ECE 477 Design Review Team 1 Fall 2011

ECE 477 Design Review Team 1 Fall 2011

Justin Huffaker, Aaron Garrett, Ryan Hannah, Brendon McCool.

Outline

Project overview Project-specific success criteria Block diagram Component selection rationale Packaging design Schematic and theory of operation PCB layout Software design/development status Project completion timeline Questions / discussion

Project Overview

Our project, code named Virtual Imaging Peripheral for Enhanced Reality or VIPER, is an augmented/virtual reality system. It will track a user’s head location and perspective and use this information to find the location of a camera position in a virtual environment. With a pair of video glasses the user would then see the virtual environment at the cameras location. As the user moves around a table top sized environment their actual and virtual perspective changes, allowing them different viewing angles of the virtual space.

Project-Specific Success Criteria

1. An ability to communicate time stamp data using RF between the base unit and head unit.

2. An ability to display images to the video glasses.3. An ability to estimate the angle and position of a

user’s head with respect to an origin point unit using accelerometer, gyroscope, compass, visual data, and ultrasonic data.

4. An ability to find angle displacement of head relative to IR beacon origin using glasses mounted camera.

5. An ability to find distance from base to head unit using ultrasonic emitter and receiver.

Block Diagram

Component Selection Rationale Implementing a Kalman Filter

Requires interfacing with Accelerometer Gyroscope Magnetometer Camera Process Module Ultrasonic Module

Component Selection Rationale General Sensor Requirements

Small size Resolution in expected data range Low cost Fast/simple communication protocol Fast sample data rate 3-axis (or two cheaper 2-axis sensors) 3.3 Volts

Component Selection Rationale Accelerometer

Specific Requirements Data range ± 2g Greater than 160 Hz data rate

MMA8452Q 3-axis 12bit ±2g, ->0.488mg sensitivity I2C interface 1.5 to 800 Hz data rate 1.95 V to 3.6 V supply voltage

Component Selection Rationale Gyroscope

Specific Requirements Track ± 200 °/sec Greater than 80 Hz data rate

ITG-3200 3 axis 16-bit ±2000°/sec, -> 0.0305176 °/sec resolution I2C interface 3.9 – 8000 samples/sec 2.1 V to 3.6 V supply voltage

Component Selection Rationale Magnetometer

Specific Requirements 25–65 μT (average magnetic field due to Earth’s

Magnetic Poles) Greater than 40 Hz data rate

MAG3110 3 axis ±1000 μT range 0.10 μT sensitivity I2C interface Output data rate up to 80 Hz 1.95 V to 3.6 V supply voltage

Component Selection Rationale

Head Unit Camera

Specific Requirements At least 126x96 pixels 40 fps Common Camera interface

TCM8230MD Max 30 fps 660x492 pixels

Camera Visual Processer Chip Specific Requirements

40 Hz camera data processing rate At least 12 Kbytes flash

AT91SAM9XE256 256 Kbytes flash Dedicated camera peripheral 180Mhz clock

Component Selection Rationale

Head Unit Microcontroller requirements

Large number of interfacing peripherals 1 I2C 2 UART 1 SPI 1 USB slave 1 ATD

ATD response rate of at least 8.5 KHz PIC32MX534F064

Cheap 80 MHz frequency All required Interfaces and enough pins to pin them out

Component Selection Rationale

Table Unit Microcontroller requirements

40 KHz PWM output for Ultrasonic PWM for IR LED UART for Xbee

PIC24FJ16GA002 32 MHz 2 PWMs UART 3 to 3.6 V operating voltage

Component Selection Rationale

Microprocessor/Motherboard Required Specifications

Estimate position and orientation using Kalman Filter OpenGL for graphics

BeagleBoard-XM 1 GHz ARM Cortex-8TM Composite and DVI out 3D graphics accelerator and OpenGL support Small footprint Supports I2C and RS-232 5 V input voltage Floating point hardware

Project Packaging Specifications Our project will have three main packaging

componets: 1. The “head unit” will contain the sensors, IR

camera, microcontrollers, ultrasonic receiver, and Xbee module

2. The “beacon unit” will contain the IR LED, a microcontroller, an ultrasonic emitter array, and the other Xbee module

3. The “Beagleboard” will contain just the microprocessor and battery

Project Packaging Constraints Head unit: must be lightweight and bring as

little discomfort to the user as possible Beacon unit: must be portable, only enough to

move from tabletop to tabletop during non-use; will be stationary during use

Beagleboard: must be lightweight enough to be attached to the user without being cumbersome

Packaging Dimensions 208 pins, 31.2mmx31.2mm, QFP;AT91SAM9XE256 28pins, 8.20mmx10.5mm, SSOP;PIC24FJ6GA002 64 pins,12mmx12mm,TQFP;PIC32MX534F06H 7.62mm height by 11 mm diameter;40TR12B-R 6mmx6mmx4.5mm; TCM8230MD 24.38mmx32.94mmx8.12mm, WRL-08664 4mmx4mmx0.9mm,QFN(chip);17.78mmx13.97(breakout);

ITG-3200 3mmx3mmx1mm,QFN(chip);17.78mmx13.97(breakout);

MMA8452Q 13.3mmx14.5mm(breakout); MAG3110 82.55mmx82.55mm; 296-25798-ND Estimated head unit package: 100mmx121mmx20mm Estimated beacon unit package:54mmx100mmx20mm Estimated Beagleboard package: 130mmx100mmx20mm

Packaging Illustration: Head Unit

Packaging Illustration: Beacon Unit

Packaging Illustration: Beagleboard

Front View

Back View

Head Unit USB Arbiter - Schematic

Head Unit USB Arbiter - Schematic

RS-232

IC BP Filter

Ultrasonic Input

5V Input

3.3V Regulator

USBPIC32MX534F064H

RJ-11

Xbee

Pinned Out Optional Inputs

Sensors

Head Unit USB Arbiter - Schematic

Switch

USB

Power Jack

3.3V

5V

LM3671

Head Unit USB Arbiter - Schematic

RJ-11

Reset

Head Unit USB Arbiter - Schematic

USB micro-b

8 MHz crystal

Head Unit USB Arbiter - Schematic

Bulk Cap

SPI to Atmel

ITG-3200

MMA8452Q

MAG3110

Xbee

Head Unit USB Arbiter - Schematic

DB-9

Signals From Micro

Head Unit USB Arbiter - Schematic

Input Output

GND3.3V

Camera Module - Schematic

Camera Module - Schematic

TCM8230MD(Camera)

Buck Voltage Regulators

JTAG Programmer

Microcontroller

Camera Module - Schematic

Camera Module - Schematic

2.8V(3.3V?) and 1.5V

Interfacing to image sensor interface peripheral

Camera Module - Schematic

Camera Module - Schematic

2.8 V

1.8V

1.5V

Camera Module - Schematic

2.8 V

1.8V

1.5V

PCB Test Points

Camera Module - Schematic

Camera Module - Schematic

Decoupling and Bulk Capacitors

Reset Pushbutton

Slow Crystal(Start up, USB, etc.)

Camera Module - Schematic

Camera Module - Schematic

Main Crystal (Actual Execution)PLL Loop Back Filter

Theory of Operation – TCM8230MD(Camera)

Theory of Operation – TCM8230MD(Camera)

Indicates that a new frame is ready

Theory of Operation – TCM8230MD(Camera)

Indicates that a new frame is ready

Indicates that a new scanline is ready

Theory of Operation – TCM8230MD(Camera)

Indicates that a new frame is ready

Indicates that a new scanline is ready

Valid data on parallel port

Theory of Operation – TCM8230MD(Camera)

Indicates that a new frame is ready

Indicates that a new scanline is ready

Valid data on parallel port

This is handled by the Image Sensor Interface peripheral

Beacon Board FunctionalityTransmit Ultrasonic Pulses to Head unit

Transmit Timestamps via Xbee module

Control IR LED via PWM

External Power Supply (12V)

SMPS Buck Converter (12-3.3V)

RJ-11

XBee Module

PIC24FJ16GA002

Optical IsolatorAmplifier

Headers for ultrasonic transmitters (4)

Headers for IR LED

External Power Supply (12V) AP1509

COUTBulk Capacitor

CIN

Jumper For IR LED

Crystal (8MHz) RJ-11 Jack

for ICD3

Reset Switch for PIC24

Op-amp amplification circuit

Optical Isolator

Jumpers for ultrasonic transmitters

PCB Layout – Head Unit

PCB Layout – Head Unit

Power Supplies

PCB Layout – Head Unit

Power Supplies

Digital Logic

PCB Layout – Head Unit

Power Supplies

Digital Logic

Analog Circuit

PCB Layout – Head Unit GND Placement

PCB Layout – Head Unit – 3.3V Placement

PCB Layout – Head Unit - Microcontrollers

PCB Layout – Head Unit – Sensor Placement

Beacon Board PCB

PCB Left Side

Power Jack, Regulator Circuit

Ultrasonic Isolation and Amplification Circuitry

RJ-11 Jack and Crystal

PIC24 Microcontroller

XBee Module and IR LED Circuit

Software Design/Development Status Explorer 16

Completed UART for RS-232 PWM at 40KHz for Ultrasonic General IO for testing and input buttons

Started I2C for Sensor communication ATD for Ultrasonic input

Need to Do Microprocessor - Kalman Filter, Graphics, and USB driver PIC32 – USB, SPI and UART for Xbee PIC24 – PWM and UART for Xbee Atmel – Camera Interface, I2C for camera, and SPI For all – Main program

Software Design/Development Status Microprocessor

Operating system and shared memory PIC32 – Head Unit

Interrupt based priority switching loop PIC24 – Base Unit

Round Robin Polling Atmel

Round Robin Interrupt

Project Completion Timeline

Task

Week

8 9 10 11 12 13 14 15 16

Hardware and Software Integration and Testing

- I2C Bus(Justin)

- XBee(Brendon or Garrett)

- Camera Testing(Ryan)

- Ultrasonics(Brendon or Garrett)

Microprocessor Software Design and Testing

- Beagle Board Programming(Justin)

- OpenGL Redering Code(Justin)

PCB Poulation and Testing

Integration of parts

Package Construction

Questions / DiscussionQuestions / Discussion