Content Company OverviewCompany Overview Quality ...Ⅲ.Gro s& FineL eak t t Ⅳ.F r eq & tmperatu t s by 25 Thermal shock-55 ~125 Dwell:10 m in, 100 c ycles MIL-STD-883E Method 1011

ContentContent

Company OverviewCompany Overview

Sales & MarketingSales & Marketing

Products & TechnologyProducts & Technology

Quality AssuranceQuality Assurance

AppendixAppendix

Manufacturing Process GuidelineManufacturing Process GuidelineManufacturing Process Guideline

Quality AssuranceQuality AssuranceQuality Assurance

2

Company OverviewCompany Overview

3

MilestonesMilestones

1983

Established TCXO Production Lines

Established SMD Production Lines

1991 1992 1993 1994 1995 1996 1997 1998 1999 2000 2001 2002 2003 2004 2005 20061984 …

Implemented Oracle ERP

Founded- Capital US$ 95,000 IPO’ed Increased Capital to US$ 34.8M

Listed in Main Board of Taiwan Security Exchange (Code- 3042)

Ranked 6th Largest Crystal/Oscillator Manufacturer in the World

Ranked 8th Largest Crystal/Oscillator Manufacturer in the World

Completed new Ningbo Factory in China

Established SAW Production Lines

Total capacity can up to 112 M /m

2007

Total capacity can up to 174 M /m

2008 2009

Ranked 5th

Production

Business

TS16949- Taiwan and China Factories

ISO 9001:2000 6 Sigma

IECQ QC080000

ISO 14001:1996

ISO 14001:2004

Green Product Policy & QS 9000

2010

Quality

Paid-in Capital: US$90 M

NQA Rewarded

4

OrganizationOrganization

Board of Directors

CTO

Landau Chang

Chairman/Founder

Paul Lin

President

Peter LinNGB President

Levi Chen

CFO

Vivien Hung

VPKevin Guo

VPLandau Chang

Sales/MarketingCaroline Kuo

ProductionKevin Guo

RDLandau Chang

QualityJoe Lo

ProcurementJohnson Tsai

ManagementAdam Lee

SCMLinda Lin

ACAP

Jerome Kuo

AOM

Hanlim Lee • AOM: Advanced oscillators and modules• ACAP: TXC-Automotive Crystal Application Products• SCM: Supply Chain Management

5

Headquarter - Taiwan Taipei

Factories(2)- Taiwan Ping-ChengChina Ningbo

Sales FAEs(10) - Taiwan TaipeiChina Shanghai, Suzhou, Shenzhen, WuhanUSA LAJapan Yokohama, OsakaEuropeSingapore

Distributors(12)- Europe-UK, Germany………

Reps(8)- Korea, India, Mexico…….

6

Sales & MarketingSales & Marketing

7

Caroline KuoAVP

PCAlice Han

NetworkingJean Jen

Global Peggie Hsu

MobileBob Tsai

LA Lou Lee

ShanghaiGilbert Chou

SuzhouJeff Lin

ShenzhenSean Huang

JapanAndy Ishida

Director

USLou LeeDirector

China Alex KuoDirector

YokohamaAndy Ishida

* S/I/D: Storage/Image/Digital Camera

OsakaIchiro Yamanouchi

SingaporeMike ReyesManager

ConsumerRich Cheng

Industry Sales (Market Segment)

Alex KuoDirector

Branch Office

Product MarketingKris Chen

FAEPatrick Lin

Business DevelopmentJacky Chen

Sales OrganizationSales Organization

AOMHanlim Lee

ACAP Jerome Kuo

Projects Wuhan

Sean Huang

EuropeMichele Aquaviva

Director

8

Business ModelBusiness Model

9

Operating Revenue Operating Revenue

(Unit: Millions of Dollars)

31%19% 22%

40%20%

18% 5%

25%

10

Worldwide RankingWorldwide RankingWorldwide Revenue of the Top Crystal and Oscillator Suppliers (Unit: Millions of Dollars)

* Data Courtesy of CS & A

2007 2008 2009 2007 2008 2009 (07-08) (08-09) 2008 2009Change Change Market Market

% % Share Share1 1 1 Epson Toyocom 656 675 641.2 2.90% -5.01% 19.90% 22.1%

2 2 2 NDK 649 571 459.1 -12.02% -19.60% 16.90% 15.8%

3 4 3 Kyocera Kinseki 380 304 292.4 -20.00% -3.82% 9.00% 10.1%

4 3 4 KDS 293 327 271.3 11.60% -17.03% 9.70% 9.4%

6 5 5 TXC 192 222 240.5 15.63% 8.33% 6.60% 8.3%5 6 6 Vectron 206 200 147.9 -2.91% -26.05% 5.90% 5.1%

- 7 7 Hosonic - 119 97.3 - -18.24% 3.50% 3.4%

7 8 8 Rakon 109 96 81.5 -11.93% -15.10% 2.80% 2.8%

8 9 9 TEW 88 75 60.1 -14.77% -19.87% 2.20% 2.1%

11 11 10 Pericom 57 53 47.6 -7.02% -10.19% 1.60% 1.6%

9 10 11 Micro Crystal 62 56 47.5 -9.68% -15.18% 1.70% 1.6%

10 12 12 River 60 51 40.8 -15.00% -20.00% 1.50% 1.4%

13 13 13 Conner-Winfield 46 44 35.1 -4.35% -20.23% 1.30% 1.2%

12 14 14 Fox 51 40 34.4 -21.57% -14.00% 1.20% 1.2%

15 15 15 CTS 35 34 27.2 -2.86% -20.00% 1.00% 0.9%

14 16 16 MtronPTI 35 28 20.9 -20.00% -25.36% 0.80% 0.7%

Total Revenue 3,564 3,388 2,900 -4.94% -14.39%

Rank Rank Rank Revenue Revenue revenueCompany Name

11

Sales Revenue by Marketing FieldSales Revenue by Marketing Field

12

2009 Sales Revenue USD$ 240M

2010(F)Sales Revenue USD$ 300M

ACAP1% NETWORKING

27%

GLOBAL20%

MOBILE24%

PC16%

CONSUMER12% NETWORKING

28%

GLOBAL21%

MOBILE23%

PC16%

CONSUMER11%

ACAP1%

Products and TechnologyProducts and Technology

13

CapacityCapacity

14

Sales by Product CategorySales by Product Category

15

2009 Sales Revenue USD$ 240M

2010(F)Sales Revenue USD$ 300M

SeamSeamCrystalCrystal

51%51%

GlassGlassCrystalCrystal

22%22%

SMD CXOSMD CXO13%13%

DIPDIPCrystalCrystal

12%12%

TFTF2%2%

SeamSeamCrystalCrystal

45%45%

GlassGlassCrystalCrystal

25%25%

SMD CXOSMD CXO21%21%

DIPDIPCrystalCrystal

7%7%

TFTF2%2%

Crystal by Package Size

Seam Type Common Frequency RangeCommon Frequency Range

16

1.6x1.2(8Q)

1.6x1.22.5x2.0

2.0x1.6(8Y)

Glass Type

3.2x2.5(7V)6x3.57x58x4.5(6X) 5x3.2(7A)

Dip Type

2.5x2.0(8Z)3.2x2.5(7M)6x3.5(6V)7x5(6P)8x4.5 5x3.2(7B)

5x3.2(4 pads, 7Y)

2.0x1.6

Oscillator by Package SizeOscillator by Package Size

CXO

7x5(6U)14x9(7H) 5x3.2

VCXO

2.0x1.6(8N)2.5x2.0(8W)3.2x2.5(7X)6x3.57x5(7W)14x9(7J) 5x3.2(7C) 1.6x1.2

2.0x1.6(7Z)3.2x2.5(7Q) 2.5x2.0(7L)6x3.57x514x9 5x3.2

TCXO

1.6x1.2

(Sample Available)

17

Products and Technology StrategiesProducts and Technology Strategies

Automotive Products

Automotive Products

Wireless Communication

Wireless Communication

Mobile

Bluetooth

WLAN

PC / ConsumerPC / Consumer

Multimedia

Desktop/Laptop

Peripherals

Digital Imaging

Others

Compact Low Power

High Frequency

Low Jitter

High Reliability

Quartz SensorQuartz Sensor

Pressure

Gyroscopes

Gases

Non-Safety

TPMS

Matured products:Matured products:

Technology Integration

Safety

PNDPND

GPS

CrystalCXOTuning Fork

High

Stability

Advanced Oscillators and Modules (AOM):Advanced Oscillators and Modules (AOM):

TCXO

Networking INetworking I

WAN (FC/GbE/FCoE)

TelecomDatacom

Networking IINetworking II

MAN

Long Haul

High Frequency

High Stability

HF OscillatorHF VCOTCXO

Stratum 3 TCXOFX/CDROCXO

ZERO Defect AutomotiveProducts

18

2011 2013

19

20122010

SMD VCXO (CMOS) 2520(<55MHz, Fund)

SMD HF VCXO (PECL/LVDS)

SMD Tuning Fork 2012

High Frequency 500MHz SO (PECL/LVDS)622.08 MHz VCXO (PECL/LVDS)

Frequency Synthesizer

Ultra stable 7050(±0.28ppm)

OCXO(±10ppb)

Tuning Fork Oscillators Output Magnitude Adjustable

Miniaturization

Diversification

SMD TCXO 2016 (±0.5 ppm)1612(±0.5 ppm)

SMD HF CXO (CMOS/PECL/LVDS)

TSX

SMD Crystal 1210

5032(<200MHz, 3OT)7050(<700MHz, PLL-Any Rate)

3225(<200MHz, 3OT)

5032(<200MHz, Fund)7050(<700MHz, PLL-Any Rate)

2520(<50MHz)

7050(±0.14ppm)

OCXO(±1ppb)

Product Plan Product Plan

Quality AssuranceQuality Assurance

20

TXC Quality SystemTXC Quality System

TXC Quality System includes：Industry/Regulation Requirements ISO9000 RequirementsTS16949 RequirementsCustomer Specific RequirementsTXC Specific Requirements

Ref. Doc.: QSM-000000 Quality Manual

21

In accordance with the principles of customer orientation, problem prevention, and the pursuit of zero defect, TXC management team commits to deploy thequality policy.

Quality PolicyQuality Policy

22

HSF PolicyHSF Policy

TXC will continue to strive for manufacturing HSF products by using environmental friendly materials and non-contamination processes in order to meet the most rigid worldwide standards and the expectation of our customer.

TXC will continue to strive for manufacturing HSF products by using environmental friendly materials and non-contamination processes in order to meet the most rigid worldwide standards and the expectation of our customer.

23

The top of TaiwanThe top of Taiwan--YushanYushan

System CertificateSystem Certificate

PingPing--Cheng FactoryCheng Factory Ningbo FactoryNingbo Factory

OHSAS 18001:2007

ISO9001: 2008

ISO/TS 16949:2009

IECQ QC080000：2005

ISO14001:2004

EMSHSPMQMS

24

System CertificateSystem Certificate

PingPing--Cheng FactoryCheng Factory Ningbo FactoryNingbo Factory

ISO 9001:ISO 9001:20082008

ISO/TSISO/TS16949:200916949:2009

IECQIECQQC080000:2005QC080000:2005 ISO 14001:ISO 14001:

20042004OHSASOHSAS

18001:200718001:2007

25

Thank You!Thank You!Thank You!

26

AppendixAppendixManufacturing Process GuidelineManufacturing Process Guideline

27

Blank ProcessBlank Process

28

Wire Sawing

Quartz Bar

A1 2 34 5 67 8 90 EN

BCD

22.1372

Wafer Frequency Lapping

SMD Process and structureSMD Process and structure

IC Die Bonding

Wire Bonding

Blank Cleaning

Base Plating

Frequency Adj.

Final Testing

Marking

Taping

Seam Sealing

Mechanical Testing

Blank Auto-Mounting

Cry

stal

Osc

illat

or

Oscillator

40.000

TXC CM211 24.576

TXC CN001

Crystal

Metal Lid

Plated Blank

Ceramic Package

( top )

Ceramic Package

( Bottom )

Oscillation IC

29

AppendixQuality Assurance

AppendixQuality Assurance

30

Quality Assurance ProcessQuality Assurance Process

• New product development follows the development procedure to ensure the product quality level can meet or even exceed the customer requirement from initial design stage to production stage.

Phase 4Pilot Run Validation

Phase 5Mass Product &

Project Assessment

Phase 2Design &

Development

Phase 3Prototype Build

Verification

Initial PhaseApplication

Phase 1 Plan & Define

Voice of Customer

ProductAssurance

Plan

EvaluationTests

ReliabilityAssurance

Tests

On-goingReliability

Tests

ProductAudit

Reference Document : QSM-R&D001

• Extended frequency or specifications follow the PQSO procedure, based on the matured product platform, and to be monitored through the FTT status review to meet customer’s quick samples response and OTD for production.

31

Reliable QualityReliable QualityGPS time-base links to all frequency

measurement equipments.Database is conducted for MSA/GR&R

monitoring.

In house reliability lab provides fully support for reliability evaluation in different product phases.

In-house reliability test capabilities have been implemented both in Ping-Cheng and NingBo factories.

Pre-condiction:Ⅰ.Electrical characteristics test

Ⅱ.IR Reflow ,2XⅢ.Gross & FineLeak test

Ⅳ.Freq. & temperature test by 25

Thermal shock -55~125

Dwell:10 min, 100 cyclesMIL-STD-883E Method 1011

Sample size :20pcs

High temp bias85+-2 128hr

MIL-STD-883 Method 1005Sample size :20pcs

Temperature bias/ Endurance Temperature cycling performance Humidity performance Endurance

Moisturising85 , RH 85% , 168hrs

JEDEC JESD-A112/3Sample size :20pcs

Solder heatResistance,Reflow

2 times at 260IEC 68-2-20

Sample size :20pcs

Pressure Pot96hrs @ 120degC,

100%RH.JEDEC JESD22-A102.

Sample size :20pcs

Mechanical Endurance

Mechanical shock1,000G,0.5mSec.,3 times for

all 3 directionsMIL-STD-202F Method 213B

Sample size :20pcs

NO. TESTING FACILITY NAME SPECIFICATION

1 SOLDER OVEN Temp. Range :0 ~ 400

2 PRESSURE COOKER Storage Temp.:100 ~ 142.9, Humidity Range :75 ~ 100%RH, Pressure : 2.0kg/cG

3 HIGH/LOW TEMP. OPERATION Storage Temp.:-85 ~180

4 VIBRATION Acceleration:100G, Max Speed:110cm/sec,Amplitude:25mmp-p, Frequency Range:5~4000hz

5 HUMIDITY CHAMBER StorageTemp.:10 ~ 100,Humidity Range : 60 ~ 98%RH

6 ACTIVE AGING TEST Frequency : <256Mhz, Temp. : 0 ~ 125

7 HIGH TEMP. OPERATION Storage Temp.:0 ~225

8 DROP TEST Max Height : 200CM

9 PROGRAMING HUMIDITY CHAMBER Storage Temp.: -40~100,Humidity Range :10 ~ 98%RH

10 AGING OVENS Storage Temp.: 0~250

11 VACUUM DRYING OVEN Storage Temp.: 0~260

12 MECHANICAL SHOCK Max Pressure:10000G

13 THERMAL SHOCK CHAMBER (AIR TO AIR) Temperature Range: -90~250

14 THERMAL SHOCK CHAMBER (LIQUID TO LIQUID) Temperature Range:-55~125

15 BENDING TESTER RATED CAPACITY 50KGf

16 CENTRIFUGAL STRENGTH Acceleration:2000G

17 RANDOM VIBRATION Acceleration:44G, Amplitude:30mmp-p, FrequencyRange:2~2000Hz

18 PROGRAMING LOW/HIGH TEMP. CHAMBER Storage Temp.: -60~180,Humidity Range :10 ~ 98%RH

32

Other AppendixOther Appendix

33

Advanced Oscillators & Modules

34

OSC Oscillation Mode Freq. Range (MHz) Features Output Type PKG (mm)

X’tal(3rd Overtone)

40MHz~200MHzStability ±25ppm/±50ppm

Phase Jitter < 0.5pSOTR -40~85C

X’tal(PLL)

60MHz~700MHzStability ±25ppm/±50ppm

Phase Jitter < 0.7pSOTR -40~85C

Oscillator(Differential)

SAW(Fundamental/Divider)

150~700MHzStability ±50ppm/±100ppm

Phase Jitter < 0.5pSOTR -5~85C/0~70C

LVPECLLVDS

14*97*5

5*3.2

X’tal(Fundamental)

32.768KHz~40MHzOscillator(Single-End)

X’tal(3rd Overtone)

40MHz~200MHz

Stability ±25ppm/±50ppm1.8V~3.3V

OTR -40~85CCMOS

14*97*5

5*3.23.2*2.52.5*2.0

VCO Oscillation Mode Freq. Range (MHz) Features Output Type PKG (mm)

X’tal(Fundamental/Mesa)

1~200

X’tal(PLL/Multiplier)

50~700

Voltage Controlled Oscillator(VCXO/VCSO)

Absolute Pull Range ±50ppm3.3V

OTR -40~85C

LVPECLLVDSCMOS

SAW(Fundamental/Divider)

150~700

14*97*5

5*3.2

High Stability, High Accuracy, High Reliability, Low Phase NoiseHigh Stability, High Accuracy, High Reliability, Low Phase Noise, Low Jitter, Low Jitter

Base Station and Wired Network Applications

GSM/CDMA/WCDMA/TD-SCDMAWiMAX/LTE

ADSLFTTx

PicocellFemtocell

Public Switched Telephone NetworkBaseBase

StationStation Wide Area Network

SONET/SDH(Fiber optic)

High Stability, High Accuracy, High ReliabilityHigh Stability, High Accuracy, High Reliability

Oscillators (CMOS/LVPECL/LVDS)

Voltage Control Oscillators (CMOS/LVPECL/LVDS)

61.44MHz 62.5MHz 77.76MHz 10MHz 32.768MHz 38.88MHz

100MHz 106.25MHz 125MHz 52MHz 61.44MHz 77.76MHz

133MHz 150MHz 155.52MHz 122.88MHz 155.52MHz 156.25MHz

156.25MHz 166MHz 187.5MHz 491.52MHz 622.08MHz 669.33MHz

212.25MHz 250MHz 312.5MHz Customized frequency & specification is available

35

Storage, Server and Network Applications

High Frequency Oscillators High Frequency Oscillators Low Phase Noise and Low JitterLow Phase Noise and Low Jitter

CMOS/LVPECL/LVDS

61.44MHz 62.5MHz 77.76MHz

100MHz 106.25MHz 125MHz

133MHz 155.52MHz 156.25MHz

166MHz 187.5MHz 212.25MHz

250MHz 312.5MHz 320MHz

Customized frequency and specification are available

Servers SANSAN

Fiber ChanelGigabit Ethernet

Switch

Storage

Client

Low Frequency OscillatorsLow Frequency Oscillators

CMOS32.768KHz to 150MHz

Customized frequency and specification are available

LANLAN

Ethernet

36

TXC Automotive ProductsTXC Automotive Products

What is ACAP?TXC-Automotive Crystal Application Products

Design Concepts“Zero Defect” requirement.Extremely rigorous reliability requirements.Wide Operating Temperature Range- up to 150 degree Celsius.Environmental Policy - Lead Free/Green Products.Compact size trend for advance Auto-Electronics Applications.

Product Design Validation ManufactureFollow APQP of TS-16949Follow AECQ STD & CSR if neededPPAP report available

37

Direction in Automotive Industry Direction in Automotive Industry

38

Automotive

Safety

Applications

Automotive

Non-Safety

TPMS

AEC-Q004 ZERO DEFECTS GUILDLINEAECAEC--Q004 ZERO DEFECTS GUILDLINEQ004 ZERO DEFECTS GUILDLINE

Customer Special RequirementsCustomer Special RequirementsCustomer Special Requirements

TXC Zero Defect ProgramTXC Zero Defect ProgramTXC Zero Defect Program

Stability

Capability

ZERO Defect

Process

ZERO Defect

Process

Reliability

TECH - InnovationTECH TECH -- InnovationInnovation

39

Products & CapacityProducts & Capacity

40

Manufacture Sites Planned Capacity

ProductsTXC

ProductSeries

QualityLevel

Capability

Size/Package

Sealing/Type

Pins/Pads

PCF NGB ACAP Line

Crystal AS Grade 3 49US DIP 2 X

Crystal AT Grade 3 49US SMD 2 X

5,000K

Crystal AX Grade 2 8045 Glass 2 X

Crystal AA Grade 2 5032 Glass 2 X

Crystal AV Grade 3 3225 Glass 4 X

8,000K

Crystal AB Grade 1 5032 Seam 4 X

Crystal AM Grade 3 3225 Seam 4 X12,000K

Crystal 9H Grade 3 4115 32768K 2 X 2,000K

Oscillator AC Grade 3 5032 SMD 4 X

Oscillator AU Grade 3 3225 SMD 4 X

Oscillator AW Grade 3 2520 SMD 4 X

3,000K

TXC Automotive Products cover 90%+ of various packages in automotive industryTXC Automotive Products cover 90%+ of various packages in automotive industry

SMD Crystal Common Frequency RangeSMD Crystal Common Frequency Range

2.0x1.6

2.5x2.0

3.2x2.5

5.0x3.2

6.0x3.5

7.0x5.0

8.0x4.5

20010080 90706040 5030209 10875 64

For specific frequency and products, please see www.txccorp.com or contact sales

20~54 MHz

1.6x1.2 24~54 MHz

14~54 MHz

12~54 MHz

8~100 MHz

7~100MHz

6~100 MHz

6~80 MHz

41

2.0x1.6 Crystal2.0x1.6 Crystal

42

Electrical Specifications

Frequency Range 20~54MHz

Frequency Tolerance (at 25°C) ±10ppm, ±20ppm, ±30ppm, or Specify

Frequency stability Over Operating Temp. Range ±10ppm, ±20ppm, ±30ppm, or Specify

Operating Temp. Range -20~+70°C, -30~+85°C, or Specify

Shunt Capacitance (C0) 3pF Max

Drive Level 1~200µW (50µW typical)

Load Capacitance 8pF, 10pF, 12pF, or Specify

Aging (at 25°C) ±3ppm / year Max

Storage Temp. Range -40~+85°C

20~30 MHz 100Ω MaxESR

30~54 MHz 80Ω Max

1.6x1.2 Crystal1.6x1.2 Crystal



Frequency Tolerance (at 25°C) ±10ppm, ±20ppm, ±30ppm, or Specify

Frequency stability Over Operating Temp. Range ±10ppm, ±20ppm, ±30ppm, or Specify




Load Capacitance 8pF, 10pF, 12pF, or Specify




30~54 MHz 80Ω Max

43

3.2x2.5 Glass Crystal3.2x2.5 Glass Crystal



Frequency Tolerance (at 25°C) ±30ppm, or Specify

Frequency stability Over Operating Temp. Range ±30ppm, or Specify

Operating Temp. Range -10~+70°C, or Specify



Load Capacitance 8pF, 10pF, or Specify




13~54 MHz 60Ω Max

44

2.0x1.6 CXO2.0x1.6 CXO

Electrical SpecificationsOutput Type CMOS

Output Load 15pF, or Specify

Oscillation Mode Fundamental

Supply Voltage 3.3V(1.8V, 2.5V available)


Frequency Stability ±25ppm, ±50ppm



Voltage Vol(Max) / Voh(Min) 0.1VDD / 0.9VDD

Rise(Tr) / Fall(Tf) Time 8ns Max

Supply Current 15mA Max

Symmetry 45~55%

Start-up Time 5ms Max

Phase Jitter(12KHz~20MHz) 2ps Max


45

3.2x2.5 TCXO for GPS/Wimax Application3.2x2.5 TCXO for GPS/Wimax Application

Electrical SpecificationsOutput Type Clipped Sinewave

Output Load 10KΩ // 10pF


Supply Voltage 2.4V~3.5V


Clipped Sinewave Output Voltage 0.8 Vp-p Typical

Frequency Stability vs Temp. (-30~+85°C) ±0.5, ±1.0, ±2.0 ppm

vs Load(Load Varies ±10%) ±.0.2ppm Max

vs Supply Voltage(Vcc=Typical±0.1V) ±.0.2ppm Max

Frequency Tolerance at 25°C after 2 Reflows with Typical Applied to Auto Frequency Control Pin ±2.0ppm Max

Slope of Frequency Drift (min. of 1Frequency reading every 2°C) ±.0.1ppm/°C Max


Auto Frequency Control(AFC)Range ±8~±16ppm/V (Vcon ±1.0V)

Supply Current 2.0mA Max


Harmonics -5dBc Max

Phase Noise at 1KHz offset -125dBc/Hz

Aging (at 25°C) ±1ppm / year Max46

2.5x2.0 TCXO for GPS/Wimax Application2.5x2.0 TCXO for GPS/Wimax Application

47

Electrical SpecificationsOutput Type Clipped Sinewave

Output Load 10KΩ // 10pF


Supply Voltage 2.4V~3.5V


Clipped Sinewave Output Voltage 0.8 Vp-p Typical

Frequency Stability vs Temp. (-30~+85°C) ±0.5, ±1.0, ±2.0 ppm

vs Load(Load Varies ±10%) ±.0.2ppm Max

vs Supply Voltage(Vcc=Typical±0.1V) ±.0.2ppm Max

Frequency Tolerance at 25°C after 2 Reflows with Typical Applied to Auto Frequency Control Pin ±2.0ppm Max

Slope of Frequency Drift (min. of 1Frequency reading every 2°C) ±.0.1ppm/°C Max


Auto Frequency Control(AFC)Range ±8~±16ppm/V (Vcon ±1.0V)

Supply Current 2.0mA Max


Harmonics -5dBc Max

Phase Noise at 1KHz offset -125dBc/Hz


Content Company OverviewCompany Overview Quality ...Ⅲ.Gro s& FineL eak t t Ⅳ.F r eq & tmperatu t s by 25 Thermal shock-55 ~125 Dwell:10 m in, 100 c ycles MIL-STD-883E Method 1011

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