EC front unit status. Outline Conclusions from mechanical prototype and actions taken Status of electrical prototype KIT’s work for TA Dev plan (tests)

EC front unit statusS. Ahmad, P. Barrillon, S.Blin, D. Cuisy, S. Dagoret-Campagne, P. Dinaucourt, R. Sliwa, JL. Socha (LAL)

A. Ebersoldt (KIT)

8th progress meeting EUSO-BalloonOctober 12th 2012 - APC

Outline• Conclusions from mechanical prototype

and actions taken• Status of electrical prototype• KIT’s work for TA• Dev plan (tests)

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Reminder: EC-front elements

• 3 different PCBs:

• First one (EC DYNODE board) allows to reroute half of the dynodes of 1 MAPMT so that they are aligned perpendicularly to the others. It covers the 4 MAPMTs.

• Second one (EC ANODE board) covers one MAPMT but has dimensions reduced allowing a flex pcb to get out. It is used to collect signal from the anodes and send them to the ASICs.

• Third one (EC HV board) covers one MAPMT. It welcomes the dynodes and supplies the HV to the EC-dynode board which transmits it to the 4 MAPMTs.

Per EC unit:• 1 EC-DYNODE board• 4 EC-ANODE boards• 1 EC-HV boards

UV filter

MAPMTMAPMT MAPMT

Flexible pcb toward EC-back

HV cables toward HV box3

Front view

6 mm outer diameter 3.1 mm inner diameter

Radius of the corner : R2.2

55 mm

Thickness: 1 mm

11 mm6 mm

17 mm

Outer and inner diameters10 and 6 mm

19.62 mm 19.62 mm

53 mm51 mm Thickness: 3 mm

9.3 mm

17 mm

~2 mm

Dimensions of PDM frame

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EC unit inside PDM frame

• EC_dynode is 54.5 mm x 54.5mm therefore it will lay on the PDM structure where the distance goes from 55 mm to 53 mm• 2 adjacent EC_anodes soldered to the MAPMT pins (going through holes of the EC_dynode) should fit in 53 x 53 mm• The EC_HV soldered to extensions coming from the EC_dynode should fit also in the 53 x 53 mm

MAPMT MAPMT

Ec_dynode

Ec_anode

Ec_HV

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EC unit assembly test at APC

It looked ok…

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MATRA mechanical prototype• The mechanical prototype was finished 12/07•MATRA people checked if the proto was fitting

inside a homemade version of the mechanical structure of 1 EC unit• They observed that the EC_anodes and EC_HV

were overlapping with the structure meaning that they were going over the 53 x 53 mm…• Calculations based on the CAD files showed that

indeed the dimensions of EC_anode and EC_HV are lightly too much… see following slides.

Mechanical prototype

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8.32 mm

EC_dynode dimensions

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1.16 mm

1.16 mm

EC_anode dimensions6 mm (8.32 – 2 x 1.16)

23.7 mm 24 mm

53.7 mm

The distance (6 mm) between two EC_anodes is needed to let the flexible cables go through this gap. It was the leading idea of the EC front unit design.

But then the global dimensions are 53.7 x 53.7 mm… we missed that .

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1.16 mm

1.16 mm

How to fix the problem for the EC_anodes

The larger holes on the edge are 2 mm large ones and there is no routing around.Therefore EC_anode rigid pcb could be reduced significantly by removing the parts

MATRA did that on the mechanical prototype to perform the potting test.

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6 mm

21.7 mm 21.1 mm

48.8 mm

New version of the EC_anodes and EC_HVAction:EC_anodes were corrected end of July 2012. EC_HV in September 2012.

In this version, the extension pins coming from the EC_dynode toward the EC_HV will go next to the EC_anodes not anymore through.

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6 mm

21.7 mm 21.1 mm

48.8 mm

New version of the EC_anodes and EC_HVAction:EC_anodes were corrected end of October/beginning of November

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Before Now

Mechanical prototype potting

Top view (fake filters) Bottom view (cables and screw)

Lateral view 1

Lateral view 2 Lateral view 3 Lateral view 413

Mechanical prototype potting• Clearly the result is not good.• MATRA thinks that the problem comes from the fact that the EC_dynode lays on the mold’s shoulder (from 55 mm to 53 mm), this way the air can not easily escape and this creates bubbles that explode.

MAPMT MAPMT

Ec_dynodeEC_anodes

EC_HV

Filters

Mold 3D view from MATRA

Picture of the mold (2 parts)

Actions:- Modification of the mold (sept 2012)- Potting will be done in vacuum

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Integration of the mechanical prototype potted

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After all (reduction of the size of the fake pcbs and removal of the central column), it fits in the mechanical frame

Electrical prototype• Due to manpower issue, MATRA started the electrical prototype of the EC beginning of this week• It should be ready next week• It is be composed of:• 4 real MAPMTs equipped with UV filters selected by Philippe• 1 EC_dynode real PCB• 2 EC_anodes of each type real PCB (old version)• 1 EC_HV (old version)

• All pcbs have been provided by KIT from the spares of boards produced for TA.• KIT is in charge of the assembly of the EC front units for TA and has started assembly tests

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TA EC front unit

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Slides from Andreas E.

TA EC front unit

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Slides from Andreas E.

Development plan (tests)

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• Once the EC front unit electrical prototype will be produced• Connection to the HVPS and HV ON to check current and MAPMTs power and

analog signals, without light (in black box)• Connection to the HVPS and HV ON to check current and MAPMTs power and

analog signals, with light ON (in black box)

• When we will have a working EC_ASIC – test_EC_ASIC couple1. EC_ASIC tests with EC front unit without potting (2 weeks)

• HV off (Pedestal measurements, DAC linearity, PC measurements)• HV on (same measurements as above) in black boxe, light off• HV on (same measurements as above) in black boxe, light on

2. EC_ASIC tests with EC front unit with potting (as much time as needed)• HV off (same measurements as above)• HV on (same measurements as above) in black boxe, light off• HV on (same measurements as above) in black boxe, light on

3. EC_ASIC tests with EC unit at 3 mbar + temperature tests• To be specified

BACK-UP SLIDES

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Mechanical prototype: fake MAPMTs

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4 pieces produced by MATRA for the mechanical prototypeWith fake UV filter as well

Fake pcbs of the EC-front boards

EC_HVEC_dynode

EC_anode straight

EC_anode curved

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