-
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
0 2 4 6 8 10 12 14 16 18 20VGS - Gate-to- Source Voltage (V)
RD
S(o
n) -
On-
Sta
te R
esis
tanc
e (
mΩ
) TC = 25°C, I D = 35ATC = 125°C, I D = 35A
G001
0
1
2
3
4
5
6
7
8
9
10
0 10 20 30 40 50 60 70 80 90 100 110 120Qg - Gate Charge
(nC)
VG
S -
Gat
e-to
-Sou
rce
Vol
tage
(V
)
ID = 35AVDS = 15V
G001
1 D
2 D
3 D
4
D
D5G
6S
7S
8S
P0093-01
Product
Folder
Order
Now
Technical
Documents
Tools &
Software
Support &Community
An IMPORTANT NOTICE at the end of this data sheet addresses
availability, warranty, changes, use in safety-critical
applications,intellectual property matters and other important
disclaimers. PRODUCTION DATA.
CSD17573Q5BSLPS492B –JUNE 2014–REVISED APRIL 2017
CSD17573Q5B 30-V N-Channel NexFET™ Power MOSFETs
1
1 Features1• Low Qg and Qgd• Ultra-Low RDS(on)• Low-Thermal
Resistance• Avalanche Rated• Lead-Free Terminal Plating• RoHS
Compliant• Halogen Free• SON 5-mm × 6-mm Plastic Package
2 Applications• Point-of-Load Synchronous Buck Converter for
Applications in Networking, Telecom, andComputing Systems
• Optimized for Synchronous FET Applications
3 DescriptionThis 0.84-mΩ, 30-V, SON 5-mm × 6-mm NexFET™power
MOSFET is designed to minimize losses inpower conversion
applications.
Top View
Product SummaryTA = 25°C TYPICAL VALUE UNIT
VDS Drain-to-Source Voltage 30 V
Qg Gate Charge Total (4.5 V) 49 nC
Qgd Gate Charge Gate-to-Drain 11.9 nC
RDS(on) Drain-to-Source On ResistanceVGS = 4.5 V 1.19
mΩVGS = 10 V 0.84
VGS(th) Threshold Voltage 1.4 V
Device Information(1)DEVICE QTY MEDIA PACKAGE SHIP
CSD17573Q5B 2500 13-Inch Reel SON5.00-mm × 6.00-mm
Plastic Package
TapeandReelCSD17573Q5BT 250 7-Inch Reel
(1) For all available packages, see the orderable addendum atthe
end of the data sheet.
Absolute Maximum RatingsTA = 25°C VALUE UNIT
VDS Drain-to-Source Voltage 30 V
VGS Gate-to-Source Voltage ±20 V
ID
Continuous Drain Current (Package Limited) 100
AContinuous Drain Current (Silicon Limited),TC = 25°C332
Continuous Drain Current(1) 43
IDM Pulsed Drain Current(2) 400 A
PDPower Dissipation(1) 3.2
WPower Dissipation, TC = 25°C 195
TJ,Tstg
Operating Junction,Storage Temperature –55 to 150 °C
EASAvalanche Energy, Single PulseID = 76, L = 0.1 mH, RG = 25
Ω
289 mJ
(1) Typical RθJA = 40°C/W on a 1-in2, 2-oz Cu pad on a0.06-in
thick FR4 PCB.
(2) Max RθJC = 0.8°C/W, pulse duration ≤ 100 μs, duty cycle
≤1%.
RDS(on) vs VGS Gate Charge
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-
2
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Table of Contents1 Features
..................................................................
12 Applications
........................................................... 13
Description
............................................................. 14
Revision
History..................................................... 25
Specifications.........................................................
3
5.1 Electrical
Characteristics........................................... 35.2
Thermal Information
.................................................. 35.3 Typical
MOSFET Characteristics.............................. 4
6 Device and Documentation Support.................... 76.1
Receiving Notification of Documentation Updates.... 7
6.2 Community
Resources.............................................. 76.3
Trademarks
...............................................................
76.4 Electrostatic Discharge
Caution................................ 76.5 Glossary
....................................................................
7
7 Mechanical, Packaging, and OrderableInformation
............................................................. 87.1
Q5B Package Dimensions ........................................
87.2 Recommended PCB Pattern.....................................
97.3 Recommended Stencil Pattern .................................
97.4 Q5B Tape and Reel Information .............................
10
4 Revision History
Changes from Revision A (February 2015) to Revision B Page
• Changed Figure 10 in Typical MOSFET Characteristics section
...........................................................................................
4• Added Receiving Notification of Documentation Updates and
Community Resources to the Device and
Documentation Support section
.............................................................................................................................................
7• Changed the dimension between pads 3 and 4 from 0.028 inches :
to 0.050 inches in the Recommended PCB
Pattern section's diagram to correct typo
...............................................................................................................................
9
Changes from Original (June 2014) to Revision A Page
• Corrected typo of Threshold Voltage units to read "V"
..........................................................................................................
1
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5 Specifications
5.1 Electrical CharacteristicsTA = 25°C (unless otherwise
stated)
PARAMETER TEST CONDITIONS MIN TYP MAX UNITSTATIC
CHARACTERISTICSBVDSS Drain-to-source voltage VGS = 0 V, ID = 250 μA
30 VIDSS Drain-to-source leakage current VGS = 0 V, VDS = 24 V 1
μAIGSS Gate-to-source leakage current VDS = 0 V, VGS = 20 V 100
nAVGS(th) Gate-to-source threshold voltage VDS = VGS, ID = 250 μA
1.1 1.4 1.8 V
RDS(on) Drain-to-source on resistanceVGS = 4.5 V, ID = 35 A 1.19
1.45 mΩVGS = 10 V, ID = 35 A 0.84 1.00
gƒs Transconductance VDS = 15 V, ID = 35 A 181 SDYNAMIC
CHARACTERISTICSCiss Input capacitance
VGS = 0 V, VDS = 15 V, ƒ = 1 MHz6920 9000 pF
Coss Output capacitance 769 1000 pFCrss Reverse transfer
capacitance 300 390 pFRG Series gate resistance 0.9 1.8 ΩQg Gate
charge total (4.5 V)
VDS = 15 V, ID = 35 A
49 64 nCQgd Gate charge gate-to-drain 11.9 nCQgs Gate charge
gate-to-source 17.1 nCQg(th) Gate charge at Vth 8.6 nCQoss Output
charge VDS = 30 V, VGS = 0 V 21 nCtd(on) Turnon delay time
VDS = 15 V, VGS = 10 V,IDS = 35 A, RG = 0 Ω
6 nstr Rise time 20 nstd(off) Turnoff delay time 40 nstƒ Fall
Time 7 nsDIODE CHARACTERISTICSVSD Diode forward voltage ISD = 35 A,
VGS = 0 V 0.8 1 VQrr Reverse recovery charge VDS= 15 V, IF = 35
A,
di/dt = 300 A/μs29 nC
trr Reverse recovery time 21 ns
(1) RθJC is determined with the device mounted on a 1-in2
(6.45-cm2), 2-oz (0.071-mm) thick Cu pad on a 1.5-in × 1.5-in
(3.81-cm × 3.81-cm), 0.06-in (1.52-mm) thick FR4 PCB. RθJC is
specified by design, whereas RθJA is determined by the user’s board
design.
(2) Device mounted on FR4 material with 1-in2 (6.45-cm2), 2-oz
(0.071-mm) thick Cu.
5.2 Thermal InformationTA = 25°C (unless otherwise stated)
THERMAL METRIC MIN TYP MAX UNITRθJC Junction-to-case thermal
resistance (1) 0.8 °C/WRθJA Junction-to-ambient thermal resistance
(1) (2) 50 °C/W
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-
GATE Source
DRAIN
N-Chan 5x6 QFN TTA MAX Rev3
M0137-01
GATE Source
DRAIN
N-Chan 5x6 QFN TTA MIN Rev3
M0137-02
4
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Max RθJA = 50°C/Wwhen mounted on 1 in2(6.45 cm2) of2-oz
(0.071-mm) thickCu.
Max RθJA = 125°C/Wwhen mounted on aminimum pad area of2-oz
(0.071-mm) thickCu.
5.3 Typical MOSFET CharacteristicsTA = 25°C (unless otherwise
stated)
Figure 1. Transient Thermal Impedance
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-
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
−75 −50 −25 0 25 50 75 100 125 150 175TC - Case Temperature
(ºC)
VG
S(th
) - T
hres
hold
Vol
tage
(V
)
G001
0
0.5
1
1.5
2
2.5
3
3.5
4
4.5
5
0 2 4 6 8 10 12 14 16 18 20VGS - Gate-to- Source Voltage (V)
RD
S(o
n) -
On-
Sta
te R
esis
tanc
e (
mΩ
) TC = 25°C, I D = 35ATC = 125°C, I D = 35A
G001
0
1
2
3
4
5
6
7
8
9
10
0 10 20 30 40 50 60 70 80 90 100 110 120Qg - Gate Charge
(nC)
VG
S -
Gat
e-to
-Sou
rce
Vol
tage
(V
)
G001
100
1000
10000
0 3 6 9 12 15 18 21 24 27 30VDS - Drain-to-Source Voltage
(V)
C −
Cap
acita
nce
(pF
)
Ciss = Cgd + CgsCoss = Cds + CgdCrss = Cgd
G001
0
20
40
60
80
100
120
140
160
180
200
0 0.05 0.1 0.15 0.2 0.25 0.3 0.35VDS - Drain-to-Source Voltage
(V)
I DS -
Dra
in-t
o-S
ourc
e C
urre
nt (
A)
VGS =10VVGS =6VVGS =4.5V
G001
0
20
40
60
80
100
120
140
160
180
200
0 0.5 1 1.5 2 2.5 3 3.5 4VGS - Gate-to-Source Voltage (V)
I DS -
Dra
in-t
o-S
ourc
e C
urre
nt (
A)
TC = 125°CTC = 25°CTC = −55°C
G001
5
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Typical MOSFET Characteristics (continued)TA = 25°C (unless
otherwise stated)
Figure 2. Saturation Characteristics
VDS = 5 V
Figure 3. Transfer Characteristics
ID = 35 A VDS = 15 V
Figure 4. Gate Charge Figure 5. Capacitance
ID = 250 µA
Figure 6. Threshold Voltage vs Temperature Figure 7. On-State
Resistance vs Gate-to-Source Voltage
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-
0
20
40
60
80
100
120
−50 −25 0 25 50 75 100 125 150 175 200TC - Case Temperature
(ºC)
I DS -
Dra
in-
to-
Sou
rce
Cur
rent
(A
)
G001
VDS - Drain-to-Source Voltage (V)
I DS -
Dra
in-t
o-S
ourc
e C
urre
nt (
A)
0.1 1 10 1000.1
1
10
100
1000
D010
DC10 ms1 ms
100 µs10 µs
10
100
0.01 0.1 1TAV - Time in Avalanche (mS)
I AV -
Pea
k A
vala
nche
Cur
rent
(A
)
TC = 25ºCTC = 125ºC
G001
0.4
0.6
0.8
1
1.2
1.4
1.6
1.8
2
−75 −50 −25 0 25 50 75 100 125 150 175TC - Case Temperature
(ºC)
Nor
mal
ized
On-
Sta
te R
esis
tanc
e
VGS = 4.5VVGS = 10V
G001
0.0001
0.001
0.01
0.1
1
10
100
0 0.2 0.4 0.6 0.8 1VSD − Source-to-Drain Voltage (V)
I SD −
Sou
rce-
to-D
rain
Cur
rent
(A
) TC = 25°CTC = 125°C
G001
6
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Typical MOSFET Characteristics (continued)TA = 25°C (unless
otherwise stated)
ID = 35 A
Figure 8. Normalized On-State Resistance vs Temperature Figure
9. Typical Diode Forward Voltage
Single pulse, max RθJC = 0.8°C/W
Figure 10. Maximum Safe Operating Area Figure 11. Single Pulse
Unclamped Inductive Switching
Figure 12. Maximum Drain Current vs Temperature
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6 Device and Documentation Support
6.1 Receiving Notification of Documentation UpdatesTo receive
notification of documentation updates, navigate to the device
product folder on ti.com. In the upperright corner, click on Alert
me to register and receive a weekly digest of any product
information that haschanged. For change details, review the
revision history included in any revised document.
6.2 Community ResourcesThe following links connect to TI
community resources. Linked contents are provided "AS IS" by the
respectivecontributors. They do not constitute TI specifications
and do not necessarily reflect TI's views; see TI's Terms
ofUse.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E)
Community. Created to foster collaborationamong engineers. At
e2e.ti.com, you can ask questions, share knowledge, explore ideas
and helpsolve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E
forums along with design support tools andcontact information for
technical support.
6.3 TrademarksNexFET, E2E are trademarks of Texas
Instruments.All other trademarks are the property of their
respective owners.
6.4 Electrostatic Discharge CautionThese devices have limited
built-in ESD protection. The leads should be shorted together or
the device placed in conductive foamduring storage or handling to
prevent electrostatic damage to the MOS gates.
6.5 GlossarySLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and
definitions.
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-
D1
Top View
E
c1
E1
41
23
Side View Bottom View
Front View
14
b (
8x)
32
e
L
K
H
D2
85
67
85
67
D3
d1
d2
8
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7 Mechanical, Packaging, and Orderable InformationThe following
pages include mechanical, packaging, and orderable information.
This information is the mostcurrent data available for the
designated devices. This data is subject to change without notice
and revision ofthis document. For browser-based versions of this
data sheet, refer to the left-hand navigation.
7.1 Q5B Package Dimensions
DIMMILLIMETERS
MIN NOM MAXA 0.80 1.00 1.05b 0.36 0.41 0.46c 0.15 0.20 0.25
c1 0.15 0.20 0.25c2 0.20 0.25 0.30D1 4.90 5.00 5.10D2 4.12 4.22
4.32D3 3.90 4.00 4.10d 0.20 0.25 0.30d1 0.085 TYPd2 0.319 0.369
0.419E 4.90 5.00 5.10E1 5.90 6.00 6.10E2 3.48 3.58 3.68e 1.27 TYPH
0.36 0.46 0.56L 0.46 0.56 0.66L1 0.57 0.67 0.77θ 0° — —K 1.40
TYP
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-
4.318(0.170)
2.186
6.586
0.350
(0.014)
1.294
x 8
(0.051)
0.746 x 8
(0.029)
(0.259)
1.072
(0.042)
1.270
0.562 x 4
(0.022)
0.300(0.012)
(0.086)
(0.050)
1.525(0.060)
0.508
x4
(0.020)
1.270 (0.050)
0.286(0.011)
0.766
(0.030)
9
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7.2 Recommended PCB Pattern
For recommended circuit layout for PCB designs, see Reducing
Ringing Through PCB Layout Techniques(SLPA005).
7.3 Recommended Stencil Pattern
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-
Ø 1.50+0.10–0.00
4.00 ±0.10 (See Note 1)
1.7
5 ±
0.1
0
R 0.30 TYP
Ø 1.50 MIN
A0
K0
0.30 ±0.05
R 0.30 MAX
A0 = 6.50 ±0.10B0 = 5.30 ±0.10K0 = 1.40 ±0.10
M0138-01
2.00 ±0.05
8.00 ±0.10
B0
12.0
0 ±
0.3
0
5.5
0 ±
0.0
5
10
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7.4 Q5B Tape and Reel Information
Notes:1. 10-sprocket hole-pitch cumulative tolerance ±0.2.2.
Camber not to exceed 1 mm in 100 mm, noncumulative over 250 mm.3.
Material: black static-dissipative polystyrene.4. All dimensions
are in mm (unless otherwise specified).5. A0 and B0 measured on a
plane 0.3 mm above the bottom of the pocket.
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-
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status(1)
Package Type PackageDrawing
Pins PackageQty
Eco Plan(2)
Lead finish/Ball material
(6)
MSL Peak Temp(3)
Op Temp (°C) Device Marking(4/5)
Samples
CSD17573Q5B ACTIVE VSON-CLIP DNK 8 2500 RoHS-Exempt&
Green
NIPDAU Level-1-260C-UNLIM -55 to 150 CSD17573
CSD17573Q5BT ACTIVE VSON-CLIP DNK 8 250 RoHS-Exempt&
Green
NIPDAU Level-1-260C-UNLIM -55 to 150 CSD17573
(1) The marketing status values are defined as follows:ACTIVE:
Product device recommended for new designs.LIFEBUY: TI has
announced that the device will be discontinued, and a lifetime-buy
period is in effect.NRND: Not recommended for new designs. Device
is in production to support existing customers, but TI does not
recommend using this part in a new design.PREVIEW: Device has been
announced but is not in production. Samples may or may not be
available.OBSOLETE: TI has discontinued the production of the
device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that
are compliant with the current EU RoHS requirements for all 10 RoHS
substances, including the requirement that RoHS substancedo not
exceed 0.1% by weight in homogeneous materials. Where designed to
be soldered at high temperatures, "RoHS" products are suitable for
use in specified lead-free processes. TI mayreference these types
of products as "Pb-Free".RoHS Exempt: TI defines "RoHS Exempt" to
mean products that contain lead but are compliant with EU RoHS
pursuant to a specific EU RoHS exemption.Green: TI defines "Green"
to mean the content of Chlorine (Cl) and Bromine (Br) based flame
retardants meet JS709B low halogen requirements of
-
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 2
-
IMPORTANT NOTICE AND DISCLAIMER
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PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY
RIGHTS.These resources are intended for skilled developers
designing with TI products. You are solely responsible for (1)
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designing, validating and testing your application, and (3)
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Mailing Address: Texas Instruments, Post Office Box 655303,
Dallas, Texas 75265Copyright © 2020, Texas Instruments
Incorporated
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1 Features2 Applications3 DescriptionTable of Contents4 Revision
History5 Specifications5.1 Electrical Characteristics5.2 Thermal
Information5.3 Typical MOSFET Characteristics
6 Device and Documentation Support6.1 Receiving Notification of
Documentation Updates6.2 Community
Resources6.3 Trademarks6.4 Electrostatic Discharge
Caution6.5 Glossary
7 Mechanical, Packaging, and Orderable Information7.1 Q5B
Package Dimensions7.2 Recommended PCB Pattern7.3 Recommended
Stencil Pattern7.4 Q5B Tape and Reel Information