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EE 587 SoC Design & Test Partha Pande School of EECS Washington State University [email protected]
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EE 587 SoC Design & Test

Jan 13, 2016

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EE 587 SoC Design & Test. Partha Pande School of EECS Washington State University [email protected]. SoC Physical Design Issues. Design Challenges. Non-scalable global wire delay Moving signals across a large die within one clock cycle is not possible. - PowerPoint PPT Presentation
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Page 1: EE 587 SoC Design & Test

EE 587SoC Design & Test

Partha PandeSchool of EECSWashington State [email protected]

Page 2: EE 587 SoC Design & Test

SoC Physical Design Issues

Page 3: EE 587 SoC Design & Test

Design Challenges

1. Non-scalable global wire delay

2. Moving signals across a large die within one clock cycle is not possible.

3. Current interconnection architecture- Buses are inherently non-scalable.

4. Transmission of digital signals along wires is not reliable.

Page 4: EE 587 SoC Design & Test

Interconnect Scaling Effects

Dense multilayer metal increases coupling capacitance

Old Assumption DSM

Long/narrow line widths further increases resistance of interconnect

Page 5: EE 587 SoC Design & Test

Effect of Advanced Interconnect

Page 6: EE 587 SoC Design & Test

Effect of Wire Scaling on Delay

What happens to wire delay? Many people claim that wire delay

goes up, as shown in the famous plot from the 1995 SIA roadmap

But it depends on how you scale the wires and which wires you are talking about.

In a technology shrink (s< 1) There are really two types of wires a. Wires that scale L directly by s, b. Wires of constant percentage of

die size, the global wires of the increasing complex chips

Delay is different for these two cases as shown here:

0.18um 0.13uma

b

L=43um T=0.8um

Shrinking ProcessD

elay

(pS)

1.0 0.5 0.35 0.250.8

10

20

30

5

15

25

Gate

Interconnect

0.180.65 0.13 0.1Source: SIA Technology Roadmap

Total

Page 7: EE 587 SoC Design & Test

Global Wire Delay

Global wires•Non-scalable delay•Delay exceeds one clock cycle

Page 8: EE 587 SoC Design & Test

Wire Modeling

Page 9: EE 587 SoC Design & Test

Elmore Delay

Page 10: EE 587 SoC Design & Test

Elmore Delay

Page 11: EE 587 SoC Design & Test

Delay of a wire

Page 12: EE 587 SoC Design & Test

FO4 vs. Wire Delay

0.0

200.0

400.0

600.0

800.0

1000.0

1200.0

650 500 350 250 180 130 90 65 45 32 22

Technology (nm)

Dela

y (

ps)

FO4 1mm

2mm

3mm

Page 13: EE 587 SoC Design & Test

Delay with Buffer insertion

Follow board notes (Chapter 10 of HJS) Refer to section 4.8 of HJS for resistance of a transistor

Page 14: EE 587 SoC Design & Test

Buffer Insertion for Long Wires

Make Long wires into short wires by inserting buffers periodically. Divide interconnect into N sections as follows:

Then delay through buffers and interconnect is given by: tp = N *[Reff(Cself+ CW/2) + (Reff + RW)(CW/2+Cfanout)] What is the optimal number of buffers? Find N such that tP/ N = 0 N sqrt(0.4RintCint L2 /tpbuf) where tpbuf = Reff(Cself + Cfanout) What size should the buffers be? Find M such that tP/ M = 0 M = sqrt((Reqn/Cg3W)(Cint/Rint))

Rw RwRw Rw

Cw/2

M M M M

Reff = Reqn/M Cself=Cj3W*M Cfanout = Cg3W*M Rw = RintL/N Cw = CintL/N

2W

W Cw/2 Cw/2 Cw/2

Page 15: EE 587 SoC Design & Test

Issues in Buffer Insertion

Even number of repeaters needed to avoid logic inversion Better strategy to optimize the delay-power product Repeaters for global wires require many via cuts from the

upper-layer wires all the way down to the substrate Floorplanning Area and power Repeated wires offer increased bandwidth

Page 16: EE 587 SoC Design & Test

Gate Delay Scaling

Gate delay has scaled almost linearly. Gate and Diffusion capacitance also scale nicely

Page 17: EE 587 SoC Design & Test

Wire Scaling

Resistance: Resistance grows under scaling, since the width and height both scale down

L_drawn 0.18 um 0.13 um 0.10 um 0.07 um 0.05 um 0.035 um

Semi-global pitch, um

0.36 0.26 0.20 0.14 0.10 0.07

Global pitch, um

0.72 0.52 0.40 0.28 0.20 0.14

Chip edge, mm

19 20.7 22.8 24.9 27.4 30.1

Detail analysis of capacitance in later classes

Page 18: EE 587 SoC Design & Test

Delay and Bandwidth

Classification of wires Connects gates locally within blocks, when devices and blocks get smaller,

these wires get shorter Connects blocks together, spanning significant portion of the die

Page 19: EE 587 SoC Design & Test

Delay and Bandwidth (Cont’d)

Wires that scale in length

Delay scales with technology Wires span block of 50k gates

Wires that do not scale in length

Increasing delay disparity with gates Relative to gate delay roughly doubles each generation

Page 20: EE 587 SoC Design & Test

Global wire delay

Global wires limit the system performance

Page 21: EE 587 SoC Design & Test

Uniformly Repeated Lines

Page 22: EE 587 SoC Design & Test

Non-uniform Buffer Insertion

Page 23: EE 587 SoC Design & Test

Non-uniform Buffer Insertion (Cont’d)

• Gain in power consumption is due to less number of buffers

Page 24: EE 587 SoC Design & Test

Summary

Single synchronous clock region will span only a small fraction of the chip area

We should not try to distribute a single low power clock all along the whole chip

The whole SoC needs to be divided into multiple functional islands with independent frequency

Synchronization of signals crossing multiple clock boundary is important