Features • Multi-sensing wireless platform implementing vibration monitoring and ultrasound detection • Updated version of STEVAL-STWINKT1, now including STSAFE-A110 populated, BlueNRG-M2SA module and IMP23ABSU MEMS microphone • Built around STWIN core system board with processing, sensing, connectivity and expansion capabilities • Ultra-low-power ARM Cortex-M4 MCU at 120 MHz with FPU, 2048 kbytes Flash memory (STM32L4R9) • Micro SD Card slot for standalone data logging applications • On-board Bluetooth ® low energy v5.0 wireless technology and Wi-Fi (with STEVAL-STWINWFV1 expansion board), and wired RS485 and USB OTG connectivity • Option to implement Authentication and Brand protection secure solution with STSAFE-A110 • Wide range of industrial IoT sensors: – ultra-wide bandwidth (up to 6 kHz), low-noise, 3-axis digital vibration sensor (IIS3DWB) – 3D accelerometer + 3D Gyro iNEMO inertial measurement unit (ISM330DHCX) with machine learning core – ultra-low-power high performance MEMS motion sensor (IIS2DH) – ultra-low-power 3-axis magnetometer (IIS2MDC) – digital absolute pressure sensor (LPS22HH) – relative humidity and temperature sensor (HTS221) – low-voltage digital local temperature sensor (STTS751) – industrial grade digital MEMS microphone (IMP34DT05) – analog MEMS microphone with frequency response up to 80 kHz (IMP23ABSU) • Modular architecture, expandable via on-board connectors: – STMOD+ and 40-pin flex general purpose expansions – 12-pin male plug for connectivity expansions – 12-pin female plug for sensing expansions • Other kit components: – Li-Po battery 480 mAh – STLINK-V3MINI debugger with programming cable – Plastic box Description The STWIN SensorTile wireless industrial node (STEVAL-STWINKT1B) is a development kit and reference design that simplifies prototyping and testing of advanced industrial IoT applications such as condition monitoring and predictive maintenance. Product summary STWIN SensorTile Wireless Industrial Node development kit and reference design for industrial IoT applications STEVAL- STWINKT1B Firmware for STEVAL- STWINKT1B evaluation kit STSW- STWINKT01 Ultra-low-power ARM Cortex-M4 MCU with FPU STM32L4R9ZIJ6 3D Accelerometer + 3D Gyro iNEMO Inertial measurement unit (IMU) with machine learning core ISM330DHCX Ultra-wide bandwidth (up to 6 kHz), low-noise, 3- axis digital vibration sensor IIS3DWB STWIN SensorTile Wireless Industrial Node development kit and reference design for industrial IoT applications STEVAL-STWINKT1B Data brief DB4345 - Rev 2 - December 2020 For further information contact your local STMicroelectronics sales office. www.st.com
12
Embed
Data brief - STEVAL-STWINKT1B - STWIN SensorTile Wireless ...
This document is posted to help you gain knowledge. Please leave a comment to let me know what you think about it! Share it to your friends and learn new things together.
Transcript
Features• Multi-sensing wireless platform implementing vibration monitoring and ultrasound
detection• Updated version of STEVAL-STWINKT1, now including STSAFE-A110
populated, BlueNRG-M2SA module and IMP23ABSU MEMS microphone• Built around STWIN core system board with processing, sensing, connectivity
and expansion capabilities• Ultra-low-power ARM Cortex-M4 MCU at 120 MHz with FPU, 2048 kbytes Flash
memory (STM32L4R9)• Micro SD Card slot for standalone data logging applications
• On-board Bluetooth® low energy v5.0 wireless technology and Wi-Fi (with STEVAL-STWINWFV1 expansion board), and wired RS485 and USB OTG connectivity
• Option to implement Authentication and Brand protection secure solution with STSAFE-A110
• Wide range of industrial IoT sensors:– ultra-wide bandwidth (up to 6 kHz), low-noise, 3-axis digital vibration sensor
(IIS3DWB)– 3D accelerometer + 3D Gyro iNEMO inertial measurement unit
(ISM330DHCX) with machine learning core– ultra-low-power high performance MEMS motion sensor (IIS2DH)– ultra-low-power 3-axis magnetometer (IIS2MDC)– digital absolute pressure sensor (LPS22HH)– relative humidity and temperature sensor (HTS221)– low-voltage digital local temperature sensor (STTS751)– industrial grade digital MEMS microphone (IMP34DT05)– analog MEMS microphone with frequency response up to 80 kHz
(IMP23ABSU)• Modular architecture, expandable via on-board connectors:
– STMOD+ and 40-pin flex general purpose expansions– 12-pin male plug for connectivity expansions– 12-pin female plug for sensing expansions
• Other kit components:– Li-Po battery 480 mAh– STLINK-V3MINI debugger with programming cable– Plastic box
DescriptionThe STWIN SensorTile wireless industrial node (STEVAL-STWINKT1B) is adevelopment kit and reference design that simplifies prototyping and testing ofadvanced industrial IoT applications such as condition monitoring and predictivemaintenance.
Product summary
STWIN SensorTileWireless IndustrialNode developmentkit and referencedesign for industrialIoT applications
STEVAL-STWINKT1B
Firmwarefor STEVAL-STWINKT1Bevaluation kit
STSW-STWINKT01
Ultra-low-powerARM Cortex-M4MCU with FPU
STM32L4R9ZIJ6
3D Accelerometer+ 3D GyroiNEMO Inertialmeasurement unit(IMU) with machinelearning core
ISM330DHCX
Ultra-widebandwidth (up to 6kHz), low-noise, 3-axis digital vibrationsensor
IIS3DWB
STWIN SensorTile Wireless Industrial Node development kit and reference design for industrial IoT applications
STEVAL-STWINKT1B
Data brief
DB4345 - Rev 2 - December 2020For further information contact your local STMicroelectronics sales office.
The kit features a core system board with a range of embedded industrial-gradesensors and an ultra-low-power microcontroller for vibration analysis of 9-DoF motionsensing data across a wide range of vibration frequencies, including very highfrequency audio and ultrasound spectra, and high precision local temperature andenvironmental monitoring.
The development kit is complemented with a rich set of software packages andoptimized firmware libraries, as well as a cloud dashboard application, all provided tohelp speed up design cycles for end-to-end solutions.
The kit supports Bluetooth® low energy wireless connectivity through an on-board module, and Wi-Fi connectivity through a special plugin expansion board(STEVAL-STWINWFV1). Wired connectivity is also supported via an on-boardRS485 transceiver. The core system board also includes an STMod+ connector forcompatible, low cost, small form factor daughter boards associated with the STM32family, such as the LTE Cell pack.
Apart from the core system board, the kit is provided complete with a 480 mAh Li-Pobattery, an STLINK-V3MINI debugger and a plastic box.
Predictive maintenance applications collect and process data from a wide variety of sensors in order to identifypotential failures in machinery before they happen. A principal requirement of such applications is that thecondition monitoring equipment is placed very close to relevant machine componentry for the data to be reliable,which is why the STWIN node is designed to be small but robust, self-powered and capable of wirelesscommunication.Another application issue is the high volumes of preferably real-time data processing involved, which canoverwhelm centralized monitoring and control systems, and corresponding communication networks. Distributed(or decentralized) computing architectures represent a valid solution to this problem by performing data pre-processing and analytical operations directly on the node. The STWIN kit supports and can demonstratethis concept through sample applications in the firmware package running on the STM32L4+ ultra-low-powermicrocontroller embedded on the core system board.
Finally, the actual sensing equipment can be subject to a very wide range of low frequency (imbalance ormisalignment), medium frequency (worn gears or bearings) and high frequency (worn cooling fan bearings)vibrations, which is why our node carries several high performance accelerometers, IMUs and magnetometers,capable of detecting movement along 9 axes to a very high degree of sensitivity. For very high frequencies inthe order of tens of kilohertz, vibration analysis is covered by sound and ultrasound applications based on datacoming from a digital microphone and a high performance analog microphone, respectively.
HP Filter --> fc = 15.9 HzLP Filter --> fc = 99.4 KHzDAC for mic bias
DFSDM_D2DFSDM_D5
DCDC_1
3V3_Sensors
2V7A
2V7A
2V7A
SYS
DFSDM1_DATIN5
DFSDM1_CKOUT
DFSDM1_CKOUTDFSDM1_D7
SAI1_FS_A/DFSDM_D3
SAI1_MCLK_ASAI1_SD_A SAI1_SCK_A
I2C2_SDAI2C2_SCL
SAI1_SD_B
DAC1_OUT1
ADC1_IN2
ADC1_IN1
PE12
R74.7k
C2100nF
C51100nF
R81M
CN4M55-6001242R
a1 b1a2 b2a3 b3a4 b4a5 b5a6 b6
C910nF
U8TS922EIJT
Vcc-C2
+IN2C3
OUT2A3
-IN2
B3Vcc+
A2
OUT1A1
-IN1
B1
+IN1C1
C5410nF
C551uF
R2810k
M1
DOUT1
GN
D1
2
GN
D2
3
VDD5
GN
D3
4
SB110R
C10100nF
C521uF
M2
DOUT4
LR2
GN
D5A
VDD1
CLK3
GN
D5B
GN
D5D
GN
D5C
R6100k
R91M
SB10NC
R29160
C301uF
MREF
M1 M1P_FILT
M1P_FILT
MREF
M1P
MREF_DIVMREF
RE
CLK_Ex
EP11
2
10A
SDMMC_D2
CM
D
USART2_RTS
3
SB25 0R
11
U1 EMIF06-MSD02N16
4
RDAT3_GND
DETGNDA
SDMMC_CMD
17
10
C2910nF
7DAT0_Ex
SD
Micro-SD
6
CLK_In
3V3_SD_485
SDMMC_D0
9A
SDMMC_D1
15
VCC
SDMMC_D3
VCC
1 10
C3
100nF
USART2_TX
VDD
14
GN
D
DAT2_Ex
1
6
DAT
1
DAT2_In3
GND
SD Card
RS485
SB24 NC
Card Removed --> CLOSECard Inserted --> OPEN
DETGNDB
5
9B3
DEB
CD
/DAT
3D
AT2
J1
NC
1
5CMD_In
DAT1_Ex
6
3V3_SD_485
SD_DETECT
C28
100nF
SD_DETECT
CLK
9
4
2
DAT3_In
GN
D
DAT
0
8
R24 62
DETCA
2
C4
10uF
5
DETCB
8
1312
4
DAT1_In
VL
RDATA_VCC
CMD_Ex
7
16
R
U19 STR485LVR25 62
SLR
10B
3
D
USART2_RX
DAT0_In
DAT3_Ex
1
9
WP/CD
8A 7
SDMMC_CK
2
3V3_SD_4853V3_SD_485
IMP34DT05
MP23ABS1
DB
4345 - Rev 2
page 8/12
STEVAL-STW
INK
T1BSchem
atic diagrams
Figure 8. STEVAL-STWINKT1B schematic (6 of 7)
A8
DAT0_In
14
7SLR
2
DETGNDB
VDD
4
10B
SB25
12CMD_Ex
13
6GND
STR485LV
DAT
2
6G
ND
10
B9
8
NC
1
3V3_SD_485Micro-SD
3
DAT2_ExVCC
15
3V3_SD_485
RE4
10nF
U1
DAT2_In
2
100nF
WP/CD
8
3V3_SD_485
Card Removed --> CLOSECard Inserted --> OPEN
SDMMC_D2
SDMMC_CK
DAT3_Ex
7
C28
USART2_TX C29
6
SD_DETECT
C3
SD Card
RS485
DE3
CMD_In
4
R2
0R
SDMMC_D1
DETGNDADETCA 9A
CLK
5
100nF
R24 62
DAT1_In9
CD
/DAT
31
U19
17
11CLK_Ex
D5
11VCC
9B
10uF
3V3_SD_485
EP62
2
SDMMC_D0
DAT
17
DAT
0
SDMMC_D3SDMMC_CMD
VL1
RDAT3_GND
1
DAT0_Ex
GN
D
CLK_In
EMIF06-MSD02N16
5
3C
MD
C4
J1
DETCB 10A
16RDATA_VCC
DAT1_Ex
10
R25
USART2_RTS
SD_DETECT
USART2_RX
NCSB24
DAT3_In
3
SD
DB
4345 - Rev 2
page 9/12
STEVAL-STW
INK
T1BSchem
atic diagrams
Figure 9. STEVAL-STWINKT1B schematic (7 of 7)
9
b1
b3
I2C3_SDA
CS_WIFI BLE_SWDCLK
BLE_CS
100nF
5SDA
1
1
4.7k
5
SPI1_CLK
18DIO1/SPI_CS
2
SPI1_MISO
a4
Male Conn
NCSB15
BLE Current monitoring
R30
USART3_RTS
19
8
SPI1_MOSI
BLE_RST
1
BLE_SPI_MISO
RTC_TAMP1
DCDC_2
VDD_BLE
4
U5
USART3_CTS
47k
BLE_SWDCLK
100nF
SB13 NC
21N
C#2
1
NC#3 7SCL
4.7k
b6
SB4
NCSB16
a3
SO8N
DIO3/SPI_MOSI
SB9 NC
BT_RESET
20
4GND
R31
VDD_BLE
WIFI_WAKEUP
14
VDD_WIFI
RESETVCC
2
BLE_SWDIO
WIFI_BOOT0
ADC IN2
BLE_INT
SB21 0R
0RSB18
3
SB20 0R
BLE_TEST8 ADC IN1
1
STSAFE-A110
8
0R
DIOA12
USART3_TX
13
3NC#1
NC
SPI2_MOSI
NC
SPI1_MOSI
STRIP254P-M-5-90-SMD
SB6 0R
WIFI_DRDY
SPI1_MISO
C33
USART3_RX
BLE_SWDIO
SB3 NC
15
1
Default ON
Default OFF
Default ON
Default OFF
M55-7001242R
BLE_SPI_MOSISPI2_MISO
BLE_SPI_SCK
VDD_WIFI
SB8 0R
5
DIO4/I2C_CLK
2
a2 b2
USART2_TX
R27
2
DIO0/SPI_CLK
16
I2C3_SCL
DIO
14/A
NAT
EST0
DIO
7/BO
OT/
UAR
T_C
TSG
ND
DIO
6/U
ART_
RTS
DIO
8/U
ART_
TXD
DIO
11/U
ART_
RXD
DIO
9/TC
K/SW
TCK
DIO
10/T
MS/
SWTD
IAN
ATES
T1
6NC#2
I2C3_SCL
I2C3_SCL
VBLUE
4 17BLE_TEST9
DCDC_2
WIFI_RSTI2C3_SDA
J8
NCSB14
Wi-Fi Current monitoring
SB5 0R
10
BLE_SPI_MOSI
I2C3_SDA
SB2
SB7 NC
SPI1_CLK
a1
4.7k
R26
b4a5
DCDC_2
DCDC_1
U7
11 12
SPI2_CLK
DIO5/I2C_SDA
3
C53
BLE
WIFI
STSAFE-A100
TAMPER
SB1
BLE_INT
a6
STSAFE_RESET
J10
BLE_SPI_MISO
7
USART2_RX
NC
#22
22
CN3
VDD_BLE
VDD_BLE
BLE_SPI_SCK
b5
BLE_SPI_CS
SB19 0R
23N
C#2
3
BlueNRG-M2SA
DIO2/SPI_MISO
6
BLE_RST
J9
BLE_CS
2
DB
4345 - Rev 2
page 10/12
STEVAL-STW
INK
T1BSchem
atic diagrams
Revision history
Table 1. Document revision history
Date Version Changes
16-Nov-2020 1 Initial release.
15-Dec-2020 2 Updated cover page features and description.
STEVAL-STWINKT1B
DB4345 - Rev 2 page 11/12
IMPORTANT NOTICE – PLEASE READ CAREFULLY
STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, enhancements, modifications, and improvements to STproducts and/or to this document at any time without notice. Purchasers should obtain the latest relevant information on ST products before placing orders. STproducts are sold pursuant to ST’s terms and conditions of sale in place at the time of order acknowledgement.
Purchasers are solely responsible for the choice, selection, and use of ST products and ST assumes no liability for application assistance or the design ofPurchasers’ products.
No license, express or implied, to any intellectual property right is granted by ST herein.
Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product.
ST and the ST logo are trademarks of ST. For additional information about ST trademarks, please refer to www.st.com/trademarks. All other product or servicenames are the property of their respective owners.
Information in this document supersedes and replaces information previously supplied in any prior versions of this document.