DVSALiteSeriesD Installation Guide DVA-08E EnUS T3813001739

RAID Subsystem DVA-08EDVA-08E SCSI Lite Series

en Installation Manual

RAID Subsystem DVA-08E | Installation Manual Table of Contents | en 3

Table of Contents

1 Warnings and Certifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51.1 Warning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51.2 Safety Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 51.3 Certification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5

2 Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72.1 Product Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72.2 Management Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92.2.1 RS-232C Terminal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92.2.2 Ethernet Port: Telnet Access. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 92.2.3 Ethernet Port: Using RAIDWatch Manager . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102.2.4 Possible RAIDWatch Connection: DAS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102.3 Enclosure Chassis . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112.3.1 Chassis Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112.3.2 Physical Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112.3.3 Front Panel Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112.3.4 Hard Drive Numbering. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122.3.5 Rear Panel Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122.3.6 Backplane Board . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122.4 Subsystem Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132.4.1 Chassis Ears . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 132.4.2 LED Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142.4.3 Drive Trays. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 142.4.4 The RAID Controller Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 152.4.5 Power Supply Unit. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 172.4.6 Cooling Modules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 182.5 Subsystem Monitoring. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192.5.1 I2C Bus . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192.5.2 LED Indicators. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192.5.3 Firmware and Bosch RAIDWatch GUI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192.5.4 Audible Alarms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 192.6 Hot-Swappable Components. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202.6.1 Hot-Swap Capabilities . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 202.6.2 Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20

3 Hardware Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 213.1 Installation Prerequisites . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 213.2 Safety Precautions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 223.2.1 Precautions and Instructions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 223.2.2 Static-Free Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 233.3 General Installation Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 243.4 Unpacking the Subsystem. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 243.5 Rackmounting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 253.6 Drive Tray Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25

4 Subsystem Operation and Monitoring. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 274.1 Subsystem Monitoring Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 274.2 Status-indicating LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 284.2.1 Brief Overview of the LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 284.2.2 LED Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 284.2.3 Drive Tray LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 294.2.4 Controller Module LEDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 304.2.5 LAN Port LEDs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 304.2.6 PSU LED . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 314.2.7 Cooling Module LED . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 324.3 Audible Alarm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 334.4 I2C Monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33

5 Subsystem Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 345.1 SCSI Connection Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 345.1.1 SCSI Port on the Controller Rear Panel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 34

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4 en | Table of Contents RAID Subsystem DVA-08E | Installation Manual

5.1.2 SCSI Termination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 345.2 Host Connection Topology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 355.2.1 Basic Configuration Rules . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 355.2.2 Single Host Connection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 355.3 Power On . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 365.3.1 Power On Checklist . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 365.3.2 Power On Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 365.3.3 Power On Status Check . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 375.4 Power Off Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 38

6 Subsystem Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 396.1 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 396.1.1 About Subsystem Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 396.1.2 General Notes on Component Replacement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 396.2 Replacing Controller Module Components . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 406.2.1 Overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 406.2.2 Notes on Controller Module Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 406.2.3 Removing the Controller Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 416.2.4 Replacing the Controller Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 426.3 DIMM Module Replacement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 436.3.1 DIMM Module Considerations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 436.3.2 DIMM Module Replacement Procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 436.4 Replacing a Faulty PSU Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 456.4.1 Notes on PSU Module Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 456.4.2 Replacing the PSU Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 456.5 Replacing a Failed Cooling Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 476.5.1 Notes on Cooling Module Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 476.5.2 Replacing a Cooling Module . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 476.6 Drive Tray Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 496.6.1 Notes on Hard Drive Maintenance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 496.6.2 Replacing a Failed Hard Drive . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 49

7 Appendix: Technical Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 517.1 Controller Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 527.2 Drive Tray Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 527.3 Power Supply Specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 537.4 Cooling Module Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 537.5 RAID Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 537.6 Fault Tolerance Management . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54

8 Appendix: Spare Parts and Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 558.1 Spare Parts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 558.2 Accessories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 55

9 Appendix: Pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 569.1 SCSI Port: VHDCI Connector Pinouts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 569.2 COM1 Cable: DB9 and Audio Jack Pinouts . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 579.3 Null Modem . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 589.4 Ethernet Port Pinouts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 589.5 Main Power . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 58

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RAID Subsystem DVA-08E | Installation Manual Warnings and Certifications | en 5

1 Warnings and Certifications

1.1 WarningA shielded power cord is required in order to meet FCC emission limits and also to prevent

interference to nearby radio and television reception.

Use only shielded cables to connect I/O devices to this equipment. You are cautioned that

changes or modifications not expressly approved by the party responsible for compliance

could void your authority to operate the equipment.

1.2 Safety PrecautionsPrecautions and Instructions

• Prior to powering on the subsystem, ensure that the correct power range is being used.

• The RAID subsystems come with drive bays. Leaving any of these drive bays empty will

seriously affect the efficiency of the airflow within the enclosure, and will consequently

lead to the system overheating, which can cause irreparable damage.

• If a module fails, leave it in place until you have a replacement unit and you are ready to

replace it.

• Airflow Consideration: The subsystem requires an airflow clearance, especially at the

front and the rear side.

• Handle subsystem modules using the retention screws, extraction levers, and the metal

frames/faceplates. Avoid touching PCB boards and connector pins.

• To comply with safety, emission, or thermal requirements, none of the covers or replace-

able modules should be removed. Make sure that during operation, all enclosure modules

and covers are securely in place.

• Be sure that the rack cabinet that the subsystem chassis is to be installed provides suffi-

cient ventilation channels and airflow circulation around the subsystem.

• Provide a soft, clean surface to place your subsystem on before working on it. Servicing

on a rough surface may damage the exterior of the chassis.

• If it is necessary to transport the subsystem, repackage all disk drives separately. If using

the original package material, other replaceable modules can stay within the enclosure.

ESD Precautions

Observe all conventional anti-ESD methods while handling system modules. The use of a

grounded wrist strap and an anti-static work pad are recommended. Avoid dust or debris in

your work area.

1.3 CertificationFCC Class B Radio Frequency Interference Statement

FCC (applies in the U.S. and Canada)

This equipment has been tested and found to comply with the limits for a Class B digital

device, pursuant to Part 15 of the FCC Rules (47 CFR, Part 2, Part 15 and CISPR PUB. 22

Class B). These limits are designed to provide reasonable protection against harmful interfer-

ence when the equipment is operated in a residential installation. This equipment generates,

uses, and can radiate radio frequency energy and, if not installed and used in accordance with

this user’s guide, may cause harmful interference to radio communications. However, there is

no guarantee that interference will not occur in a particular installation. If this equipment does

cause harmful interference to radio or television reception, which can be determined by turn-


6 en | Warnings and Certifications RAID Subsystem DVA-08E | Installation Manual

ing the equipment off and on, the user is encouraged to try to correct the interference by one

or more of the following measures:

• Reorient or relocate the receiving antenna.

• Increase the separation between the equipment and receiver.

• Connect the equipment into an outlet on a circuit different from that to which the

receiver is connected.

• Consult the dealer or an experienced radio/TV technician for help

This device complies with Part 15 of FCC Rules. Operation is subjected to the following two

conditions: 1) this device may not cause harmful interference, and 2) this device must accept

any interference received, including interference that may cause undesired operation.

This device is in conformity with the EMC.

CB (Certified Worldwide)

This device meets the requirements of the CB standard for electrical equipment with regard to

establishing a satisfactory level of safety for persons using the device and for the area sur-

rounding the apparatus. This standard covers only safety aspects of the above apparatus; it

does not cover other matters, such as style or performance.


RAID Subsystem DVA-08E | Installation Manual Introduction | en 7

2 IntroductionThe flexible, high performance RAID subsystem combines SCSI-320’s high-speed data transfer

rate with low-cost SATA-II hard disk solution, the subsystem offers the best storage return on

investment (ROI.)

The subsystem is easy to use. All modules including the drive trays, controller module, cooling

modules and PSUs can be access from either subsystem front or rear. Most of these modules

are hot-swappable and can be served while the subsystem is still running.

The subsystem’s embedded firmware offers the same protection and maintenance functional-

ities as those designed for an enterprise-level RAID solution. The subsystems provide unprece-

dented configuration flexibility and allow for the customization of storage subsystems to meet

specific demands. It is a rigorous and durable subsystem that can be easily configured and

operated.

Fully featured RAID redundancy (which provides advanced data protection) ensures that the

complete range of RAID levels (RAID 0, 1(0+1), 3, 5, 10, 30, and 50) is supported by the sub-

system. Bosch implements Smart Technologies (IOSmart, DrvSmart and SysSmart) into the

intelligent firmware further guarantees the overall availability of valuable data.

IT managers using the RAID subsystems will be able to save the totally investment cost and

rapidly develop a comprehensive storage array.

2.1 Product OverviewThe RAID subsystem comes in a 2U-high rack-mountable chassis. The SATA-based RAID sub-

system has one (1) 320MB/second SCSI (SCSI-320) host channel and provides RAID protec-

tion to the data stored in the eight (8) hot-swappable, SATA-II hard drives. The 2U-profile

subsystem is equipped with redundant and hot-swappable cooling modules and a single

power supply module. The modular nature of the subsystem and the easy accessibility to all

major components ensure the ease of subsystem maintenance.

All controller functionality is managed by robust and easily upgraded firmware. Arrays created

using different versions of firmware are compatible and data stored in all Bosch-based sub-

systems can be managed or shared within a storage network. The subsystem is ideal for

direct-attached data storage, backup, and retrieval.

When you are configuring your storage subsystem, the followings should also be considered.

• Host ID mapping is flexible, in the sense that the same array can be associated with dif-

ferent host ID/LUNs, allowing the host clustering configurations. Drives on different chan-

nels can then be grouped into an array, and the array has its unique volume size, stripe

size, and optimization mode. Arrays of different RAID levels can be striped together into

logical volumes, making management of huge volume size an easier task.

• Using a mix of LVD and legacy devices, such as devices using single-ended signaling, is

not recommended. Use LVD terminators if all your devices support LVD signaling. Please

refer to the documentation provided with your SCSI devices to avoid possible conflicts.

• When selecting the number of hard drives to be included in a logical configuration that

should be presented through the host channels, the transfer rates and the mechanical

performance of the hard disks should be considered. The combined bandwidth of the

two SCSI host channels is 640MB/s, sufficient for most applications. If properly config-

ured, combining subsystems or drive enclosures may increase the number of drives and

helps to bring out the most of IOPs performance.

If you consider cascading multiple enclosures, considerations may include the characteristics

of your I/O load. Select the correct combination of optimization mode and a specific RAID

level. Please refer to the Administration Manual for more details on the preferences, and ana-


8 en | Introduction RAID Subsystem DVA-08E | Installation Manual

lyze them with reference to the preferences of your host applications, such as the scatter/

gather elements.

An optimal configuration is always a compromise among different factors. For instance, a

large array with many drive members may be more efficient, but the chance of failing a mem-

ber is also increased.

Fig. 2.1 Front view

iNOTICE! On receiving and unpacking your subsystem, please check the package contents against the

included unpacking checklist. If any modules appear to be missing, please contact your sub-

system vendor immediately.



2.2 Management Connection

2.2.1 RS-232C TerminalTo access the configuration utility embedded in the controller firmware, do the following:

1. Use a serial cable, to connect the audio jack connectors (COM1) (see Figure 2.2) on the

back of the RAID controllers to the serial port of a management computer.

Fig. 2.2 Management Interfaces

2. The null modem should be attached to either the DB-9 end of the serial cable or directly

to the serial port of the computer running a terminal emulation program as a manage-

ment station.

3. The configuration utility is accessed by VT-100-compatible software running on a PC. The

connection requirements are listed below:

Terminal connection should work properly using the above setting.

2.2.2 Ethernet Port: Telnet Access1. Use a reliable Ethernet cable with RJ-45 phone jacks to connect the Ethernet port on the

controller module installed in the upper module slot.

2. Connect the other end of the Ethernet cable to your local area network. An IP address

should be acquired for the subsystem’s Ethernet port. The subsystem firmware also sup-

ports automatic client configuration such as DHCP.

3. Consult your network administrator for an IP address that will be manually assigned to

the controller Ethernet port.

4. Assign the IP address to the controller Ethernet port and specify the NetMask and Gate-

way values. Power off your system and then power on again for the configuration to take

effect.

5. Select "View and Edit Configuration Parameters" from the main menu on terminal screen.

Select "Communication Parameters" -> "Internet Protocol (TCP/IP)" -> press [ENTER] on

the chip hardware address -> and then select "Set IP Address."

6. Provide the IP address, NetMask, and Gateway values accordingly.

7. PING the IP address from your management computer to make sure the link is up and

running.

8. Open a command prompt and key in “telnet <IP address>” to access the embedded firm-

ware utility.

Baud rate 38400

Data bits 8

Stop bits 1

Parity None



2.2.3 Ethernet Port: Using RAIDWatch Manager To prepare the controller for using the RAIDWatch manager, do the following: (For RAIDWatch

versions 2.1 and above)

1. Prepare the Ethernet port connection; see the description in the previous section.

2. Download or access the RAIDWatch installation program in the Product Utility CD that

came with your subsystem.

3. Assign an IP address to the controller Ethernet port and specify the Net Mask and Gate-

way values.

4. Execute the install shield program (there are specific installers for different OSes) to

begin the installation process. Select an appropriate installation batch for your installa-

tion scheme. The available options are listed below:

– Centralized Management allows you to install the RAIDWatch GUI, a Root agent,

RAID agents, Configuration Client utility, and necessary drivers on the computer cho-

sen as a management center.

– Stand-alone (on Host) - Selecting this option installs the In-Band driver (RAID

agents) for servers directly attached to a RAID subsystem, and the RAIDWatch GUI

on the local computer.

– Stand-alone (on Subsystem) - This will install the GUI onto the subsystem itself. The

RAID subsystem comes with the necessary RAID agents embedded in the firmware.

A RAID subsystem uses a small section of formatted disk space (called the reserved

space) to store GUI files. Installed in this mode, RAIDWatch can be started by a

remote browser accessing the IP address assigned to the subsystem’s Ethernet port.

For more details, please refer to the connection view diagrams below.

Use a Java-compatible browser and key in the controller IP address as your URL. NOTE: If

you are using the third installation scheme (Stand- alone on Subsystem mode), at least

one drive slot should be populated. The controller firmware distributes the necessary

RAIDWatch modules to a small portion of disk capacity that is automatically formatted

once the configuration is done.

2.2.4 Possible RAIDWatch Connection: DAS

Fig. 2.3 RAIDWatch in a DAS Environment: Multiple Arrays Monitored on a Direct-Attached Server



2.3 Enclosure Chassis

2.3.1 Chassis OverviewThe subsystem comes in a 2U metal chassis. A backplane board divides the enclosure inter-

nally into front and rear sections. The front section accommodates eight (8) drive trays (with

their associated hard drives) and the rear section accommodates one (1) or two (2) PSU mod-

ule(s), two (2) single-fan cooling modules, and a single RAID controller module. The sub-

system comes with two (2) forearm handles or two (2) chassis ears with finger grip on either

side of the subsystem front enable you to easily insert/extract the chassis into/from a rack or

cabinet. Pre-drilled mounting holes on the sides of the chassis allow you to attach separately

purchased slide rails.

All active components on the RAID subsystems are accessed through the front or rear panel.

The modular nature of the active components facilitates their ease of maintenance. Almost

every major component is hot-swappable and can be easily replaced while the system is run-

ning.

• RAID controller module: RAID controller comes with a main board and a DDR RAM DIMM

module mounted on it to provide the system I/O transaction power and RAID functional-

ity.

• PSUs: Connect the hot-swappable PSUs to the main power source will provide sufficient

power to the subsystem. A power switch is located on each PSU to turn the subsystem

on and off.

• Cooling modules: The redundant cooling modules ventilate the subsystem to reduce the

operating temperature within the subsystem.

2.3.2 Physical DimensionsThe subsystems come in a standard 2U, 19" chassis with the following dimensions:

• Measured with forearm handles: 482mm x 88mm x 505mm (width x height x depth)

• Measured without forearm handles: 446mm x 88mm x 490mm (width x height x depth)

2.3.3 Front Panel OverviewThe front section of the subsystem features a 4 x 2 layout for eight (8) 3.5-inch disk drives and

LED panel. A description of the front panel component is given below:

Fig. 2.4 Front View

The front panels are designed to accommodate the following components:

• Chassis ear and LED panel: Two (2) chassis ears are located on either side of the sub-

system front. An LED panel that shows subsystem operating status by indicating LEDs

covers the left chassis ear. (Please refer to Section 2.4.1 Chassis Ears and

Section 2.4.2 LED Panel.)

iNOTICE!

Components accessed through the front panel are referred to as “Front Panel Components”

and Components accessed through the rear panel are referred to as “Rear Panel Components.”



• Drive bays with drive tray canisters: The drive bays are used to house the subsystem

hard drives. The subsystem contains eight (8) drive bays with a blank plate covering the

upper part of the front panel.

2.3.4 Hard Drive NumberingA blank plate covers the upper chassis. When viewing from the front, drive bays (slots) are

numbered from Slot 1 to Slot 8 (see Figure 2.5), from left to right, and then from middle to

bottom.

Fig. 2.5 Drive Bay Numbering Sequence

2.3.5 Rear Panel OverviewThe rear section of the subsystems are accessed through the rear panel and is reserved for a

single RAID controller module and two (2) cooling modules. (See Figure 2.6).

Fig. 2.6 Rear View

The rear panels shown above are designed to accommodate the following components:

• RAID controller module: Each controller module contains a RAID controller board and a

pre-installed DDR RAM DIMM module, which provide the system RAID functionalities.

• PSU: The subsystem contains one (1) PSU. The hot-swappable PSU provides power to

the subsystem. A power switch is located on the right of each PSU to turn the system on

and off.

• Cooling module: The redundant cooling module is used to ventilate the subsystem and to

reduce the temperature within the subsystem.

2.3.6 Backplane BoardAn integrated backplane board separates the front and rear sections of the subsystem. This

PCB board provides logic level signals and low voltage power paths. Thermal sensors and I2C

devices are on-board to detect system temperature and cooling module running status. This

board contains no user-serviceable components.

CAUTION! Accessing the backplane board may lead to fatal damage of the RAID subsystem. Any interfer-

ence with this board may lead to critical and irreversible damage.



2.4 Subsystem ComponentsAll the active components on the subsystems can be accessed through either the front or rear

panel. The modular design of the active components facilitates their easy installation and

removal. Hot-swap mechanisms are incorporated to eliminate power surges and signal

glitches that might occur while removing or installing these modules.

2.4.1 Chassis EarsEach subsystem enclosure has two (2) chassis ears on either side of the subsystem. Each

chassis ear contains a finger grip, and two (2) screw holes. The left chassis ear, when face the

subsystem front, is covered by the LED panel. A plastic cap conceals the right chassis ear. To

access the finger grips, pressing the LED panel and the plastic cap toward to the center of the

subsystem. (See Figure 2.7 and Figure 2.8) This mechanical design allows more finger room

for holding the subsystem into or out of the server rack. However, it is not recommended to

use these finger grips to lift up subsystem.

The screw holes on the chassis ear can be used to secure the subsystem to a rack using the

screws provided by your slide rail kit.

Fig. 2.7 Accessing the Left Finger Grips

Fig. 2.8 Accessing the Right Finger Grips



2.4.2 LED PanelThe subsystem comes with an LED panel in each front chassis for system status display (see

Figure 2.9). This module contains a Power Status LED, Host Busy LED, System Fault LED, and

a Mute button. The status LEDs indicate major component as well as subsystem statuses.

These LEDs deliver important messages from the subsystem to users and their definitions are

further explained in Section 4.2 Status-indicating LEDs.

The MUTE button stops the alarm until the next controller event occurs.

Fig. 2.9 LED Panel

2.4.3 Drive TraysThe subsystem comes with eight (8) drive trays (see Figure 2.10) designed to accommodate

separately purchased standard 1-inch pitch, 3.5-inch SATA disk drives. The drive bays are eas-

ily accessible from the front of the enclosure. Two (2) LEDs on the front of the tray indicate

the drive status. A key-lock on each drive tray secures the hard drive in place, while a conve-

nient release button ensures fast and efficient drive hot-swapping. Retention screw holes are

located on the sides of the drive tray and are reserved for securing hard drives to the tray.

Fig. 2.10 Drive Tray Front View

CAUTION! Be careful not to warp, twist, or contort the drive tray in any way (e.g., by dropping it or resting

heavy objects on it). The drive tray has been customized to fit into the drive bays in the sub-

system. If the drive bay superstructure is deformed or altered, the drive trays may not fit into

the drive bay.



2.4.4 The RAID Controller ModuleThe RAID controller module contains a main circuit board, a preinstalled 256MB DDR RAM

DIMM module, and the necessary support interfaces. The controller module contains no user-

serviceable components. Except when replacing a faulty unit or installing the cache memory

inside, the controller module should never be removed or opened.

Fig. 2.11 RAID Controller Model

• Cooling module speed detection: If the controller board temperature breaches the high

temperature threshold, the cooling modules in the subsystem will automatically turn to

the high fan speed to cool the system down.

• Docking connectors: The FCI docking connectors at the rear of the controller boards are

used to connect the controller module to the backplane board.

• Hand Screws: Two (2) hand screws located on the sides of the controller rear panel pro-

vide easy controller module installation and secure the controller module in place.

Controller Module Interfaces

The controller module rear panel is accessed through the controller module rear panel shown

in Figure 2.12.

Fig. 2.12 RAID Controller Rear Panel

CAUTION!

Although the RAID controller can be removed, the only time you should touch the controller

itself is to replace the memory module or to install the memory module. The RAID controller is

built of sensitive components and unnecessary tampering can damage the controller.

iNOTICE!

If the pre-installed DIMM module is not damaged, it can be reused when the controller module

is being replaced. Controller modules both come without DIMM module installed.



• Host Ports: One (1) SCSI-320 host channels connect the subsystem to the host comput-

ers equipped with SCSI-320 compatible adapters through the single VHDCI connector on

the subsystem’s controller module rear panel.

• COM Port: Each controller module comes with one (1) COM ports. The COM port is used

for accessing the controller-embedded configuration utility through the network that

allows you to configure and monitor your array and upgrade firmware over a VT-100 ter-

minal emulation program running on a management computer. An audio-jack to DB9

cable is shipped with your subsystem to facilitate the connection. Use the cable to con-

nect the COM serial port to a PC hyper-terminal for terminal emulation management.

• Ethernet port: The controller module on the subsystem comes with a 10/100M Ethernet

port used for remote management through the network. Shielded cables must be used to

protect against emissions. Connect the other end of the Ethernet cable to a LAN hub port

of the local network.

• LED indicators: Each controller board rear panel comes with four (4) LED indicators.

Please refer to Section 4 Subsystem Operation and Monitoring for information on how to

monitor your subsystem using these LED indicators.

DIMM Module

Each controller module comes with a 184-pin DDR RAM DIMM socket that is pre-installed a

256MB DDR RAM DIMM. The DIMM socket and module can be found on the controller board.

When the DIMM module is being changed, the controller module must be removed from the

subsystem chassis. Please see Section 6 Subsystem Maintenance for upgrading/replacing DIMM

modules.

iNOTICE!

The subsystem comes with preset configurations for channel mode and channel ID settings,

and should be sufficient for most applications.



2.4.5 Power Supply UnitThe subsystem is equipped with one (1) PSU on the left side of subsystem rear. The 2U, 350W

PSU is permanently mounted into a 2U bracket especially designed to house both the PSU and

a cooling module.

As shown in Figure 2.13, the PSU comes with a single power socket for power cord plug-in and

a single power switch to turn the PSU on and off. The PSU also comes with one (1) embedded

cooling fan to provide sufficient airflow to keep the PSU a consistent temperature. A single

LED is used to indicate the PSU status. A handle at the back of the PSU has been especially

designed to enable you to remove the PSU from the subsystem. This should only be done if

the PSU has failed and needs to be replaced.

A retention screw at the upper right corner of the PSU module is used to secure the PSU to

the enclosure. If the PSU needs to be removed, the retention screw must be removed first.

When installing a new PSU module, make sure that the retention screw has been firmly

secured.

For the PSU specifications, please refer to Section 7 Appendix: Technical Specifications.

Fig. 2.13 PSU Module

iNOTICE! Cooling modules can be independently removed from the chassis without affecting PSU opera-

tion.



2.4.6 Cooling ModulesThe SATA-based RAID subsystems are equipped with two (2), 1U single-fan, redundant, hot-

swappable cooling modules shown in Cooling Module. One 9.7cm blower is housed in each

cooling module. These modules have been designed to generate a cooling flow from the front

to the rear of the subsystem to extract the heat generated by the SATA hard drives.

Fig. 2.14 Cooling Module

Intelligent Dual Speed Operation

The cooling fans in the cooling module operate with two rotation speeds. Under normal oper-

ating conditions, the cooling fans run at the low speed, which is sufficient for maintaining effi-

cient airflow across the components. Under the following conditions, cooling fans raise their

rotation speed to increase the airflow:

1. Component failure: if one cooling fan in a cooling module, a PSU, or a temperature sensor

fails, the remaining cooling fan(s) automatically raises its rotation speed.

2. Elevated temperature: if the temperature breaches the upper threshold set for any of the

interior temperature sensors, the cooling fans automatically raise their rotation speed.

3. During the subsystem initialization stage, the cooling fans operate at the high speed and

return to low speed once the initialization process is completed and no erroneous condi-

tion is detected.

iNOTICE!

There are two values set for the upper temperature thresholds. One is set for event notification

and the other triggering higher fan rotation speed. The preset value for event notification can

be changed using the firmware-embedded configuration utility, while the fan speed trigger is

not a user’s option. Please refer to the Administration Manual for the options with event notifi-

cation values.



2.5 Subsystem MonitoringThe subsystem comes with a number of different monitoring methods that provide you with

continual updates on the status of the system and individual components. The following mon-

itoring features are included in the subsystem.

2.5.1 I2C BusThe following subsystem elements are interfaced to the RAID controller over a non-user-ser-

viceable I2C bus:

• Cooling modules

• Temperature sensors

2.5.2 LED IndicatorsThe following active components come with LEDs to indicate the status of the individual com-

ponents:

• RAID controller

– 4 controller status LEDs

– 2 Ethernet port status LEDs

• LED panel (3 LEDs)

• Cooling module (1 LED on each module)

• PSU module (1 LED on each module)

• Drive tray (2 LEDs on each module)

2.5.3 Firmware and Bosch RAIDWatch GUIFirmware: The firmware is pre-installed software that is used to configure the subsystem. The

firmware can be accessed through a terminal emulation program running on a management

computer that is connected to the subsystem’s serial port.

Bosch RAIDWatch: Bosch RAIDWatch is a premier web-based graphical user interface (GUI)

that can be installed on a remote computer and is used to access the array through LAN or the

Internet. The manager communicates with the array via the connection of the existing host

interface or Ethernet link to the RJ-45 LAN port.

2.5.4 Audible AlarmsThe subsystems come with audible alarms that are triggered when certain active components

fail or when certain (controller or subsystem) thresholds are exceeded. If you hear hastily

repeated beep tones from the subsystems it is imperative that you immediately determine and

rectify the problem.

Event notification messages indicate the completion of or the condition when proceeding with

array configuration tasks and are always accompanied by two (2) or three (3) successive and

prolonged beeps.

CAUTION!

Failing to respond when a critical alarm is heard can lead to permanent damage of the sub-

system. When an audible alarm is heard, rectify the problem as soon as possible.



2.6 Hot-Swappable ComponentsProper subsystem cooling is referred to as “normalized” airflow. Normalized airflow ensures

the sufficient cooling of the subsystem and is only attained when all components are properly

installed. Therefore, a failed component should only be hot-swapped when a replacement is

available. If a failed component is removed but not replaced, permanent damage to the sub-

system can result.

2.6.1 Hot-Swap CapabilitiesThe RAID subsystems come with a number of hot-swappable components. A hot-swap compo-

nent is one that can be exchanged while the subsystem is still online without affecting the

operational integrity of the subsystem. These components should only be removed from the

subsystem when they are being replaced. At no other time should these components be

removed from the subsystem.

2.6.2 ComponentsThe following components are all hot-swappable:

• Cooling module

• Hard drive

iNOTICE! Instructions on how to replace these hot-swappable components are given in

Section 6 Subsystem Maintenance.


RAID Subsystem DVA-08E | Installation Manual Hardware Installation | en 21

3 Hardware Installation This chapter gives detailed instructions on how to install the controller module, hard drives,

and drive trays into the subsystem. Installation into a rack or cabinet should occur before the

hard drives or drive trays are installed into the subsystem. Please confirm that you received all

of the components listed on the Unpacking List that came with the subsystem before pro-

ceeding with the installation process.

3.1 Installation Prerequisites• Static free installation environment: The subsystems must be installed in a static-free

environment to minimize the possibility of electrostatic discharge (ESD) damage. (See

Section 1 Warnings and Certifications).

• Component check: Before installing the subsystems, you should first check to see that

you have received all the required components. (See Section 3.3 General Installation Pro-

cedure) If any items appear damaged, contact your vendor for a replacement.

• Cabling:

– One (1) audio-jack-to-DB9 cable is provided to facilitate the connection of the COM1

port for local terminal emulation access to the array.

– For the power connections to the power sources, one (1) power cord is provided for

the subsystem.

– The RJ-45 Ethernet cable for network management connection is a user-supplied

item.

• Memory module: If you wish to change the pre-installed DDR RAM DIMM module, the sep-

arately purchased module(s) must be installed. (See Section 6 Subsystem Maintenance)

• Rack installation: The enclosure chassis can be installed into a rack cabinet using sepa-

rately purchased mounting rails, rear-attached brackets, or Bosch Slide rails. (See

Section 3.5 Rackmounting) A printed copy of installation guide is provided with the slide

rails package.

CAUTION! Carefully follow the installation instructions described in this manual to prevent any difficulties

and damages to your system.


22 en | Hardware Installation RAID Subsystem DVA-08E | Installation Manual

3.2 Safety Precautions

3.2.1 Precautions and Instructions• Please read these safety instructions carefully.

• Please keep this Installation Manual for later reference.

• Please disconnect the power cord from AC outlets before servicing or cleaning. Don‘t use

liquid or sprayed detergent for cleaning. Use moisture sheet or clothe for cleaning.

• Rack-mounted RAID subsystem – The subsystem is intended to be rack-mounted, follow-

ing concerns should be paid special attentions when the unit is mounted in a rack sys-

tem.

– “The RAID subsystem is to be installed in an environment with maximum ambient

temperature must not exceed 50°C.”

– “The openings on the enclosure are for air convection hence protected the equip-

ment from overheating. DO NOT COVER THE OPENINGS.”

– “Mounting of the RAID subsystem in the rack should be such that a hazardous con-

dition is not achieved due to uneven mechanical loading.”

– “Consideration should be given to the connection of the RAID subsystem to the sup-

ply circuit and the effect that overloading of circuits might have on over current

equipment nameplate ratings should be used when addressing this concern.”

– “This equipment must be connected to the reliable earthing before using. Particular

attention should be given to supply connections other than direct connections to the

branch circuit (e.g. use of power strips.)”

• CAUTION: RISK OF EXPLOSION IF BATTERY IS REPLACED BY AN INCORRECT TYPE. DIS-

POSE OF USED BATTERIES ACCORDING TO THE INSTRUCTIONS

• The RAID subsystems are pluggable equipments; the socket-outlet shall be installed near

the equipment and shall be easily accessible.

• Please keep the RAID subsystem from humidity.

• Lay RAID subsystem on a reliable surface when install. A drop or fall could cause injury.

• Make sure the voltage of the power source (100-120 or 200-230VAC) when connect the

RAID subsystem to the power outlet.

• Place the power cord such a way that people cannot step on it. Do not place anything

over the power cord. The power cord must be rated for the product and for the voltage

and current marked on the product’s electrical ratings label. The voltage and current rat-

ing of the cord should be greater than the voltage and current rating marked on the prod-

uct.

• All cautions and warnings on the RAID subsystem should be noted.

• If RAID subsystem is not use for long time, disconnect the equipment from mains to avoid

being damaged by transient over-voltage.

• Never pour any liquid into ventilation openings; this could cause fire or electrical shock.

• Never open the RAID subsystem. For safety reason, qualified service personnel should

only open the equipment.

• If one of the following situations arises, get the equipment checked by service personnel:

– The power cord or plug is damaged.

– Liquid has penetrated into the RAID subsystem.

– The equipment has been exposed to moisture.

– The RAID subsystem has not worked well or you cannot get it work according to this

manual.

– The RAID subsystem has dropped and damaged.

– If the RAID subsystem has obvious sign of breakage



• Thermal notice: All drive trays (even if they do not contain a hard drive) must be installed

into the enclosure. Leaving a drive bay or module slot open will greatly affect the airflow

efficiency within the enclosure, and consequently lead to system overheating. Keep a

faulty module in place until you have a replacement unit and are ready to replace it.

• An enclosure without disk drives can weigh up to 19 kilograms. (42 lbs.) Two people will

be required to install or relocate the subsystem. Drives should be removed from the

enclosure before moving the subsystem.

• Airflow considerations: The subsystem requires an airflow clearance especially at the

front and rear. For proper ventilation, a minimum of 2.5cm (1 inch) is required between

the front of the enclosure and rack cover; a minimum of 5cm (2 inches) is required

between the enclosure and end of the cabinet.

• Handle the system modules by the retention screws, eject levers, or the module’s metal

frame/face plate only. Avoid touching the PCB boards or connector pins.

• Always secure every enclosure module with its retaining screws or make sure it is held in

place by its latches.

• Be sure that the rack cabinet in which the subsystem chassis is to be installed provides

sufficient ventilation channels and airflow circulation around the subsystem.

• Provide a soft, clean surface to place your enclosure on before working on it. Servicing

the enclosure on a rough surface may damage the finish of the chassis.

• When working with the subsystem, it is important to use tools with extreme care. Do not

place tools or other items on top of the enclosure to avoid damaging the outward appear-

ance of the chassis.

• If it is necessary to transport the subsystem, remove and repackage all drives and

replaceable modules separately.

3.2.2 Static-Free InstallationStatic electricity can damage the system’s electronic components. To prevent ESD damage to

any of the components, follow these precautions before touching or handling them:

• Discharge the static electricity accumulated in your body by wearing an anti-static wrist-

band.

• Avoid carpets, plastic, vinyl, and Styrofoam in your work area.

• Handle all components by holding their edges or metal frames. Avoid touching the

exposed circuitry on PCB boards and connector pins.



3.3 General Installation ProcedureFollowing all the instructions provided below can save installation time. Detailed, illustrated

instructions for each component are given in the following sections.

1. Unpack: Unpack the subsystem and confirm that all the components on the list were

included. (See Section 3.4 Unpacking the Subsystem)

2. Rack/Cabinet installation: If the subsystem is going to be installed in a rack or cabinet, it

should be installed prior to installing the hard drives. Installing the subsystem into a rack

or cabinet requires at least two (2) people. (See Section 3.5 Rackmounting)

3. Install drive trays: After the hard drives have been installed into the drive trays, the drive

trays must be installed into the enclosure itself. (See Section 3.6 Drive Tray Installation)

4. Cable connection: Use the supplied power cords to connect the subsystem to main

power. It is recommended to connect power cords to separate and independent power

sources for higher redundancy. Make sure your subsystem is electrically grounded. It is

also recommended to use the included cable clamps to prevent accidental disconnection

of the power cords.

5. Power up: Once the components have been properly installed and all cables are properly

connected, you can power up the subsystem and configure the RAID array. (See

Section 5.3 Power On)

Installation Procedure Flowchart

Table 3.1 shows a flowchart of the installation procedure. As you complete each step, check

off the “Done” box on the right. Please use this flowchart in conjunction with the instructions

that follow.

3.4 Unpacking the SubsystemCompare the Unpacking List against the actual package contents to confirm that all required

materials have been received. Carefully check the items contained in each box before pro-

ceeding with installation.

CAUTION!

To ensure that your system is correctly installed, please follow the steps outlined below. If you

follow these steps, installation will be fast and efficient. If you do not follow these steps, you

may accidentally install the hardware incorrectly.

Step Installation Procedure Done

1 Unpack See Section 3.4 Unpacking the Subsystem

3 Rack/Cabinet Installation See Section 3.5 Rackmounting

5 Drive Tray Installation See Section 3.6 Drive Tray Installation

6 Cable Connection

7 Power On See Section 5.3 Power On

Table 3.1 Upgrade Procedure Flowchart

CAUTION!

Do not rely on the non-definitive, summarized unpacking list shown below--it is for reference

only. A detailed packing list can be found in your product shipping package or product CD.



3.5 RackmountingThe subsystem is designed to fit into a variety of 19-inch rack cabinets or racks. Make sure you

have an appropriate site location and cables prepared with adequate lengths to connect to

main power and other devices.

Two (2) slide rails are available from Bosch for installing the subsystem into a rack or cabinet.

The available models are listed in the beginning of this section. To install the subsystem into a

rack or cabinet, please refer to the installation instructions that came with the slide rails.

The subsystem should be installed in the rack or cabinet before the hard drives and the drive

trays are installed. If the drive trays with the associated hard drives are installed first, the sub-

system will be too heavy to lift.

Use two (2) front finger grips on the chassis ear to push or pull the subsystem into/out of a

rack. Secure the subsystem chassis to the rack using the two (2) screw holes on each chassis

ear. To access the finger grip and screw holes, open the LED panel and the plastic cap. Please

see Section 2.4.2 LED Panel for detail description.

3.6 Drive Tray InstallationOnce the hard drives have been installed in the drive trays, the drive trays are ready to be

installed into the subsystem.

1. Make sure the key-lock is in the unlocked position, i.e., the groove on its face is in a hori-

zontal orientation as shown in Figure 3.1. If the groove is in a vertical position, then the

key-lock is locked and the front flap on the drive tray cannot be opened.

Fig. 3.1 Front View of an Individual Drive Tray

2. Open the front flap on the drive tray (see Figure 3.2) by pushing the release button on the

front of the drive tray. The front flap will open in an upward direction.

Fig. 3.2 Opening the Drive Tray Front Flap

WARNING!

All drive trays must be installed into the enclosure even if they do not contain a hard drive. If

the trays are not installed into the enclosure, the ventilation required for cooling will not be

normalized and the subsystem will overheat.



3. Align the drive tray with the slot in which you wish to insert it. Make sure that it is resting

on the rails inside the enclosure, and then gently slide it in. This should be done smoothly

and gently. (See Figure 3.3)

Fig. 3.3 Installing a Drive Tray

4. Close the front flap on the drive tray. Make sure the front flap is closed properly to

ensure that the connector at the back of the hard drive is firmly connected to the corre-

sponding connector on the back-plane board. If the front flap is not closed properly, the

connection between the hard drive and the subsystem will not be secure. (See

Figure 3.4)

Fig. 3.4 Closing the Drive Tray Front Flap

5. Lock the flap into place by turning the key-lock until the groove on its face is pointing

down (vertical orientation). (See Figure 3.5)

Fig. 3.5 Drive Tray Key-Lock Rotation

6. Once the drive tray is inserted, the RAID controller will recognize the drive and scan it in

automatically.


RAID Subsystem DVA-08E | Installation Manual Subsystem Operation and Monitoring | en 27

4 Subsystem Operation and MonitoringThis chapter provides information on how to monitor the subsystem.

4.1 Subsystem Monitoring OverviewThe subsystem is equipped with a variety of self-monitoring features that help to keep sub-

system managers informed of the subsystem operational status. These monitoring features

provide vital feedback to help you maintain the operational integrity of the subsystem. Prompt

response to warnings and subsystem component failure notifications will ensure safe opera-

tion of the subsystem and help ensure the longevity of the subsystems.

Self-monitoring features include:

• Firmware (FW): The RAID controllers in the subsystems come with pre-installed FW. The

FW can be accessed using a PC running terminal software through the RS-232C (audio

jack) serial port. Device status information can be obtained from the FW. The FW capabil-

ities have been fully described in the Administration Manual that came with your sub-

systems. Please refer to this manual for further information.

• Bosch RAIDWatch: Bosch RAIDWatch is a fully integrated, Java-based, Graphical User

Interface (GUI) that came with the subsystem and can be used to monitor and maintain

the subsystem and the RAID controllers using your web browser. The LAN port at the

back of each controller module enables you to use an Ethernet cable to connect to the

subsystem.

• The Bosch RAIDWatch Panel View can be customized to show a direct representation of

the subsystem in the content panel of the Bosch RAIDWatch screen. Panel View allows

you to quickly determine the operational status of critical subsystem components. Please

refer to the Bosch RAIDWatch User’s Manual for further details.

• Detailed installation instructions for Bosch RAIDWatch Manager are given in the Bosch

RAIDWatch User’s Manual located on the product CD that came with the EV system.

• Configuration Client: Configuration Client is a powerful module that runs as an indepen-

dent program from Bosch RAIDWatch and can be installed on different hosts. It is used

for event notification via email, fax, LAN broadcast, SNMP traps, MSN Messenger, ICQ,

SMS (Short Message Service), and the configuration utility screen. Configuration Client

helps prevent blind time and keeps you constantly informed as to the status of the stor-

age management subsystem. Instructions on activating Configuration Client functionality

are given in the Bosch RAIDWatch User’s Manual.

• LEDs: Device-status-indicating LEDs are placed on all of the subsystems’ active compo-

nents. These LEDs inform you of the integrity of a given component or a given link. You

should become familiar with the different LEDs on the subsystem and be aware of their

functions. (See Section 4.2 Status-indicating LEDs)

• Audible Alarm: An audible alarm is present on the subsystem controller board and will be

triggered if any of a number of threatening events occurs. These events usually jeopardize

the functional and operational integrity of the controller board and must be heeded at all

times. Events such as a breaching of the temperature threshold will trigger the alarm. If a

subsystem manager is present, the manager should use either the LED panel, or the PC

hyper-terminal to determine the cause of the alarm and take the appropriate corrective

measures. (See Section 4.3 Audible Alarm)

• Inter-Integrated Circuit (I2C): The I2C bus monitors the operational integrity of the cool-

ing modules, voltage readings, and RAID controller board temperature.

Subsystem monitoring is a necessary part of subsystem management. If failure events or other

disruptive events are detected and reported, the subsystem manager must take the appropri-


28 en | Subsystem Operation and Monitoring RAID Subsystem DVA-08E | Installation Manual

ate action to rectify the problem. Failure to act in a properly specified manner to a system

event (like overheating) can cause severe and permanent damage to the subsystem.

4.2 Status-indicating LEDs

4.2.1 Brief Overview of the LEDsThe following devices come with LEDs that inform subsystem managers about the operational

status of the component on which they are mounted. The RAID subsystems feature status-

indicating LEDs distributed over the active components in the following ways:

4.2.2 LED Panel

Fig. 4.1 LED Panel

An LED panel is provided on the subsystem. Each LED panel consists of three (3) status LEDs.

The Mute/Service button located directly below the status LEDs is used to turn on and off the

services LED as well as stop the alarm until the next controller event occurs.

The LED panel houses three (3) status LEDs (see Figure 4.1) that indicate the status of sub-

system. The definitions of these LEDs are given in Table 4.2 below.

Component LEDs per Module Total LEDs Definition

LED Panel 3 3 See Section 4.2.2 LED Panel

Drive Tray 2 16 See Section 4.2.3 Drive Tray

LEDs

Controller Module 4 4 See Section 4.2.4 Controller

Module LEDs

LAN Port 2 2 See Section 4.2.5 LAN Port

LEDs

PSU Module 1 1 See Section 4.2.6 PSU LED

Cooling Module 1 2 See Section 4.2.7 Cooling

Module LED

Table 4.1 LED Distribution



4.2.3 Drive Tray LEDsTwo (2) LED indicators are located on the right side of each drive tray. (See Figure 4.2) Refer

to Table 4.3 for the LED definitions. When notified by a drive failure message, you should

check the drive tray indicators to find the correct location of the failed drive. Replacing the

wrong drive can fatally fail a logical array.

Fig. 4.2 Drive Tray LEDs

Name Icon Color Status

PWR

(Power)

Blue ON indicates that power is being supplied to the sub-

system.

OFF indicates that no power is being supplied to the sub-

system.

BUSY White FLASHING indicates that there is activity on the host/drive

channels.

OFF indicates that there is no activity on the host/drive

channels.

ATTEN

(Attention)

Red ON indicates that a component failure/status event has

occurred.

OFF indicates that the subsystem and all its components

are operating correctly.

Table 4.2 LED Panel’s Status LED Definitions

LED Name Color Status

Drive Busy Blue ON indicates read/write activity on the drive.

OFF indicates there is no read/write activity on the drive.

Power Sta-

tus

Red/

Green

GREEN indicates that power is being supplied to the drive.

OFF indicates no power is being supplied to the drive or the drive

tray is not properly installed.

RED indicates drive failure or faults have occurred.

Table 4.3 Drive Tray LED Definitions



4.2.4 Controller Module LEDsThe rear-facing faceplate of the RAID controller module is shown in Figure 4.3. The LEDs are

numbered from 1 to 4. The definitions are shown in Table 4.4 below. There are two (2) more

LEDs on the LAN port. They are described in the section follows.

Fig. 4.3 Controller Rear Panel

4.2.5 LAN Port LEDsA shielded Ethernet cable must be used to connect the RJ-45 Ethernet port to a hub on a net-

work after you assign a permanent IP to the subsystem. This enables you to manage your sub-

system via the web. Two (2) LEDs located on the Ethernet port indicate the Ethernet

connection status. See Figure 4.4 for the locations of the two (2) LED indicators. Refer to

Table 4.5 for the LED definitions.

Fig. 4.4 LAN Port Indicators

LED Name Color Status

1 Ready (Controller

Ready)

Green ON: Indicates controller is active and operat-

ing normally.

OFF: Controller is not ready for operation.

2 Hst Bsy

(Host Ports Busy)

Green FLASHING: Activities on the host ports.

OFF: No activities on the host ports.

3 Drv Bsy

(Drive Busy)

Green FLASHING: Activities on the drive side.

OFF: No activities on the drive side.

4 C_Dirty

(Cache Dirty)

Amber ON: Indicates that data is currently being

cached in memory or is being held up by the

BBU during a system power loss.

Table 4.4 Controller Module LED Definitions

Name Color Status

Online Status Green ON indicates currently connected to a LAN

LAN Activity Green BLINKING indicates active transmission

Table 4.5 Ethernet Port LED Definitions

Link Status Activity Link Status Activity



4.2.6 PSU LEDThe PSU comes with a single LED located just above the power switch and just below the

retention screw (see Figure 4.5). The LED is used to indicate the operational status of the PSU

module. Please refer to the PSU LED definitions shown in Table 4.6.

Fig. 4.5 PSU LED

Color Status

Flashing Green The power supply has not been turned on. The PSU module LED will blink

when the subsystem is connected to a power source but has not been

turned on.

Static Green The PSU is operating normally and experiencing no problems

Static Red The PSU has failed and is unable to continue providing power to the sub-

system.

OFF The power cord is unplugged or the power cord is plugged but no power is

being supplied from the power source.

Table 4.6 PSU Module LED Definitions



4.2.7 Cooling Module LEDThe cooling module comes with a single status-indicating red LED shown in Figure 4.6. LED

definitions are given in Table 4.7.

Fig. 4.6 Cooling Module LED

The subsystem has a novel approach to stabilizing the temperature within the subsystem:

When the sensors within the enclosure detect critical working conditions, such as high ambi-

ent temperature or the failure of any cooling, the system will turn the cooling fans to high

speed to extract more heat. Once the ambient temperature cools down to normal or the faulty

module has been replaced, the cooling fans return to normal speed.

LED Status

OFF The cooling module is operating normally.

ON The cooling module has failed and must be replaced.

Table 4.7 Cooling Module LED Definitions



4.3 Audible AlarmDifferent subsystem environmental and operational parameters (i.e., temperature, etc.) have

been assigned a range of values between which they can fluctuate. If either the upper or lower

thresholds are exceeded, an audible alarm will automatically be triggered. The alarm will also

be triggered when an active component of the subsystem fails. If the subsystem manager is

onsite and hears the alarm, the manager will have to read the error message on the PC termi-

nal in order to determine what has triggered the alarm. After determining what has occurred,

the subsystem manager must take appropriate actions to rectify the problem.

Failed Devices

The audible alarm will be triggered if any of the following devices fail:

• RAID controller module

• Cooling module

• PSU

• Hard drive

4.4 I2C MonitoringPresence detection and the general working status of the cooling modules and other modules

are monitored through an I2C serial bus. If any of these modules fail, you will be notified via

the various methods described above.

CAUTION!

When an alarm is triggered, it is necessary for you to determine the problem. If the audible

alarm is ignored and the problem is not rectified, unexpected damages may occur.

iNOTICE!

When the temperature exceeds a preset threshold, the controller’s charger circuits will stop

charging. You will then receive a message that says “Thermal Shutdown/Enter Sleep Mode.”

When the temperature falls back within normal range, the battery will resume charging.


34 en | Subsystem Connection RAID Subsystem DVA-08E | Installation Manual

5 Subsystem ConnectionThis chapter introduces sample topologies, configuration options and server connections for

the RAID subsystems and discusses both the power on and power off procedures.

The RAID subsystem supports one (1) SCSI host channels featuring SCSI-320 protocol (also

known as Ultra-320), the latest iteration of the SCSI drive interface standard. The SCSI-320

enables maximum data transfer rates up to 320MB/second per channel from host computers

to the subsystems or expansion systems. This is twice the bandwidth as the Ultra160 stan-

dard, allowing you optimal performance and flexibility with configuring storage applications.

5.1 SCSI Connection OverviewSCSI cables are not supplied with the subsystem. Refer to Section 8 Appendix: Spare Parts and

Accessories for information.

5.1.1 SCSI Port on the Controller Rear PanelThe subsystem is equipped with one (1) VHDCI SCSI connector on the back of the enclosure.

(See Figure 5.1)

Fig. 5.1 SCSI Connector on the Rear Panel

5.1.2 SCSI TerminationCorrect SCSI termination procedures require that the last device on the SCSI bus be termi-

nated. If the last device is not terminated or if devices other than the last are terminated,

erratic SCSI bus behavior may occur.

An auto-detection, on-board terminator is built into the subsystem. You do not need to install

an external terminator when a subsystem acts as the last device in the daisy chain configura-

tion. The on-board terminator default is enabled. If the subsystem is not the last device in the

daisy chain configuration, the terminator will be automatically disabled. Although it is not rec-

ommended, if you prefer to disable the firmware setting for the on-board terminator using a

RS232C terminal session or Bosch RAIDWatch management software, the auto-detection

function is also disabled.

Typically, the host computer or host adapter (SCSI card inside the PC) is the first device and

some are already terminated. When installing the subsystem on a SCSI bus with other devices,

be sure to observe the above rules regarding all devices on the SCSI bus. Consult your host

computer and/or host adapter manual for additional information on correct termination pro-

cedures.


RAID Subsystem DVA-08E | Installation Manual Subsystem Connection | en 35

5.2 Host Connection Topology There is no direct association between host ports and drive channels. Drives are associated

with host port IDs as the logical configuration of drives, e.g., a logical drive. A logical drive can

be composed of drives on different drive channels, and a logical drive can be associated with

target IDs on different host ports.

Drive access contention (that may happen when two (2) host computers can access the same

array) and data-path failover activities should be handled by a third-party software running on

host computer(s).

5.2.1 Basic Configuration RulesWhen you are configuring your subsystem, the following are some basic rules that should be

followed.

• When selecting the number of hard drives that will be connected through the drive chan-

nels, the transfer rates and the mechanical performance of the hard disks should be con-

sidered.

• When cabling, follow all SCSI channel specifications. Pay attention to signal quality and

avoid electronic noise from adjacent interfaces.

• The drives in the same logical array should have the same capacity, but it is preferred that

all the drives within the subsystem have the same capacity.

• A spare drive should have a minimum capacity equal to the largest drive that it is

expected to replace. If the capacity of the spare is less than the capacity of the drive it is

expected to replace, then the controller will not proceed with the failed drive rebuild.

5.2.2 Single Host Connection

Fig. 5.2 Single Host Connection

In the example shown in Figure 5.2, the SCSI port is connected to a host adapter on a host

computer. This topology does not provide path redundancy. If one of the host channels

becomes disconnected, or if the cable connecting one of the host ports to the host computer

is damaged, data flow will be interrupted.

iNOTICE! Please adhere to these basic configuration rules. They are provided for your convenience to

ensure that your storage system will run smoothly and effectively.



5.3 Power OnAfter installing all the components in the subsystem, connecting the host channels to the

host, and connecting the expansion cables to the expansion enclosures, the subsystem is

ready to be powered on.

5.3.1 Power On ChecklistBEFORE powering on the subsystem, please check the following:

• Memory module: Memory modules have been correctly installed on the controller boards.

• Hard drives: Hard drives have been correctly installed in the drive trays.

• Drive trays: All the drive trays, whether or not they contain a hard drive, have been

installed into the subsystem.

• Cable connections: The subsystem has been correctly connected to host computer(s),

and external devices.

• Power cords: The power cord has been connected to the PSU on the subsystem and

plugged into the main power source.

• Ambient temperature: All the subsystem components have been acclimated to the sur-

rounding temperature.

5.3.2 Power On ProcedureWhen powering on the subsystem, please follow these steps:

1. Power on any expansion enclosures if applied.

If you have daisy chain additional subsystem or any external devices, power on those

devices before powering on the subsystem that is connected directly to the host com-

puter(s).

2. Power on the subsystem.

To power on the subsystem, please follow the procedures below.

– Using the power cords provided in the package, connect the power socket(s) on the

subsystem rear panel to the main power source.

– Turn the power switch on. (See Figure 5.3)

Fig. 5.3 Power Sockets and Power Switches

3. Power on the host computers.

The host computers should be the last devices that are turned on. Please refer to the

manual that came with your host computers to see their own power on procedures.

CAUTION! All necessary cables connections must be made between subsystems before turning on the

subsystem. If you power on the subsystem before correctly connecting the cables, unexpected

damages may occur.


RAID Subsystem DVA-08E | Installation Manual Subsystem Connection | en 37

5.3.3 Power On Status CheckOnce the subsystem has been powered on, the status of the entire subsystem should be

checked to ensure that everything is running smoothly and that there are no complications or

malfunctions.

1. LEDs on LED panel: The power status LED on the LED panel should illuminate, indicating

that power is being supplied to the system.

2. Controller module LEDs: The Controller Ready, Host Busy, and Drive Busy LEDs should all

flash green.

3. Drive tray LEDs: The green LEDs for all the drive trays that contain a hard drive should

light up showing that there is power. Drive tray LEDs should also start flashing, indicating

that the RAID control units are attempting to access the hard drives.

4. PSU LEDs: If the PSU is operating normally and experiencing no problem after being pow-

ered on, the LEDs on the PSU should light green constantly.

5. Firmware and Bosch RAIDWatch: The overall status of the system may be checked using

the pre-installed firmware or the Bosch RAIDWatch GUI.

6. Audible alarm: If any errors occur during the initialization process, the onboard alarm will

sound in a hastily repeated manner.

System firmware can be configured to support a delayed sequence for starting drives. Please

consult your Administration Manual for more details.

iNOTICE!

The subsystem has been designed to run continuously. If a component fails, the fault can be

corrected online.



5.4 Power Off ProcedureIf you wish to power down the subsystem, please follow these steps:

1. Stop I/O access to the system.

Use the software provided on the host computer to stop all IO accesses to the sub-

system. Please refer to the user’s manual that came with your host computer.

2. Flush the cache.

Locate the C_Dirty LED on the back of controller module to check if there is still cached

data in memory. Use the Shutdown Controller function to flush all cached data. This pre-

pares the RAID subsystem to be safely powered down.

3. Turn off the power.

Turn off the power switches at the top of the rear panel of the subsystem. Once the sub-

system has been powered down, other devices that are connected to the subsystem may

be powered down.

iNOTICE! If you wish to power down the subsystem, please ensure that no time-consuming processes,

like “Regenerate Logical Drive Parity” or a “Media Scan,” are taking place.


RAID Subsystem DVA-08E | Installation Manual Subsystem Maintenance | en 39

6 Subsystem Maintenance

6.1 OverviewConstant monitoring and maintenance of your subsystem minimizes system downtime and

preserves the working integrity of the system for a longer period of time. If any of the sub-

system components fail, they must be replaced as soon as possible.

6.1.1 About Subsystem MaintenanceAll of the following components can be replaced in case of failure:

1. Controller module – Section 6.2 Replacing Controller Module Components

2. Memory module – Section 6.3 DIMM Module Replacement

3. PSU modules – Section 6.4 Replacing a Faulty PSU Module

4. Cooling modules – Section 6.5 Replacing a Failed Cooling Module

5. Hard drives – Section 6.6.2 Replacing a Failed Hard Drive

6.1.2 General Notes on Component Replacement• Most of the components on the subsystems, including the cooling modules and drive

trays are hot-swappable and can be changed while the subsystem is still in operation.

• Qualified engineers who are familiar with the subsystem should be the only ones who

make component replacements. If you are not familiar with the subsystems and not famil-

iar with RAID subsystem maintenance in general, it is strongly advised that you refer sub-

system maintenance to a suitably qualified maintenance engineer.

• Normalized airflow is directly dependent upon the presence of all subsystem compo-

nents. Even if a subsystem component fails, it should not be removed from the sub-

system until a replacement is readily at hand and can be quickly installed. Removing a

subsystem component without a replacement can lead to permanent subsystem damage.

• When replacing any hot-swappable component, caution should be taken to ensure that

the components are handled in an appropriate manner. Rough or improper handling of

components can lead to irreparable damage.

• When removing a controller module from the subsystem, ensure that the power has been

turned off and that all precautionary measures, without exception, are adhered to. The

controller board contains very sensitive components and can be easily damaged.

CAUTION! Do not remove a failed component from the subsystem until you have a replacement on hand.

If you remove a failed component without replacing it, the internal airflow will be disrupted

and the system will overheat, causing damage to the subsystem.

CAUTION!

When inserting a removable module, take heed that DO NOT USE EXCESSIVE FORCE! Forcing

or slamming a module can damage the pins on the module connectors either on the module

itself or on the backplane. Gently push the module until it reaches the end of module slot.

Feel the contact resistance and use slightly more force to ensure the module connectors are

correctly mated. If the module comes with extraction levers or retention screws, use them to

secure the module.


40 en | Subsystem Maintenance RAID Subsystem DVA-08E | Installation Manual

6.2 Replacing Controller Module Components

6.2.1 OverviewThe controller module in the subsystem consists of the following replaceable components:

• DDR RAM DIMM module

• Controller module itself

If any of these components fails, it needs to be replaced. To replace any of these components,

the controller module must be removed.

6.2.2 Notes on Controller Module Maintenance• The controller module contains a DIMM module. It is not recommended to re-use the

DIMM module extracted from a failed controller unless you have a similar RAID subsystem

that can be used to test the module. You can contact your vendor for sending the failed

controller in for repair.

• When replacing the controller module, it must be remembered that the controller board

is one of the most sensitive components in the subsystem. All previously stipulated safety

precautions (see Section 3 Hardware Installation ) must be strictly adhered to. Failure to

adhere to these precautions can result in permanent damage to the controller board,

resulting in lengthy delays.

• Prior to replacing the controller module, it is imperative for your own safety to be sure no

power is being supplied to the system.

CAUTION!

The docking connector on the rear of the controller module is very delicate and the connector

pins can be broken easily. Do not touch the connector pins. Visually examine each connector

pin before inserting the controller module into the subsystem. A broken pin may damage the

subsystem backplane board and cause a subsequent system crash.

CAUTION!

Unnecessary tampering with the controller module can cause severe and permanent damage.

Only move the controller module if it is absolutely necessary. If you have no reason to remove

the controller module from the subsystem, leave it in place.

When removing a controller module from the subsystem, all anti-static preventative techniques

should be strictly adhered to. Failure to adhere to specified cautionary measures could result

in severe damage to the controller board.



6.2.3 Removing the Controller ModuleTo remove the controller module:

1. Stop host I/Os or host applications to avoid losing data or causing data inconsistency.

2. Power off the subsystem in the way described in Section 5.4 Power Off Procedure.

3. Disconnect all cables from the controller module. These include the SCSI cables for host

connection, an RS-232C (audio jack) cable for COM port connection, and an Ethernet

cable for network connection.

4. Loosen the retention hand screws that are located on both sides of the RAID controller’s

rear panel. Use a Phillips screwdriver to loosen them so that the controller can be

removed from chassis. (See Figure 6.1)

Fig. 6.1 Loosening Controller Module Retention Screws

5. Gently pull the controller module out of the subsystem. Place the controller module on a

clean surface. (See Figure 6.2)

Fig. 6.2 Removing the Controller Module

Hand screw



6.2.4 Replacing the Controller ModuleIf the controller module itself has failed, it must be replaced. To replace a failed controller

module:

1. Remove the controller module from the subsystem (see Section 6.2.3 Removing the Con-

troller Module.) If the DIMM modules are undamaged they can be removed and reinstalled

on the new controller module. For instructions on removing and installing a DIMM mod-

ule, please see Section 6.3 DIMM Module Replacement.

2. Install the DIMM module onto the new controller module; making sure that DDR RAM

DIMM module is securely in place. (Refer to Section 6.3 DIMM Module Replacement.)

3. Install the replacement controller module. Align the controller module with the controller

module bay at the rear of the subsystem. Gently slide the controller module in. (See

Figure 6.3.)

Fig. 6.3 Inserting the Controller Module

4. Secure the controller module to the subsystem by tightening the hand screws at the

sides of the controller rear panel. (See Figure 6.4.)

Fig. 6.4 Fastening Controller Module Retention Screws

5. Re-attach all the cables that were removed. These include the cables that connect to the

host and the expansion chassis, any Ethernet cable that was previously attached to the

LAN port, and any cables that were attached to the COM ports.

6. Power on: Once the new controller module has been properly installed and the cables

have been correctly connected, turn the subsystem power on.

Hand screw



6.3 DIMM Module ReplacementThe subsystem comes with a preinstalled 256MB DDR RAM DIMM module on each controller.

If the memory module has failed, the preinstalled module must be removed and a new, sepa-

rately purchased DIMM installed.

The DIMM module is located on the controller board. The controller board is a sensitive com-

ponent and must be treated with care to avoid being damaged. Replacement and installation

instructions are described fully below.

6.3.1 DIMM Module ConsiderationsIf the memory module on the controller module is going to be replaced, the following issues

must be considered when purchasing a replacement DIMM module:

• Purchasing considerations: Contact your subsystem vendor for an updated list of compat-

ible DIMM modules.

• Installation considerations: When installing the DIMM module, it is necessary to remove

the controller module from the chassis and then remove the module from the controller.

The controller board is more susceptible to damage than the other components and must

be handled with extreme care.

• Secure installation: When replacing the DIMM module, make sure that the new DIMM

module is firmly in place prior to installing the controller module. If the DIMM module is

not firmly in place, the subsystem will not run and the controller will need to be removed

and the DIMM module correctly installed.

6.3.2 DIMM Module Replacement ProcedureIf any of the DIMM modules fails, the onboard DIMM modules must be replaced. The DDR RAM

DIMM module is installed on the back of the controller board. Therefore, to replace any of the

memory modules, the controller module must be removed from the subsystem and the con-

troller board must be removed from the controller module.

To replace the DIMM module:

1. Remove the controller module from the subsystem, and place it on a clean surface. (See

Section 6.2.3 Removing the Controller Module)

2. Remove the previously installed DDR RAM DIMM module. To do this, press both DDR

RAM DIMM socket latches outward; the DDR RAM DIMM module will be ejected by the

mechanism (see Figure 6.5).

CAUTION!

The controller board in the module contains sensitive components. Please ensure that all anti-

static precautions stipulated above are strictly adhered to. Only qualified engineers can

replace a DIMM module.



Fig. 6.5 Removing the DIMM Module

3. Insert the new DDR RAM DIMM module into the DIMM socket. Align the new module to

the DDR RAM DIMM socket, and then gently push the DIMM module into the socket. The

latches on the sides of the socket will close automatically and secure the DDR RAM DIMM

module into the socket. (See Figure 6.6)

Fig. 6.6 Inserting the DIMM Module

4. Install the controller module back in its original location. (See Section 6.2.4 Replacing the

Controller Module)

iNOTICE! When replacing a DIMM, the whole subsystem needs to be powered down. Therefore, when

replacing a DIMM, you should carefully select the time when the replacement will be made in

order to minimize the overall disruption to service.



6.4 Replacing a Faulty PSU Module

6.4.1 Notes on PSU Module Maintenance• Number of PSU module: The subsystem comes with one 1 PSU module.

If you like to maintain the PSU, flash the cache and turn off the subsystem before pro-

cessing. To turn off the subsystem, please refer to Section 5.3 Power Onof this manual.

• Immediate replacement: When a PSU fails, it should ideally be replaced immediately. Do

not remove the PSU module unless a replacement is readily available. Removing a PSU

without a replacement will cause severe disruptions to the internal airflow and the sub-

system will overheat, possibly causing irreparable damage to some of the subsystem

components.

• PSU bracket: The PSU module is permanently mounted in a two-level steel bracket, creat-

ing a single unit. The PSU is located in the upper level and a removable cooling module is

mounted in the lower level. When removing the PSU from the subsystem, the cooling

module is also being removed.

6.4.2 Replacing the PSU ModuleTo replace a PSU, please follow these steps:

1. Turn off the PSU using the power switch found on the center of each PSU. (See

Figure 6.7)

2. Remove the power cord connecting the failed module to the main power. The power cord

socket is found on the left side of each PSU. (See Figure 6.7)


3. Remove the PSU retention screw at the top right-hand side of the PSU. (See Figure 6.8)


4. Remove the PSU by pressing down the PSU handle found on the top of the PSU. (See

Figure 6.9) to dislodge the PSU from the subsystem.

Fig. 6.9 Pressing Down the PSU Handle

Power Switch

Power Socket

Subsystem

PSU handle

Subsystem



5. Use the handle to gently pull the PSU out of the enclosure. (See Figure 6.10).

Fig. 6.10 Dislodging the PSU

6. Remove the cooling module from the lower level of the PSU. Please refer to

Section 6.5 Replacing a Failed Cooling Module.

7. Insert the previously removed cooling module into the new PSU. (See

Section 6.5 Replacing a Failed Cooling Module)

8. Insert the new PSU into the subsystem. Make sure the PSU handle is in its down position

so that the saddle notches on the lower edges of the handle can lock on to the edge

metal brackets along the chassis inner walls. Push the PSU into the slot and pull the han-

dle upward to secure the module. (See Figure 6.11)

Fig. 6.11 Installing the PSU

9. Secure the PSU to the subsystem by inserting the retention screw into the PSU. (See

Figure 6.12)

Fig. 6.12 Installing the PSU

10. Reconnect the power cord that connects the PSU to the main power source.

11. Turn on the PSU.

PSU handle

Subsystem

PSU handle

Subsystem

Subsystem



6.5 Replacing a Failed Cooling Module

6.5.1 Notes on Cooling Module Maintenance• Redundant cooling modules: The subsystems are equipped with two (2) redundant, hot-

swappable, single-blower cooling modules located on either side of the lower subsystem

rear. These cooling modules control the internal operational temperature of the sub-

system and therefore their working integrity should be maintained at all times.

• Detecting a failed cooling module: If a cooling module fails, you can be notified of the fail-

ure by the LED located at the back of the module, an audible alarm, the terminal event

prompts, the Bosch RAIDWatch, or through the various methods by the Configuration Cli-

ent utility.

• Replacing a cooling module: Once you are notified that a cooling module has failed, it

should be replaced as soon as possible. A failed cooling module should only be removed

from the subsystem when you have an immediately available replacement module that

can be installed as soon as the failed cooling module has been removed.

6.5.2 Replacing a Cooling ModuleThe cooling modules are secured to the chassis with two latches located on the rear of the

module. To replace the cooling module, please follow these steps:

1. To remove the cooling module, pull both side latches toward the center of the cooling

module. Withdraw the cooling module from the PSU bracket by gently pulling on the han-

dle at the bottom of the module.

Fig. 6.13 Removing the Cooling Module

2. Install the new cooling module by aligning the module with the cooling module slot on

the bottom of the PSU bracket and gently sliding it in. The latches will hold the module in

place.

Fig. 6.14 Installing the Cooling Module

CAUTION! • The latches at the back of the cooling module secure the cooling module into the enclo-

sure. If these latches are broken, the warranty on the cooling module will be void.

• Although the cooling modules are fully redundant, it is not advisable to run the subsystem

with any of the cooling modules missing. Whenever a cooling module fails, the system is at

risk of sustaining irreparable damage.

• Keep a failed module in its enclosure bay until a replacement unit is in hand.



CAUTION! Forcing or slamming a module into place can damage the connector pin on the module itself or

that on the subsystem backplane.



6.6 Drive Tray Maintenance

6.6.1 Notes on Hard Drive Maintenance• Hot-swappable drive trays: The drive trays are all hot-swappable. If a hard drive fails, it

can be replaced while the subsystem is still running.

• Handles: If the failed hard drive is behind either the left or right front handle, unfold the

handles to access to the drive trays.

• Front flap mechanism: Do not leave a drive tray’s front flap open. The front flap and its

key-lock secure a drive tray to chassis slot. A disk drive operating with the half-open front

bezel may result in signal glitches and Data Compare Errors might ensue.

• Remove drives slowly: Although drive trays are designed to be hot-swappable, slowly

withdraw the drive tray when removing it from the subsystem. Removing the drive tray

too quickly may cause a drive I/O timeout.

• Replacement on hand: If a hard drive has failed, make sure you have a replacement hard

drive readily available before removing the failed drive. Do not leave the drive tray slot

open for an extended period of time. The airflow will be disrupted and subsystem compo-

nents will overheat and may be permanently damaged.

6.6.2 Replacing a Failed Hard DriveWhen a hard drives fails, it needs to be replaced. To replace a hard drive, please follow these

steps:

1. Identify the drive tray that contains the hard drive that needs to be replaced.

2. Identify the drive tray that contains the hard drive that needs to be replaced.

3. Open the key-lock (See Figure 6.15) by turning the key-lock on the front of the drive tray

until the groove on its face is in a horizontal orientation.

Fig. 6.15 Drive Tray Key-lock Rotation

CAUTION!

The hard drive is fragile therefore always handle with extreme care. Do not drop the hard drive;

always be slow, gentle, and careful when setting down a hard drive. Only handle the hard drive

by the edges, and avoid touching any components or connectors.

CAUTION!

Replacing the wrong drive in an array may cause fatal errors in a RAID configuration. You

should identify a failed drive from the Bosch RAIDWatch GUI screen, by checking the drive slot

ID in the terminal screen, by checking the LEDs on the drive tray panel, and/or use the identify/

flash drive function in firmware. Please refer to Administration Manual for details on this func-

tion.



4. Open the front flap by pushing the button at the front of the drive tray. (See Figure 6.16)

The drive tray front flap will automatically be lifted and the drive tray will be dislodged

from the chassis.

Fig. 6.16 Opening the Front Flap

5. Gently and carefully remove the drive tray with the hard drive from the chassis. (See

Figure 6.17)

Fig. 6.17 Removing a Drive Tray

6. Re-install the new drive tray back to the subsystem. Refer to Section 3.6 Drive Tray Instal-

lation.


RAID Subsystem DVA-08E | Installation Manual Appendix: Technical Specifications | en 51

7 Appendix: Technical SpecificationsEnvironmental Specifications

Humidity Operating: 5% to 90% (non-condensing)

Non-operating: 5% to 95% (non-condensing)

Temperature Operating: 0º to 40ºC (32º F to 104º F)

Non-operating: -40º to 60ºC (-40º F to 149º F)

Altitude Operating: 3,658m (12,000 ft.)

Non-operating: 12,192m (40,000 ft.)

Shock (Half-sine) Operating: 5G, half-sine, 11ms duration

Non-operating: 15G, half-sine, 11ms duration

Vibration Operating: 5 - 500Hz, 0.2G, X/Y/Z Sine

Non-operating: 5 - 500Hz, 1.0G, X/Y/Z Sine

Acoustic Noise 65dB max.

Power Requirements

Input Voltage 115VAC / 6A

240VAC / 3A with PFC (auto-switching)

Frequency 47-63Hz

Power Consumption 350W

Dimensions

With Chassis Ears 88.0mm (3.5 inches) (H) x 446.0mm (17.6 inches) (W) x

498.0mm (19.6 inches) (L)

With Front Handles 88.0mm (3.5 inches) (H) x 446.0mm (17.6 inches) (W) x

490.0mm (19.4 inches) (L)

Without Chassis Ears and Han-

dles

88.0mm (3.5 inches) (H) x 481.6mm (19 inches) (W) x

498.0mm (19.6 inches) (L)

System Weight

Net weight: 19.37 Kg (42.7 pounds); Gross weight: 27.5 Kg (60.63 pounds)

Certifications

• UL

• FCC Class-B

• CE

• CB

• BSMI


52 en | Appendix: Technical Specifications RAID Subsystem DVA-08E | Installation Manual

7.1 Controller Specifications

7.2 Drive Tray Specifications

Warning Alarms

• Audible alarms

• System LEDs

• Bosch RAIDWatch Manager

• RS-232C terminal

• Event notifications sent over email, fax, LAN broadcast, SNMP traps, MSN messenger,

ICQ, SMS short messages

Configuration Specifications

RAID Levels 0, 1(0 + 1), 3, 5, 10, 30, 50, JBOD, and non-RAID disk spanning

Host OS Compatibility Host OS independent; supports all major platforms

Host Interface 1 SCSI-320 channels via one (1) VHDCI connector

Host Channels 1 pre-configured SCSI-320 host channels

Drive Interface Supports 8 channel connection to 3Gbps SATA-II disk drives,

SATA-I backward compatible

Drive Channels All drive channels are pre-configured, routed through a back-

end PCB and cannot be changed

Caching Mode Write-through or Write-back

Cache Memory Pre-installed 256MB (or above) DDR RAM DIMM with/without

ECC, in one DIMM socket

Number of LUN’s Up to 32 per host ID

Multiple Target IDs/Host

Channel

Yes

Firmware on Flash Memory Yes

Specifications

Height 28mm (1.1 inches)

Width 110mm (4.33 inches)

Depth 218.92mm (8.62 inches)

Key-lock Yes


RAID Subsystem DVA-08E | Installation Manual Appendix: Technical Specifications | en 53

7.3 Power Supply Specifications

7.4 Cooling Module Specifications

7.5 RAID Management

Specification

Nominal Power 350W

DC Output 12.0V: 25A

5.0V: 25A

3.3V: 20A

Input Frequency 47 to 63Hz

AC Input 115VAC / 6A or 240VAC / 3A with PFC

Power Factor Correction Yes

Hold-up Time At least 16ms at 115/230VAC full load after a loss of AC input

Over-temperature Protec-

tion

Auto shutdown when cooling is lost or elevated temperature is

detected; over-voltage protection is also available.

Cooling Fans Two fans (inside PSU)

Specification

Speed High or low rotation speed controlled by firmware

Max. Air Flow (each module) High speed: 31.8 CFM

Low speed: 20.1 CFM

Input Power 9/3.12W max.

Rated Voltage DC 12V

Temperature Operating: -10 to +60ºC

Storage: -20 to +70ºC

Specification

Configuration Text-based firmware-embedded utility over RS-232C connection

through the included audio jack-to-DB-9 serial cable

The Bosch RAIDWatch Manager program using Ethernet connec-

tion

Performance Monitoring Yes

Remote Control and Moni-

toring

Yes

Event Notification Yes (via Bosch RAIDWatch’s sub-modules, Configuration Client

or NPC)

Management Connection In-band over Ethernet, or RS-232C

Configuration on Disk Configuration data stored on disk drives for logical drive assem-

blies to exist after controller replacement; basic settings, e.g.,

channel mode settings, are stored on NVRAM

Failure Indicator Via audible alarm, LED panel, Bosch RAIDWatch Manager ses-

sion, event notifications, or event prompts on terminal emulation


54 en | Appendix: Technical Specifications RAID Subsystem DVA-08E | Installation Manual

7.6 Fault Tolerance Management

Specification

SATA drive SMART support Yes

Battery Back-up Option Yes

Automatic Drive Failure Detection Yes

Regenerate Logical Drive Parity Yes

Bad Block Reassignment Yes

Automatic Rebuild upon Failed Drive Replacement Yes

Automatic Rebuild on Spare Drives Yes

Manual Clone of Suspected Failed Drive Yes

Concurrent rebuild on Multiple Drives in a RAID (0 + 1) Logical

Drive

Yes

Salvage the 2nd Temporarily Failed Drive in a RAID 1, 3 or 5 Logi-

cal Drive

Yes

Salvage the 1st Temporarily Failed Drive in a RAID 0 Logical Drive Yes


RAID Subsystem DVA-08E | Installation Manual Appendix: Spare Parts and Accessories | en 55


8 Appendix: Spare Parts and Accessories

8.1 Spare PartsThe active components and their model names are listed in Table 8.1:

8.2 AccessoriesAccessories that must be purchased separately are listed in Table 8.2.

Model Name Description

DVA-ADTK-000A Drive tray, Type-III bezel and Type-II LED lightpipe

DVA-ADTK-050A Drive tray including 500GB Hitachi SATA drive

DVA-SPEK-08A Power supply module, for lite subsystem, 350W capacity

DVA-SFAK-08A Cooling fan module, for ES/EV 2U DDR-interface subsystems

DVA-SCSK-08A SCSI to SATA RAID controller module, 1 x SCSI-320 VHDCI host con-

nector

Table 8.1 Controller Module List

Model Name Description

DVA-ACON-HD50A SCSI external round cable, HD50 to VHDCI

DVA-ACON-HD68A SCSI external round cable, DB68 to VHDCI

DVA-ACON-VD68A SCSI external round cable, VHDCI to VHDCI

DVA-ASRK-28A Enhanced Slide rail assembly, for ES/EV 2U series subsystem,

21"~28.5" rack depth

DVA-ASRK-36A Enhanced Slide rail assembly, for ES/EV 2U series subsystem,

25.5"~36" rack depth

Table 8.2 Accessories List

56 en | Appendix: Pinouts RAID Subsystem DVA-08E | Installation Manual

9 Appendix: Pinouts

9.1 SCSI Port: VHDCI Connector PinoutsThe SCSI port connector pinouts comply with specifications in T10 Working Draft, Project

1365D, SCSI Parallel Interface-4.

* NC = No Connection, * GND = Ground,

* TPWR = Terminator Power

Pin Name Pin Name

1 SD12+ 35 SD12-

2 SD13+ 36 SD13-

3 SD14+ 37 SD14-

4 SD15+ 38 SD15-

5 SDP1+ 39 SDP1-

6 SD0+ 40 SD0-

7 SD1+ 41 SD1-

8 SD2+ 42 SD2-

9 SD3+ 43 SD3-

10 SD4+ 44 SD4-

11 SD5+ 45 SD5-

12 SD6+ 46 SD6-

13 SD7+ 47 SD7-

14 SDP0+ 48 SDP0-

15 GND 49 GND

16 DIFSENS 50 GND

17 TPWR 51 TPWR

18 TPWR 52 TPWR

19 NC 53 NC

20 GND 54 GND

21 SATN+ 55 SATN-

22 GND 56 GND

23 SBSY+ 57 SBSY-

24 SACK+ 58 SACK-

25 SRST+ 59 SRST-

26 SMSG+ 60 SMSG-

27 SSEL+ 61 SSEL-

28 SC_D+ 62 SC_D-

29 SREQ+ 63 SREQ-

30 SI_O+ 64 SI_O-

31 SD8+ 65 SD8-

32 SD9+ 66 SD9-

33 SD10+ 67 SD10-

34 SD11+ 68 SD11-


RAID Subsystem DVA-08E | Installation Manual Appendix: Pinouts | en 57

9.2 COM1 Cable: DB9 and Audio Jack Pinouts COM1 cable is used to connect a PC running terminal emulation program.

Fig. 9.1 Figure C-1: COM1 Cable CN1 and CN2 Connectors

CN1 Pin Number Pin Name

1 Ground

2 TXD

3 RXD

CN2 Pin Number Pin Name

1 NC

2 RXD

3 TXD

4 DTR (Shorted)

5 GND

6 DSR (Shorted)

7 RTS (Shorted)

8 CTS (Shorted)

9 NC


58 en | Appendix: Pinouts RAID Subsystem DVA-08E | Installation Manual

9.3 Null ModemA null modem is used for wire-swap and is necessary for connecting COM1 CN2 to a PC serial

port.

Fig. 9.2 Figure C-2: Null Modem Pinouts

9.4 Ethernet Port Pinouts

Fig. 9.3 Figure C-3: LAN Port Pinouts

9.5 Main Power IEC-type receptacle.

Swap pin 2 and pin 3



Pin Pin Name Pin Pin Name

1 LAN_TXP 5 N2

2 LAN_TXN 6 LAN_RXN

3 LAN_RXP 7 N1

4 N2 8 N1


RAID Subsystem DVA-08E | Installation Manual Index | en 59

IndexNumerics2U 11AAdministration Manual 27, 37airflow 23, 53airflow clearance 23alarm trigger 33ambient temperature 36audible alarm 19, 27, 33audio jack 57audio-jack to DB9 cable 16Bbackplane board 12blower 18Bosch RAIDWatch 19, 27Ccable connection 36Cabling 21chassis ear 13COM port 16Communication Parameters 9component check 21Configuration Client 27controller board 12controller module 12, 15, 40, 41controller module LED 30Controller Specifications 52cooling module 11, 12, 18cooling module latches 47cooling module LED 32Cooling Module Specifications 53cooling module speed detection 15cooling modules 47Ddata flow 35DB9 57DDR 11DDR RAM 12DDR RAM DIMM module 15DDR RAM DIMM socket 16DIMM 40DIMM module 11, 43DIMM socket latches 43docking connector 15drive bay 12drive bays 14drive IO timeout 49drive tray 14, 25, 36, 49drive tray LED 29drive trays 49Eelectronic noise 35electrostatic discharge 21elevated temperature 18ESD damage 23Ethernet cable 41Ethernet link 19Ethernet Port 58

Ethernet port 16event notification 27Ffaulty module 23finger grip 13firmware 19, 27flush cache 38front flap 25, 50front panel 13GGateway 9Graphics User Interface 27groove 25GUI 19, 27Hhand screw 15handles 49hard drive 49hard drives 36host computer 35hot-swap mechanism 13hot-swappable 39hot-swappable components 20hyper-terminal 16II2C 27, 33I2C bus 19initialization stage 18Internet Protocol 9IO access 38IP address 10Kkey-lock 14, 25LLAN port 27LAN Port LED 30LAN port LED 30LED indicators 16LED panel 11, 13, 14, 28LEDs 19, 27logic level signal 12Mmain power 45memory module 36minimum capacity 35MUTE button 14NNetMask 9normalized airflow 20, 39PPanel View 27path redundancy 35permanent IP 30Phillips screwdriver 41plastic cap 13power cord 17, 36power down 38


60 en | Index RAID Subsystem DVA-08E | Installation Manual

power on 36power path 12power socket 17, 36Power Supply Specifications 53power switch 11, 12, 17, 36PSU 11, 12, 45PSU Bracket 45PSU LED 31Rrack installation 21Rackmounting 25RAID functionalities 12RAIDWatch User’s Manual 27rear panel 11, 12, 13release button 14reserved space 10retention screws 23RJ-45 30RS-232C cable 41Ssample topologies 34SCSI cables 41SCSI-320 protocol 34sensors 32services LED 28Shutdown Controller 38signal quality 35single-blower 47slide rail kit 13slide rails 25spare drive 35static electricity 23static free 21status check 37Ttemperature sensor 18terminal emulation program 19thermal notice 23UUltra-320 34Unpacking List 24unpacking list 21upper threshold 18URL 10Vventilation 23VHDCI connector 16VHDCI SCSI connector 34VT-100 terminal 16


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DVSALiteSeriesD Installation Guide DVA-08E EnUS T3813001739

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