Der Weg vom Transistor zum emissionsfreien Rechenzentrum · Der Weg vom Transistor zum emissionsfreien Rechenzentrum Dr. Bruno Michel Manager Advanced Thermal Packaging IBM Zurich
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Der Weg vom Transistor zum emissionsfreien Rechenzentrum Dr. Bruno Michel Manager Advanced Thermal PackagingIBM Zurich Research LaboratorySäumerstrasse 4, CH-8803 Rüschlikon, [email protected]
IBM Research, Zurich Research Laboratory, Rüschlikon, Switzerland
- Thermal issues propagate up to the world climate- Global length- and decade time-scales involved - A holistic view is required to solve these problems
IT to become part of the solution to climate challenge!
High-performance chip-level cooling improves energy efficiency AND reduces carbon emission:– Cool chip with ΔT = 20ºC instead of 75ºC– Save chiller energy: Cool datacenter with
T > 60ºC hot water – Re-use: Heat 700 homes with 10 MW datacenter
Need for carbon footprint reduction – EU, IPCC, Stern report targets– Chillers use ~50% of datacenter energy – Space heating ~30% of carbon footprint
Zero-emission concept valuable in all climates– Cold and moderate climates:
energy savings and energy re-use – Hot climates: Free cooling, desalination
Europe: 5000 district heating systems– Distribute 6% of total thermal demand– Thermal energy from datacenters absorbed
“Aquasar” - a milestone towards future more efficient computers 3D integration requires interlayer cooling for stacked logic chips Bonding scheme to isolate electrical interconnects from coolant
Through silicon via electrical bonding and water insulation scheme
A large fraction of energy in computers is spent for data transport Transport energy depends on distance: Shrinking computers
saves energy Interaction with ETH on CMOSAIC NanoTera project Vision for more compact and more efficient exascale computers
Aquasar Key Message and Outlook Reduce emission up to 85% through heat re-use Save up to 40% of energy and substantially reduce energy Performance evaluation and optimization as part of CCEM project
Roadmap for large efficiency increase in 15 years – Interlayer cooling of 3D chips in CMOSAIC NanoTera Project
IBM Team and Business PartnersCore Team for Aquasar Build: IBM Research - Zurich: Ingmar Meijer, Stephan Paredes, Thomas Brunschwiler, Patrick
Ruch, Marcus Oestreicher, Thorsten Kramp, IBM Germany, Böblingen: Jürgen Marschall, Manfred Ries,
Walter Weber, Martin Bachmaier, Gottfried Goldrian IBM Schweiz: Bruno Battaglia
Acknowledgements: Peter Buhler, Marcel Bürge, Ralph Heller, Daniel Jehle,
Markus Kirschner, Urs Kloter, Michael Malms, Oliver Rettig, Walter Riess, Daniel Ronzani, Sandra Rufener, Hansruedi Steinauer, Erich Rütsche, Jörg Schanze, Gerhard Schoor, Jürgen Stumpp, Heiner Tschopp,Kurt Wasser, and Martin Witzig
Business Partners: Wolverine Tube, Inc. Walter Meier AG APC by Schneider Electric