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Page 1: DATE 2012

1 / 1 / 22

The

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Page 2: DATE 2012

www.thalesgroup.com

Research & Technology

HiP

EA

C'1

2

FlexTileswww.flextiles.eu

Fabrice Lemonnier, DATE 2012

Project coordinator: THALES

Funding budget: 3,670,000€

Starting date: 15/10/2011

Duration: 36 months

www.thalesgroup.com

Page 3: DATE 2012

3 / 3 / 22

The

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cont

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thi

s do

cum

ent

and

any

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pro

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Industrial issues

Embedded Real-Time Applications

low power consumption

low volume

Adapt to environment dynamicity, flexibility & dependability

Smart cameraCognitive radio UAV

Time To Market

adaptable product line

Fault-tolerance

Page 4: DATE 2012

4 / 4 / 22

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Challenges

address increasing application dynamicity

-using self-adaptive capabilities

increase software development productivity of manycore

-reduce Time to Market

-reuse of legacy software

-reuse of hardware IPs.

increase accessibility to manycore technologies

-propose a European alternative on the worldwide market of this technology

increase energy efficiency

-for embedded systems

-and High-Performance Computing (HPC) systems.

Page 5: DATE 2012

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Objectives of the project

1) develop a heterogeneous manycore based on available IPs

definition of generic interfaces

2) improve programming efficiency of heterogeneous manycores

3) self-adaptation

thanks to virtualisation layer

4) develop a dynamic reconfigurable technology

pre-emption and relocation capabilities.

Page 6: DATE 2012

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Other Projects

Existing manycores provide static allocation and sheduling

• TILE-Gx™ 8000 from Tilera (16 to 100 cores)

• MPPA® from Kalray (256 to 1024 cores)

• PicoArray from Picochip (248 cores)

• FlexTiles (1 to thousands of cores)

Projects:

Morpheus

Hardware Flexibility / dynamicity

Prog

ram

mab

ility

FlexTiles

FOSFOR

ReconOSAether

Apple-Core

Tsar Mosart

reconfigurable inside

ADAM

Page 7: DATE 2012

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1) develop a heterogeneous manycore system on a chip

Homogeneous GPP nodes

Heterogeneous acceleratorsnodes

GPP Node

AI

DSPNode

NI

GPP Node

NI

NoC

NI NI NI

AI AI

NI

Config. Ctrl.

DDR Ctrl.

NI

GPP Node

NI

I/O

NI

Generic Interfaces

eFPGA Domain (Reconfigurable HW acc.)

Dedicated Accelerator

Node

Dedicated Accelerator

Node

Page 8: DATE 2012

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1) Execution model

Master Nodes

Slave Nodes

GPP

eFPGA nodesDSP nodes

GPP Node

acceleratornode

NI

NoC

NI

Accelerator Interface (AI)

accrequests

control / status

DMA

DMArequests

data

Page 9: DATE 2012

9 / 9 / 22

The

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. ©

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S 2

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2) programming efficiency of heterogeneous manycores

Virtualisation layer

relocatable binary code

Parallelisation, partioning

Application

Hardware Nodes

Compilation Synthesis, P&Rrelocatable bitstream

Hardware Abstraction Layer

Hardware Abstraction Layer API

Operating Library API

Kernel Resource Monitoring &

Allocation

DIAGNOSISO = F(L)

ACTION

SYSTEM

toolchain

operating library

heterogenousmanycore

MONITORING

Page 10: DATE 2012

10 /10 / 22

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3) self-adaptation: virtualization layer

Heterogeneous Hardware

Controlled byKernel and

Virtualization layerEthernet

IMDCT MatrixMult

Accelerator/Virtual Code

Dynamicallocation / binding

DIAGNOSISO = F(L)

ACTION

SYSTEM

MONITORING

Mapping

GPP Node

AI

DSPNode

NI

GPP Node

NI

NoC

NI NI NI

AI AI

NI

Config. Ctrl.

DDR Ctrl.

NI

GPP Node

NI

I/O

NI

Dedicated Accelerator

Node

Dedicated Accelerator

Node

eFPGA Domain (Reconfigurable HW acc.)

Page 11: DATE 2012

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The

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Tile Tile Tile

Tile Tile Tile

Tile Tile Tile

4) develop a new dynamic reconfigurable technology

Homogeneous manycore

FlexTiles: a 3D stacked chip

Page 12: DATE 2012

12 /12 / 22

The

info

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Tile Tile Tile

Tile Tile Tile

Tile Tile Tile

4) develop a new dynamic reconfigurable technology

Homogeneous manycore

FlexTiles: a 3D stack chip

NoC

Two layers communicating through one or several NoCs

Page 13: DATE 2012

13 /13 / 22

The

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Tile Tile Tile

Tile Tile Tile

Tile Tile Tile

4) develop a new dynamic reconfigurable technology

Homogeneous manycore

NoC

FlexTiles: a 3D stack chip

3D stacked reconfigurable layer

Page 14: DATE 2012

14 /14 / 22

The

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Tile Tile Tile

Tile Tile Tile

Tile Tile Tile

4) develop a new dynamic reconfigurable technology

3D stacked reconfigurable layer

Homogeneous manycore

NoC

FlexTiles: a 3D stack chip

Map Accelerated functions

Page 15: DATE 2012

15 /15 / 22

The

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Tile Tile Tile

Tile Tile Tile

Tile Tile Tile

4) develop a new dynamic reconfigurable technology

3D stacked reconfigurable layer

Homogeneous manycore

NoC

FlexTiles: a 3D stack chip

Duplicate

Page 16: DATE 2012

16 /16 / 22

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Tile Tile Tile

Tile Tile Tile

Tile Tile Tile

4) develop a new dynamic reconfigurable technology

3D stacked reconfigurable layer

Homogeneous manycore

NoC

FlexTiles: a 3D stack chip

Migrate

Page 17: DATE 2012

17 /17 / 22

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cont

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4) develop a new dynamic reconfigurable technology

I/O

NoC

GPP

Acc1

GPP

Acc1

GPP

Acc3

GPP

Acc4I/O

GPP

DDR ctrl

GPP

thread1 thread2 thread3 thread4

API

thread1 thread2

thread1 thread2thread3 thread4

API

thread1

thread2

Application

Tools for parallelisation and mapping

Acc1

Acc1

Acc3

Acc4

Dynamic allocation

Dynamic allocation

Tools for parallelisation and mapping

Page 18: DATE 2012

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NoC QoS

chip

GPP

icache

dcache

dLMEM GPP

NI

iLMEM eFPGA

eFPGA

dLMEM eFPGA

iLMEM DSP

DSP

dLMEM DSP

DDR

NI+

DDR ctrl

on chipshMEM

NI NI

controlNOC

bitstreamNOC

dataNOC

instructionNOC

test/debugNOC

Page 19: DATE 2012

19 /19 / 22

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ANoC (CEA)

GALS: asynchronous logic in nodes, local synchronous coreshighly scalablebetween nodes: no global clock, no even local clockpower efficient and dependablepacket switchingwormhole protocollow latency

Page 20: DATE 2012

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AEtheral NoC (TUe)

Guaranteed levels of services and performancesContention free routing by constructionwormhole routing specified at design time Globally Synchronous with time slots

Page 21: DATE 2012

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Results

• Versatile accelerated multicore architecture• SystemC simulator and FPGA demonstrators

• Physical design of embedded reconfigurable technology• To be implemented on a 3D stacked layer

• HW and SW interfaces to address heterogenous manycores• Create or use standards

• Virtualisation layer code, kernel• Self adaptive

• Heterogeneous manycore Tool chain• Design both multicore and accelerated functions at the same time

• Network selection according to required QoS

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The

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Consortium and questions

Partners & Third Party

Country Main scientific and technical contributions

THALES France Infrastructure and applications

KIT Germany Virtualisation layer

TUE Netherlands Kernel ; NoC

CSEM Switzerland DSP

CEA France NoC ; 3D stacking

UR1 France Reconfigurable technology

SUNDANCE United Kingdom

FPGA Demonstrator

ACE Netherlands Parallelisation and compilation Tools

8 partners in 5 countries

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The

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rmat

ion

cont

aine

d in

thi

s do

cum

ent

and

any

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are

the

pro

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any

rev

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, di

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ion,

dis

trib

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opyi

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herw

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use

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docu

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str

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appr

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. ©

TH

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Tem

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www.flextiles.eu

- Thank you for your attention

- Questions ?