ENIAC JOINT UNDERTAKING “Final Publishable Summary Report” EPT300 Enabling Power Technologies on 300mm wafers ENIAC Call 2011/2 Coordinator Infineon Technologies Austria AG Johann Massoner Cristina De Luca (P.M.) Management Support EUTEMA Erich Prem Jörg Irran (P.M.)
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ENIAC JOINT UNDERTAKING
“Final Publishable Summary Report”
EPT300
Enabling Power Technologies on 300mm wafers
ENIAC Call 2011/2
Coordinator Infineon Technologies Austria AG
Johann Massoner Cristina De Luca (P.M.)
Management Support
EUTEMA Erich Prem Jörg Irran (P.M.)
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ENABLING POWER TECHNOLOGIES ON 300 MM WAFERS
EPT300 PROJECT - ECSEL JU
INTRODUCTION
EPT300 (Enabling Power Technologies on 300mm wafers) is a 36 month project that “aims
to be a decisive step forward to strengthen Europe’s leading position in power semiconductor
technologies and More-than-Moore manufacturing capabilities relating to energy efficient
electronic solutions. Power semiconductor
devices fabricated in a European leading
pilot line for 300mm wafer production are
the scope of the project, for which
manufacturing excellence, cost
competitiveness and challenging
applications are critical boundary
conditions”. EPT300 project started as
planned by first of April and the consortia
achieved already many intermediate
deliverables and milestones, according to
the technical annex plan. The partners
collaborate to the innovative approach in a
professional and active manner. EPT300 on one hand addresses challenges in research on
process and production technologies on the other hand on handling and automation for
advanced power technologies based on 300mm wafers. The major axes are the following:
The investigation of the future performance requirements and reliability targets for
demonstrator power technologies including application.
The development and research of enhanced substrate materials and ultra-thin wafer
technologies
The investigation and implementation of enhanced equipment and new power
processes for 300 mm
Automation challenges for 300 mm thin wafers are covered by developing new
concepts and requirements, researching new possibilities in factory automation and
material handling in a mixed wafer environment and also in wafer transportation
carrier, automated wafer substrate tracking and transportation.
The final challenge of EPT300 project is: the setup of the first pilot line and high volume
power 300mm production with the first demonstrators in CoolMOSTM, IGBT and SFET
technologies.
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CONSORTIUM
EPT300 is a focused 36 month project with 23 partners
including large industry, small and medium enterprises and
research institutes from Austria, Germany, Italy and the
Netherlands.
The very broad know how across consortium members
associated with high competences of a semiconductor
company like Infineon can act as engine for “R&D in Europe
micro- and nanotechnologies”.
AUSTRIA
Infineon Technologies Austria AG is a legally independent subsidiary, 100% owned by
Infineon Technologies AG in Germany. It is one of the globally acting manufacturing and
research &development centres of Infineon Technologies AG.
Infineon Technologies IT-Services GmbH is a global center of competence delivering and
developing IT services and solutions for approximately 25.000 IFX employees at more than
80 IFX sites on three continents (Asia Pacific, Europe, North America).
Lam Research Corporation has been a major supplier of wafer fabrication equipment and
services to the worldwide semiconductor industry for more than 30 years.
mechatronic systemtechnik gmbh is a successful, fast-growing high-tech company
headquartered in Villach, Austria. mechatronic has several years of experience in the
semiconductor industry providing fully automated handling solutions for handling thin or
warped (dome-, bowl-, or potato-shaped) wafers.
SICO Technology GmbH is an SME employing 45 people. SICO manufactures and
processes fused silica, fused quartz, various types of silicon and ceramic products for
various industries that include semiconductor, optical, automotive and aerospace.
Artesyn Austria GmbH&CoKG 100% owned by Emerson who is a world leading supplier of
power supply equipment, from 1 Watt mobile phone chargers, several kW telecom rectifiers
and solar inverters up to MW UPS solutions for data centers and wind mills. Emerson serves
the entire industry, from Telcom, Datacom, Computing and Storage, Medical, Lighting, Solar,
Electric Drives, Wind Power, Defense and Arospace.
CTR is a non-universitary, ISO 9001:2008-certified R&D centre focussing mainly on
Advanced Sensor Systems and Technologies. As a professional, industry-oriented R&D
service provider CTR conducts both fundamental research and application-oriented R&D
projects for and with its customers.
eutema is a strategic research and technology consultant company based in Vienna, Austria
with a focus on ICT. It is skilled in designing and managing research programmes and
projects as well as RTD policies.
Universität Klagenfurt The Department of Statistics is part of the Faculty of Technical
Sciences of the University of Klagenfurt.
ITALY
LPE was founded in 1972 as a producer of chemical wet benches and small cvd reactors.
Starting from 1987 LPE focused his activity to silicon epitaxial reactor for power devices.
From then LPE has established various satellite companies in the USA, in Czech Republic,
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in France, in Japan and in 2004 in China.
GERMANY
HAP was founded in 1991 by two scientists of Carl Zeiss Jena. HAP is a SME and develops
and manufactures handling solutions, robotics for wafer, carrier, masks, pellicle and for PCBs
and complex automatization for semiconductor industry and solar industry.
Infineon Technology Dresden GmbH is one of the largest production sites of Infineon
Technologies AG. Infineon Technologies AG, headquartered in Munich, Germany.
Infineon Technologies AG, headquartered in Munich, Germany, focuses on three central
challenges facing modern society: Energy Efficiency, Mobility and Security. Infineon offers
semiconductors and system solutions for automotive and industrial electronics, chip card and
security applications.
For over 10 years, Roth & Rau - Ortner GmbH (former Ortner c.l.s. GmbH) has participated
in complex production logistics with a broad portfolio of customised services for the
semiconductor industry. The focus of its work is on the development and production of tailor-
made automation solutions and customer specific service concepts for the improvement of
company internal material flow for semiconductor manufacturers.
Semikron is an internationally leading power semiconductor manufacturer. 2011 marks the
60th anniversary of the German-based family enterprise which employs 3600 people
worldwide
Siltronic AG is a global leader in the market for ultra-pure silicon wafers and the partner of
numerous leading chip manufacturers. Siltronic AGdevelops and manufactures wafers with
diameters of up to 300 mm at production sites in Europe, Asia and the United States.
Technische Universität Dresden is a leading region of semiconductor engineering and
manufacturing in Europe (Globalfoundries, Infineon, X-FAB, ZMD) with large second and
third-level delivery industry and a strongly evolving software industry (Deutsche Telekom,
SAP-SI).
NETHERLANDS
Philips Healthcare is an expanding business that plays a significant role in the vision of
Philips that is built around healthcare and lifestyle.
ASM is a leading manufacturer of wafer-fab and packaging equipment and materials. ASM’s
Front-end Operations has a 40-year track record in the industry, particularly in all types of
CVD technologies such as LPCVD, ALD, RTCVD, PECVD and Epitaxy.
Bruco Integrated Circuits B.V. is specialized in design of custom made Integrated Circuits.
Bruco Integrated Circuits offers design services that focus on the development of analog,
mixed-signal, RF and high voltage custom made integrated circuits.
Heliox is specialised in the research, design and manufacturing of high performance power
conversion products. The R&D department of Heliox is mainly located in The Netherlands.
Eindhoven University of Technology Electromechanics and Power Electronics (EPE) group
has an extensive expertise in the fascinating field of advanced methods and tools to enhance
the analysis, design and multi-objective optimization of innovative electromagnetic structures
and cyclically switched networks.
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TECHNICAL ACHIEVEMENTS AND EXPLOITATION POTENTIAL
EPT300 project is based on the concept of 300mm wafers in a 1:1 transfer approach from
200mm to fully prove compliance with application requirements. So the old device in 200mm
should have the same performance of the transferred device in 300mm. The challenges in
EPT300 are related to the processes, equipment, automation and handling, substrates that
are needed for such a “challenging” transfer to a higher area of wafers. It is obvious that all
partners in the projects contributed in a professional and constructive way to these
remarkable results. All contributions finally lead into a released technology platform. It’s also
worth to mention that for the partner Infineon the overall cost especially to mitigate the risk by
running alternative paths have been much higher as claimed by the EPT300 project, which is
only a part of a global activity for 300mm.
PERFORMANCE INDICATORS CONCERNING EPT300:
Demonstrators for all technologies (CoolMOS™, SFET4 and IGBT 1200V) available.
Demonstrators
Technologies Planned Achieved demonstrators and
qualification for production
CoolMOS C3,C6 C3,C6,C9
SFET 4 4, 5
IGBT 1200V 1200V, RCH3
Overall improvements:
Yield Frontend 8” yield performance baseline exceeded by >0.5%
Yield Backend YB 1,2% better than planned
Costs reduction Actual cost performance improvement for 300mm Wafers
compared to 200mm Wafers is in the expected range of 22%-
30% @ pilot line Villach.
Technology readmap Technology roadmap for 300mm power technologies is defined
for the sites Villach and Dresden.
Line stability Line stability cpk better than 8”
Thin wafer
manufacturing
processes specified
and defined
Qualified and base line volume established in Infineon Villach;
also Dresden ready to run initial volume
Proof of the optimized
logistic
A 300mm logistic flow over the whole process line including front
end to back end and a secure transport of 300mm thin wafers is
now established and qualified at Infineon (IFAT, IFD and IFAG)
ant its partners in the supply chain
Demonstrating a
thickness of about ½ of
300mm thin wafer technology is demonstrated and qualified for
CoolMOS™ (200µm & 60µm), IGBT (120µm) and SFET
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the current state of the
art
technology (40µm). 1st results to enabling the next generation of
ultra-thin wafer technology are available. Further investigation by
concept studies to be finished to explore the limits
Raw material costs
efficiency in
comparison to 200mm
For the unified power substrate and lightly doped n type wafers
an increase in cost of 5 - 10% is expected on the long term.
Therefore the price difference per area will go up. These
disadvantages of the 300mm substrates in cost could be
compensated by measures taken in 300mm wafer production.
Uniformity optimization
@ Si spin etch
Improvement of the uniformity from 2.7% to 2.1% was achieved
with hardware (equipment) and process modifications.
Future performance requirements and reliability targets for demonstrator power
technologies including application
In the EPT300 project, new base materials and new equipment were explored for power
semiconductor technologies. Therefore we used this as opportunity to design new product
characteristics. A “try and error” approach would not be feasible because of the enormous
costs. This activity was mainly conducted in the 1st and 2nd year of the project and was
successfully closed; the results were used as input for the definition of future application
power converter designs in the different application domains.
All application demonstrator designs have been defined and simulated by the different
teams. The goal of the defined demonstrators was to proof the 1:1 capabilities of the EPT300
devices. Targeted applications in this project were:
Next generation power converter for Medical Equipment
Low EMI power converter
Highly efficient telecom rectifier
In the last year of the project the functional models has been converted to the final
demonstrators by implementing necessary updates of the design or convert the lab model to
a first production prototype model. The updated demonstrators have been successfully
finalized and used to conduct the 1:1 capability measurements of the transferred products
which are already available on a 200mm.
IMPROVEMENT per application:
Next generation power converter for medical equipment
Demonstrator was developed and will be available for Medical X-ray products with the
following advantages:
1) Excellent EMI behavior by using soft switching techniques (cost advantages because of less measures needed to stay in the requested limits for the medical application, this could be housing bus also additional suppression components. At the end this will save costs);
2) Higher efficiency – loss reduced
3) Size reduction and costs reduction achieved
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4) Efficiency of isolated concept increased
Low EMI power converter:
The demonstrator is a “PI-AVR” (PI for an alternator voltage regulator) with low EMI active 3
phase automotive rectifier. The target of loss reduction was achieved and the efficiency gain
was in the required range.
Highly efficient telecom rectifier:
The prototype development resulted in a highly efficient telecom rectifier. Increase the
efficiency was a must to enable convection cooling. This could be achieved by using the
latest power electronic components.
Burn–in reduction:
Industrial and automotive applications show a steadily increasing demand in terms of quality
and reliability. Various qualification tests are implemented in order to guarantee the products
long term stability. Semiconductor devices show an increased failure rate at the beginning of
their life. Different procedures are applied for keeping this early life failure rate (ELFR) level
at a minimum. However, in case of novel technologies, new production lines etc., the actual
ELFR needs to be evaluated. This is done by stressing an independently selected number of
devices after production – referred to as burn-in study. A burn-in study is successfully
completed if the early life failure probability p is proven to meet a target ppm-level at a certain
confidence level. In general, zero failures are required. Once a fail occurs, the burn-in study
actually has to be restarted. The total savings of new burn-in methodologies exceed the
expected results and lead to a faster closure of BI studies and release from 100% BI.
AUTOMATION challenges
Within the EPT300 project a lot of automation challenges were addressed already at the
beginning of the project establishing the first worldwide semiconductor fabs using 300 mm
power manufacturing processes. Many of the new processes required new materials, or
equipment which was not available at the market supporting the classic semi 300 standards.
Therefore, high efforts were spent for equipment and process automation for a lot of new
non-standard tools. Classic automation systems using robotic tool loading are using
conveyor based tool loading system like robotics (see Fig.1b) or overhead (OHT) based
automated material handling system, see Figure 1 c below. Within the EPT300 project all
different automation concepts were investigated for their optimized use within the new 300
mm wafer facilities and implemented within the pilot lines.
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Another focus area was the development of automated handling procedures of 300 mm thin
wafer handling. Those substrates are very sensitive in terms of wafer breakage and all end
effector systems within the special thin wafer process chain must be optimized to the
individual requirements of each handling procedure. Figure 2 shows the handling platform
used at IFAT and IFD using typical end effectors, shown in Fig. 2b. Handling of thin wafers
was optimized to the lowest possible contact regarding particle and defect density level (see
example of a typical defect density map within Fig.2 c) as well as lowest level of trace
element contaminations on the wafers.
Very complex is the use of many different substrate types including orientation of the wafers.
A lot of new automation- as well as new identification concepts, and sorting steps were
worked out fulfilling the requirements of the power 300 business.
As a new method, a tool box for analysing and simulation of new automation concepts as
well as capacity evaluation for existing automated material handling system was developed
which is the base for many new performance monitoring before implementation of cost
intensive transportation hardware. Figure 3 shows an example for the virtual fab analysis
which is used now within the ramp up of the fabs.
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Figure 3: Example for fab simulation (demonstrator was worked out within EPT300)
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ABSTRACTS FROM EPT300 - INNODAY 2015:
EASYLOAD 300-200: Automation with Focus on Mixed-Wafer Fab