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FACILITY, EQUIPMENT, AND PERSONNEL PROTECTION
Design considerations for grounding systems and proper bonding practices.
• 1936 – First public demonstration of CADWELD Process
1939Product installation
in the field
ERICO® MARKET FOCUS
5ERICO Grounding and Bonding
Purpose of Grounding
• The primary goal of the grounding system throughout any facility is SAFETY.
• Grounding is implemented to ensure rapid clearing of faults and to prevent hazardous voltage, which in turn reduce the risks of fires and personnel injuries.
• Secondary are effective lightning protection, diminishing electromagnetic coupling (EMC), and the protection against electromagnetic pulses (EMP).
Presenter
Presentation Notes
First and formost ensure clearing of the ground fault Secondary systems lightning protection and signal reference grids
EQUIPOTENTIAL PLANE (NEC 547.2)
Personnel Safety
An equipotential plane is an area where wire mesh or other conductive elements are embedded in or placed under concrete, bonded to all metal structures and fixed non-electrical equipment that may become energized, and connected to the electrical grounding system.
An equipotential plane minimizes ground potential rise8ERICO Grounding and Bonding
Grounding Electrode System
Basic Electrical Theory Resistivity
Resistivity is the intrinsic property of a material to impede the flow of electrical current. It is the resistance factored by the length and cross sectional area. It is also referred to as volume resistivity.
Equipotential Plane ?
• Equipotential Plane:A mass or bonded masses of conducting material that offers a low impedance to current flow.
Equipotential Bonding of Pools
Equipotential Grid Options and Equipment Bonding Requirements
Wind Power Opportunities
Exothermic Connections
Exothermic Connections
• Provide a Molecular Bond Between Conductors– Current Carrying Capacity
Equal to that of the Conductor– Permanent – Never Loosen or Corrode – Never get a Higher in
Resistance – Can be Visually Checked for
Quality
Comparison of Mechanical and Exothermic Connections
Molecular Bonds Guarantee Conductivity Across the Entire SectionContact and Spreading Resistance Portion of Connection is Zero