This is a two parts lecture series. Many companies have begun their lean journey and have implemented lean manufacturing methods. The next step is applying lean to other processes including product development. While Lean New Product Development (Lean NPD) does focus on customer value and eliminating waste, it is also a front loaded, knowledge based approach. From a quality and reliability perspective, this should be viewed positively because it offers the opportunity to do the up front tasks needed to ensure robust and reliable products. This 2-part webinar provides in introduction to Lean NPD and shows how it can be applied to reliability requirements definition, design decisions, risk assessment and mitigation, critical characteristics and process control, product testing, and failure analysis / corrective action to improve product reliability and robustness. Part 1 introduces the key elements of lean new product development, reliability requirements definition, Lean Quality Function Deployment (QFD), set based design, change point identification, and integration of reliability tasks into the decision flow and value stream.
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Part 2:Part 2:Using FMEA, DFR, Test and Failure Analysis in Lean NPD
ASQ Reliability DivisionASQ Reliability Division Short Course SeriesShort Course SeriesThe ASQ Reliability Division is pleased to present a regular series of short courses
featuring leading international practitioners, academics and consultantsacademics, and consultants.
The goal is to provide a forum for the basic andThe goal is to provide a forum for the basic and continuing education of reliability
Potential Key Characteristic Possible Annoyance Zone
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SEAL COMPRESSION HEIGHT
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SERATION DAMAGE
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Special CharacteristicsMatrix
Process Steps from Flow Chart
Characteristics from Requirements and DFMEAEffect of Step onCharacteristics
Developing the Control Plan• Prioritize Process Risks Identified in the
PFMEA and the Special CharacteristicsMatrix
• Process Flow Diagram• Lessons Learned from Similar Processes• Process Control Data from Related
Processes• Measurements Required for Process Control• SPC Control Limits• Complete the Items in Control Plan Template
Control Plan ItemsMachine, Device, Jig,
Tools for Mfg.For each operation that is described, identify the processing equipment machine, device,
jig, or other tools for manufacturing, as appropriate.
No. Enter a cross reference number from all applicable documents such as, but not limited to,process flow diagram, numbered blue print, FMEAs, and sketches.
Product Features or properties of a part, component or assembly that are described on drawingsor other primary engineering info. Compilation of important product characteristics.
Process Process variables that have a cause and effect relationship with the identified productcharacteristic. Identify those process characteristics for which variation must becontrolled to minimize product variation. There may be more than one processcharacteristic for each product characteristic.
Product/ProcessSpecifications/Tolerance
Specifications/tolerance may be obtained from various engineering documents, such as, butnot limited to, drawings, design reviews, material standard, computer aided design data,manufacturing, and/or assembly requirements.
Evaluation/Measurement/Technique
Identify the measurement system being used, including, gages, fixtures, tools, and/or testequipment required to measure the part/process/manufacturing equipment.
Sample When sampling is required list the corresponding size and frequency.
Control Method Brief description of how the operation will be controlled, including procedure numberswhere applicable. Operations may be controlled by SPC, inspection, attribute data,mistake proofing, sampling plans, and other. If elaborate control procedures are used,reference document by ID name/number.
Reaction Plan Specify the corrective actions necessary to avoid producing nonconforming productsor operating out of control. May also refer to a specific reaction plan number and identifythe person responsible for the action.
Using the Control Plan
• For Critical Characteristics, Use ControlPlan to Identify:– Measurements: How, When, How Often– Controls to Keep Characteristic in Tolerance– Actions if Characteristic Out of Tolerance
• Use Lean NPD Tools to IdentifyUnknowns, Apply Resources, AssignTasks
Design for Reliability andRobustness
How do we Design-in Reliability?• Stress Analysis and Test
– Find Product Limits & Understand User Needs– Products fail due to variation or in limit environments
where stress exceeds strength– Stress and strength distributions:
DFR Strategies
Stress-Strength vs. Age
Reducing Stress / StrengthInterference
• Increase strength of the part– Understand operating environment stresses– Select more robust parts or materials– Increase design margin– Supplement deterministic design with probabilistic
tools• Reduce part strength variability
– Understand sources of part variation and deterioration– Controlled production process (SPC)– Protect vulnerable components
• Production Validation– Demonstrate Corrective Action is Effective– Validate Final Product Made on Production Tools
Robustness Indicator Figure
Factors(Temperature, Vibration,Humidity etc) Analysis & Test Results for
Each Factor on current ornew product
Requirement orSpecification Margin or
Robustness ofDesign Factor
(Can be Created in Excel using Radar Chart)
If RequirementExceeds TestResult or hasSmall Margin,Design is NotRobust
General Approach to AcceleratedLife Test (ALT)
• Understand Failure mechanisms• Understand Operating and Design Limits• Clarify Use Level Stress Application• Conduct Qualitative tests like HALT or step-
stress tests to define product limits and failuremodes
• Conduct Quantitative ALT to extrapolate life atuse level conditions– Times to Failure at Accelerated Stress Levels– Use life-stress relationships and distributions
ALT Plan• Stresses to be Considered• Life-Stress Relationship for Each Stress• Application Use Level for Each Stress• Use Level Failure Criteria / Threshold• Test Duration and Resources Available• Consider Use of DOE to help estimate:
– Stress Factors with Most Effect– Probability of Failure at Specified Use Level– Probability of Failure at Maximum Stress– Interactions to Help Define Life-Stress Relationship
Highly Accelerated Life Test(HALT) – Qualitative ALT
1. Improve Reliability by FindingWeaknesses and CorrectingThem Early.
2. Establish Upper and LowerOperating and Destruct Limits ofEnvironmental Stressors
3. Typically done in Temperature &Vibration Chamber forElectronics & ElectromechanicalProducts
4. Concept can be Applied to OtherStressors (Voltage, Current,Mechanical Loads, etc.)
Quantitative ALT
• Test to Failure at Multiple AcceleratedStress Levels
• Use Analysis to Extrapolate Reliability orLife at Application Use Level Stress
• Can be Used to Demonstrate Ability toMeet Reliability Requirements
Cautions on Acceleration• Understanding product limits helps prevent accelerating
to unrepresentative stresses and failure modes• Time
– Consider Heat Buildup– Effects of Cycling
• Temperature– Material Phase transitions– Non-linear response– High temperature or thermal cycling?
• Power– Protective and limit devices– Transients
• Vibration– Mechanical limits or resonances
• What failure mechanism are we accelerating?
Data Collected• Test Parameters Measured
– Temperature, Power Density, Cycle Rate, Vibration,Humidity, Voltage, etc. applied
– Product Response or Function (monitor during test)• Time to Failure or Run Time (Suspended)
– At least 3 Different Stress Levels– Fit Data Points to Appropriate Distribution
• Product Limits from Step Stress Test• Failure Mode Observations
Data Analysis• Analyze Data and Extrapolate Life at Use Level
– Arrhenius – Temperature– Eyring – Temperature or humidity– Inverse Power Law – Voltage, Power, Mechanical– Multiple Life-Stress Models
• Temperature / Humidity• Temperature / Non-Thermal: Temp / Voltage or Power• General Log Linear: multiple accelerating stresses• Proportional Hazards: multiple covariates• Cumulative Damage – Time varying stress profiles
Data Analysis – Use LevelReliaSoft ALTA 7 - www.ReliaSoft.com
Data 1General Log-LinearWeibull328|10|1F=35 | S=51
Pdf Line
John PaschkewitzWatlow Electric Mfg Co2/4/20083:41:01 PM
Life vs. Stress as Trade-OffRe l ia So ft AL TA 7 - w w w .Re l ia So ft.c om
L if e v s S t re s s
Std= 0 .7937 ; K= 7 .1350E-12 ; n= 3 .6556
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M ea n L i fe L ineTop CB M e a nBo ttom CB M ea n
157.8S tre s s L e v e l Po in tsM ed ia n Po in tI m pos ed Pd f
186 .7S tre s s L e v e l Po in tsM ed ia n Po in tI m pos ed Pd f
281 .6S tre s s L e v e l Po in tsM ed ia n Po in tI m pos ed Pd f
J ohn Pa s c hk ew itzW a tlow E le c tric M fg Co10 / 8 / 20093 :06 :05 PM
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R e g i o n o fU n a c c e p ta b l eW a tt D e n s i ty
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A LT C y c les f rom 250 t o 430 C
A LT C y c les f rom 250 t o 500 C
0 . 168" d ia s hea t h. 021 " d ia P C N iC rw ire c y c led us ing
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Production Validation Test
• Repeat selected Qualification Tests onany Changes in Product or Process
• Test Samples made on ProductionProcesses
• On-Going Reliability Test (ORT)– HASS – Highly Accelerated Stress Screening– HASA – Highly Accelerated Stress Audit– Periodic HALT Re-Test on Production Units
Failure Analysis / FRACAS
Failure Analysis Tools• Basic
– Recovery of Failed Samples– Electrical Test, Microscopy, Digital Photography
• Non-Destructive Methods– X-Ray (Real Time Digital is Particularly Helpful)
• Disassembly / De-capsulation– Tools or Chemicals to remove layers
• Scanning Electron Microscopy & EDS– Defects, Corrosion, Material Failure
• Acoustic Microscopy / Imaging (Voids / Defects)• Some Internal, Others at Outside Labs
NDT – Electrical Characteristics
Curve Tracer – Showing Good and Failed Part Response
Real Time Digital X-Ray
Real Time X-Ray Example
Digital X-Ray Examples
SEM / EDS
Example of SEM / EDS Analysis
Pt: Rh: Al87:10 : 3 Pt : Rh : Si
82.7:10.3:6.7
PCB Failure Analysis Methods
Thomas Paquette, Insight Analytical Labs, Test & Measurement World, August 2006.
Failure Analysis Summary
• Progressive Use of Tools from NDT toDissection and Cross-Section Exam
• Objective is to Find Physical Evidence ofFailure Mechanism
• Document with Photos and Analysis toCapture Knowledge Gained
• Update FMEA or DRBFM with FA Findings
FRACASFailure Reporting, Analysis & Corrective Action System
• Build Knowledge Base• Process and Tool
– Reliability & Quality of Product, Service, Process orSoftware is Tracked, Measured, and Improved
– Applies to Entire Product Life Cycle– Consistently Ranked Among the Most Important
Reliability Tasks– Closed Loop: Ability to Feed Root Cause & Corrective
Action Information Back Into Design Process forFurther Improvement
Hierarchy of Failure Causes
Design Related Failures
Manufacturing & QualityRelated Failures
Repair Induced
CustomerInduced
Capture Failures from Verification Test to Field Operation
Capturing FA Knowledge• Capture Failure Analysis Results in
Searchable Tool– Commercial Data Base Tool– A3 Format Documents with Keywords– SharePoint (Microsoft)
• Key is Ability to Retrieve Knowledge withMinimal Search Effort
• Lean NPD is Knowledge Based – Key isContinually Adding to AccessibleKnowledge
Summary• Features of Lean NPD for Reliability
– Front End Focus to Gain Knowledge• Basis for Better Design Decisions
– Design for Robustness, Reliability– Understand Physics of Failure
• Testing to Learn and Verify– Test to Failure and Understand Causes
• Knowledge Capture for Future Re-use• Develop & Control Critical Characteristics
References• King, John P. and Jewett, William S.;
Robustness Development and ReliabilityGrowth; Prentice-Hall, Boston, 2010.
• SAE International, J1211, April 2009, Handbookfor Robustness Validation of AutomotiveElectrical / Electronic Modules.
• Using DOE Results in Design of ALT, Reliability Edge,Vol 10, Issue 2, pp. 1-7.
References• SAE 2003-01-2877, Reliability Problem Prevention
Method for Automotive Components, H. Shimizu, T.Imagawa, H. Noguchi.
• A Guide to GD3 Activities and DRBFM Technique toPrevent Trouble, S. Kano, H. Shimizu, Toyota, 2001.
• Lean Product Development, Eric Rebentisch, Oct 5,2005, MIT Open Courseware,http://ocw.mit.edu/courses/aeronautics-and-astronautics/16-852j-integrating-the-lean-enterprise-fall-2005/lecture-notes/8_rebentisc_leng.pdf
• Bill Haughey, DRBFM, Applied Reliability Symposium,June 2007, March 2008
• Please provide your feedback on this webbased short course: e-mail [email protected] or to ASQ RD
• One day seminar on this topic availablethrough:http://www.hobbsengr.com/Accelerated_Reliability_Seminar_Schedule.htm– Apr 13, 2011 in Chicago, IL– May 2, 2011 in Minneapolis, MN