMARC™ and Qseven™
computer-on-modules (COMs).
The LEC-BW is a SMARC® Short Size Module with dual or quad-core
Intel® Pentium™ and Celeron™ Processor N3000 Series System-on-Chip
(SoC) from 1.46 up to 1.91 GHz and up to 8 GB on board DRAM. The
graphics interfaces include LVDS, HDMI and DP supporting multiple
independent screens. The module also offers 2x camera interfaces.
The LEC-BW's additional rich I/O options include 1x GbE, 1x
SDIO/SD/MMC, 2x SATA-III 6Gbit/s, 1x USB 3.0, 2x USB 2.0 (host), 1x
USB 2.0 (client) 12x GPIO, 2x SPI, and 4x I2C. The LEC-BW features
standard operating system support for Windows 7/8.1/10, Linux, and
Android, and also offers optional support for QNX and VxWorks.
“ADLINK has the largest portfolio of SMARC modules in the
market, with a model featuring an ARM or x86 processor from the
major CPU vendors,” said Dr. Harald Schmidts, ADLINK´s product
manager for SMARC and Qseven product lines. “We continue to work
closely with SGeT to evolve the standards for SMARC and other COM
in order to take advantage of the lower power, higher compute
performance that is being introduced with each new processor.”
ADLINK's Q7-BW is based on the Qseven Hardware Specification v2.0
and features a dual or quad-core Intel® Pentium™ and Celeron™
Processor N3000 Series System-on-Chip (SoC) from 1.46 up to 1.91
GHz and up to 8 GB onboard memory. Graphic interfaces include
single/dual channel LVDS, HDMI/DP, and 2x eDP (optional)
interfaces. I/O includes 3x PCIe x1 Gen2, 1x GbE, 1x USB 3.0, 5x
USB 2.0 (host), and 1x USB2.0 (client), as well as storage support
for 1-2x SATA3 6Gbit/s (1x onboard SATA SSD, optional) and 1x SDIO
(4 bit). The option is also available for soldered, bootable eMMC
flash storage from 4GB to 64GB. The Q7-BW features standard
operating system support for Windows 7/8.1/10, Linux, and
Android.All of ADLINK's computer-on-modules come equipped with SEMA
(Smart Embedded Management Agent), enabling remote management and
control of distributed devices. ADLINK's SEMA-equipped devices
connect seamlessly to our SEMA Cloud solution to enable remote
monitoring, autonomous status analysis, custom data collection and
initiation of appropriate actions. All collected data, including
sensor measurements and management commands, are available from any
place, at any time via encrypted data connection.
MORE: http://www.adlinktech.com/Computer-on-Module
Embedded Systems World - January 2016 Page 4
http://www.cast-inc.com/
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SYSGO certified according to ISO 9001:2015Mainz, Germany -
December 02, 2015
• ISO 9001:2015 published on 09/27/2015 in a completely revised
version• SYSGO receives the new ISO 9001:2015 certificate in
November 2015 • High Level Structure well suited to SYSGO• High
investment security for customers
SYSGO is one of the first companies to have its processes
certified according to the new revision of ISO 9001:2015. The
international standard for quality management has been completely
revised. The new High Level Structure is now suited for mapping the
complex processes in the development of safety- and
security-critical software. SYSGO has strict in-house quality
requirements in product development that could not be adequately
covered with the old ISO:9001. The ISO 9001:2015 certificate
provides SYSGO customers visible investment security. New ISO
9001:2015 supports in-house quality standards
SYSGO develops operating systems and basic software for safety-
and security-critical systems such as for aircraft, cars and trains
that are certified for their safety according to industry-specific
standards, including DO-178B/C, ISO 26262 and EN 50128 as well as
Common Criteria (ISO 15408). The old version of ISO 9001 did not
suffice and was not flexible enough to provide SYSGO with a strict
in-house quality assurance that meets the industry-specific
requirements for functional safety and Cyber Security. The
completely revised ISO 9001:2015 now enables linking of the
requirements for industry-specific functional safety standards for
the development of mission-critical software with a
process-oriented quality standard. SYSGO has been tested and
certified by the „Deutsche Gesellschaft zur Zertifizierung von
Managementsystemen (DQS GmbH)“. “ The old version of the ISO 9001
was unsuitable for our very strict in-house standards,” explains
Kai Sablotny, COO at SYSGO and board member responsible for
certification according to the new standard. “The High Level
Structure of the ISO 9001:2015 allowed us to integrate our quality
standards, including risk and change management, which are based on
the industry-specific certification requirements for functional
safety and cyber security standards.”
The certificate can be viewed on the DQS website:
bit.ly/1kRrua2
Securable investment securityProduct-specific safety and
security standards provide information about the condition and
production process of a particular product. ISO 9001:2015 provides
a broader overview of the processes of the entire company in its
context and includes risk management. The ISO 9001:2015 certificate
provides customers, suppliers and institutions involved with the
company visible proof of good corporate governance and investment
security in their collaboration with SYSGO.
ISO 9001:2015 with High Level StructureThe new structure of ISO
9001 ensures identical definition and structure of all management
systems and a unified use of key texts and concepts, thus
facilitating the linking with other standards. The current ISO
27001 for information security management, for example, also uses a
High Level Structure. ISO 9001:2015 requires anchoring in
management and provides for better alignment with in-house business
processes as well as self-defined product and service quality. The
new flexibility of ISO 9001 enables resource-efficient,
process-oriented quality management that takes into account the
requirements of other standards.
PikeOS HypervisorPikeOS is a hypervisor especially made for
embedded systems. With real-time, virtualization and partitioning,
it provides all the features needed to build today's
multi-functional and high-integrated devices. Its security
architecture creates a foundation for critical systems allowing
official approval by the authorities and certification according to
international functional safety standards. PikeOS is the only
European software platform for smart devices in the
Internet-of-Things.
ELinOS Industrial Grade LinuxELinOS is an embedded Linux
distribution purpose-built for the use in industrial applications.
The integrated development environment is tailored to the specific
requirements of embedded systems and comes with board support
packages for the most successful hardware of the embedded market.
ELinOS aims at the timesaving and cost-efficient use of Linux in
the embedded field. The product is supplemented by training classes
and project-oriented support by experienced developers.
About SYSGOSince 1991, SYSGO provides operating systems and
services for embedded systems. In the late 90's, SYSGO pioneered
the use of Linux in the embedded market with the ELinOS
distribution. For safety and security critical devices, SYSGO
offers PikeOS, the world's first SIL 4 certified hypervisor for
multi-core processors, which builds the foundation for smart
devices in the Internet-of-Things. With their product portfolio,
SYSGO is the leading non-US RTOS-supplier with customers like
Samsung, Airbus, Thales, Continental and many more. Markets include
Aerospace & Defense, Industrial Automation, Automotive,
Railway, Medical and Network Infrastructure. SYSGO is part of the
Thales Group and has facilities in Germany, France, Czech Republic,
UK and North America. It maintains a global distribution network
and supports its customers in formal certification according to
international safety and security standards. www.sysgo.com
Embedded Systems World - January 2016 Page 5
https://www.mydqs.com/kunden/kundendatenbank.html?aoemydqs[company_no]=521129&aoemydqs[action]=singleView&cHash=8a9c23070218b349d6b9ea37d6393ce3
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ADLINK Introduces New Products Based Intel® Xeon® Processor
D-1500 Product Family for Reliable, Dense and Rugged IoT
Solutions
CompactPCI® and VPX blades combine advanced intelligence, high
performance and low power consumption to address the needs of
compute-heavy, small-footprint military and transportation
applications
ADLINK Technology, Inc., a leading global provider of
cloud-based services, intelligent gateways, and embedded building
blocks for edge devices that enable the Internet of Things (IoT),
today announced two new solutions based on the Intel® Xeon®
Processor D-1500 Product Family. These latest ADLINK offerings are
based on 14nm technology-based, server-class Intel® processors that
bring intelligence to the edge for IoT applications, and include
CompactPCI and VPX processor blades targeted at military and
transport applications where ruggedness and compute requirements
are intense and space is at a premium.
“The Intel® Xeon® Processor D-1500 Product Family will have
extended temperature processors, which Intel will make available in
the first quarter of 2016. These processors support extended
temperature requirements that ADLINK sees with many of our customer
applications, making possible a host of new embedded solutions for
extreme environments,” said Yong Luo, general manager of ADLINK's
Embedded Computing Product Segment. “In addition, this latest
offering brings the performance and advanced capabilities of Intel®
Xeon® technology to a dense, lower-power system-on-chip with
integrated PCH technology and Intel® Ethernet and a ball-grid array
package to meet thermal design power targets, all in a compact
package.”
“The Intel® Xeon® Processor D-1500 Product Family delivers
exceptional value and unmatched performance density per watt with
enhanced reliability, availability, and serviceability capabilities
(RAS) thermal design power (TDP) ranging from 19W to 45W," said
Samuel Cravatta, product line director, Internet of Things Group.
"Customers are able to achieve hardware and software scalability
with existing development tools and processes, which are perfect
for supporting a complete product line that meets a range of IoT
requirements—all while saving valuable time and resources."
The ADLINK cPCI-6940 Series is a 6U CompactPCI processor blade
in single/dual-slot (4/8HP) width form factor and features the
Intel® Xeon® processor D-1500 product family and 16GB DDR4-2133 ECC
soldered memory plus 2x SODIMM supporting up to 32GB of DDR4-2133
ECC socket type memorywith a total memory of up to 48GB. The
cPCI-6940 is ideal for applications requiring high performance and
good value per watt, as well as a virtualization environment and a
high level of flexibility through peripheral and expansion
slots.
Front panel I/O for the cPCI-6940 includes 2x GbE, 1x
DisplayPort and 1x VGA, 2x USB 3.0 ports and 1x DB-9 COM port. The
cPCI-6940D also offers 2x 10G SPF+ supported by the Intel® Xeon®
Processor D-1500 Product Family SoC and XMC expansion on selected
SKUs. Rear I/O signals include two GbE for PICMG 2.16, 2x DVI-I, 1x
VGA (switched from front), 4x USB 2.0 and two USB 3.0, PS/2
keyboard/mouse, 3x COM, HD Audio, and 4x SATA.
ADLINK also provides a selection of rear transition modules
(RTMs) for customers to choose from based on application needs. The
cPCI-6940 Series' extended temperature range, vibration resistance,
and high computing power make it ideal for mission critical
applications.
The ADLINK VPX3010 Series is a rugged, conduction-cooled 3U
processor blade featuring the Intel® Xeon® Processor D-1500 Product
Family and DDR4-2133 soldered ECC SDRAM up to 16GB. The design of
the VPX3010 conforms to numerous VITA standards, including the VITA
46.0 VPX Base Standard and VITA 65 OpenVPX architecture framework
for VPX.
The VPX3010 includes one 10GBASE-KX4 and up to three 1G Ethernet
ports; up to PCIe x16 Gen3 interfaces supporting non-transparent
bridge; and one XMC expansion slot (PCIe x8 Gen3) with rear I/O to
P2. Soldered SLC NAND flash 32GB SATA 6Gb/s storage comes standard,
with expansion options available using an RTM. An extended
temperature range of -40°C to +85°C is also supported. For more
information please visit www.adlinktech.com
Embedded Systems World - January 2016 Page 6
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Events
Key Whitepaper
About us
Industrial IoTWireless Connectivity
WhitePaper
Request your copy [email protected]
IoT World
Embedded WorldSystems
ATCA World
Telecom WorldCOTSBroadband Broadcast IoT Convergence
Editor/Publisher: e2moswww.e2mos.com
[email protected]: 4 FREE e-magazinesClick on the Logo’s
Consortium of Industry Leaders launches the "S3P" Major
Collaborative Project and Alliance S3P Project aims at developing a
Smart, Safe and Secure Software Development and Execution Platform
for IoT
PARIS, France — December 8th, 2015
Esterel Technologies (Consortium Leader, wholly owned affiliate
of ANSYS),
and Technology Platform Partners: • CEA Tech, • Krono Safe•
MicroEJ • Prismtech (now part of ADLINK)• Prove & Run• SYSGO•
Telecom ParisTech • TrustInSoft
and Industrial Users Partners: • Airbus• Alstom• Altran
Connected Solutions (World Class Center of Altran)• Axa France•
Continental• Eolane• NXP Semiconductors (including Freescale
Semiconductor acquired by NXP)• Sagem• Schneider Electric• Sorin•
STMicroelectronics• SurTec• Thales
Together are creating the S3P Consortium to develop an IoT
Software Development and Execution Platform, S3 Platform. The S3P
Platform aims at enabling the rapid development and exploitation of
IoT-capable devices and applications, combining unprecedented
safety, security, agility and portability.
The S3P Consortium also creates with the support of the Embedded
France Association, the Cap'tronic Association and the Eclipse
Foundation the S3P Alliance ecosystem to foster the wider national
and international deployment of its initiative with the aim at
further expanding its usage by other leading consumer and
industrial brands.
The development of the S3 Platform is supported by the S3P
Project, a 45 M€ investment project, that is financially supported
by the S3P Consortium members and by the French Government
"Nouvelle France Industrielle" initiative with a 18.3 M€ government
funding, under the "Programme d'Investissements d'Avenir".
" The creation of S3 Platform, Project and Alliance is a key
contribution to building a smart, safe and secure software
development and execution platform for the worldwide deployment of
IoT", said Eric BANTEGNIE, CEO of Esterel Technologies and Vice
President of ANSYS, Inc., "it also contributes directly to the
objectives of building a comprehensive "Digital Trust Solution" for
the development of the economy, a key objective of the French
government".
embeddedworldNuremberg, Germany
Feb 23-25
&
MWGBarcelona, Spain
Feb 22-25
... they again managedto have their event
during the same week
Embedded Systems World - January 2016 Page 7
http://www.iotworld.be/http://www.telecomcots.com/http://www.emb-sys-world.com/http://www.atcaworld.com/http://www.esterel-technologies.com/news-events/press-releases/consortium-industry-leaders-launches-s3p-major-collaborative-project-alliance/
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Ž
‘
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Œ Battery - Pack GPSŽ Structural Backbone Hydrogene Tanks (2x)
In-Wheel Engines‘ Fuel Cell’ PTO (Power Take-Off)
Farmertronics introduces the eTrac-20, a new concept small track
tractor
Farmertronics has planned to start engineering and building the
eTrac-20 very soon.
This is a complete new concept small track tractor for the fruit
cultivation market.
This vehicle won’t be propelled by a diesel engine anymore but
by 3 independant electrical hub motors. The first version will be
equiped with a 30 kWh battery pack and the successor will be
equiped with a hydrogen fuel cell for range extension.
The pictures are giving a first impression of this advanced
tractor.
TECHNOLOGYPrecision farmingRenewable energyCrop managementFleet
management
MORE: www.farmertronics.comFarmertronics - Reusel 8, 5751 WG
Deurne, The Netherlands - Phone +31-611335661, email:
[email protected]
High-performance embedded computing could be crucial enabler of
bistatic RADAR & SONAR
Two surveillance technologies that have been in common use for
more than half a century -- radio detection and ranging (radar) and
sound navigation and ranging (sonar) may undergo substantial
enhancements with the addition of remote transmitters.
These offboard transmitters could create a new generation of
bistatic radar and sonar that not only could enhance the
performance of these systems, but also could preserve the
stealthiness of weapons platforms like jet fighter aircraft and
fast attack submarines.
Radar and sonar, in their essence, represent relatively simple
concepts: they both transmit energy that bounces off objects nearby
and detects targets by receiving energy from the return signals.
Radar bounces radio waves off targets, while sonar does the same
with sound waves.
An added benefit of radar and sonar is the ability to estimate
the target's distance from the transmitter, based on the time it
takes for the transmitted signal to bounce back. They detect
potential enemies and give reasonably accurate estimates of how far
away the enemies might be.
MORE: see John Keller article (26-Jan-2016), John is editor at
Military & Aerospace Electronics CLICK HEREIt includes related
items with LINKS:• DARPA eyes bistatic sonar with UUV-based pingers
to preserve stealth of attack submarines• Stealth-detecting
bistatic radar is back in the news• Navy reaching out to industry
for expertise in bistatic sonobuoys for wide-area airborne ASWThis
third point in the surveillance chain complicates the sonar signal
processing challenge, and adds difficulties of time lag, potential
uncertainty of the relative positions of transmitter and receiver,
and a host of other factors that would require sonar systems with
supercomputer-like power.
Such challenges, however, may be getting a solution with today's
high-performance embedded computing (HPEC) technology. Embedded
versions of the Intel Xeon processor, as well as other
high-performance processors, could provide that kind of
supercomputer power to deployed aircraft and submarines, and
perhaps even new generations of UAVs and UUVs.
Embedded Systems World - January 2016 Page 8
http://www.militaryaerospace.com/articles/2016/01/bistatic-radar-sonar.html?cmpid=EnlEmbeddedComputingFebruary82016&eid=295595503&bid=1304088
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