Electronic Costing & Technology Experts...• The FXTH87 is the 4th generation TPMS from Freescale. It features the smallest footprint with It features the smallest footprint with
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DISCLAIMER : System Plus Consulting provides cost studies based on its knowledge of the manufacturing and selling prices of electronic components and systems. The given values are realistic estimates which do not bind System Plus Consulting nor the manufacturers quoted in the report. System Plus Consulting is in no case responsible for the consequences related to the use which is made of the contents of this report. The quoted trademarks are property of their owners.
– ASIC 28– View, Dimensions & Marking– Delayering– Main Blocks Identification– Process Identification– Cross-Section – Process Characteristics
– MEMS Pressure Sensor 41– View, Dimensions & Marking– Sensing Area Details– Cross-Section– Process Characteristics
– MEMS Accelerometer 58– View, Dimensions & Marking– Bond Pad Opening & Bond Pad– Cap Removed & Cap Details– Sensing Area Details– Cross-Section– Process Characteristics
4. Physical Comparison with Infineon SP37 88
5. Manufacturing Process Flow 91– Global Overview– ASIC Front-End Process– ASIC Wafer Fabrication Unit– MEMS Pressure Sensor Process Flow– MEMS Accelerometer Process Flow– MEMS Wafer Fabrication Unit– Packaging Process Flow & Assembly Unit
6. Cost Analysis 113– Synthesis of the cost analysis– Main steps of economic analysis– Yields Hypotheses– ASIC 118
– ASIC Front-End Cost– ASIC Probe Test & Dicing Cost– ASIC Wafer & Die Cost
– MEMS Pressure Sensor 124– MEMS Pressure Sensor Front-End Cost– MEMS Pressure Sensor Cost per process steps– MEMS Pressure Sensor Probe Test & Dicing Cost– MEMS Pressure Sensor Wafer & Die Cost
– MEMS Accelerometer 131– MEMS Accelerometer Front-End Cost– MEMS Accelerometer Cost per process steps– MEMS Accelerometer Probe Test & Dicing Cost– MEMS Accelerometer Wafer & Die Cost
– Back-End : Final Test & Calibration Cost– FXTH87 Component Cost
The reverse costing analysis is conducted in 3 phases:
Teardown analysis
• Package is analyzed and measured• The dies are extracted in order to get overall data: dimensions, main blocks, pad number and pin out, die marking• Setup of the manufacturing process.
Costing analysis
• Setup of the manufacturing environment• Cost simulation of the process steps
Selling price analysis
• Supply chain analysis• Analysis of the selling price
Reverse costing analysis represents the best cost/price evaluation given the publically available data, and estimates completed by industry experts.
Given the hypothesis presented in this analysis, the major sources of correction would lead to a +/- 10% correction on the manufacturing cost (if all parameters are cumulated).
These results are open for discussion. We can reevaluate this circuit with your information. Please contact us: