RF FILOX VMOS TRANSISTOR Dr. M. M. A. Hakim Dr. M. M. A. Hakim East West University East West University
Jul 25, 2015
RF FILOX VMOS TRANSISTOR
Dr. M. M. A. HakimDr. M. M. A. Hakim
East West UniversityEast West University
Fabrication processFabrication process
STEP 1: 1. p-well implant all over the wafer (B, 2.5e14 cm-3; 50 keV);2. drive-in anneal (1100degC);3. etch to remove oxide formed after drive-in anneal.
Fabrication processFabrication process
STEP 2:1. Pillar definition mask (PL), anisotropic etch. Preliminary target four
different pillar height: 250, 350, 450 and 550 nm.2. Etch damage removal.
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STEP 3: 1. Pad oxidation (dry, 900degC, 10 nm); Pad oxide = stress relief
oxide; protect Si by thermal expansion of Si3N4;2. Deposit Si3N4 (120 nm, 740 degC)
Fabrication processFabrication process
STEP 4: Active area definition 1. Active area definition mask AA; this mask defines the source, the
source contact and the bulk contact area;2. Anisotropic etch
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STEP 5: 1. Hydrox oxidation (dry, 1000degC, 400nm); Lateral electrical isolation
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STEP 6: 1. Anisotropic etch of Si3N4 and of pad oxide to leave sidewall spacers
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STEP 7: FILOX oxidation1. Dry, 1100degC2. Three thicknesses: 40, 70 and 100 nm
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STEP 8: Bulk contact implant (p+);1. Mask PP; this mask is larger than the AA to ensure that the bulk
contact covers all of the active area width;2. Implant B+ (1e15cm-3, 50 keV);
Fabrication processFabrication process
STEP 9: S/D Implant1. Mask NGA; this mask is larger than the AA to ensure that the source
covers all of the active area width;2. Implant As+ ( 20° tilted; 3e15cm-3, 120, 140 & 165 keV); there is
only a S\D implant; LDD are provided by anneal
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STEP 10: Nitride fillet and stress relief oxide removal1. Wet etch to remove oxide formed on top of Si3N4;2. Wet etch to remove nitride fillets;3. Wet etch to remove pad (or stress relief) oxide4. 30 nm of FILOX oxide might be removed
Fabrication processFabrication process
STEP 11: Gate oxidation and gate poly deposition. 1. Gate oxidation (dry, 900degC) 2. Deposition of polySi (Low Pressure; 200nm; 5e19cm-3; 650degC)
Fabrication processFabrication process
STEP 12: Poly gate etch1. Mask polysilicon P1; Removal PolySi with anisotropic etch, leaving
only the fillets; 2. The mask protects the link between the Gate contact and the fillets
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STEP 13: Back end processing1. Deposition of 100nm undoped Silox+ 500nm BPSG;2. RTA implant activation and reflow3. Mask CW; Vias for metallization