U. Mavric, M. Fenner, J. Branlard, H. Schlarb, DESY K. Czuba, WUT-ISE D. Makowski, A. Mielczarek, P. Perek, F. Makowski, TUL-DMCS DeRTM-LOG1300 MicroRF Backplane Concept Purpose • The MicroRF Backplane extends the connectivity of RTMs and introduces eRTMs (extended RTMs). • The CLKs, LOs, REFs and Pilot Tone can now be distributed over the backplane • It allows to make a better use of the available space in the crate Features • Extends the MTCA.4 board management to the rear • Each RTM can be powered by rear power supplies • 3 Additional slots for RF-related purposes (LO, CLK generation, signal generation etc.) • Improves isolation between digital PICMG, AMC backplane and RF domain Evaluation of the extension of the MicroTCA.4 board connectivity to the rear side of crates. The contribution summarizes recent activities in the extension of the MicroTCA.4 connectivity to the rear side of standard MicroTCA.4 crates. The need for such an extension started as a need for a cleaner and more isolated environment from digital areas present in the front side of the crate. Local-oscillator generation, clock generation and their distribution were moved into a MicroTCA.4 crate and they could benefit from the standard MicroTCA.4 board management layer and connectivity. For this reason an RTM- backplane manager which sits in the rear side of the management carrier hub was used as a bridge from the front side to the rear. The backplane manager provides power, management layer and PCIe connectivity to the rear. Special emphasis was put on the layout of the digital signals in the rear MicroRF-backplane in order to avoid the possibility of pollution of high sensitivity signals. Finally an example of practical usage of the new extension is presented. This project is supported by Helmholtz Validation Fund HVF-0016 “MTCA.4 for Industry”. Abstract eRTM Modules Purpose • CLK, LO generation • Used on 21 RF stations (42 crates) in the Eu-XFEL • REF, LO, CLK distribution Features • 9 LO Outputs, 9 REF outputs, 9 Pilot Outputs, 22 diff. CLK outputs • Active temperature control of the RF sections • Integration into MTCA.4 framework LO/CLK generation module Rear backplane manager J21 J21 J21 J21 J21 J21 J21 J21 J21 J21 J21 J30 J31 J31 J30 # 15 # 14 # 13 # -1 # -2 # -3 # 12 # 11 # 10 # 9 # 8 # 7 # 6 # 5 # 4 # 3 # 2 # 1 J 14 J 10 J 10 J21 J21 FRU J31 J 11 J 12 J30 RTM-PM (6HP) 12 x uRTM (12 x 4HP) MCH-RTM-BM (6HP) 3 x eRTM (3 x 6HP) J 13 RTM Power Module (RTM-PM) RTM-PM (6HP) J11 J10 J10 J13 J14 J12 J10 J10 J10 J10 J10 J10 J10 J10 J10 J10 Zone 1 Zone 2 Zone 3 RTM Power Module (RTM-PM) DeRTM-CLK Monitoring, Histories, Events, Control, … System Integration On-Board RF Temperatures • The Peltiers regulate the temperature of the circuit. • The regulation efficiency is 0.05 deg (out-of-loop) On-Board Rel. Humidity • The PCB is not isolated against humidity changes • An on-board humidity sensor shows rel. humidity changes in the crate RF Power Monitoring • CLK, LO and REF power is logged PCB Hotspots • The hottest areas of the PCB are logged DC Power • DC power consumption of various subsections is logged • The picture shows the power consumption of the Peltier controllers DOOCS Interface • On the application level we can control the LO, CLK generation, monitor the RF power, monitor various temperatures, control the Peltier elements etc. Board Management • Standard MTCA.4 management is extended to the rear and is managed by the front MCH Board Management • The front MCH sees the rear eRTM similar as the front AMC modules /dev • The LO, CLK generation module is recognized as one of the devices in the PCIe tree. Purpose • Universal CLK generation • Dual PLL, External CLK, Internal free-running CLK, CLK divider, CLK fan-out\ • Fractional-N based Features • 22 diff. CLK outputs • Integration into MTCA.4 framework • Possible mounting of external mezz. with external CLK generation