Decade of pulsed power development presentation

6/3/2004© Copyright 2004 Cymer, Inc.

A Decade of Solid State Pulsed Power Development at CYMER Inc.

R. Ness, P. Melcher, G. Ferguson, and C. HuangCYMER Inc., 17075 Thornmint Court,

San Diego, CA, 92127, USA2004 Power Modulator Conference, May 23-26, 2004


Outline

h Background and History of Cymerh Pulse power requirements for lithography light-sourcesh High volume manufacturing requirements issuesh Survey of Cymer’s solid state pulse power

h Past, present and futureh Specificationsh Designh Lessons learned


CYMER Background and History

h World's Leading Supplier of Excimer Lasers for Semiconductor Photolithography

h Founded in 1986 and Headquartered in San Diego, CA with ~800 Current Worldwide Employees

h Primary Customers are ASML, Nikon, and Canon but Lasers are Utilized in Virtually Every Semiconductor Fab (Fabrication) Facility

h 2282 CYMER Lasers Installed Worldwide as of Q1 2004 (Virtually All with Solid State Pulsed Power)


Solid State Pulsed Power Module (SSPPM) Technology Introduced at CYMER in Early '90sh Components developed by Dan Birx Through a DARPA SBIR

Contracth Significant Advantages for Lithography Laser Over Prior

Technologyh "Infinite" Lifetime Compared to Thyratron Based Unitsh Energy Recovery of Pulse Reflected from Laser Load Increases Chamber

Lifetime Significantly (at Least ~70%)h Less Impact on Semiconductor Fab Operation (Fewer

Repairs/Replacements, No Warm-up Time Needed, etc.)h No Pre-Fires Causing Missing Pulses and Wafer Level Rework h Laser Cost of Ownership (CoO) Therefore Significantly Reduced

h First SSPPM Unit Shipped in Production Laser in 1995h ~3800 SSPPM Module Sets Manufactured Since Then


Laser Trend is Higher Rep-Rate and Power, Lower Bandwidth, Lower Cost of Operation

SSPPM Introduced Here

Lithography Lasers Highly Line Narrowed (Lots of Energy Thrown Away for Spectral Purity).Therefore, Electrical Power Increases With Bandwidth Improvements in Addition to Rep-Rate Increases.

Example at Left is KrF TrendCoc/Bp: Cost of Consumables ($) / Billion Pulses

Spectral Power: Laser Power (W) / Laser Bandwidth (pm)


Timeline History of Laser Model / SSPPM Generation Also Shows SSPPM Trends

Year 1995 1996 1997 1998 1999 2000 2001 2002 2003 2004

Laser ELS-4000F ELS-5000 ELS-5000A ELS-5010 ELS-6010 ELS-7000 ELS-7010Series KrF KrF ArF KrF KrF KrF KrFIntro EX-4000FA ELS-6000 ELS-6010A XLA100

ArF KrF ArF ArFNanoLith 7000

ArF

SSPPM 5000 5000 5010 6000 6010 7000 7000 XLA XLA EUVGeneration

Repetition 600 Hz 1000 Hz 1000 Hz 2000 Hz 2500 Hz 4000 Hz 4000 Hz 4000 Hz 4000 Hz 5000 HzRate

Output ~19 kV ~19 kV ~19 kV ~23 kV ~23 kV ~31 kV ~31 kV ~31 kV ~31 kV ~5 kVVoltage

Output 150 ns 150 ns 110 ns 100 ns 100 ns 60 ns 60 ns 60 ns 60 ns 30 nsRisetime

Higher Rep-Rate - More Laser Power and Higher Wafer ThroughputHigher Output Voltage - Typically More Laser Energy / Pulse and/or Tighter BW

Faster Output Risetime - Typically Better Energy Conversion


A Variety of Issues Existed for Successful Volume Manufacturing of SSPPM Modulesh Design/Change Management: Detailed Documentation was

Developed:h Part Specificationsh Piece Part, Sub-Assembly, and Assembly Drawingsh Multi-Level Bills of Material (~800 Line Items)h Assy and Test Procedures for Sub-Assy and Module Levels

h Supply Chain: Procurement Had to Ramp Up With Parts / New Vendors

h Manufacturing/QA: Manufacturing Staff was Trainedh Testing: Intermediate and Final Test Stand HW was Set Uph Logistics: Worldwide Spares Distribution / Stocking was Initiated


Semiconductor Fab Application Requires Very Long Lifetime / High Reliability

h ~5 Year Life on Fab Tool Implies Infinite SSPPM Lifetime (at Least 25 to 50B shots)

h Laser Demonstrates > 99% Total Uptimeh 5000 Series SSPPM Tested for Over 50B Shots

(Over 2.5 Years) With No Signs of Degradationh HALT Testing (Primarily Thermal) Conducted for

Multiple Generationsh Extensive Thermal Testing Done Prior to Design

Release


5000 Series SSPPM Transfer Function Shows No Measurable Change After 50B Shots*

* IEEE PPC Melcher, Ness, et al. June 2001

Data Overlays WithinExperimental MeasurementAccuracy of ~5%


5000 Series SSPPM Thermal HALT TestingNo Failures Up to 86 Deg. C Exhaust Air

20 30 40 50 60 70 80 90 10020

30

40

50

60

70

80

90

100

110

120

L SCR Heat Sink R SCR Heat Sink Bias Inductor Front ER Inductor Back ER Inductor Charge Inductor

Sens

or T

empe

ratu

re (D

eg. C

)

Bulk Exhaust Temperature (Deg. C)


SSPPM Operating Voltage Range is Large Compared to Many Magnetic Pulse Compressors

h Laser Operating Voltage Varies Significantly Depending Upon Chamber Life and Gas Conditions

h Typical Range of Laser SSPPM Initial Stored Energy is ~1.5 to 5.5 J per Pulse

h Complicates SSPPM Magnetic Switch Designh Timing Compensation Required for Consistent

Propagation Delay Over Entire Voltage Range


Many Other Issues are Also Important For This Application in Semiconductor Fab

h Packaging: Module Size Minimized Since Fab Floor Space is Very Expensive

h Serviceability: Weight and Ease of Troubleshooting Relate to Potential Field Service and Module Replacement

h Cost: Driving Factor Since it Impacts Profith Compliance: Need to Avoid Potential Fab Contaminants

h Minimize Fluid Impregnants Typically Used for HV Insulationh Use Materials Approved for Fab Use

h Safety: Units Must Also Comply With SEMI, UL, TUV Standards


5000/5010 SSPPM System Requirements

h 1000 Hz Operationh 1.5 - 4.0 J/Pulse Initial Stored Energy on C0h 550 - 800 V Input Voltage Rangeh ~12 - 19 kV Output Voltage Rangeh 150 ns Output Voltage Risetime (5000)h 110 ns Output Voltage Risetime (5010)


5000/5010 Series SSPPMElectrical Schematic Diagram

Compression HeadCommutator

HVPS

Laser Chamberh Capacitor Charging Power Supplyh Parallel SCR Switchingh 26X (28X in 5010) Inductive Voltage Adder Transformerh 3 Stages of Magnetic Pulse Compression

h 10 µs Initial Transfer Down to 150 ns


5000 Series Laser Frame ShowingLocation of SSPPM Modules

(Behind Panel)

1000 V,6 kJ/sec

HVPS

Air-CooledCommutator

w 1st Compression

Stage and Pulse XFMR

Laser Controller

2 Stage,H20-CooledCompressionHead

Laser Chamber


5000 Issues - Minor Problems Resolved During Initial Manufacturing and Production

h Magnetic Core Production Issuesh Instituted Close Monitoring of Magnetic Core Parameters

to Avoid Unacceptable Componentsh Compression Head Cooling

h Added Cold Plate to CH Housing to Cool Switch Cores and Minimize Loss of ∆B Due to Temp

h HV Cable Connector Problemsh Identified Errors in Commercial Connector Design


5000 Timing Compensation - Customer Requires Tight Control of Throughput Delay*

h Stepper/Scanner Manufacturers Require Sync Out Signal for Their Own Diagnostics

h Trigger-to-Laser Light Must be Constant in Spite of SSPPM Operation at Different Voltages as Laser Chamber Ages

h Solution: Sample Final Charging Voltage and Insert Appropriate Proportional Delay in Low Level Electronics Prior to SCR Trigger

"Timing Compensation for an Excimer Laser Solid-State Pulsed Power Module (SSPPM)", with D. Johns, et al, IEEE Transactions on Plasma Science, Volume 28, Number 5, October 2000.



h 2000 Hz Operation (6000)h 2500 Hz Operation (6010)h 1.5 - 5.4 J/Pulse Initial Stored Energy on C0h 600 - 1150 V Input Voltage Rangeh ~12 - 23 kV Output Voltage Rangeh 100 ns Output Voltage Risetime



Commutator Compression Head Laser ChamberHVPS

h Capacitor Charging Power Supplyh Parallel IGBT Switchingh 23X Inductive Voltage Adder Transformerh 2 Stages of Magnetic Pulse Compression




(Behind Panel)

1200 V, 14 kJ/sec,Air-Cooled HVPS

Air-CooledCommutator

w 1st CompressionStage and

Pulse XFMR

Laser Controller

Air-Cooled,Single Stage CompressionHead

Laser Chamber


6000 Series SSPPM Uses 2 Stages of Magnetic Pulse Compression (MPC) Vs. Prior 3 Stage Design

h Maturity of IGBT Technology Allowed Replacement of SCR and Enabled Faster Commutation Time (C0-C1 Transfer)

h Faster Commutation Time and Improvement to MPC Designs Allowed Elimination of One Stage of Pulse Compression

h Advantages:h Improved SSPPM Efficiencyh Better Residual Voltage Snubbingh Improved Manufacturability and Serviceability


6000 UL/TUV ComplianceTesting Performed at CYMER

h Module Level Certification by NRTLs (Nationally Recognized Testing Labs)

h Tested to UL 3101-1 and EN 61010-1 Standardsh Includes Detailed Analysis of:

h Construction (Creepage and Clearance)h Material (Flammability, Electrical Properties, etc.)h Environmentalh Failure Modes

h Single-Point Failureh Fault Handlingh Electrical and Thermal

h Isolation and Grounding


6000 Air/Water Heat Exchanger

h Environmental Control Important to Long-Term Reliability of Module

h Internal and External Resistance to Direct Water Cooling

h Compromise w/ Air-to-Water HXh Advantages:

h Ability to Control Critical Componentsh Reduced Need to Cooling Fluid Bathh Minimize Heat Load to Fab Air Exhaust


6000 Timing Comp Improved From Single to Multi-Segment Linear Approximation

600 700 800 900 1000 1100 120030.14

30.15

30.16

30.17

30.18

30.19

30.20

30.21

30.22

30.23

30.24 T0+15 min T0+30 min T0+60 min T0+75 min T0+105 min

SSPP

M P

ropa

gatio

n D

elay

(µs)

Voltage (V)

Improved From Approximately + 200 ns to < + 50 ns Over Full Voltage Rangeand Operating Temperature Range as Module Heats Up with Time



h 4000 Hz Operationh 1.5 - 5.4 J/Pulse Initial Stored Energy on C0h 750 - 1450 V Input Voltage Rangeh ~16 - 31 kV Output Voltage Rangeh 60 ns Output Voltage Risetime



HVPS Resonant Charger Commutator Laser ChamberCompHead

h Resonant Charging Power Supplyh Parallel IGBT Switchingh 25X Inductive Voltage Adder Transformerh 2 Stages of Magnetic Pulse Compression




H20-Cooled, 30 kW, 800 V HVPS

H20-Cooled, 1450 VResonant Charger

H20-CooledCommutator w 1st

Compression Stage and Pulse XFMR

Laser Controller

H20-Cooled, Single Stage Compression Head

Laser Chamber


Resonant Charger Technology Replaced Cap Charging Power Supply for 7000 Series SSPPM

h As Rep-Rate Increases, Inter-Pulse Time Decreasesh Significant Part of Time Required by Controller to

Calculate Voltage for Next Pulse in Constant Energy Modeh Additional Time Required for Energy Recoveryh As a Result, Time Allowed for Charging Decreasing Faster

Than Rep-Rate Increase - Cap Charger Not Effectiveh Solution - Resonant Charging and Simpler HVPS

h Pulse Charging can be Done Very Fasth HVPS Can Still Deliver Constant Power Flow to Filter Capacitor

Resulting in More Constant AC Power Draw with Fewer Harmonics


Water Cooling Implemented for 7000 Series SSPPM Thermal Management

h Water Cooling Required to Remove Thermal Heat Loadh Implementation Features

h Cold Plate in Commutator for Cooling Semiconductors and 1st Stage Reactor Housing

h Water Tubing Supplied to Cool Output Reactor Housingh Inductive Isolation of High Voltage Potential

h No Joints Internal to Moduleh No Possibility of Leaks Inside Module


Cooling Water Tubing to Output Magnetic Switch Housing Inductively Isolated

Solid Tubing Run Inside Chassis Avoids Joints and Leak PotentialCopper Tubing Also Provides Bias Current Return Path


Laser Design Paradigm Occurs in 2002 at CYMER as Laser Power and BW Requirements Get Tougher

h Laser Power Traditionally Increased by Rep-Rate Increaseh However, Chamber Blower Power Increasing with Cube of

Rep-Rate (All Else Constant)h Chamber Acoustics and Tougher BW Complicating Issuesh Optics Issues and Module Lifetimes Also Not Acceptableh Solution - Two Chamber MOPA Laser

h Low Power Master Oscillator (MO) Which Produces Tight BWh High Gain Power Amplifier (PA) Which Boosts Output Power


XLA Series Lasers Require Two Parallel SSPPM Systems to Drive MOPA Laser Configuration

h Laser Output Efficiency Strongly Dependent Upon MOPA Timing Synchronization

h PA SSPPM Output Pulse Must be Generated ~40 + 5ns After MO SSPPM Pulse so that PA is Energized When MO Light Pulse Arrives20 30 40 50 60

6

7

8

9

10

Out

put E

nerg

y (m

J)

MO-PA Delay (ns)

Operating Point


XLA Series Laser Frame ShowingLocation of SSPPM Modules

MO Commutator

Resonant Charger

PA Commutator

MO Compression Head

MO Laser Chamber

PA Compression Head

PA Laser Chamber

HVPS


XLA SSPPM Electrical Schematic Diagram

HVPS Resonant Charger Commutators CompHeads

LaserChambers

Common Resonant Charger Drives 2 Parallel SSPPMs for Master Oscillator and Power Amplifier


IGBT Gate Driver Improvements Reduced Jitter From ~50 ns to Less Than 1 ns

AfterBefore

Commercial IGBT Driver Circuit Displayed Strong Delay vs. Rep-Rate Dependence and Strong Delay Drift Vs. Temperature


A Magnetic Core Tester Was Developed to Confirm Switch Vsec Matching

HVPS

Pulser

Test Fixture

DataAcquisition System

Matching Helps Ensure MO-PA Synchronization Over All Voltages / Temperatures


Cores Are Procured in Matched SetsWithin Range of Target Bsat

V*t=0.18838+0.81162*Bm(Correlation Coefficient R=0.92)

Nor

mal

ized

Vol

t-sec

ond

of R

eact

or

Normalized Average Bm of Magnetic Cores


Kaiser Systems Resonant Charger Pulse-to-Pulse Regulation Difference Between Max-Min Out of 10 Bursts

111

2131

4151

6171

8191

750

850

950

1050

1150

0

0.01

0.02

0.03

0.04

0.05

0.06

0.07

0.08

0.09

MAX-MIN (%

PULSE COUNT

VOLTAGE

S/N 710018 SPREAD BY PULSE


XLA Timing Synchronization Held to Less Than + 2.0 ns Between MO and PA SSPPMs

0

0.5

1

P uls e Inde x∆t M

OPA

Erro

r, ns

, σ

S igm a

0 10 20P roba bility, %

0 50 100 150 200 250-2.5

-2

-1.5

-1

-0.5

0

0.5

1

1.5

2

∆t M

OPA

Erro

r, ns

Cha m be r S ync h E rror, Ine rna l Ene rgy Control, 4 kHz

Ave ra geMinMa x

Laser Controller Handles Long Term Timing Changes Due to Thermal Drift and/or Voltage Changes


SSPPM Systems Also Being Developed to Support EUV Lithography Light Sources

Electrodes

Insulator

Pinch

h Dense Plasma Focus Device Produces 13.5 nm Lighth SSPPM Design Conceptually Very Similar to Laser Designs

h Energy Recovery to Reduce Electrode Erosion / Improve Efficiencyh HV Power Supply and Resonant Chargingh Parallel IGBTs and Several Stages Magnetic Pulse Compressionh Inductive Voltage Adder Transformer


EUV DPF SSPPM Requirements

h 5000 Hz Operationh 15 - 21 J/Pulse Initial Stored Energy on C0h 1200 - 1400 V Input Voltage Rangeh 4 - 5 kV Output Voltage Rangeh ~30 ns Output Voltage Risetime into DPF Load


EUV DPF SSPPMElectrical Schematic Diagram

h Resonant Charging Power Supplyh Parallel IGBT Switchingh 4X Inductive Voltage Adder Transformerh 2 Stages of Magnetic Pulse Compression

h 4 µs Initial Transfer Down to ~30 ns Risetime on DPF Load

HVPS Resonant Charger SSPPM DPF Load


Typical EUV DPF Output Waveforms Show Normal Pulse and Energy Recovery

-100 -50 0 50 100 150 200 250 300 350-3

-2

-1

0

1

2

3

4

5

6

Time (ns)

-0.6

-0.4

-0.2

0.0

0.2

0.4

0.6

0.8

1.0

1.2

Volta

ge (k

V)EU

V Emission (N

ormalized)

12.8J Input

2.7J Recovered

BLACK: C2 VoltageRED: Anode VoltageBLUE: EUV Emission


EUV DPF SSPPM is Designed into aSingle, Coaxial Module

Magnetic Switch Bias Circuitry

Series Diodes andTriggers/Snubbers

IGBT DeckC0 Capacitor DeckC1 Capacitor Deck

Pulse Transformer

C2 Capacitor Decks (3)


Thermal Management Design is Critical at ~100 kW Average Power Levels

h Water-Cooled Cold Plates Designed for Semiconductors (IGBTs and Series Diodes)

h Mandrel and Housing Hardware Also Developed to Remove Heat from Magnetic Coresh Integral Water Cooling Channels

h LS1 Charging Inductor or "Saturable Assist"h LS2 Magnetic Switchh Pulse Transformer Coresh LS3 (Output) Magnetic Switch


EUV DPF Output Magnetic Switch Peak Temperature Reduced by ~Half

Fin

Magnetic CoreCore Mandrel

O.D.I.D.

Peak Temperature = ~160 Deg. CPeak Temperature = ~320 Deg. C

Baseline Design with Single 1.0" Core and Water Cooling to Core Mandrel

New Design with Water Cooling and 0.060" Fin Inserted Between Two 0.5" Cores and Improved Thermal Contact Between Core/Mandrel


Future Development - Expected Trends

h Lasers and EUV Light Sources Will Continue to Require Higher Average Power and Higher Rep-Rates (Potentially up to 10 kHz)

h Higher (>30 kV) Output Voltages Likely Necessaryh Thermal Management Will Become Even More

Critical and More Complicatedh All Other Requirements Maintained (if Not Improved)

h Reliability and Lifetimeh Costh Packaging and Serviceabilityh Compliance and Safety


Summary

h Commercial Pulsed Power Applications Do Exist!!h Pulsed Power Hardware Can be Reliableh Pulsed Power Hardware Can Have a Long

Lifetime (10's to 100's of B of Shots)


Acknowledgements

h The Authors Would Like to Acknowledge:h Dan Birx for Transferring the SSPPM Technology to CYMER

(and Training us Well Enough to Carry On)h Brett Smith, Robert Saethre, and David Johns for

Engineering Various Designsh Bill Partlo for Guiding SSPPM Development Towards

Designs Optimized for Laser and Light Source Performanceh Terry Houston for Assembling, Modifying, Troubleshooting,

and Testing All of the Prototype Modulesh Kaiser Systems and Universal Voltronics for Developing

Power Supply and Charging Modules

Decade of pulsed power development presentation

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