Direct Optical Registration - A B R A C I · PDF fileDirect Optical Registration ... •Punch or drill w/ heat bonding systems ... Punched hole size variation due to thickness of

Direct Optical Registration of Multilayers

Direct Optical Registration Achieving optimum registration

Registration accuracy of typical systems•Punch or drill w/ heat bonding systems - 6 to 8 layer low technology

•Punch or drill w/ rivet systems – 6 to10 lyr, some HDI, small panel sizes

•Post etch punch w/ pin lam – limited panel sizes 75-100 micron typ -expensive $

•Post etch punch w/ DIS coupled inductive welding – more consistent registration, expanded sizes, not limited by lamination and separator plates

Direct Optical Registration Achieving optimum registration

Direct Optical Registration accuracy by DIS

•30 to 75 micron layer to layer registration typical after lamination

•high layer count, current customers process 24 to 34 layer and higher

•HDI & sub-laminated panels

•expanded sizes

Optimization of Direct Optical Registration using CMS

Direct Optical Registration of Multilayers

• All layers are optically aligned via the vision/positioning system

• Layers are held in position by a clamping mechanism

• Vision system maintains position of target during complete alignment/clamping cycles

CCD CAMERA

CCD CAMERA

Optical Process

Machine vision measures and computes best fit position

Direct Optical Registration Capabilities

– +/-0.7 mil (17micron) nominal final registration accuracy prior to lamination.

– High layer count and HDI capable.– Improved sequential lamination registration.– Improves upon any current pin registration

approaches. – Provides a technical path for improvement in

layer to layer registration.

Direct Optical Registration

Machine vision based layup station. Eliminates punch/drill and pin registration processes.Improved layer to layer registration coupled with increased process stability.Reduces core handling.Layers are welded together using the DIS patented SmartWeld Welding Technology

SmartWeld Welding Technology

• Coupled Inductive energy transmission from top and bottom heads.

• Top and bottom heads can function as stand alone units

• Thermocouple imbedded in weld heads for precise control

A C

A C

Top SmartHead

Bottom SmartHead

tc

tc

SmartWeld Welding Technology

• Coupled Inductive energy for rapid, precise heating independent of layer count.

• Each weld coupon on each core is a heat source• Uniform heating from top to bottom on every layer. • Active pressure foot controls panel thickness and ensures heat transfer. • Programmable profile including ramp up, soak and cool down. • Simulates complete press profile on the weld area.

System Operation

Direct Optical Registration vs. Pin RegistrationBenefits

• Operation benefits: – Accuracy is increased by the elimination of

punching operations.

– Utilizes existing lay up station labor.

– Simplified book break down, eliminates pin cleaning, bushing replacement.

Direct Optical Registration vs. Pin RegistrationCost and Process Savings

• Material Savings: – No yield loss from damaged cores during layup (thin

cores)

– No Rivet machines or templates required

– No tooled materials required: Foils, prepreg, CAC

– Panel size may vary without purchasing new tooling.

Direct Optical Registration Systems

• Layers are continuously checked by the vision system at all critical alignment step

• All systems utilize Coupled Induction to weld the layers

• No need for templates for different panel sizes

Equipment Features

Pre-align camera Touch Screen PC Interface

Pre-align platform

Panel unload

Alignment and welding area

PWS - Pin Welding System

PWS is a stepping stone to better registration accuracy

Utilizes SmartWeld coupled induction technology

Eliminates pin lamination processes.

Improved layer to layer registration coupled with increased process stability.

Reduces core handling.

Core Measurement Station :Precise measurement of actual target locations.Utilizes up to 10 cameras to maximize registration data collection.

Direct Optical Registration Technology Roadmap

DIS: Installations

Tolerances: Standard PEP/Rivet

Punched hole size variation due to thickness of laminate on innerlayer.

Location tolerance of hole to hole on innerlayer.

Location tolerance of image to punched slot on innerlayer.

Rivet size variation, tolerance increases with different quality rivets.

Alignment tolerance of tooling and tooling wear.

Layer shift due to rivet distortion.

+/- 13 micron (+/- 0.0005 inch)

+/- 25 micron (+/- 0.001 inch)

+/- 25 micron (+/- 0.001 inch)

+/- 25 micron (+/- 0.001 inch)

+/- 25 micron (+/- 0.001 inch)

+/- ??? micron

Tolerances: Rivet Template & Pin Lamination

Location tolerance of bushing in lamination plates

Location tolerance of slot to center of bushing

Lamination pin size

Distortion of innerlayer slots at lay up (thin cores)

Lamination bushings break in lamination plates

Lamination pins bend or break

+/- 8 micron (+/- 0.0003 inch)

+/- 25 micron (+/- 0.001 inch)

+/- 8 micron (+/- 0.0003 inch)