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Introduction to Electronics Assembly 1
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Table of Contents
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Introduct
ion
Components
Inter
connections
Electronics Assembl
y
Industry Over
view
Electrostatic Discharge
Assembly Pr
ocessesIncoming Inspection
Through-Hole Assembly
Automatic Insertion
Manual Insertion
Wave Soldering
Hand Soldering
Surf
ace Mount Assembly
Solder Paste Application
Component Placement
Reflow Soldering
Adhesive Application
Cle
aning
Electr
ical Test
Rewor
k and Repair
Confor
mal Coating
Final System Assembl
y
GLOSSARY
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Introduction to Electronics Assembly2 Introduction to Electronics Assembly 3
Introduction
Look around. Electronic prod-ucts are everywhere. Theyre inour homes, offices, schools,hospitals, airports, banks andstores. And year after year thereare innovations - products getbetter and better, theyre easierto use and their value increasesas they do more for the same orlower cost.
Personal computers are a per-fect example. Ten years agothey were priced high and ranslow. Now theyre a lot fasterand cheaper.
If you were to take the cover offan electronic product youd seecomponents and interconnec-tions.
An inside view of a typicalelectronic device.
An ATM machine is anelectronic device we all use.
A laptop and cell phone atwork in the field.
IntroductiontoElectronicsAssembly
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Introduction to Electronics Assembly14 Introduction to Electronics Assembly 15
Training References:IPC-VT-33 Introduction to SurfaceMount Assembly (Video)
IPC-VT-71-75 Surface MountEvaluation Series
Technical References:IPC-TP-1115 Selection andImplementation Strategy for a
Low-Residue, No-Clean ProcessIPC-DRM-SMT Surface MountSolder Joint EvaluationDesk Refernce Manual
Solder Paste Application
Solder paste is a mixture of fluxand tiny balls of solder in pasteform. The application of solderpaste is commonly done usinga stencil printing process.Solder paste is pressed throughopenings in a stencil screenonto the corresponding circuit
board lands with a squeegeemade of hard rubber or stain-less steel. The stencil openingsare called apertures. They aredesigned to make sure the rightamount of solder paste isdeposited onto each land. Theapertures must be in perfectalignment with the surface
mount lands.
Training References:IPC-VT-34 Solder Paste PrintingIPC-VT-35 Solder Paste PrintingDefect Analysis andPrevention (Videos)
Technical References:IPC-7525 Stencil DesignGuidelines
IPC/EIA J-STD-005 Requirementsfor Soldering Pastes
Inspecting a surface mount assemblyafter component placement.
Solder paste printing on adifferent machine.
The solder paste printingprocess.
Hand Soldering
An assembly may also containodd-form and temperature sen-sitive components such as bat-teries, switches, connectors, orunsealed parts that will have to
be manually inserted and handsoldered after the wave solder-ing operation.
Soldering iron selection, tip sizeand desired heat range shouldbe considered for the work athand. An important factor inhand soldering is solder wire
selection.Training References:IPC-VT-42/43 Hand SolderingIPC-VT-49 The Seven Sins ofHand Soldering
IPC-VT-36 Hand Soldering WithLow Residue Fluxes (Videos)
Technical References:IPC-7711 Rework of
Electronic AssembliesIPC/EIA J-STD-001 Requirementsfor Soldered Electrical andElectronic Assemblies
IPC-A-610 Acceptability OfElectronic Assemblies
Surface Mount Assembly
Surface mount technology isnewer than through-hole tech-nology. Rather than beinginserted through holes in thecircuit board, surface mountcomponent leads sit on landson the surface of the board.Surface mount assembly con-sists of three basic processes -
solder paste application, com-ponent placement and reflowsoldering.
Operator at hand solderingworkstation.
Chip component soldered to asurface mount land.
Hand soldering up close.
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Introduction to Electronics Assembly20 Introduction to Electronics Assembly 21
Cleaning
Some companies use no-cleansoldering operations that do notrequire any cleaning process tofollow assembly and soldering.Others require a cleaning oper-
ation that removes undesirablecontaminants including any fluxresidues that may be left overfrom the soldering operation.Depending on the type of fluxused, cleaning may be accom-plished using water or a moreactive cleaning agent. If certaintypes of flux residues are not
removed, corrosion and ulti-mately assembly operatingproblems can occur.
Training References:IPC-VT-47 Wave Soldering (Video)IPC-VT-36 Hand Soldering WithLow Residue Fluxes (Video)
Technical References:IPC-TP-1115 Selection andImplementation Strategy for aLow-Resdiue,No-Clean Process
IPC-SC-60 Post Solder SolventCleaning Handbook
IPC-SA-61 Post-SolderSemiaqueous CleaningHandbook
IPC-AC-62 Post-Solder Aqueous
Cleaning HandbookIPC-CH-65 Guidelines forCleaning of Printed Boards andAssemblies
IPC-9201 Surface InsulationResistance Handbook
Hand soldering with alow-residue flux.
A No Clean flux label.
The cleaning operation.
printer. The glue dots areapplied between the chip com-ponent lands, rather than onthe lands themselves. If theadhesive were placed on thelands, the components would-nt be able to be reliably sol-
dered to the lands. In otherwords, the adhesive wouldblock the solder.
After adhesive application, thecomponents are positionedusing automated placementequipment. The adhesive isthen cured. Curing allows the
glue to achieve its full strength.
Next, the required through-holecomponents are inserted fromthe primary side of the board.
The fully assembled circuitboard is then passed through a
wave solder machine. The sol-der wicks up the holes to solder
the through-hole leads. The sur-face mount chip componentsglued to the bottom side of theboard are also soldered at thistime. This completes the mixedtechnology assembly process.
Training References:
IPC-VT-51 Adhesive Applicationfor Surface Mount (Video)
Technical References:IPC-CA-821 GeneralRequirements for ThermallyConductive Adhesives
Applying adhesive using thestencil printing method.
An assembly surfs the solder waveto complete the process.
Placing chip components ontop of adhesive temporarily
holds them in place.
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