Embedded Stackable Board Computer PM Sandy Chen [email protected] Nov’. 20.2011 MIO-5270 Sales kit MI/O Extension SBC (AMD G-Series)

EEmbedded mbedded SStackable tackable BBoard oard CComputer omputer PM Sandy ChenPM Sandy [email protected]  Nov’. 20 .2011Nov’. 20 .2011

MIO-5270 Sales kitMI/O Extension SBC (AMD G-Series)MIO-5270 Sales kit

MI/O Extension SBC (AMD G-Series)

AMD G-Series MI/O Extension SBC with 48-bit LVDS/ HDMI/ VGA/ DirectX 11 2 GbE/ HD Audio/ 4COM/ 2 SATAII/ 6 USB2.0/ Mini-PCIe/ 1 CFast/ MIOeAMD G-Series MI/O Extension SBC with 48-bit LVDS/ HDMI/ VGA/ DirectX 11 2 GbE/ HD Audio/ 4COM/ 2 SATAII/ 6 USB2.0/ Mini-PCIe/ 1 CFast/ MIOe

AMD G-Series + AMD A50M, DDR3 1066MHzT40R1.0G SC (5.5W) / T40E 1.0G DC (6.4W) (Fan-less)

T56N 1.65G DC (18W) +A50M(4.7W)

AMD G-Series + AMD A50M, DDR3 1066MHzT40R1.0G SC (5.5W) / T40E 1.0G DC (6.4W) (Fan-less)

T56N 1.65G DC (18W) +A50M(4.7W)

Advantech iManager & SUSIaccessSupports Embedded Software API and Utility

Win CE, Win7 , WinXP, WinXPe, Linux Support

Advantech iManager & SUSIaccessSupports Embedded Software API and Utility

Win CE, Win7 , WinXP, WinXPe, Linux Support

Low Power Consumption (kit TDP: 10.5~23W)12V DC Power input , support DC power hot plug design

Extended Temperature Option (-20~80C)

Low Power Consumption (kit TDP: 10.5~23W)12V DC Power input , support DC power hot plug design

Extended Temperature Option (-20~80C)

2 GbE/ HD Audio4 COM/ 6 USB2.0/ 2 SATAII/ GPIO/ SMBUS/ CFast

MIOe/ Mini-PCIe Expansion or mSATA

2 GbE/ HD Audio4 COM/ 6 USB2.0/ 2 SATAII/ GPIO/ SMBUS/ CFast

MIOe/ Mini-PCIe Expansion or mSATA

2018/Q3Longevity

2018/Q3Longevity

DirectX 11, 2D/ 3D/ Motion Video AccelerationMultiple display: 48-bit LVDS, HDMI, VGA

Hardware decode (UVD 3):H.264, VC-1 & MPEG2

DirectX 11, 2D/ 3D/ Motion Video AccelerationMultiple display: 48-bit LVDS, HDMI, VGA

Hardware decode (UVD 3):H.264, VC-1 & MPEG2

MIO-5270 Compelling Features

Available Now!

DC JackDC Jack

2 x 2Power2 x 2Power

MI/O Extension FeaturesMI/O Extension Features

MIO-5270 Product SPEC 

Block DiagramBlock Diagram

Board Layout – Component SideBoard Layout – Component SideSATA1

HD & PWR LED

FAN

DDR3 SODIMM

USB 5/6

USB 1/2 DC PowerVGA

48 bits LVDS

HDMIUSB 3/4 GbE1 GbE2

SATA2

AMD G-Series

RS422/485

ResetInverter

Power Button

SATA Power

AMD A50M

eDP

LVDS Power Select(3.3V/ 5V/ 12V)

SMBUS

Board Layout – Solder side Board Layout – Solder side 

Mini PCIe

MIOeExpansion

CFast socket

Dimension (mm): 146 mm (L)* 102 mm (W) (5.7" x 4.0")

Audio

COM1/3/4(RS232)

RS422/485 Select

COM2(RS422/485)GPIO

Rear I/O PlacementRear I/O Placement

Power Connector Type OptionPower Connector Type Option

DC Jack

If need specific power connector type on different SKU, support by request.

MIO-5270S-S0A1EMIO-5270D-S0A1E

MIO-5270D-S6A1E

Type Model Rear I/O Photo

Type 1 MIO-5270MIO-5250

2*USB + 2*USB + HDMI + VGA + 2*GbE+ LED(Power/ Hard Disk) + DC Power

Thermal SolutionThermal Solution

ModelMIO-5270S-S0A1E (AMD T40R, 1.0GHz SC)MIO-5270D-S0A1E (AMD T40E, 1.0GHz DC) MIO-5270D-S6A1E (AMD T56N, 1.65GHz DC)

Photo

P/N: 1960053507N001 P/N: 1960053508N001

DescriptionCPU Heatsink Dimension: 137(L)* 84.2(W)* 25(H)mmTotal height including CPU board + heatsink is 35(H)mm

CPU Cooler Dimension: 137(L)* 84.2(W)* 25(H)mmTotal height including CPU board + Cooler is 35(H)mm

Model

Photo

Description

Standard Thermal Solution

Optional Thermal Solution

MIO-5270S-S0A1E (AMD T40R, 1.0GHz SC)MIO-5270D-S0A1E (AMD T40E, 1.0GHz DC)

MIO-5270D-S6A1E (AMD T56N, 1.65GHz DC)

P/N: 1960054266T001

Heat Spreader Dimension: 137(L)* 84.2(W)* 16.7(H)mmTotal height including CPU board + heat spreader is 26(H)mm

.

MIO-5270 Advanced Technology AMD G-Series Low Power Consumption Solution

Power Consumption:– T40R 1.0G Single Core: TDP of AMD bundle kit is 10.5 Watts (Value)– T40E 1.0G Dual Core : TDP of AMD bundle kit is 11.4 Watts (Low Power)– T56N 1.65G Dual Core: TDP of AMD bundle kit is 23 Watts (Performance)

Low Idle Power:– Optimized display refresh minimizes DRAM activity, Display refresh doesn’t require chipset activity– UVD 3.0 offloads video decode dramatically reducing CPU loading during video playback

Maximum Integrated Graphics Performance! AMD graphics core with DirectX® 11 Support 48-bit LVDS, HDMI V1.3, VGA (eDP option) 2D/ 3D/ Motion Video acceleration DVD/ Blu-ray

MIOe Expansion with Maximum Flexibility Unified pin definition including Display, Communication, I/O, Storage, Power interfaces… MIO-5270 provides the computing & power, customer can choose standard module or design self module to secure

domain knowhow. Efficient schedule with complete solution (MIO-5270 + MIOe module) Less RD design resource & total cost

Support iManager Enhance system reliability. Manage onboard devices

Design for Ruggedized Solution--- Advantech MIO-5270Design for Ruggedized Solution--- Advantech MIO-5270

• MIO-5270 is designed with 100% Solid Capacitors (固態電容 )

Wide temperature design and test criteria: Power/ Clock generator/ Sequence PCB Type: TG-150 as PCB type, much reliable in high temperature environments.

• Rugged Design on Selected Components

Higher tolerance for high frequencies & high temperature With better MTBF compared with Electrolytic Capacitors No more exploding capacitors More reliable solution if using Solid capacitors than Electrolytic capacitors

• High ESD Protection for RS-232 I/O Pins to ±15kV

IEC61000-4-2 Air Gap Discharge: ±15kV IEC61000-4-2 Contact Discharge : ±8kV Human Body Model: ±15 kV

Power Hot Plug Design on MIO-5270Power Hot Plug Design on MIO-5270 MIO-5270 was designed for single 12V DC in and with Power Hot Plug protection IC

design on MIO-5270. The power tolerance range is 12V +/-10%. Based on following operation process, MIO-5270 still can work stable to bootup if the

power tolerance range is 12V +/- 10% Standard power turn on process on normal single board.–Connect SBC + power cable + power supply or DC power module, then turn on the power button as ON.

Not normal power turn on process:–Turn the power button as ON first, then connect SBC + power cable + power supply or DC power

module, in such kind of operation the board may with unstable problem (board damage, not bootup…) with unstable surge.

DC Power Module

DC Adapter

Power SupplyDC Jack 2x2 right angle power connector

AMD G-Series Platform- GPU Architecture AMD G-Series Platform- GPU Architecture 

AMD G-Series Platform- Direct X11AMD G-Series Platform- Direct X11- DirectX 11 Enables an Amazingly Rich Experience- DirectX 11 Enables an Amazingly Rich Experience

AMD G-Series Platform- Software SupportAMD G-Series Platform- Software Support

Linux SupportLinux Support

Performance BenchmarkPerformance Benchmark

MIO-5270 Performance_CPUMIO-5270 Performance_CPU

Test with 2GB Memory

MIO-5270 Performance_GraphicMIO-5270 Performance_Graphic

MIO-5270 Power Consumption

Rugged Design on ESBC w/ iManagerRugged Design on ESBC w/ iManager

Page 21

Power Consumption

BIOS

iManager for ESBC--- Guaranteed Boot up at Extreme ColdiManager for ESBC--- Guaranteed Boot up at Extreme Cold

iManager

Initial

System Running

Start Bootup

OS

System Hanged

iManager for ESBC--- Voltage Dips & Interrupt Detection & RecoveryiManager for ESBC--- Voltage Dips & Interrupt Detection & Recovery

iManager

Initial

System Running

Voltage Dips

System Running

Bootup

Voltage back to normal range

Page 24

Target ApplicationsTarget Applications

POS/ KIOSK

HMI (Human Machine Interface)

Transportation

Casino Gaming, Pachinko/Slot Machine

MedicalFeasibility management

Digital Signage

General Purpose

Less effort to get “Flexibility”

Fan-less when using heat spreader

Order InformationOrder Information

Optional AccessoriesOptional Accessories

Packing ListPacking List Embedded OS/ APIEmbedded OS/ API

New Form Factor: MI/O ExtensionNew Form Factor: MI/O Extension

The SPEC on standard SBC can’t be fulfilled if need additional I/O change

The SPEC on standard SBC can’t be fulfilled if need additional I/O change

Resource: Need redesign PCB to fulfill the SPEC requirement

Options: Go ODM or SOM projects for customized demand, need higher quantity & NRE.

Resource: Need redesign PCB to fulfill the SPEC requirement

Options: Go ODM or SOM projects for customized demand, need higher quantity & NRE.

The customer needs a board easier for system integration

The customer needs a board easier for system integration

The customer hopes to keep domain knowhow through easier way

The customer hopes to keep domain knowhow through easier way

Time to MarketTime to Profit

Time to MarketTime to Profit

Less cabling: less problems and cost on assembling.Concentrated thermal design: make thermal design

be easier in customer’s system integration.

Less cabling: less problems and cost on assembling.Concentrated thermal design: make thermal design

be easier in customer’s system integration.

Documentation: customer can keep domain knowhow to design their own I/O module by referring to Advantech design guide & SPEC.

Documentation: customer can keep domain knowhow to design their own I/O module by referring to Advantech design guide & SPEC.

Save development schedule and cost: Choose one platform based on MI/O Extension structure, just change I/O module can approach different applications in a short time.

Save development schedule and cost: Choose one platform based on MI/O Extension structure, just change I/O module can approach different applications in a short time.

Why a New Form Factor – MI/O Extension- Takes New Position between SBC and COM

Positioning on Different SolutionsMI/O Extension Single Board Computer Computer On Module

Readiness 100%(I/O module only by demand)

100% 60~80%(Need bundle carrier board )

Flexibility Middle Low High

RD Resource Low ~ Middle(design I/O module if needed)

Low High(design carrier board)

Pricing Middle Middle High

Develop Schedule

Short ~ Middle Short Long

Dimension 146*102mm100*72mm

146*102mm Q7, ETX, COM-Express, COM-Ultra...

Keep domain knowhow

Yes(design I/O module)

No Yes(design carrier board)

Target customer

Only lack few I/O interfacesSensitive on pricing

Tight development scheduleWith RD ability who can

design I/O module.

Need single board solutionNeed wide-range choices

Time to Market

Complicated SPEC demandWith exists COM carrier boardWith senior RD ability who

can design power sequence and I/O functions.

MI/O Extension: Multiple I/O Extension

MIO/ MIOe Solution from Advantech MIO/ MIOe Solution from Advantech 

• 100% Done on MI/O Extension W/ CPU, memory, power, complete I/O and expansion slots Better thermal design Requires less cabling

• Flexibility from MIOe Secure core knowledge on MIOe modules Advantech provide MIOe design guide for reference Unified multiple interfaces & ready for future mainstream

interfaces Power comes from MI/O CPU board instead of MIOe, less design

effort,

• Easy for System Integration SFF in 146* 102mm on MI/O Extension Easier system assemblage Save up to 20% system space Reduce total cost ownership

MIOe

MI/O

MI/O Extension Mechanical PlacementMI/O Extension Mechanical Placement

• Heat Generating Parts on Component Side Including CPU, South bridge, memory, power, active IC… solve the thermal issues on one side

• Thermal Solution Larger space for better thermal result.. Reduced tooling fee with minimum CNC rework.

•Coast Line and DIP connectors Saves production costs Right angle DIP connectors (Power)

Component Side

• Expansion Slots on Solder Side MIOe Expansion miniPCIe expansion CF/Cfast card (can take the card away from rear I/O)

• Hard Disk Placement Hard disk on solder side prevents thermal issues Saves system space.

•SMD Lockable Connectors Lockable connector type on COM & audio.

Solder Side

Rear I/O PlacementRear I/O Placement

With minimum cabling needed• LVDS cable• SATA cable• COM cable• Audio cable

With minimum cabling needed• LVDS cable• SATA cable• COM cable• Audio cable

LED2 GbEsHDMI CRT2USBs2USBs DC Power

MI/O Extension(Multiple I/O) New Form FactorMI/O Extension(Multiple I/O) New Form Factor

Install Hard DiskInstallMIOe

InstallHeat SpreaderMIO

MI/O

Screws

MIOe

Heat Spreader

Hard Disk

Flexibility PossibilitiesFlexibility Possibilities

MI/O A

MI/O B

MIOe Module A

MIOe Module B

MI/O Extension SBC+ MIOe Expansion Module = Vertical Applications

Your own MIOe design !

MIOe Module C

Unified MIOe for MIO Extension SBCUnified MIOe for MIO Extension SBC

Interface Number Functions can beDisplayPort 1 HDMI, LVDS, DVI, CRT or eDP display interface…

PCIe x 1 4 Gigabit Ethernet, USB 3.0, SATA/RAID, FPGA or PCI expansion…

USB 3.0USB 2.0

12

Super speed storage, capture card, HD Webcam & display interface…

LPC 1 Legacy bus & Multi-UART, PS2 KB/MS, GPIO, FDD, IR, Parallel port from LPC I/O…

HD Audio 1 Line out, keep flexibility with selected amplifier…

SMBus 1 Implementation for GPIO control, Smart battery/ Charger, W/R EEPROM or System communication…

VCC (Power) +12V

VCC (Power) +5VSB

GND

Interfaces are considered including most demands from customer and future chipset trends Interfaces are considered including most demands from customer and future chipset trends

Easy System

Integration

Minimum Design Effort

Secure CoreKnowledge

Compact Chassis Design

Flexibility/Vertical Market

Cost Effective

MIOMIO

MIO PositioningMIO Positioning

 Contact product manager for any further information Sandy.Chen

@advantech.com.tw

 Contact product manager for any further information Sandy.Chen

@advantech.com.tw

Thank you!