D. Cheng Feb 11, 2014 QXF Instrumentation Trace Update.

D. Cheng

Feb 11, 2014

QXF Instrumentation Trace Update

D. Cheng 2

Design Status

2/11/2014

• OL SQXF trace is ~80% complete– Design elements in place; spacing and locations to be

finalized• IL SQXF trace is ~15% complete• Schedule estimate– Week of 2/17: Negative mask order to be placed– Week of 2/24: Negative mask received– Week of 3/10: Receive traces

• (HQ trace fab. may possibly bump this date)

– Week of 3/17: QA’d traces ready for use

D. Cheng 3

Material Status

2/11/2014

• LARP order has not been placed– Material requires 10 week lead time for order– May 2014 delivery, at the earliest, if ordered this

month• CERN has sent us 5m (600 mm wide) of their

material for at least 3 sets of traces to start with– GTS #DEVL-178-13 (same as one of LARP’s options)– 304L + Adhesive AS1084 + Apical AV

D. Cheng 4

Outer Layer Lead End

2/11/2014

VTB02

VTB04VTB05aVTB03 VTB07a

D. Cheng 5

Outer Layer Return End

2/11/2014

VTB05bVTB07b VTB06

D. Cheng 6

Production Status

2/11/2014

• Practice SQXF traces can be fabricated normal– But LBNL trace fabrication expert will be retiring

3/31• Options for the future (production)– LBNL tech training (on-going)– Possible return of expert (after mandatory

separation)– Outside vendor qualifications*

D. Cheng 7

Additional Slides

2/11/2014

D. Cheng 8

Coil IL

2/11/2014

D. Cheng 9

Reference: LARP Coil Instrumentation Traces

2/11/2014

Stainless Laminate Adhesive*

Polyimide (Apical AV)

Additional Kapton**

TQ/LQ 304 / 25 µm 15 µm 25 µm -

HQ Coils 1-10 304 / 25 µm 15 µm 25 µm -

HQ Coils 11-14 304 / 25 µm 15 µm 25 µm 25 µm

HQ Coils 15-21 304 / 25 µm 15 µm 25 µm 50 µm

HQ Coils 22-26 304 / 25 µm 15 µm 25 µm 25 µm

LHQ 304 / 25 µm 15 µm 25 µm 50 µm

*Modified cross-linked epoxy system, AS 1084** Joined by single strip of 3M VHB F-9460PC(More info in 9/23/13 presentation)

D. Cheng 10

QXF Coil Instrumentation Trace Options

2/11/2014

Stainless Laminate Adhesive*

Polyimide Thickness

Notes

Apical AV 304 / 25 µm 15 µm 50 µm Currently used in LARP coils; extensive 4 K data

Apical NP 304 / 25 µm 15 µm 50 µm Higher strength version of AV; not as much published

data for use @ 4 K; currently what vendor has

quotedKapton MT 304 / 25 µm 15 µm 50 µm High thermal conductivity

polyimide, ~3x that of Kapton HN-equivalent at RT; 20% more expensive;

only available in large quantities ($45k min. order)

*Modified cross-linked epoxy system, AS 1084

D. Cheng 11

Instrumentation Trace Fabrication Process

2/11/2014

• Design and print artwork (negative mask) • Cut trace laminated material to length• Cover conductive laminate with resist• Expose resist under negative mask with UV light• Wash the uncured resist from laminate• Etch laminated material with cured resist

pattern– Conductive layer covered by resist remains

• Remaining resist washed off by stripping agent

D. Cheng 12

Instrumentation Trace Impreg. Preparations

2/11/2014

• Electrical QA• Perforate polyimide layers• Install during coil impregnation

Coil Processing: Impregnation• Does CTD 101K epoxy exhibit acceptable

radiation hardness?– What are the requirements?– What is the real data?

• Technical challenges for impregnation using Cyanate Ester blends (or other materials) must be overcome for long coils

• Instrumentation traces– Do laminated polyimide trace materials pose

problems for impregnation?– Trace behavior (bubbles) on inside bore after

testing cycle have continued

April 9, 2013D.W. Cheng - LARP CM20/HiLumi,

Napa, CA 13

Bubbles on inside bore of LQS03 after magnet test

Inside bore of HQ02a during assembly (Coil 15 was previouslytested in HQ mirror)

April 9, 2013D.W. Cheng - LARP CM20/HiLumi,

Napa, CA 14