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Embedded Solution Product Roadmap. Applications Overview LEX System's Specialty New products highlight Product Development Timeline Intel embedded chipset.

Mar 31, 2015

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Page 1: Embedded Solution Product Roadmap. Applications Overview LEX System's Specialty New products highlight Product Development Timeline Intel embedded chipset.

Embedded Solution Product Roadmap

Page 2: Embedded Solution Product Roadmap. Applications Overview LEX System's Specialty New products highlight Product Development Timeline Intel embedded chipset.

Applications Overview LEX System's Specialty New products highlight Product Development Timeline Intel embedded chipset solutions VIA embedded chipset solutions LEX SYSTEM roadmap

Networking, Multimedia, Surveillance, POS/Automation, Digital Signage/Thin client LEX SYSTEM chassis LEX SYSTEM panel PC & wall mount series LEX SYSTEM accessories

Page 3: Embedded Solution Product Roadmap. Applications Overview LEX System's Specialty New products highlight Product Development Timeline Intel embedded chipset.

DVR

Network

POS/Automation

Digital Signage

Car PC

. POS

. Kiosk

. Automation Control

. Access Control

. Building / ATM Monitoring

. Firewall

. Thin Client

. VPN

. Server

. Retail / Restaurant

. Hospitality

. Enterprise

. Transportation

. Intelligent Transport System (ITS). GPS / 3G / WIFI. Smart Power System

Page 4: Embedded Solution Product Roadmap. Applications Overview LEX System's Specialty New products highlight Product Development Timeline Intel embedded chipset.

. Wide Range Power & DC-IN Power on board

. CPU / Memory / Storage on board features

. Highly Integrated & Various Expansion Platform

. Extreme Temperature & Anti-Shock Ability

. IP66/IP67 Water / Dust Proof Feature

. Rechargeable Battery feature

. Small form factor fanless system

. Car Power on/off delay control

Page 5: Embedded Solution Product Roadmap. Applications Overview LEX System's Specialty New products highlight Product Development Timeline Intel embedded chipset.

Application:

. Medical Panel PC

. Test Equipment

. Pharmacy automation

. Hospital administration automation

7” / 10.1” Hand hold Panel PC

Page 6: Embedded Solution Product Roadmap. Applications Overview LEX System's Specialty New products highlight Product Development Timeline Intel embedded chipset.
Page 7: Embedded Solution Product Roadmap. Applications Overview LEX System's Specialty New products highlight Product Development Timeline Intel embedded chipset.
Page 8: Embedded Solution Product Roadmap. Applications Overview LEX System's Specialty New products highlight Product Development Timeline Intel embedded chipset.
Page 9: Embedded Solution Product Roadmap. Applications Overview LEX System's Specialty New products highlight Product Development Timeline Intel embedded chipset.
Page 10: Embedded Solution Product Roadmap. Applications Overview LEX System's Specialty New products highlight Product Development Timeline Intel embedded chipset.
Page 11: Embedded Solution Product Roadmap. Applications Overview LEX System's Specialty New products highlight Product Development Timeline Intel embedded chipset.

M/B Features Chassis

2I260 A Cedarview-M N2600 CPU, HDMI / DVI, 1 x GbE, USB, ANT/UNO/TWIN

2I260 D Cedarview-M N2600 CPU, HDMI , 3 x GbE , USB, ANT/TWIN

2I268 HW/HB Cedarview-M N2600/2800 CPU, HDMI & DVI, 1 x GbE, 5 x USB, Rechargeable Battery, Wide Range DC IN

2I268 C Cedarview-M N2600/2800 CPU, DVI, LVDS & Touch Screen Panel PC series

CI847A/C Intel® Mobile IVY Bridge 1047UE / i3 / i7, DVI & HDMI, 4 x GbE, USB 3.0 MiTex/Panel PC/Twister

3I280A/L Cedarview-M N2800 CPU, DVI or HDMI,2 x GbE, USB3I280L –DVI, 2 x GbE , USB ,(DP to LVDS 2ch-48bits )

CUBE/TWITTER/LEO,BRIK,BLOK, panel pc

series

3I280CM Cedarview-M N2800 CPU, HDMI,2 x GbE, USB, CPC-Car Power Control, LVDS & Touch Screen

Panel PC seriesCube/Twitter

3I847AW/CWIntel® Mobile IVY Bridge 1047UE / i3 / i7, DVI & HDMI, 2 x GbE, USB 3.0,

LVDS & Touch Screen, Wide Range DC IN, CPC-Car Power Control (option)

Twitter/Tiger/Panel PC

3I847HW Intel® Mobile IVY Bridge 1047UE / i3 / i7, DVI, 2 x GbE, USB 3.0, LVDS & Touch Screen, Wide Range DC IN , CPC-Car Power Control (option)

2I847H Intel® Mobile IVY Bridge 1047UE / i3 / i7 ,1x GbE, USB 3.0, LVDS & Touch Screen

3I847NMIntel® Mobile IVY Bridge 1047UE / i3 / i7, HDMI,1x GbE, 4 x PoE, USB 3.0, LVDS & Touch Screen, Wide Range DC IN, CPC-Car Power Control

(option)Tiger/Twitter

2I380A/C SOC Baytrail E38XX, 2 x GbE, COM, VGA, USB 3.0 Twin/Panel PC

3I380AW/CWSOC Baytrail E38XX, 2 x GbE, USB 3.0,HDMI(DVI), CPC

LVDS & Touch Screen, Wide Range DC IN, CPC-Car Power Control (option)

Tiger/Panel PC

3I380D SOC Baytrail E38XX, 4 x GbE, COM, DVI, HDMI, LVDS, USB,CPC Twin/Panel PC

Page 12: Embedded Solution Product Roadmap. Applications Overview LEX System's Specialty New products highlight Product Development Timeline Intel embedded chipset.

Q3Q2 Q4 Q1 Q2

2013 2014

MP

2I260ADimension: 2.5 ” (102 x 73mm)

MP

2I260DDimension: 2.5 ” (102 x 73mm)

CHASSIS FOR 2I260

TWIN

ANT

TWIN w/2.5” HDD

Page 13: Embedded Solution Product Roadmap. Applications Overview LEX System's Specialty New products highlight Product Development Timeline Intel embedded chipset.

Q3Q2 Q4 Q1 Q2

2013

CI847A / C Dimension: Lex standard (200 x 150mm)

Sample released in Sept.

MP

3I847AW / CW Dimension: 3.5 ” (145 x 102mm)

MP in end of Oct.

3I847HW (pin header type) Dimension: 3.5 ” (145 x 102mm)

2I847H (pin header type)Dimension: 2.5 ” (102 x 73mm)

3I847NM Dimension: 3.5 ” (145 x 102mm)

Sample released in Oct.

MP in end of Nov.

Sample released in Nov.

MP in end of Dec.

Sample released in end of Dec. .

MP in end of Jan., 2014 .

2014

Page 14: Embedded Solution Product Roadmap. Applications Overview LEX System's Specialty New products highlight Product Development Timeline Intel embedded chipset.

Q3Q2 Q4 Q1 Q2

2013 2014

MP in end of Feb., 2014

MP in mid of Mar., 2014

3I380AW / CWDimension: 3.5” (145 x 102mm)

Sample released in mid of Dec.

Sample released in end of Dec.

Sample released in mid of Feb. 2014

MP in end of Apr. 2014

2I380A / CDimension: 2.5” (102 x 73mm)

3I380DDimension: 3.5” (145 x 102mm)

Page 15: Embedded Solution Product Roadmap. Applications Overview LEX System's Specialty New products highlight Product Development Timeline Intel embedded chipset.

Q3Q2 Q4 Q1 Q2

2013 2014

MP in Oct.

TwinDimension: 145W x 96.3D (150D) x 35H mmChassis for MB: 2I268 / 2I260 / 2I380

MP in end of Sept.

TigerDimension: 190.8W x 130D x 58.8H mmChassis for MB: 3I847 A / 3I847NM

TWIN w/2.5” HDD

Page 16: Embedded Solution Product Roadmap. Applications Overview LEX System's Specialty New products highlight Product Development Timeline Intel embedded chipset.

533 MHz FSB, DDR2 533/667, SATA, LVDS, PCIeIntel 945GSE

DDR3 667/800, SATA, LVDS, PCIeIntel Atom D525

Intel CedarView –M N2600/2800 DDR3 800/1066, DVI/HDMI , Low power Consumption

Intel Core i7 / i5 / Celeron DDR3 1333/1600, LVDS 18/24 dual channel, USB3.0

DDR3L 1066/1333 , SATA, LAN , USB3.0Intel SoC BayTrail-I

Page 17: Embedded Solution Product Roadmap. Applications Overview LEX System's Specialty New products highlight Product Development Timeline Intel embedded chipset.

V4 1066 MHz, DDR3VIA VX900

Page 18: Embedded Solution Product Roadmap. Applications Overview LEX System's Specialty New products highlight Product Development Timeline Intel embedded chipset.

Processor Chipset Feature

Intel SoC E38XX DDR3L 1333

Intel SoC Baytrail3I380AW (2 x GbE, CPC(option),USB 3.0, HDMI, LVDS & Touch,3I380CW ( Wide Range DC-IN. CPC(option) )

Intel IVY Bridge 1047UE / i3 / i7 DDR3 1333/1600

Intel Pather Point(PCH) HM76

3I847HW (Wafer IO connector board,2 x GbE, USB 3.0, Wide range DC-IN), CPC(option)3I847AW/CW (2 x GbE, USB 3.0, CPC(option) , LVDS, Wide range DC-IN)2I847H (Wafer IO connector board,1 x GbE, USB 3.0, )

Intel Cedarivew N2800

DDR3 1066

Intel Cedarview-M + ICH10

3I280CM (4 x USB, 2 x GbE, Wide Range DC-IN. CPC )

Intel Atom D525

DDR3 800

Intel AtomD525 + ICH8M

3I525AW (2 x Realtek GbE, 6 x COM, Wide range DC-IN)3I525CW (6 x COM, 2 x GbE, Wide range DC-IN)BI525CW (Back up Battery support, Wide range DC-IN)SI525AW (4 x CX25878 chips with 4 Video-IN)

Intel CedarView N2600

DDR3 800

Intel CedarView-M+ NM10

2I268HW (Wafer IO connector board,2 1 x GbE, DVI & HDMI, LVDS, Touch Screen, Wide range DC-IN)

Page 19: Embedded Solution Product Roadmap. Applications Overview LEX System's Specialty New products highlight Product Development Timeline Intel embedded chipset.

Processor Chipset Feature

Intel SoC E38XX DDR3L 1333 Intel SoC Baytrail 3I380D (4 x GbE, COM, DVI, HDMI, LVDS, USB,CPC)

InteI IVY Bridge 1047UE / i3 / i7

DDR3 1333/1600

Intel Pather Point(PCH) HM76

3I847AW (2 x GbE, USB 3.0, DVI & HDMI , Wide range DC-IN)3I847NM (HDMI,1x GbE, 4 x PoE LAN, USB, Wide range DC-IN)

Intel Cedarview N2600 DDR3 800

Intel Cedarview-M + NM10 2I260D (HDMI, 3 x GbE, 2 x USB)

Intel Atom D525 DDR3 800Intel Atom

D525 + ICH8M

3I525D (4 x Realtek GbE, LAN Bypass 100Mb, 3G SIM socket)3I525U (4 x Intel GbE, LAN Bypass 100Mb, 3G SIM socket)NI525A (3 x Intel GbE, 4 x PoE switch GbE ports)

Intel Core Duo/ Core 2 Duo

DDR2 533/667Intel 945GME + ICH7M CI945A (4 x Intel / Realtek GbE, CPU socket version)

Intel CedarView N2600

DDR3 800

Intel CedarView-MNM10

2I260A (1 x Realtek GbE, DVI & HDMI )

VIA E-Series Nano DDR3 1066 VIA VX900 3V900D (3 x Realtek LAN, VGA, 3 x USB)

Page 20: Embedded Solution Product Roadmap. Applications Overview LEX System's Specialty New products highlight Product Development Timeline Intel embedded chipset.

ProcessorChipset Feature

Intel SoC E38XX DDR3L 1333 Intel SoC Baytrail3I380CW (2 x GbE, Car Power Control, USB , HDMI, LVDS & Touch screen, Wide Range DC-IN)

Intel SoC E38XX DDR3L 1333 Intel SoC Baytrail 2I380A/C (2 x GbE, USB 3.0, HDMI, LVDS & Touch Screen)

Intel Cedarview-M DDR3 1066 Intel Cedarview-M + ICH10 3I280A (DVI or HDMI, 2~4 x USB, 2 x GbE)

Intel IVY Bridge 1047UE / i3 / i7 DDR3 1333/1600

Intel Pather Point(PCH) HM76

3I847CW (DVI & HDMI,2 x GbE, USB, Wide Range DCIN)CI847C (DVI & HDMI, 4 x GbE, USB 3.0)

Intel Atom D525 DDR3 800 Intel Atom D525 + ICH8M3I525CW (6 x COM, 2 x GbE, Wide range DC-IN)3I525HW (All I/O as in PIN header, Wide range DC-IN)BI525CW (Rechargeable Battery, Wide range DC-IN)

Intel IVY Bridge DDR3 1333 Intel QM77 CI770C (HDMI, DVI/VGA, 6~10 x COM, 9 x USB )

Intel CedarView N2600 DDR3 800 Intel CedarView-M + NM10 2I268C (1 x Realtek GbE, DVI, LVDS, Touch Screen,)

VIA E-Series Nano DDR3 1066 VIA VX900 3V900C (HDMI, H.264 decode, 18/24 dual channel LVDS)

Page 21: Embedded Solution Product Roadmap. Applications Overview LEX System's Specialty New products highlight Product Development Timeline Intel embedded chipset.

ProcessorChipset Feature

InteI IVY Bridge 1047UE / i3 / i7

DDR3 1333/1600

Intel Pather Point(PCH) HM76

3I847NM (HDMI,1x GbE, 4 x PoE, USB, Wide range DC-IN)

Intel Atom D525 DDR3 800Intel Atom

D525 + ICH8MNI525A (3 x Intel GbE, 4 x PoE switch GbE ports)SI525AW (4 x CX25878 chips with 4 Video-IN)

Intel Core Duo/ Core 2 Duo

DDR2 533/667Intel 945GME + ICH7M

SI945A-4S (1 x CX25878 chip with 4 Video-IN)

SI945A-4U (4 x CX25878 chips with 4 Video-IN)

SI945A-4H (4 x CX25878 chips with 16 Video-IN)

Page 22: Embedded Solution Product Roadmap. Applications Overview LEX System's Specialty New products highlight Product Development Timeline Intel embedded chipset.

Processor Chipset Feature

Intel SoC E38XX

DDR3L 1333Intel SoC Baytrail

3I380AW (2 x GbE, Car Power Control, USB , HDMI, Wide Range DC-IN)2I380A (2 x GbE, USB 3.0, HDMI, )

Intel IVY Bridge 1047UE / i3 / i7

DDR31333/1600

Intel Pather Point(PCH) HM76

3I847AW (2 x GbE, USB 3.0, DVI & HDMI , Wide range DC-IN)

Intel Atom D525 DDR3 800Intel Atom

D525 + ICH8M3I525AW (2 x Realtek GbE, 6 x COM, Wide range DC-IN)

Intel Core Duo/ Core 2 Duo

DDR2 533/667Intel 945GME + ICH7M MI945A (VGA/DVI ports, TV-Out, Video-IN, S-Video)

Intel CedarView N2600

DDR3 800

Intel CedarView-M+ NM10

2I260A (1 x Realtek GbE, DVI & HDMI )

VIA E-Series Nano DDR3 1066 VIA VX900 3V900A (HDMI, H.264 decode, SPDIF (option))

Page 23: Embedded Solution Product Roadmap. Applications Overview LEX System's Specialty New products highlight Product Development Timeline Intel embedded chipset.

Model ANT TWIN TWIN w/2.5” HDD

Dimensions mm 135W x 85D x 30H 145 x 96.3D x 35H 145 x 150D x 35H

Storage mSATA mSATA 2.5” HDD

Material Aluminum Aluminum Aluminum

Weight 0.5 kg 1.0 kg 1.3 kg

ANTTWIN

TWIN w/2.5” HDD

Page 24: Embedded Solution Product Roadmap. Applications Overview LEX System's Specialty New products highlight Product Development Timeline Intel embedded chipset.

Model UNO BRIK CUBE BLOK LEO TWITTER TIGER

Dimensions mm

180W x 125D x 42H187 x 130D x

52H178W x 116D x

55H195W x 138D x

70H246W x 124D x

50H210W x 125D x

55H190.8W x 130D x

58.5H

Storage 2.5” HDD 2.5” HDD 2.5” HDD 2.5” HDD 2.5” HDD 2.5” HDD 2.5” HDD

Material Aluminum +Plastics Aluminum Aluminum + SECC Aluminum + SECC Aluminum Aluminum Aluminum

Weight 1 kg 1.3 kg 1 kg 1.4 kg 1.22 kg 1.22 kg 2.2kG

UNO

BRIK

CUBE

BLOK

LEO

TWITTER

TIGER

Page 25: Embedded Solution Product Roadmap. Applications Overview LEX System's Specialty New products highlight Product Development Timeline Intel embedded chipset.

Model TINO TINO 2PCI TWISTER NEO

Dimensions mm 245W x 177D x 68H 268W x 182D x 110H 300W x 200D x 75H 275W x 172D x 50H

Storage 2.5” HDD 2.5” HDD + 2 x PCI 2.5” HDD + PCI card or 3.5” HDD 2.5” HDD

Material Aluminum

Weight 2.9 kg 3 kg 2.9 kg 2 kg

Page 26: Embedded Solution Product Roadmap. Applications Overview LEX System's Specialty New products highlight Product Development Timeline Intel embedded chipset.

Model 1U FANLESS Half 1U FANLESS Half 1U w/ FAN

Dimensions mm 440W x 360D x 44.3H 440W x 218.8D x 44.3H 442W x 214D x 44.5H

M/B Q’ty 1~2 1~2 1~2

Storage 1 x 3.5”HDD or 2.5” HDD 1 x 3.5” HDD or 2.5” HDD 1 x 3.5” HDD or 2.5” HDD

Option Slim CD-RON / LCM / Extra USB, COM, PS2 KB&MS, GPIO, AUDIO, IEEE1394, PCI card, 3G, GPS, Bluetooth, WiFi, VGA

Half 1U FANLESS with 2 pcs Mother board

Page 27: Embedded Solution Product Roadmap. Applications Overview LEX System's Specialty New products highlight Product Development Timeline Intel embedded chipset.

Panel Size 8.4” 10.4” 12.1” 15” 17”

Dimensions254W x 190H x 58D

mm288W x 245H x 61D

mm320W x 275H x 61D mm 384W x 312H x 66D mm

413W x 343H x 79.5D mm

Weight 2 kg 2.2 kg 4 kg 6.5 kg 7 kg

Hard Drive 2.5” HDD 2.5” HDD 2.5” HDD 2.5”/3.5” HDD 2.5”/3.5” HDD

Max Resolution SVGA 800 x 600SVGA

800 x 600

XGA1024 x

768XGA 1024 x 768 XGA 1024 x 768 SXGA 1280 x 1024

Backlight LED LED LED LED LED

Touch Screen Resistive Touch Resistive Touch Resistive TouchResistive Touch

(Capacitive by Option)Resistive Touch

Mounting Spac.VESA 75,

Panel MountVESA 75/100,Panel Mount

VESA 75/100, Panel Mount

VESA 75/100,Panel Mount

VESA 75/100,Panel Mount

Waterproof IP65 IP65 IP65 IP65 IP65

Fanless Panel PC – 4:3 seriesFanless‧Waterproof‧Touch Screen‧Wall Mount‧Open-frame design

Page 28: Embedded Solution Product Roadmap. Applications Overview LEX System's Specialty New products highlight Product Development Timeline Intel embedded chipset.

Panel Size 7” 10.2” 15.6”

Dimensions 189W x 128H x 58D 286W x 190H x 60D mm 408W x 265H x 55.5D mm

Weight 1.2 kg 1.3 kg 2 kg

Hard Drive CF card / 2.5” HDD 2.5” HDD 2.5”/3.5” HDD

Max Resolution WSVGA 1024 x 600 WSVGA 1024 x 600 HD 1366 x 768

Backlight LED LED LED

Touch ScreenResistive Touch

(Capacitive by Option)Resistive Touch Resistive Touch

Mounting Spac. VESA 75 VESA 75/100 VESA 75/100

Waterproof IP65 IP65 IP65

Fanless Panel PC – 16:9 seriesFanless‧Waterproof‧Touch Screen‧Wall Mount‧Open-frame design

Page 29: Embedded Solution Product Roadmap. Applications Overview LEX System's Specialty New products highlight Product Development Timeline Intel embedded chipset.

Panel Size 8.4" 10.4” 12.1” 15”

Dimension 254W x 190H x 42D mm 287.6W x 245H x 44D mm 320.3W x 275H x 43D mm 384W x 312H x 45D mm

Resolution SVGA 800 x 600 SVGA 800 x 600 SVGA 800 x 600 XGA 1024 x 768

Brightness 450 400 450 350

Contrast Ratio 600:1 700:1 700:1 700:1

Touch Screen Resistive Touch Resistive Touch Resistive Touch Resistive Touch

Mounting Spec. VESA 75 VESA 75 / 100 VESA 75 / 100 VESA 75 / 100

waterproof IP65 IP65 IP65 IP65

Page 30: Embedded Solution Product Roadmap. Applications Overview LEX System's Specialty New products highlight Product Development Timeline Intel embedded chipset.

Interface Model Name & Function Optional Model

PCI Express card E617A (4 x PoE 10/100/1000 BaseT(X) 802.3 af ; 12V DC input / 48V DC output

PCI Express card E811A-4G (4 x Realtek 8111C 10/100/1000 Mbps LAN)

PCI Express card E811A-4U (4 x Intel 82574 L 10/100/1000 Mbps LAN ) Optional

Mini PCI card M810A-1R (1 x Realtek 8100C 10/100 Mbps LAN)

Mini PCI card M810A-2R (2 x Realtek 8100C 10/100 Mbps LAN) Optional

Mini PCI card M810A-1G (1 x Realtek 8110SC 10/100/1000 Mbps LAN) Optional

Mini PCI card M810A-2G (2 x Realtek 8110SC 10/100/1000 Mbps LAN) Optional

Mini PCIe card M574A-G (1 x Realtek 8111C 10/100/1000 Mbps LAN)

Mini PCIe card M574A-U (1 x Intel 82574 L 10/100/1000 Mbps LAN)

LAN Wafer NW367A (4 x 802.3af PoE w/ LAN Switch) Only for NI525A

PCI card ADSL2 + Modem

PCI card P811B-4R (4 x 10/100 Mbps Realtek LAN AND 1 x Mini PCI socket )

E617A supports 4 ports 802.3af PoE

Page 31: Embedded Solution Product Roadmap. Applications Overview LEX System's Specialty New products highlight Product Development Timeline Intel embedded chipset.

Interface Model Name & Function

USB 2.0 Bluetooth (Bluetooth 2.0 + EDR support)

Mini PCIe card 3G ( HSPA/UMTS, EDGE/GPRS/GSM, EV-

Mini PCIe card Wi-Fi

Mini PCIe card GPS

Bluetooth 3G Wi Fi GPS

Page 32: Embedded Solution Product Roadmap. Applications Overview LEX System's Specialty New products highlight Product Development Timeline Intel embedded chipset.

Model Name Interface Feature

M878A Mini PCI card Video capture card for 1~4 CH video input

Hardware video compression card Mini PCI card 4 x video input & 4 x Audio input

HD video decode module Mini PCIe card H.264/AVC High Profile

M858A Mini PCIe card 8CH D1 video in & 8CH Audio in

Video Capture cardHardware videocompression card

HD videodecode card

8CH D1surveillance card

Page 33: Embedded Solution Product Roadmap. Applications Overview LEX System's Specialty New products highlight Product Development Timeline Intel embedded chipset.

Model Name Interface Feature

M435A SBC USB wafer USB to SD card

M531A Mini PCIe card SATA & RAID extension

M923A Mini PCIe card SATA extenstion

CF006 SATA SATA to CFast slot

CF001 PATA IDE to CF slot

USB to SD card SATA & RAID extensionSATA extension SATA to CFast slotIDE to CF slot

Page 34: Embedded Solution Product Roadmap. Applications Overview LEX System's Specialty New products highlight Product Development Timeline Intel embedded chipset.

Model Name Interface Function Note

CN027 USB Wafer 1-2 x SIM card Powered from M/B

CN030 PCIe & USB 1 x SIM card Mini PCIe card

CN041 USB 2.0 2 x Mini PCIe & 2 SIM card GPRS/3G/3.5G

CN024 SBC IO wafer 5~6 x COM, 2 x USB, Audio For 3I525A

M954A Mini PCIe card Mini PCIe to 4 x RS232 or RS 422

M303A USB 2.0 USB to RS232 or RS485

LD004 SBC LVDS wafer 1 x chabbel LVDS to RGB output & 3 x control outputs Vsync, Hsync & DE

M750A Mini PCIe card 2 x VGA or 1 x DVI + 1 x VGA 1920 x 1080 Resolution

M643A Mini PCIe card 3 x IEEE 1394 a/b Work w/ CN039

3 x IEEE 1394 a/b module

Page 35: Embedded Solution Product Roadmap. Applications Overview LEX System's Specialty New products highlight Product Development Timeline Intel embedded chipset.

Riser card

Model Name Specification Note

RS005 1 PCI To 1 PCI For SI525A, CI945A

RS007 1 PCI To 2 PCI For SI525A, CI945A, MI945A

RS009 1 PCI To 2 PCI For SI525A, CI945A, MI945A, TINO 2 PCI system

RS010 1 PCI To 1 PCIe For MI945A / CI945C

RS011 1 PCI To 1 PCIe & 1PCI For 1U with MI945A / CI945C

RS203 1 PCI To 2 PCIe For CI650A, CI770A, TINO 2PCI system

RS211 PCI slot Br to PCIe x1 for 1U For 1U with CI650, CI770, CI847

RS215 PCI slot Br to 1PCI For Twister/ TINO with CI650, CI770, CI847

RS221 PCI slot Br to 2 PCI For 1U with CI650, CI770, CI847

RS222 PCI slot Br to 2 PCI For TINO -2 PCI with CI650, CI770, CI847

Power board

Model Name Function Note

PW016 DC IN +19 V, Battery Charger board DC Out :12V

PW017. DC IN: +9V to +36V

. OVP: 37V, OCP: 7.2VDC Out: 12V

PW201. DC IN: +9V to +36V

. Adjustable power ON/OFF delay time. CPC Hardware and Software

DC Out: 12V/5A

PW202. DC IN: +15V to +36V

. Adjustable power ON/OFF delay time. CPC Hardware and Software

DC Out: 12V/10A

PW301 PD to ISO DC 12V

PW302 PD to ISO DC 12V & Charger 2S

Power on/off delay module

Page 36: Embedded Solution Product Roadmap. Applications Overview LEX System's Specialty New products highlight Product Development Timeline Intel embedded chipset.

Digital I/O card

Model Name Function Note

CIO104 2 Digital Input + 2 Digital Output (1 Power Relay + 1 SSR) CIO104-2I2O

CIO108 4 Digital Input + 4 Digital Output (2 Power Relay + 2 SSR) CIO108-4I4O

CN003 4 DI & 4 DO

CN031 For VGA, RS232, Audio, LAN, USB, Power & more 2.0 mm wafer to TB 3.5 mm connector

CN033 For Power, USB & more 2.0 mm wafer to TB 3.5 mm connector

CN034 4 DI & 4 DO

Wall Mount KitsVESA mounting kits

For Panel PC / Touch monitorFor LEO / TWITTER / UNO / BRIK / CUBE

VESA 75 /100

System Wall mount kits For NEO / TWISTER / TINO

Isolator 4 DI and 4 DO

Page 37: Embedded Solution Product Roadmap. Applications Overview LEX System's Specialty New products highlight Product Development Timeline Intel embedded chipset.

For more information, please visit our websitehttp://www.lex.com.tw

OFFICE Email

TAIWAN Headquarters [email protected]

EUROPE Headquarters [email protected]

Russia Branch [email protected]

USA Branch [email protected]

Japan Branch [email protected]

China Branch [email protected]