JAXA 23 rd Microelectronics Workshop Electroless Ni/Pd/Au Plating Electroless Ni/Pd/Au Plating for High Reliable Gold Wire Bonding with Electronic Devices for Space Applications for High Reliable Gold Wire Bonding with Electronic Devices for Space Applications (1) Au Plating Combinations and Reliability (2) Au Grain Size and Crystal Growth (2) Au Grain Size and Crystal Growth (3) Diffusion of Under-plated Metal onto Au surface (4) Wire Bonding Reliability Ranking of Au Plating Yukihisa Hiroyama (4) Wire Bonding Reliability Ranking of Au Plating Hitachi Chemical Co., Ltd.
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Electect o ess / d/ u at groless Ni/Pd/Au Plating for …face hology Su Morp h M t ion Au Au Pd Au FIB/SI o ss Sec Pd Cr Ni 1 µm Ni 1 µm Ni 1 µm JAXA MEWS23 Surface Morphology and
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JAXA MEWS23 JAXA 23rd Microelectronics Workshop
Electroless Ni/Pd/Au Plating Electroless Ni/Pd/Au Plating ect o ess / d/ u at gfor High Reliable Gold Wire Bonding with Electronic Devices for Space Applications
ect o ess / d/ u at gfor High Reliable Gold Wire Bonding with Electronic Devices for Space Applications p ppp pp
(1) Au Plating Combinations and Reliability(2) Au Grain Size and Crystal Growth(2) Au Grain Size and Crystal Growth(3) Diffusion of Under-plated Metal onto Au surface(4) Wire Bonding Reliability Ranking of Au Plating
Yukihisa Hiroyama
(4) Wire Bonding Reliability Ranking of Au Plating
Hitachi Chemical Co., Ltd.
JAXA MEWS23 11
Structure of BGA AssemblyStructure of BGA Assembly
Gold WireDie Bonding
MaterialSemiconductor
Chip
Molding
Gold Wire Chip
WireWire MoldingMaterial
P k S b t t
WireWireBondingBonding
Solder Ball
Solder Solder JointJoint
Package Substrate
BallPrinted Circuit Board
JointJoint
JAXA MEWS23 Wire BondingWire Bonding
22Wire BondingWire Bonding
Gold WireAluminum ElectrodeCopper
Line
LSILine Resist
LSI
Die Bonding Material G ld Pl t dDie Bonding Material Gold PlatedTerminalPackage Substrate
JAXA MEWS23
Solder Ball JointSolder Ball Joint33
Solder Ball JointSolder Ball Joint
Package SubstrateCopper Pad Package SubstrateCopper Pad
Solder Ball Gold Plated Terminal
Solder BallResist
JAXA MEWS23 44
Characterization of Gold PlatingCharacterization of Gold PlatingE’less Ni/Au(ENIGEG)(5/0 5µm)
E’lyticNi/Au(5/0 5µm)
ItemE’less Ni/Pd/Au(ENEPIGEG)(5/0 5/0 5µm)
Wire Bondability OK OK OK(5/0.5µm)(5/0.5µm) (5/0.5/0.5µm)
Wire Bondabilityafter Aging*Wi B d bilit
OK NG OKWire Bondabilityafter Aging*and Plasma**
OK OK OK
Solder Joint Reliability OK NG OK
* Aging : 150ºC, 50 hours ** Plasma : O2 plasma
JAXA MEWS23
G ld Pl i C bi i i hG ld Pl i C bi i i h55
Gold Plating Combination withE’less and E’lytic Processes
Gold Plating Combination withE’less and E’lytic Processesyy
Gold Plating Process Thickness (µm)ENEPIGEG (Ni/Pd/Au)ENEPIG (Ni/Pd/IG)
5/0.5/0.55/0.5/0.05
Gold Plating Process Thickness (µm)
ENEPIG (Ni/Pd/IG)ENIGEG (Ni/Au)Ni(SB-Watt)/E’lytic Au
5/0.5 5/0.5
Ni(B-Watt)/E’lytic Au Ni(B-Sulf)/E’lytic AuNi(SB Watt)/IGEG
Model of Grain Structure andModel of Grain Structure and1717
Model of Grain Structure and Diffusion on ENEPIGEG
Model of Grain Structure and Diffusion on ENEPIGEG
IGEG
ENEPIGEG
IGEGIGEG
ENEPIGEG(Electroless Ni/Pd/Au)
IGEGIGEG
EPEP EP
ENEN ENFIB/SIM Analytical Result
Grain Boundary DiffusionGrain Boundary Diffusion
FIB/SIM Analytical Result
JAXA MEWS23 1818
Model of Grain Structure andModel of Grain Structure andModel of Grain Structure and Diffusion on Ni(SB-Watt)/AuModel of Grain Structure and Diffusion on Ni(SB-Watt)/Au