RockHydro Critical Design Review Northwest Nazarene University Advisor: Dr. Lawrence Chad Larson Ben Gordon Seth Leija David Vinson Zach Thomas Drew Johnson
Dec 20, 2015
RockHydro Critical Design ReviewNorthwest Nazarene UniversityAdvisor: Dr. Lawrence
Chad LarsonBen Gordon
Seth LeijaDavid VinsonZach ThomasDrew Johnson
Section 1: Mission Overview◦ Purpose◦ Goals◦ Theory◦ Success◦ Benefits◦ Expected Results◦ Organizational Chart
Section 2: Design Description◦ Design Process◦ Design Requirements◦ User Guide Compliance◦ System Overview◦ Design View◦ Superhydrophobic◦ Flexible Chips◦ Radiation Hardened Chips◦ Pseudo code◦ Block Diagram
Table of Contents
Section 3: Prototyping/Analysis Section 4: Manufacturing Plan Section 5: Testing Plan Section 6: Risks Section 7: Project management plan Section 8: Conclusions
Table of Contents
Mission Overview
Study the feasibility of using Superhydrophobic materials in the presence of high acceleration and vibrations for possible use on space missions.
Test Radiation Hardened chips and new FleX chips with American Semiconductors Inc.
Mission Overview: Purpose
Do research on superhydrophic material that would allow it to be used in future space missions.
Gather data on Radiation hardened chips and to gain experience working with the microchip industry.
Mission Overview: Goals
Mission Overview: Theory When water is in contact
with the superhydrophobic surface (diatomaceous earth) it is more attracted to its own surface tension than it is to the material. This is because the material works like a microscopic bed of nails. Diatomaceous earth is a new material developed by John Simpson at Oakridge National Laboratory and is exceptional due to its high contact angle with water and low price.
For this mission to be considered a success, the SH material needs to be recovered and tested post-flight. It would be best if the Superhydrophobic material survived the flight.
Get usable data from the radiation hardened chips
Mission Overview: Success
The goal of this launch is to prove that this diatomaceous earth can survive a rocket launch and still be functional post-flight.
This material could have many different benefits if it is shown to survive space travel. The SH material has already been shown to work in microgravity by NNU and NASA’s SEED. NASA would benefit from the data gathered if they decide to use this material on future missions.
Mission Overview: Benefits
Mission Overview: Expected Results It is hypothesized that the material will
survive the high acceleration and vibrations and still be functional in post-flight testing.
It is expected that the radiation hardened chips will make less errors in the flight compared to the non-hardened chips.
Expected Results
Team Organization
American Semiconductors
Dale Wilson
Electrical David Vinson
Seth LeijaDrew Johnson
Superhydrophobic
Mechanical Ben GordonChad LarsonZach Thomas
AdvisorDr. Dan
Lawrence
AdvisorDr. Parke
Design Description
Design Superhydrophobic Encasement Design American Semiconductor Board/
Final Design of Plate. Build encasement/Build American
Semiconductor board. Implement into Plate
◦ Test board◦ Run full flight test
Design Process
Physical Envelope Cylindrical: Diameter: 9.3 inches Height: 4.75 inches Mass Canister + Payload = 20±0.2 lbf Center of Gravity Lies within a 1x1x1 inch
envelope of the RockSat payload canister‘s geometric centroid.
Design Requirements
A Superhydrophobic “donut” will be on one plate
The electrical systems will be on another plate above the original plate.
System Overview
Design View
Superhydrophobic “donut”
Flexible Chips
Geiger Counter Board
Arduino Board
Superhydrophobic
“Donut”
A donut shaped hollow object will house Superhydrophobic material. This shape allows for different forces on different axis.
This will be on the lower plate and will be placed around the center support.
Measured Donut
Bottom Outer Drawing
Bottom Inner Drawing
Top Inner Drawing
Top Outer Drawing
With Standoffs
Flexible Chips New flexible chips from American
Semiconductors will now be integrated in with the Arduino subsystem
American Semiconductors will work with students to design a board which will test their radiation hardened chips
Radiation Hardened Chips
Arduino/American Semiconductor Board
& Geiger Counter
Pseudo code for ArduinoloadTestVectors();runTestVectorsThroughASChips();readSensorData();writeSensorDataToSDCard();saveTestToSDCard();CompareResultsWithExpected();If Error
{writeErrorToSDCard();}
Our system will be activated by a G-Switch. When turned on, the Arduino will load test vectors from the attached SD card. Additional sensor data from previous RockON boards will also be written to the SD card. The test vectors will be run through different portions ASC’s chip and the results will be compared to the expected results. The raw data as well as the errors will both be written onto the SD card.
Using 1 PCB Geiger board will record radiation Arduino board will test the radiation
hardened chips and flex chips for error count Arduino will also have flash memory Activating with G-switch
There is software out there for Arduino that will be used
Electrical Design Elements
G-Switch
Arduino
ASC Chip(Packaged)
ASC Chip(Unpackaged
)
Voltage Regulator
SD Card
Clock
Microcontroller
PowerDataClock Power
Supply
Block Diagram
Prototyping/Analysis
Since the CDR, the superhydrophobic enclosure has been designed and is currently being prototyped on our dimension sst 1200es 3D printer. The materials have been collected from American Semiconductors and are in the process of being tested so they will function properly throughout the launch and flight.
Prototyping Plan
Detailed Mass Budget
32
Mass BudgetSubsystem Total Mass (lbf)
SH 2.5Electrical 1
… … … … Total 3.5Over/Under 6.5
The mass is scheduled to be found more thoroughly once the parts are procured
Ballast will be needed
Arduino board: 7 V with each I/O pin running on 40 mA.
Flexchips: 1.2 V, low but unknown amperage.
Geiger Counter: 9V, same as RockOn.
All parts will be turned on at the start of the flight.
Power Budget
Manufacturing Plan
SH “Donut” needs to be manufactured
Mechanical Elements
Print Prototype
Nov 30 Jan 25
Complete Fabrication
Mechanical Subsystem
Begin Testing
Jan 11
Fix errors in design
Jan 18
Electrical and Software Elements
Electronic Parts arrive
Dec 12
Board assembled
Electrical Subsystem
Jan 23
Board design complete
Feb 10 Feb 13
Testing Begins
This schedule was made with help from American Semiconductor Inc.
PCB Needs to be prototyped and manufactured
We suspect that there may be up to 5 small revisions made on the electronics.
The Arduino board, socket, SD card, and PCB still need to be obtained.
Electrical Elements
Testing Plan
Need to figure out how much water there needs to be to be useful in the “Donut”
Test for any leakage◦ To test for leakage the amount of vibration
resistance needs to be found◦ A passed test will be zero leakage
Test the contact angle of the superhydrophobic surface.
Mechanical Testing
The chips will be tested to make sure they produce the correct outputs before entering an area with radiation to see how much the radiation affects functionality.
Data will be taken at 1MHz
The electrical system will pass once it is shown to be able to gather data for a whole flight test. Correct voltages will be measured.
Electrical and Software Testing
Most of the code still needs to be written. We are waiting for all the parts to arrive and then will write the code with American Semiconductor’s help. American Semiconductors has a testing code that will hopefully be modified to complete our necessary actions.
Software
Risks
Previous Risk Factors Risk 1: SH enclosure
breaks Risk 2: G-switch fails to
start data collection Risk 3:Malfunction of
electrical board. 1: The SH enclosure will
be double layered and extensively tested.
2: Will just have to be accepted.
3: The board will be tested to be in perfect working order multiple times prior to launch.
Consequence
Risk 1 Risk 2
Risk 3
Possibility
Risk Factors Risk 1: Leads on
Flex chip fall off. Risk 2: G-switch
fails to start data collection
Risk 3: wires on packaged chip break due to G’s during launch
Consequence
Risk 2
Risk 1
Risk 3
Possibility
Project Management Plan
BudgetItem Amount Budgeted ($)
½ Can $7000.00 paid by American Semiconductors
Superhydrophobic Material Made by NNU for less then $50.00
Travel Funded by Idaho Space Grant
Facilities Provided by NNU
Radiation Hardened Chips and other Electronics
Provided by American Semiconductors
Electronics hardware $200 by NNU
With the “donut” being manufactured the main focus will be on the electrical system. We have established weekly meetings with American Semiconductors to stay on schedule.
Questions?
Conclusion