DAQMB Production Status

DAQMB Production StatusDAQMB Production Status

S. DurkinThe Ohio State University

Florida EMU Meeting 2004

S. Durkin, Jan. 9, 2004 2

DAQMB Production DAQMB Production DAQMB Production DAQMB Production

EMU Peripheral Crate ESRNov. 6, 2003

Approved for Production

8-layer PC Board,2 Ball-Grid Array FPGAs718 Components/Board

S. Durkin, Jan. 9, 2004 3

Production : NumbersProduction : NumbersProduction : NumbersProduction : Numbers

ME 1/2, 1/3, 2/1, 2/2, 3/1, 3/2 360

ME 1/1 72

ME 4/1 36

SubTotal 468

10% spare boards 47

Total boards producing 515

10% spare parts

•10% of spare boards will be built for anticipated swapping,

•10% spare parts will be ordered for board repair

All Parts Ordered, 99% of Parts in Hand

S. Durkin, Jan. 9, 2004 4

Production Production Production Production

PC boards will be etched and stuffed commerciallyBoards will be measured and debugged on computerized tester before and after burn-in at OSU

Each board will have a unique ID

Board tracking: Microsoft Access

S. Durkin, Jan. 9, 2004 5

-Testing Station checks all input and output signals by computer-Exercise 5 CFEB’s and LVMB-CCB,TMB signals mimicked by FPGA on backplane

Test Station Built and Working

Production Test and DebuggingProduction Test and DebuggingProduction Test and DebuggingProduction Test and Debugging

S. Durkin, Jan. 9, 2004 6

Production Test SoftwareProduction Test SoftwareProduction Test SoftwareProduction Test SoftwareProduction Test Software written and tested.

S. Durkin, Jan. 9, 2004 7

Production preparation: Burn inProduction preparation: Burn inProduction preparation: Burn inProduction preparation: Burn in

Burn In

CDF: 50-60 C for 8-24 HrsSufficient for tantalums failuresNo sensitivity to semiconductor

failure

US Military: 125 C for 320 Hrs Chip Makers recommend against this

CFEB: 65 C for 24 Hrs Prove to be effective, not damaging

Each DMB: 65C for 24 Hrs

Test Before and After

S. Durkin, Jan. 9, 2004 8

Pre-Production BoardsPre-Production BoardsPre-Production BoardsPre-Production Boards

-11 DAQMB delivered (Nov 19, 2003)

-Stuffed commercially, No problems, Work well

DAQMB well within Budget

Full Production will begin whena Complete Crate of Electronics is tested

Costs: PC Board $ 200 Stuffing $ 60 Components $ 750 Mechanical $ 100

Total: $ 1110

S. Durkin, Jan. 9, 2004 9

New Crate Controller DevelopmentNew Crate Controller DevelopmentNew Crate Controller DevelopmentNew Crate Controller Development

A VMEbus Controller with Gigabit Ethernet – A custom board designed and

developed at OSU– Based on XILINX Virtex-II Pro– Customizable firmware.– Optical transceiver (for Gbit Ethernet) – Communicates with stand-alone PC

(in USC55) via Ethernet

Advantages Over Dynatem– No operating system or software on

the controller. All programming done on stand-alone PC in USC55.

– Faster, less expensive: ~ $600 each

Status– PC board produced and stuffed– Firmware being developed

S. Durkin, Jan. 9, 2004 10

DDU and DCC StatusDDU and DCC StatusDDU and DCC StatusDDU and DCC Status

540 DMB as inputs (160MB/s)

Detector

Peripheral Crates

AFEB

CFEB

ALCT

8 SLINK64 as outputs (800MB/s)Expected data rate 1.2 GB/s

SLINK64

FED Crate (DDU/DCC)

FRL

Myrinet5Gb/s Fibers

CMSDAQ

USC55

DMB to DDUGb/s Fibers

S. Durkin, Jan. 9, 2004 11

FED CrateFED CrateFED CrateFED Crate

• Four 9U Crates

9U X 220mm Board

• Data Concentration:

15 DMB to 1 DDU

9 DDU to 1 DCC

1 DCC to 2 SLINK64

9 DDU per SLINK (4)

4/5 DDU per SLINK (8)

2/3 DDU per SLINK (16)

1 DDU per SLINK (36)

36 DDU, 4/8 DCC needed

DDU DDU

CCD

Base-line design Optional

S. Durkin, Jan. 9, 2004 12

DDU/DCC custom backplaneDDU/DCC custom backplaneDDU/DCC custom backplaneDDU/DCC custom backplane

VME P3 spaces, 6.4 Gbps rated connectorData from DDU to DCCTTC control bus (clock, L1A, command/data)

DCC DDUsDDUs DDUs DCCDDUs

S. Durkin, Jan. 9, 2004 13

DDU-04 FunctionDDU-04 FunctionDDU-04 FunctionDDU-04 Function

• Collect data from 15 DMB (15*160MB/s), Send data to DCC (640MB/s)

• Check data, Detect error, send to FMM

• Spy data by Gigabit Ethernet

• Capable of SLINK64

Improvements over DDU-02:Earlier error detectionBetter PCB timingMore reliableHigher effective data bandwidth

VP20

DMBs

DMBs

GigabitEthernet

SLINK64

VP20

To FMM

DCC

S. Durkin, Jan. 9, 2004 14

DCC FunctionDCC FunctionDCC FunctionDCC Function

• Merge data from 10 DDU (10*640MB/s), send to CMS DAQ SLINK64 (2*800MB/s)

• Receive and fan out TTC fast control for the crate

• Spy data by two Gigabit Ethernet links

• Expected:

Constant 800MB/s on SLINK64

>100MHz DDR FIFO

extra 1MB buffer for the SLINK64

error detection abilityDDUsVP2

VP20

FIFO

SLINK64

GigabitEthernet

GigabitEthernet

TTCrx

SLINK64

S. Durkin, Jan. 9, 2004 15

StatusStatusStatusStatus

• DCC PCB Ordered, DDU PCB

• FPGA firmware: Being Developed

• System will be ready before 2004 slice test

We are confident in the design

We are working hard on the system