EasyPACK ™ module with EDT2 IGBT and diode and PressFIT / NTC Features • Electrical features - Blocking voltage 750 V - Low V CE,sat - Low switching losses - Low Q g and C rss - Low inductive design -T vj,op = 150°C • Mechanical features - 4.2 kV DC 1 second insulation - High creepage and clearance distances - High power density - Integrated NTC temperature sensor - PressFIT contact technology - RoHS compliant - UL 94 V0 module frame Potential applications • Automotive applications • (Hybrid) electrical vehicles (H)EV • Motor drives Product validation • Qualified according to AQG 324 Description The FF300R08W2P2_B11A is a very compact and flexible product offering integrated isolation for the main inverter of hybrid and electric vehicles. The module uses the benchmark EDT2 IGBT generation allowing 750V blocking voltage and IcN of 300A.The chipset has benchmark current density combined with short circuit ruggedness for reliable inverter operation under harsh environmental conditions. The EDT2 IGBTs also show excellent light load power losses, which helps to improve system efficiency over a real driving cycle. The EDT2 IGBT was optimized for applications with switching frequencies in the range of 10 kHz.The EasyPACK TM package is qualified for automotive applications and is validated according to AQG 324. Its high power cycling capability as well as the high creepage and clearance distances add to the product reliability. The power module comes with PressFIT Pins for the signal terminals to avoid additional time consuming selective solder processes, which provides cost savings on system level and increases system reliability. Type Package Marking FF300R08W2P2_B11A EasyPACK ™ 2B Module SP005424885 FF300R08W2P2_B11A EasyPACK ™ module Datasheet Please read the Important Notice and Warnings at the end of this document Revision 1.01 www.infineon.com 2021-09-13
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EasyPACK™ module with EDT2 IGBT and diode and PressFIT / NTC
Features• Electrical features
- Blocking voltage 750 V- Low VCE,sat
- Low switching losses- Low Qg and Crss
- Low inductive design- Tvj,op = 150°C
• Mechanical features- 4.2 kV DC 1 second insulation- High creepage and clearance distances- High power density- Integrated NTC temperature sensor- PressFIT contact technology- RoHS compliant- UL 94 V0 module frame
Potential applications• Automotive applications• (Hybrid) electrical vehicles (H)EV• Motor drivesProduct validation• Qualified according to AQG 324DescriptionThe FF300R08W2P2_B11A is a very compact and flexible product offering integrated isolation for the main inverter of hybrid andelectric vehicles. The module uses the benchmark EDT2 IGBT generation allowing 750V blocking voltage and IcN of 300A.Thechipset has benchmark current density combined with short circuit ruggedness for reliable inverter operation under harshenvironmental conditions. The EDT2 IGBTs also show excellent light load power losses, which helps to improve system efficiencyover a real driving cycle. The EDT2 IGBT was optimized for applications with switching frequencies in the range of 10 kHz.TheEasyPACKTM package is qualified for automotive applications and is validated according to AQG 324. Its high power cyclingcapability as well as the high creepage and clearance distances add to the product reliability.The power module comes with PressFIT Pins for the signal terminals to avoid additional time consuming selective solderprocesses, which provides cost savings on system level and increases system reliability.
edges general tolerances surfaceISO 8015 principle of independencydimensions ISO 14405 GGtarget geometry according CAD filewith general tolerances method of least-squares1
All dimensions refer to module in delivery condition
00 Ersterstellung Revision Änderung Erstellt durch Genehmigt von Genehmigt am
3
C1E1 G1
1
2
1
E2G2T1 T2
1,40,2
16,40,5
120,35
62,80,5
(53)
480,3
56,70,3
42,50,15
22,70,316,40,2
4,50,12,30,1 x8,5+0,3
510,15
- Pin-Grid 3,2mm - Tolerance of PCB hole pattern - Hole specification for contacts see AN 2009-01 - Diameters of drill Ø1,15mm and copper thickness in hole 25-50µm
0,1
PCB hole pattern
2x9 according to screw head / washer
03,26,49,612,816
21,25
26,5
3,26,49,612,816
21,25
26,5
01,6817,6
20,8
2425,5
1,6 8 11,2
20,8
24 25,5
2,84x
Figure 3
FF300R08W2P2_B11AEasyPACK™ module
7 Package outlines
Datasheet 11 Revision 1.012021-09-13
8 Module label code
Module label code
Code format Data Matrix Barcode Code128
Encoding ASCII text Code Set A
Symbol size 16x16 23 digits
Standard IEC24720 and IEC16022 IEC8859-1
Code content ContentModule serial numberModule material numberProduction order numberDate code (production year)Date code (production week)
Digit1 – 56 - 1112 - 1920 – 2122 – 23
Example71549142846550549911530
Example
Packing label code
Code format Barcode Code128
Encoding Code Set A
Symbol size 34 digits
Standard IEC8859-1
Code content ContentModule serial numberModule material numberProduction order numberDate code (production year)Date code (production week)
IdentifierX1TS9DQ
Digit2 – 912 – 1921 – 2528 – 3133 – 34
Example950566092X0003E0754389113915
Example
X950566091T2X0003E0S754389D1139Q15
7154914284655054991153071549142846550549911530
Figure 4
FF300R08W2P2_B11AEasyPACK™ module
8 Module label code
Datasheet 12 Revision 1.012021-09-13
Revision historyDocument revision Date of release Description of changes
V1.0 2020-07-24 Target Datasheet
1.00 2021-07-29 Final datasheet
1.01 2021-09-13 Layout correction
FF300R08W2P2_B11AEasyPACK™ module
Revision history
Datasheet 13 Revision 1.012021-09-13
TrademarksAll referenced product or service names and trademarks are the property of their respective owners.
IMPORTANT NOTICEThe information given in this document shall in noevent be regarded as a guarantee of conditions orcharacteristics (“Beschaffenheitsgarantie”).With respect to any examples, hints or any typicalvalues stated herein and/or any information regardingthe application of the product, Infineon Technologieshereby disclaims any and all warranties and liabilitiesof any kind, including without limitation warranties ofnon-infringement of intellectual property rights of anythird party.In addition, any information given in this document issubject to customer’s compliance with its obligationsstated in this document and any applicable legalrequirements, norms and standards concerningcustomer’s products and any use of the product ofInfineon Technologies in customer’s applications.The data contained in this document is exclusivelyintended for technically trained staff. It is theresponsibility of customer’s technical departments toevaluate the suitability of the product for the intendedapplication and the completeness of the productinformation given in this document with respect to suchapplication.
WARNINGSDue to technical requirements products may containdangerous substances. For information on the typesin question please contact your nearest InfineonTechnologies office.Except as otherwise explicitly approved by InfineonTechnologies in a written document signed byauthorized representatives of Infineon Technologies,Infineon Technologies’ products may not be used inany applications where a failure of the product orany consequences of the use thereof can reasonablybe expected to result in personal injury.