Engineering Simulation: The Road(s) Ahead€¦ · Rand 3D PLM services, re-seller 2 Sharc meshing for CFD (Harpoon) 1 Siemens PLM Software PLM, MCAE, FEA, pre-post, mech. testing,

NAFEMS World Congress 2015 | 21-24 June | San Diego | California | USA

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Engineering Simulation:

The Road(s) Ahead

Dr. Dennis A. Nagy

Principal

BeyondCAE


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Engineering Simulation:

The Road(s) Ahead

• There are multiple major themes being pursued in CAE

in the foreseeable future — I will highlight just a few

• I may be a “CAE expert” but “predictions are hard,

especially about the future”

• Everyone at this NWC 2015, from the biggest gurus to

the most recent neophytes, can play a role in

determining the actual roads taken


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MCAE Encompasses Many Themes

• The very large list of sub-topics under

(M)CAE (and the massive number of

presentation topics here at the NWC)

needs some structure

• My three ways of classifying the many

themes/subjects of MCAE are

– Along the MCAE Food Chain

– Around the MCAE Total Solution Pinwheel

– In the 4-D “Multi” space


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*i.e., realistically, how long does it take a development to

move from initial research idea through to end-user use and

significant perceived/measured business benefit?

BENEFICIAL

INNOVATION

How fast do key

developments

flow along this

food chain?*

NWC 2015 Presentations and Exhibitors: Where Do They Fit Along the MCAE Food Chain?

X

60

= ~Number of

NWC 2015

Presentations

91

23

82


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NWC 2015 Presentations: Where Do They Fit

Around the MCAE Total solutions “Pinwheel”?

Four main components and four connectors


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NWC 2015 Presentations: Where Do They

Fit in the MCAE 4-D “Multi-” Space?

Co-simulation

MBSE (Model-Based

System Engineering)

Software tools and

product development data

available on global clouds


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Multi-Geographical: Globally-Distributed

Design Teams and Suppliers


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(My) Leading* Themes on the Roads Ahead (numbers are for reference, not priority!)

1. User Environments

2. Dramatic Expansion of Useful CAE

3. The “Appification” of CAE

4. Computing: HPC, Cloud and New Hardware

Architectures/Devices and Programming

Paradigms

5. New Materials: Simulation Design

6. Synergy of Topology Optimization and 3D

Printing (Additive Manufacturing)

7. Traditional CAE Meets System Engineering

(MBSE) *There are many more—I’ve chosen just a few


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1. CAE User Environments:

A Fork in the Road?

Broad General-purpose

CAE environments, e.g.,

Ansys AIM, MSC Apex,

Abaqus CAE, Siemens

PLM NX CAE,…

Domain/problem-specific

“vertical” applications,

templates, and application-

builder tools (“SimApps”) e.g.,

Ansys ACT, COMSOL

Application Builder, Comet,

EASA,… Enhancing ease-of-use and

productivity for

continuously-growing

community of CAE

specialists and CAE-

knowledgeable product

development engineers

Opening the “CAE

Door” to engineers,

designers, and even

non-engineers to

leverage useful CAE

(sometimes “under the

covers”)


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3. The “Appification” of CAE:

Key Enabler in Dramatic Expansion

• Gap will not be proactively

closed anywhere near fast

enough by only continuing

to train engineers on today’s

general-purpose CAE

tools/systems

• Vertical Apps/Templates,

capturing/embodying

domain/problem-specific

expertise, and hiding the

details of general-purpose

CAE “under the covers,” will

be essential to accelerate

effective use of CAE


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3. The “Appification” of CAE:

Key Enabler in Dramatic Expansion

• Desktop Engineering relevant articles:– Managing Simulation Democratization, Jamie Gooch, April 1,

2015

– The “Appification” of Simulation, Kenneth Wong, April 1, 2015

• Dedicated Session (within SPDM Conference) – 7K - “Democratizing CAE with SPDM” (362)

– G. Valine (GKN Driveline), M. Panthaki (Comet Solutions), M. Tiller (Xogeny)

• Front End Analytics (FEA), NWC Sponsor

– J. F. Betts presentation (411) (1K, Monday,13:30)

– Front End Analytics session (5K, Tuesday, 16:20)

• Other presentations: 78, 188


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4. Computing: Hardware,

Programming, and Accessibility• Major trends affecting CAE’s future:

• Massively-parallel architectures

– Non-Von Neuman

– New programming languages leveraging massively parallel

• Rapid penetration of practical HPC-based Cloud Computing

• Immersive visualization

• Cognitive computing, quantum computing,…

– Open issue: If/when current-generation CAE software will

need to be re-written?

• See in particular:– Prof. Ahmed Noor’s Keynote (Tuesday 8:55)

– Louis Komzsik’s invited presentation (Wednesday 9:45)

– Exhibitors:

• Penguin Computing, Eon Reality, Frauenhofer, NAG, zSpace

– Other presentations: 35, 123, 308, 339, 341, 422, 427, 362

– My chaired session: 6C HPC4 – Cloud, Tuesday, 17:40


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• The move to composites replacing metals was the first

step

• More realistic simulation of composites and other more

complex materials has led to “virtual testing” (simulation)

to compute material properties and use them as additional

design parameters, which can then also be optimized

• Major CAE vendors have acquired corresponding

expertise: – MSC: eXstream

– Siemens PLM:

– DS/Simulia:

• Talk to them in Exhibit area, as well as Granta, HBM

nCode,

• Presentations: 15, 29, 45, 54, 73, 90, 108, 127, 137, 173,

187,197, 218, 232, 286, 353, 375, 377, 401, 413


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6. Synergy of Topology Optimization and

3D Printing (Additive Manufacturing)• Topology optimization started as a small niche tool because the

resulting weight-optimized free-form (almost organic) shapes were

usually not cost-practical to manufacture

• 3-D printing (additive manufacturing) of production

parts/components using variety of structurally suitable materials has

now emerged as practical for “exotic” organic shapes

• WatchDE/Microsoft Webinar:

Optimization and 3D Printing Revolutionize Design

Thursday, June 25, 2015 | 2:00 p.m. ET

• Presentations: 101, 133, 154, 238


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7. Traditional CAE Meets System

Engineering (MBSE)

• NAFEMS-INCOSE partnership just a first step, just

starting to produce results

• Key role in cascading requirements, systemsub-

systemcomponent multi-fidelity simulation

• Leading 3-D CAE vendors now have MBSE tools:

– Ansys:

– Siemens PLM: Imagine

– DS: Dymola

• Talk to Ansys, Siemens, Simulia, INCOSE in the

Exhibition area

• Presentations: 63, 196, 300, 336, 368


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Sessions Relevant to My Leading Themes1. User Environments

– 7E, 8F, 8J


– 3G, 4G, 6J

3. The “Appification” of CAE

– 5K, 7K

4. Computing: HPC, Cloud and New Hardware Architectures/Devices

and Programming Paradigms

– 3F, 4F, 5G, 6C


– 1C, 1D, 2C, 3C, 4C, 5C

6. Synergy of Topology Optimization and 3D Printing (Additive

Manufacturing)

– 1D, 1J, 3J, 4J, 5E, 5J, 8C

7. Traditional CAE Meets System Engineering (MBSE)

– 1F, 2F, 5B, 6F, 7J


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The Exhibiting Vendors are Very Active:

Go Out and Talk to ThemExhibitors (see Exhibition Plan) Specializations Themes

Altair CAE envoronment (Hyperworks), cluster mgmt. 1,3,4,6

Ansys MCAE, ECAE, EDA, CAE environment 1,2,3

Autodesk PLM, MCAD, MCAE 1,4

Beta CAE Systems MCAE pre/post 1

CD-adapco broad CFD offering 1,2,3

ChiasTek system integration, co-simulation 7

Convergent Science CFD for IC engines 1,3

Dassault Systemes Simulia FEA, pre/post, PIDO, composites, optimization 1,2,5,7

Dynardo Robust design optimization 6

Electro Magnetic Works electromagnetic simulation 1

Engys open-source CFD, optimization 1,6

Eon Reality virtual and augmented reality 4

ESI MCAE, manufacturing, crash/impact 1

Esteco optimization, MCAE environment 1

e-Technostar pre/post, MCAE for automotive 1

Fraunhofer SCAI algorithms, methods in Computational Science 4

Front End Analytics (FEA) vertical MCAE apps, process automation 3

Granta Design materials database 5

HBM-nCode fatigue and durability software 5

INCOSE system modeling 7

Intes FEA, pre/post 1

ITI TranscenData CAD, CAM, CAE, PLM data exchange interfaces 2

Mentor Graphics EDA, CFD, electronic cooling 1

MSC Software FEA, pre/post, MBD, materials, composites 1

NAFEMS everything! 1-7

Numerical Algorithms Group (NAG) math subroutines, HPC 4

Penguin Computing cloud services 4

Phoenix Integration optimization, PIDO 6

Plan International promote and protect children's rights

Rand 3D PLM services, re-seller 2

Sharc meshing for CFD (Harpoon) 1

Siemens PLM Software PLM, MCAE, FEA, pre-post, mech. testing, MBSE 1,2,5

System@tic open-source cloud 4

Transvalor Americas materials-forming software 5

Weidlinger Associates Inc. engineering consulting 2

zSpace 3D virtual reality glasses 4


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The Heart of NAFEMS

As an international, non-profit association,

NAFEMS wants to look further than our own

membership, and actively contribute to

society at large. Starting at the NAFEMS

World Congress 2015 in San Diego this

year, NAFEMS will be raising funds for Plan

International, a charitable organization

which aims to help deprived children

throughout the world.

Please make sure to visit their stand

#24 in the NWC 2015 Exhibition area


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[email protected]

mailto:[email protected]

Engineering Simulation: The Road(s) Ahead€¦ · Rand 3D PLM services, re-seller 2 Sharc meshing for CFD (Harpoon) 1 Siemens PLM Software PLM, MCAE, FEA, pre-post, mech. testing,

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