Ted Dangelmayer and Terry Welsher, of Dangelmayer Associates, present two topics involving Electrostatic Discharge (ESD) and the connection to product reliability. Please join both presentations to increase your understanding of the impact of ESD and specific considerations during product design. Many engineers are aware of some aspects of the importance of ESD as a threat to product yield, returns and malfunction. What is surprising is the breadth of its impact across a wide variety of products, technologies, services and markets. For instance, it has recently been determined that, for some technologies, many EOS (Electrical Overstress) failures have been misdiagnosed and were actually ESD. In this seminar we present a broad survey of the impacts including this EOS misdiagnosis issue. The best known effects, those on integrated circuits, will be discussed and the implications of the IC technology and packaging roadmaps will be discussed. We will also describe the effects on other areas including MEMS, flat panel displays, phototools, manufacturing equipment, hand-held devices and operating systems. In each case we will describe how ESD caused failure or malfunction. Where available, industry-wide data will be summarized. Newly realized ESD failure mechanisms such as Charged-Board Events (CBE), Cable Discharge Events (CDE) and transient-induced latch-up will also be discussed.
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Transcript
Part I:Broad Impact of Electrostatic Discharge (ESD) on ProductDischarge (ESD) on Product
ASQ Reliability DivisionASQ Reliability Division Short Course SeriesShort Course SeriesThe ASQ Reliability Division is pleased to present a regular series of short courses
featuring leading international practitioners, academics and consultantsacademics, and consultants.
The goal is to provide a forum for the basic andThe goal is to provide a forum for the basic and continuing education of reliability
Human Body Model When the air breaks down between the human’s finger and an IC pin, charge is suddenly transferred from the person via the grounded pin of the IC to ground.