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137Catalog 1773095 Dimensions are shown for Dimensions are in millimeters Canada: +1 (905) 475-6222 UK: +44 (0) 800-267666Revised 4-12 reference purposes only. and inches unless otherwise Mexico/C. Am.: +52 (0) 55-1106-0800 France: +33 (0) 1-3420-8686
The MULTIGIG RT productline is a backplane intercon-nect family that offers flexi-bility and customization.This printed circuit based,pinless, interconnect familyis comprised of modularcomponents which can beused in a variety of combi-nations. The connectors inthis innovatively flexibleplatform can be combinedto provide the density, datathroughput, and signalintegrity required for appli-cations in today’s computer,military, medical, or indus-trial control industries. Theuse of printed circuit wafersin this connector system
allows for cost effectivesequencing and electricalcustomization of the con-nector. Wafers can be man-ufactured specifically fordifferential or signal endedperformance and theimpedance, propagationdelay, and crosstalk of theconnector can be alteredper customer requirements.This scalable board tobackplane connector familyis a robust, “pinless” designwhich eliminates the pinfield on backplane boardsand reduces the end user’sexposure to field failure incard cage systems. TheMULTIGIG RT connector
family is designed specifi-cally for 20.30 [.800] or25.40 [1.00] card pitchsystems.
� MULTIGIG RT 1connector —141 signals/inch, datarates up to 3.125 Gb/s
� MULTIGIG RT 2connector —113 signals/inch, datarates of 3.125 Gb/s to6.4� Gb/s and has beendemonstrated to support10 Gb/s
MULTIGIG RT connectorsconsist of interlocking leftend and right end signalmodules (half or full), centersignal modules, and standalone modules available invertical receptacles (back-plane application) and rightangle plugs (daughtercardapplication), and comple-mentary mechanical guideassemblies (available in size10.80 [.425], 9.00 [.354] or7.20 [.283]. The guideassembly provides blindmating and misalignmentfor the connectors. The10.80 [.425] and 9.00 [.354]guide assembly alsoprovides keying and isavailable with or withoutan internal contact forelectrostatic discharge(ESD) protection.
The modules are capableof being stacked in anyconfiguration within the limi-tations given in this catalogto a maximum length of 120between guide assemblies.These connectors performat two separate densitylevels: Tier 1 and Tier 2.The connectors are placedon the pc board bymanually-operated orautomatic machines.
The modules have 6, 8, or10 rows of signal contactswith 20.30 [.800], 25.40[1.000], or 9.00 [.354]centerline spacing (profilesize). A right angle plugmodule having 7 rows with20.30 [.800] spacing is alsoavailable for Tier 2 only toaccommodate special
applications used by theVMEbus International TradeAssociation (VITA). Thesignal contacts, along withthe ground contacts (in Tier1 modules only) and ESDcontacts (if using the 10.80[.425] guide assemblywith ESD contact) providesequencing for each group
of modules.
When corresponding withpersonnel, use the terminol-ogy provided to facilitateyour inquiries for information.Basic terms and features ofthis product are provided inthe art below and on the fol-lowing page.
Vertical Receptacle(Backplane) Connector
Product Selection Guide
HalfLeft End Module
FullLeft End Module
FullRight End Module
10.8 mmGuide Pins
7.2 mmGuide Pin
Stand AloneModule
Standoff
Center Module
Standoff
Collar
Key No Key
HalfRight End Module
Standoff
Standoff
Housing
Ground Contact(In Tier 1 Only)
Mounting PostWith Screw Hole
Mounting PostWith Threads
MountingPost
Eye-of-NeedleCompliant PinSignal Contact
Polarization Post
Polarization Post
Polarization Rib
Polarization Slot Polarization Slot
Contact Cavities
VITA, VMEbus, VPX, and VXS aretrademarks of VITA.
142Catalog 1773095 Dimensions are shown for Dimensions are in millimeters Canada: +1 (905) 475-6222 UK: +44 (0) 800-267666Revised 4-12 reference purposes only. and inches unless otherwise Mexico/C. Am.: +52 (0) 55-1106-0800 France: +33 (0) 1-3420-8686
Tier 1 and Tier 2 recepta-cles contain eye-of-needlecompliant pin signal con-tacts; the Tier 1 receptaclealso contains ground con-tacts. Each housing fea-tures standoffs for thermalventing, polarization ribs(on end modules) andpolarization slots (on thecenter module) for properstacking of the modules,and polarization posts toensure correct orientationon the pc board.
Plugs contain eye-of-needlecompliant pin signalcontacts and pc wafers(blades). The housingfeatures alignment pins toensure correct orientationon the pc board.
Guide Assemblies
The guide assemblyconsists of a guide pin(used with receptacles)and a guide module (usedwith plugs).
The guide pin features acollar and mounting post
(having a screw hole orthreads) with or without akey. The guide pins areavailable with various lengthmounting posts. The mount-ing post is used with cus-tomer supplied hardware toattach the guide pin to thepc board. Guide pins mustbe chosen according tothickness of pc board beingused; otherwise, interfer-ence with proper mating ordamage to system compo-nents will occur. Guide pinswith keys are available invarious keying positions.
The guide module featuresa housing with or without akey and with a screw hole,mounting post, and pilotpost. The mounting postand pilot post are used toposition the guide moduleon the pc board, and thescrew hole is used withcustomer supplied hard-ware to attach the moduleto the pc board. The 10.80[.425] and 9.00 [.354] guidemodule is available with orwithout an ESD contactlocated inside the module.
Right Angle Plug(Daughtercard) Connector
Product Selection Guide(Continued)
HalfLeft End Module
FullLeft End Module
FullRight End Module
10.8 mmGuide Module
7.2 mmGuide Module
Stand AloneModule
HalfRight End Module
Center Module
Housing
PC Wafers (Blades)
Alignment Pin
ESD Contact(Inside Module)
(Optional)
Housing
Pilot Post
Screw Hole
Mounting Post
Key
No Key
ContactPads
Eye-of-NeedleCompliant PinSignal Contact
143Catalog 1773095 Dimensions are shown for Dimensions are in millimeters Canada: +1 (905) 475-6222 UK: +44 (0) 800-267666Revised 4-12 reference purposes only. and inches unless otherwise Mexico/C. Am.: +52 (0) 55-1106-0800 France: +33 (0) 1-3420-8686
Customization Options The MULTIGIG RT productline is fully customizable.This is accomplished bymeans of stacking thePCB wafers in the correctlocation to achieve thedesired mix of high speeddifferential, high speedsingle-ended, and low
speed/high speed densitysignals. In addition, powercan be carried through thePCB wafers by replacingone or more signal wafersfor a power wafer.
Shown below is a TEproposal for a typical
MULTIGIG RT connectorapplication. As you can see,we took full advantage ofthe MULTIGIG RT connectorcapabilities. Contact yourTE representative to have aproposal drawn-up to meetyour specific needs.
Typical MULTIGIG RTConnector Implementation
MULTIGIG RT7.2mm GuideReceptacle
MULTIGIG RT 220.3mm Center Plug16 Differential Pair Wafers(3 Pairs Each)
MULTIGIG RT 220.3mm Center Plug16 Open Pin Field Wafers(9 Single-ended Lines Each)
MULTIGIG RT 220.3mm Right End Plug16 Open Pin Field Wafers(9 Single-ended Lines Each)
MULTIGIG RT 220.3mm Right End Plug
3 Open Pin Field Wafers (9 Single-ended Lines Each)8 Single-ended Wafers (6 Lines Each)
2 Power Wafers (3 Lines Each)
145Catalog 1773095 Dimensions are shown for Dimensions are in millimeters Canada: +1 (905) 475-6222 UK: +44 (0) 800-267666Revised 4-12 reference purposes only. and inches unless otherwise Mexico/C. Am.: +52 (0) 55-1106-0800 France: +33 (0) 1-3420-8686
The Tier 1 connector systemcan be customized withDifferential and Single-ended wafers. In addition,a power wafer is availablefor the 25.40 [1.000] pitch
product that provides4 power lines and 2 senselines per wafer. Shownbelow are differential,single-ended and poweroptions.
146Catalog 1773095 Dimensions are shown for Dimensions are in millimeters Canada: +1 (905) 475-6222 UK: +44 (0) 800-267666Revised 4-12 reference purposes only. and inches unless otherwise Mexico/C. Am.: +52 (0) 55-1106-0800 France: +33 (0) 1-3420-8686
The Tier 2 connector systemis fully customizable due tothe lack of a bussed groundsystem. This allows us tostack the many optionsavailable (with more being
developed as needed) inany configuration that isnecessary to meet the cus-tomers needs. Shown hereare some of the options thatare currently available.
VITA, VMEbus, VPX, and VXS aretrademarks of VITA.
147Catalog 1773095 Dimensions are shown for Dimensions are in millimeters Canada: +1 (905) 475-6222 UK: +44 (0) 800-267666Revised 4-12 reference purposes only. and inches unless otherwise Mexico/C. Am.: +52 (0) 55-1106-0800 France: +33 (0) 1-3420-8686
� High density: 140 contactsper inch provides 70 contactpairs per inch fordifferential signaling
� Options include 20.32[.800] and 25.40 [1.000]pitch card spacing
� Modular options for signal,power, keying and guidance
� Optimized footprints
� Robust design
� Low noise levels
� Supports differential pairwidths of 6 mils with 9 milspacings
� Single-ended optionavailable; contact TE forperformance data
The MULTIGIG RT Tier 1connector meets customerrequirements for high-densityand high-performancetwo-piece interconnects.In TE and independent labtests, the MULTIGIG RT Tier1 connector has performedin excess of 3 Gb/s usingstandard FR-4 board mate-rial and routing techniques.
The MULTIGIG RT Tier 1connector is a differentialconnector with a contactdensity of 70 pairs per inch.The robust connector usesdaughtercard plugs with aprinted circuit board (PCB)
wafer design and back-plane receptacles with acompletely enclosed dual-beam design. All signallines use redundant pointsof contact for high reliability.
The MULTIGIG RT Tier 1connector is available forboth 20.32 [.800] and 25.40[1.000] pitch card spacing.The totally modular systemallows flexibility in choosingsignal and power modulesas well as guidance, keying,and electrostatic discharge(ESD) modules to meet themost demanding applica-tions. Signal modules can
be customized for specificelectrical requirements —such as sequencing — thatare critical in high speedapplications.
Power modules are availablewith two- and four-voltageoptions, each circuit capa-ble of carrying 20 amps.The robust metal guide pinprovides eight keyingoptions and a unique ESDcontact to discharge staticwhen daughtercards arehot-plugged.
� High density: 113 contactsper inch provides 56 contactpairs per inch fordifferential signaling
� Options include 20.32[.800] and 25.40 [1.000]pitch card spacing
� Modular options for signal,power, keying and guidance
� Optimized footprints
� Robust design
� Low noise levels
� Supports differential pairwidths of 6 mils with 9 milspacings
� Single-ended, open pinfield and power wafersavailable
The MULTIGIG RT Tier 2connector is the latestproduct release to meetcustomer requirements forhigh-density and high-performance two-pieceinterconnects. In TE andindependent lab tests,the MULTIGIG RT Tier 2connector has performedin excess of 6 Gb/s usingstandard FR-4 board mate-rial and routing techniques,and has been demon-strated to 10 Gb/s.
The MULTIGIG RT Tier 2connector system providesthe flexibility to configurethe daughtercard forDifferential, Single-ended,Open Pin Field, or Power
within a single connectormodule. All of these optionsthen mate into a commonBackplane Receptacle.The robust connector usesdaughtercard plugs with aprinted circuit board (PCB)wafer design and back-plane receptacles with acompletely enclosed dual-beam design. All signallines use redundant pointsof contact for high reliability.
The MULTIGIG RT Tier 2connector is available forboth 20.32 [.800] and 25.40[1.000] pitch card spacing.The totally modular systemallows flexibility in choosingsignal and power modulesas well as guidance, keying,
and electrostatic discharge(ESD) modules to meet themost demanding applica-tions. Signal modules canbe customized for specificelectrical requirements —such as sequencing — thatare critical in high speedapplications.
Power modules are availablewith two- and four-voltageoptions, each circuit capa-ble of carrying 20 amps.The robust metal guide pinprovides eight keyingoptions and a unique ESDcontact to discharge staticwhen daughtercards arehot-plugged.
� Optimized footprints forsignal integrity and ease ofboard design
� Utilizes a 0.56 [.022]diameter via for backplaneconnector for lower costboard fabrication
� Three levels of signalcontact sequencing
� Modular connector system
� Available for 20.30 [.800] or25.40 [1.00] card pitchsystems
� Provides ESD protection
� Complete connector familyincludes…
� Power Modules
� Guidance Modules
The VITA 41 VXS productline is a backplane intercon-nect family that offers flexi-bility and customization.VXS is an ANSI standardthat combines parallelVMEbus technology withenhancements to supportswitched serial fabricsincluding PCI Express,RapidIO, StarFabric andInfiniBand over a new highspeed P0 connector.Backward compatibility ismaintained with existingbackplanes that do not have
a conflicting P0 scheme.Combining the VME2eSSTparallel bus with switchfabric technologies formulti-point, high-speed datatransfers creates choicesfor embedded computingdesigns of all types. Underthe VITA 41 VXS specifica-tion, VMEbus cards (nowcalled “payload cards”) areconnected via a high-speedP0 connector. Each payloadcard has two 4x VXS ports(port A and port B) to con-nect to other boards in the
system. Each VXS port iscomprised of 4 HSS linksrunning at speeds up to2.5Gbps or 3.125Gbps.
Applications
� Military
� Aerospace and Defense
� Rugged, mission criticalapplications
� Mass data storage
� High-end and mid-rangeservers
� Telecommunicationsequipment
INFINIBAND is a trademark of the
InfiniBand Trade Association.
PCI Express is a trademark of PCI-SIG.
RAPIDIO is a trademark of RAPIDIO, Inc.
STARFABRIC is a trademark ofStarGen, Inc.
VITA, VMEbus, VPX, and VXS aretrademarks of VITA.Check out the websitehttp://www.vita.com/vso-stds.html
152Catalog 1773095 Dimensions are shown for Dimensions are in millimeters Canada: +1 (905) 475-6222 UK: +44 (0) 800-267666Revised 4-12 reference purposes only. and inches unless otherwise Mexico/C. Am.: +52 (0) 55-1106-0800 France: +33 (0) 1-3420-8686
� Optimized footprints forsignal integrity and ease ofboard design
� Utilizes a 0.56 [.022]diameter via for backplaneconnector for lower costboard fabrication
� Three levels of signalcontact sequencingModular connector system
� Available for 20.30 [.800] or25.40 [1.00] card pitchsystems
� Provides ESD protection
� Complete connector familyincludes…
� Power Modules
� Guidance Modules
The VITA 46 VPX productline is a backplane intercon-nect family that offers levelsof flexibility and customiza-tion never before seen inthe industry. VPX provideshigh-speed data rates thattraditional VME is notdesigned for; by mergingthe latest packaging andconnector technology withthe latest bus and serialtechnology.
This printed circuit based,pinless, interconnect familyis comprised of modularcomponents which can beused in a variety of combi-nations. VPX dramaticallyincreases bandwidth withfewer pin counts andenables heterogeneousarchitectures to help pre-serve existing investmentsin technology and systems.The MULTIGIG RT productoffers new 7-row high-speed connector modulesthat support VPX data rates.
Applications
� Military
� Aerospace and Defense
� Rugged, mission criticalapplications
� Mass data storage
� High-end and mid-rangeservers
� Telecommunicationsequipment
VITA, VMEbus, VPX, and VXS aretrademarks of VITA.Check out the websitehttp://www.vita.com/vso-stds.html
155Catalog 1773095 Dimensions are shown for Dimensions are in millimeters Canada: +1 (905) 475-6222 UK: +44 (0) 800-267666Revised 4-12 reference purposes only. and inches unless otherwise Mexico/C. Am.: +52 (0) 55-1106-0800 France: +33 (0) 1-3420-8686