COMPREHENSIVE CHIPSET SYSTEM SOLUTION PORTFOLIO€¦ · SOLUTION PORTFOLIO. 2 3 APPLICATION APPLICATION SHAPING CONVERGED COMMUNICATIONS Leveraging over two decades of leadership

COMPREHENSIVE CHIPSET SYSTEMSOLUTION PORTFOLIO

2 3

APPLICATIONAPPLICATION

SHAPING CONVERGED COMMUNICATIONSLeveraging over two decades of leadership in semiconductor development and innovation in signal processing and wireless communications, DSP Group offers a comprehensive portfolio of System-On-Chip (SoC) solutions for consumer electronics (CE) end products at home, in the office, and on-the-go. Our complete solutions enable OEMs/ODMs to introduce innovative products that embed smart processing and converged communications, addressing the growing demand for more cost-effective design, innovative applications/technologies and low-power processing. Our complete SoC solutions include hardware development kits (HDKs), embedded software packages, and software development kits (SDKs) – everything you need to develop innovative, cost-effective and power-efficient products. Our advanced technologies are positioning DSP Group as an enabler in the burgeoning Internet of things, smart voice processing for mobile and wearable devices, and enterprise telephony markets.

SOLUTIONSDSP Group continues to play a key role in the rapidly-changing communications arena. OEMs/ODMs, telecommunication operators, and service providers use our market-leading solutions to rapidly bring to market innovative products for mobile, home, and enterprise environments. Complementing our traditional offering, our new solutions for mobile voice enhancement (HDClear™), home automation and security (ULE), and enterprise telephony (VoIP) are enabling our customers to develop a new wave of products by raising the bar in both voice processing and converged communications.

Cordless Phones

Leading the cordless phone market with over 70% market share, DSP Group continues to offer cost-effective, fully-featured and comprehensive solutions - delivering unrivaled range, unmatched listening experience and robust processing power, while enabling rich GUI functionality. For entry-level to high-end applications, our products feature the industry’s smallest footprint, the highest level of integration, and the lowest power consumption.

Our solutions include reference designs for the following applications:

• CAT-iq reference design with advanced GUI• DECT/CAT-iq module• Wireless audio and cordless headset• PSTN cordless phone• Visual Monitoring

Home Gateways, CAT-iq and FMC

DSP Group’s DCX DECT/CAT-iq SoC solution for home gateways and fixed mobile convergence (FMC) provides advanced DECT cordless capabilities including HD voice quality, multi call, multi-line, and ULE functionality. Our DCX solutions support multiple lines and handsets while complying with the CAT-iq 2.0, 2.1, 3.0 (SUOTA) and ULE standards.

Our solutions include reference designs for the following applications:

• DECT cordless phones• DECT/CAT-iq modules

Home Automation & Security

Based on best-in-class ULE technology, our home automation and security solutions offer low cost of ownership together with market-leading performance. Using a wide variety of sensors, ULE is an ideal short range wireless technology for home automation and security, safety, energy management, climate control, and healthcare applications connected via consumer premise equipment (CPE) such as home gateways and over the top boxes (OTT’s).

Our solutions include reference designs for the following applications:

• ULE nodes• ULE-enabled gateways

Enterprise VoIP

A top three VoIP silicon providers for enterprise voice, DSP Group offers comprehensive, best-in-class, yet highly-affordable VoIP solutions. Powering the full range of IP phones, analog telephone adapters (ATAs) and enterprise desktop IP phones, DSP Group’s scalable, green solutions are ideal for enterprise VoIP. They deliver enterprise-grade acoustics and exceptional HD voice quality, while featuring the industry’s lowest power consumption.

Our solutions include reference designs for the following applications:

• Mid-range to high-end IP Phones• Entry level IP phones• ATAs

HDClear™ – Voice Enhancement for Mobile

HDClear by DSP group is a revolutionary technology for eliminating background noise and enhancing voice quality. In mobile phones, wearable devices, PCs and tablets, HDClear suppresses background noise and promotes high speech intelligibility for unparalleled voice communications and user experience. HDClear also markedly enhances the accuracy and performance of automatic speech recognition (ASR) applications, voice commands and voice activation. HDClear is an ideal solution for mobile and wearable devices, bringing a better user experience to voice communications, command and activation – all with ultra-low power consumption.

Our solutions include reference designs for the following applications:

• Mobile phones• Wearable devices• Tablets• Cordless/Corded headsets

4 5

PRODUCTSPRODUCTS

PRODUCTSTargeting home, enterprise, and mobile markets, DSP Group’s comprehensive chipset portfolio reduces development risk costs, and shortens time to market. ODMs and service providers use our system-on-chips (SoCs), hardware reference packages (HDKs) and software development packages (SDKs) to rapidly and cost-effectively develop cutting-edge consumer electronics and business products.

CHIPSET PRODUCT FAMILIES

Home Enterprise Mobile

CordlessPhones

GatewaysHome Automation

& SecurityVideo and Multimedia

CommunicationsVoice Over IP

(VoIP)HDMobile

DCX (ARM9)DECT BB, DECT RFVoice AFE, PMU

DCX (ARM9)DECT BB, DECT RFPMU

DHX91 (ARM9)DECT ULE BB, DECT ULE RFVoice AFE, PMU

DMW96(Cortex-A8+ARM9)Video DEC/ENC, VoIP DSP,Security HW, 2D GPUWi-Fi: 802.11b/g/nOpt: DECT BBRF22 Wi-Fi RF

DVF99 (2xARM9)VoIP DSP, Voice AFE,Security HW, 2D GPUPMU,Opt: DECT BB

DBM11 (DSP)TL-DSP Noise Cancellation

DCE (DSP)DECT BBVoice AFE, PMU

RF19 DECT RFRF24 2.4DECT RF

DVF99 (2xARM9)DECT ULE BB,DECT ULE RFVoIP DSP, Voice AFE, PMU

DVFD8 (ARM9+DSP)VoIP DSP,Voice AFE, PMU, Opt: DECT BB DRF19: DECT RF,PMU

DBMD2 (DSP)TL-III-DSPNoise Cancellation

DCX (ARM9)DECT ULE BB,DECT ULE RFVoice AFE, PMU

DECT CORDLESS – DCE AND DCX FAMILIES

A market leader in DECT and next-generation CAT-iq cordless technology, DSP Group offers a wide range of cost-effective, highly-integrated SoC solutions. Delivering high-quality audio with notably low power consumption, our field-proven chipset solutions are ideal for totally integrated digital cordless telephony, home automation and security, and DECT-enabled gateways.

DSP Group’s cordless chipset solutions are available in two chipset families:

• The DCE family is a highly integrated, low-power ROM-based chipset solution, delivering enhanced audio and extended range for entry-level applications.

• The DCX family is a low-power, Flash and ROM-based chipset solution targeting mid-to-high-range cordless applications. Built on an open platform with powerful ARM9™ core processing capabilities, the cost-effective DCX family delivers unsurpassed telephony coverage and HD voice features.

DCE DCX

DE56 +RF19Z/RF24

DCE58 + RF19Z/RF24

DCX78/79 DCX81 DCXD1 + DRF1912

Function Baseband + RF Baseband + RF Single Chip Single Chip Baseband + RFAPU

Segment

Entry Level ✓ ✓ ✓

Mid-Range ✓ ✓ ✓

High-End ✓ ✓ ✓

Radio Frequency

DECT (EUR) RF19Z RF19Z ✓ ✓ ✓

DECT 6.0 (US) RF19Z RF19Z ✓ ✓ ✓

K-DECT RF19Z RF19Z ✓ ✓ ✓

J-DECT RF19Z RF19Z ✓ ✓ ✓

2.4 GHz RF24 RF24

Memory

External QSPI Flash ✓ ✓

External SRAM ✓

Internal RAM ✓ ✓ ✓ ✓ ✓

Internal Flash ✓

ROM ✓ ✓ ✓

Processing and Features

Processor TeakLite TeakLite ARM968 ARM926 ARM926

MIPS 74-110 MHz 74-99 MHz 124MHz 208MHz 208MHz

Cache I+D I+D

Hardware Accelerators ADPCM ADPCMADPCM

MLSE (only in DCX79)

JPEGDMA

ADPCMMLSE

JPEGDMA

ADPCM MLSE

Non-Blind Slot ✓ ✓ ✓

Integration

RF PA ✓ ✓ ✓ ✓ ✓

RF Switches ✓ ✓ ✓ ✓

14-Segment LCD ✓ ✓

I /O

Keypad ✓ ✓ ✓ ✓ ✓

GPIO ✓ ✓ ✓ ✓ ✓

UART ✓ ✓ ✓ ✓ ✓

USB ✓ ✓ ✓ ✓

PCM/IOM/TDM ✓ ✓ ✓ ✓

I2S ✓ ✓

SPI ✓ ✓ ✓ ✓ ✓

PWM ✓ ✓ ✓ ✓ ✓

External Bus 8-bit 16-bit

6 7

PRODUCTSPRODUCTS

DECT-ENABLED HOME GATEWAY (HGW) – DCX FAMILYDSP Group’s DCX chipset family for HGW and FMC provide advanced DECT cordless capabilities including HD voice quality, multi-line, multi-handset and ULE support, while integrating the most advanced CATiq 2.0, 2.1, 3.0 (SUOTA) stack.

The DCX family is a low-power Flash and ROM-based chipset solution targeting mid- to high-range cordless applications. Built on an open platform with powerful ARM9™ core processing capabilities, the cost effective DCX family delivers unsurpassed telephony coverage and HD voice features

DCX78/79 DCX81

Function Single Chip Single Chip

Standards

ULE ✓ ✓

DECT ✓ ✓

Radio Frequency

DECT (EUR) ✓ ✓

DECT 6.0 (US) ✓ ✓

K-DECT ✓ ✓

J-DECT ✓ ✓

Memory

External QSPI Flash ✓

Internal RAM ✓ ✓

Internal Flash ✓

ROM ✓

Processing and Features

Processor ARM968 ARM926

MIPS 124 MHz 208 MHz

Cache I+D

Non-Blind Slot ✓ ✓

Integration

RF PA ✓ ✓

RF Switches ✓

I/O

Keypad ✓ ✓

GPIO ✓ ✓

UART ✓ ✓

USB ✓ ✓

PCM/IOM/TDM ✓ ✓

SPI ✓ ✓

HOME AUTOMATION AND SECURITY – ULE (ULTRA LOW ENERGY) FAMILYDSP Group is leading the ULE revolution to meet the growing demand in the Home Area Network (HAN) market for efficient low-power, wireless solutions.

An extension of DECT, the new ULE standard enables development of multi-year, battery-run HAN applications that enjoy all of the advantages of DECT, such as interference-free connectivity and extended range. Leveraging its long-term technological and market leadership in DECT applications, DSP Group designed the architecture for ULE and is driving its adoption, together with the DECT Forum and the ULE Alliance.

DSP Group offers an advanced ULE family of chips, as well as a comprehensive ULE and HAN FUN (Transport and Application layer) protocol.

The DHX91 is a low-power chipset solution for home automation and security. Equipped with audio capabilities and a powerful ARM926™ processor, it implements hibernation features to deliver advanced ULE.The ULE base utilizes existing and proven cordless SoCs, functioning as a standalone ULE over the top box (DVF99) and embedded module for home gateways (DCX81).

Base Node

Function DVF99 DCX81 DHX91

Segment

ULE ✓ ✓ ✓

Radio Frequency

DECT (EUR) ✓ ✓ ✓

DECT 6.0 (US) ✓ ✓ ✓

K-DECT ✓ ✓ ✓

J-DECT ✓ ✓ ✓

Memory

Internal RAM ✓ ✓ ✓

External QSPI Flash ✓ ✓ ✓

Processing and Features

Processor 2 x ARM926 ARM926 ARM926

MIPS 2 x 400MHz 208MHz 208MHz

Cache I+D I+D I+D

Hardware Accelerators SecurityJPEG

ADPCMMLSE

JPEG ADPCM MLSE

Non-Blind Slot ✓ ✓

Hibernation ✓

Integration

RF PA ✓ ✓

RF Switches ✓ ✓

I /O

Keypad ✓ ✓

GPIO ✓ ✓

UART ✓ ✓

USB ✓ ✓

PCM/IOM/TDM ✓ ✓

I2S ✓ ✓

SPI ✓ ✓

PWM ✓ ✓

External Bus 8-bit

ULE I/O ✓

8

PRODUCTSPRODUCTS

9

ENTERPRISE VOICE – DVF FAMILY A top three silicon vendor for enterprise voice, DSP Group offers the DVF chipset family. Our DVF SoCs family is a comprehensive solution for developing affordable, scalable and green VoIP home and of¬fice products. DVF facilitates rapid introduction of embedded features into residential devices such as cordless IP and instant messaging (IM) phones. DVF enables development of low-power enterprise IP, analog terminal adapters (ATAs) and home VoIP phones that offer superb acoustic echo cancellation, high-quality HD voice, multi-line capabilities, and an enhanced user interface (UI). Built on an open platform with ARM processors running on Linux OS, DVF includes IPfonePro™, an extensive SDK for IP phones and ATAs.

DVF99, the latest member of the DVF family, provides outstanding cost/performance value for mid-range to high-end IP phones. Designed specifically to meet Tier 1 requirements, DVF99 fully complements existing DSP Group solutions, including DVFD818 VoIP processors for low- and mid-range applications, and the XpandR® media processor for video IP devices.

DVFD8187 + DAP19x2 DVFD8185 + DRF19x2 DVF9918 DVF9919

Function VoIP Processor + PMU + AFEVoIP Processor + PMU + AFE

+ RadioVoIP Processor + PMU

+ AFEHigh-end VoIP Processor +

PMU + AFE

Segment

IP Phone ✓ ✓ ✓ ✓

ATA ✓ ✓ ✓ ✓

Cordless IP Phone, ATA ✓ With external RFIC With external RFIC

High-End IP Phone, ATA ✓

VoIP Codecs

# of Channels 4~6 4~6 6 >8

Codec TypesG.711, G.722, G.723.1,

G.729A/B, iLBC, G.722.2G.711, G.722, G.723.1,

G.729A/B, iLBC, G.722.2

G.711, G.722, G.723.1, G.729A/B, iLBC, G.722.2

and more

G.711, G.722, G.723.1, G.729A/B, iLBC, G.722.2 and

more

MCU

Processor ARM 926 ARM 926 ARM 926 ARM 926

MIPS 220 MHz 220 MHz 400 MHz 600 MHz

DSP / Co-Processor

Processor R.E.A.L R.E.A.L ARM 926 ARM 926

MIPS 120 MHz 120 MHz 400 MHz 500 MHz

App Memory

External RAM SDRAM SDRAM SDRAM DDR2, DDR3, mDDR

External Flash SPI, NAND SPI, NAND QSPI, NAND QSPI, NAND, Parallel NOR

I/O

Ethernet RMII RMII RMII, RGMII MII, RMII, RGMII

Keypad 8x8 8x8 7x8 10x8

GPIO ✓ ✓ ✓ ✓

UART ✓ ✓ ✓ ✓

USB Device (FS) Device (FS) Host/Device (FS) OTG (FS/HS)

PCM/IOM/TDM ✓ ✓ ✓ ✓

I2S ✓ ✓ ✓ ✓

SPI ✓ ✓ ✓ ✓

PWM ✓ ✓ ✓ ✓

DVFD8187 + DAP19x2 DVFD8185 + DRF19x2 DVF9918 DVF9919

Advanced Features

Crypto Engine Software Software Hardware Hardware

Secured Boot ✓ ✓

GPU 2D

Touch Screen ✓ ✓ ✓

Color LCDC External 1/8/16-bit I/F External 1/8/16-bit I/F External 1/8/16-bit I/F Embedded WVGA LCDC

PMU

Voltage Converters 1.2V, 1.8V & 3.3V DCDC/LDO 1.2V, 1.8V & 3.3V DCDC/LDO1.2V, 1.8V & 3.3V DCDC/

LDO1.2V, 1.8V & 3.3V DCDC/LDO

AFE

Audio In3 MIC Amps

2 ADCs3 MIC Amps

2 ADCs3 MIC Amps

2 ADCs3 MIC Amps

2 ADCs

Audio Out3 SPK Amps

2 DACs3 SPK Amps

2 DACs3 SPK Amps

3 DACs3 SPK Amps

3 DACs

Speaker Amp 1.1 W 1.1 W 1.2 W 2 W

Radio

DECT, DECT 6.0, J-DECT, K-DECT

✓ RF19Z RF19Z

2.4 GHz RF24 RF24

10 11

PRODUCTSPRODUCTS

CONNECTED MULTIMEDIA SCREENS – XpandR FAMILY

DSP Group’s Xpander family facilitates cost-effective development of multimedia terminals. Optimized for real-time communications, our XpandR multimedia chipset family, powering Android-based multimedia home phone and supports both Wi-Fi and DECT. A highly integrated, dual-core application processor with wireless connectivity, XpandR features an HD video decoder and encoder, 3D graphics, a security processor, Wi-Fi and DECT basebands. Provided with a form-factor reference design and an Android-based SDK with reference applications, XpandR is a complete system solution for multimedia phones, tablet/media phones and video phones.

DMW74 DMW96 RF22 RF19Z DP52

Function Processor ProcessorWi-Fi

TransceiverCordless

TransceiverPMU

Generation

XpandR II ✓ RF52 RF19C ✓

XpandR III ✓ ✓ ✓ ✓

CPU

Main ProcessorARM9

@240 MHzARM Cortex™-A8

@1 GHz

Co-ProcessorDSP TL

@160 MHzARM9

@300 MHz

Memory

Flash NAND NAND, eMMC

External DRAM mSDRAM DDR2, LPDDR2

Hardware Integration

Video ENC 720p

DEC 1080p

GPU GC400

12M Pol/S

Wi-Fi 802.11a/b/g 802.11a/b/g/n

DECT ✓ ✓

RF PA ✓ ✓

RF Switches ✓ ✓

Radio Frequency

DECT (EUR) ✓

DECT 6.0 (US) ✓

K-DECT ✓

J-DECT ✓

2.4 GHz ✓

I /O

UART 2 3

USB 1 x USB2.0 2 x USB2.0

TDM 2 3

MII ✓ ✓

SPI ✓ ✓

PWM ✓

Power

DC2DC 2

LDO 6

Charger ✓

HDClear™ – VOICE ENHANCEMENT FOR MOBILE – DBM FAMILYDSP Group’s DBM family of SoCs offers the ultimate noise-cancellation experience to users of mobile phones, wearable devices, tablets, DECT wireless and wired headsets, and fixed-line corded or cordless phones.

The DBM chipsets are available in small footprints and embed DSP Group’s advanced HDClear™ technology. DBM chipsets dramatically suppress background noise for far-end users, enhance privacy for near-end speakers, and maximize performance of Automatic Speech Recognition (ASR) engines.

The DBMD2 chip is DSP Group’s most advanced solution for voice communications. It supports a rich set of voice processing features to significantly enhance voice call quality, intelligibility and speech recognition accuracy, including:

• Noise suppression for the far-end listener• Noise reduction and speech conditioning for the near-end listener• Acoustic Echo Cancellation (AEC)• Flexispeech – variable speech playback for the hearing impaired • Flexible Listening Experience (FLE) – automatic adjustment of incoming

voice when the near-end listener is in a noisy environment• Ultra-low power voice activation and voice command

DBM11 DBMD2

Function

Far-end noise cancellation ✓ ✓

Near-end noise reduction ✓ ✓

Maximized ASR ✓

AEC ✓

FLE ✓

Voice activation and voice commands ✓

Segment

Mobile phone ✓

BT headset ✓ ✓

Cordless ✓ ✓

headset/handset ✓ ✓

Wired headset ✓

Tablets ✓

Wearable devices

Processor 16 bits 32 bits

Program memory ROM RAM

App Memory

External EEPROM (optional) Serial External Serial Flash

I/O

GPIO ✓ ✓

UART ✓ ✓

PCM/TDM ✓ ✓

I2S ✓ ✓

I2C ✓ ✓

SPI ✓ ✓

SLIMbus ✓

Advanced Features

Microphones Bone Conduction and two acoustic VSensor™ and two acoustic MICs

Noise Reduction ✓ ✓

Background Sound Replacement ✓ ✓

Power Supplies

Voltage 1.8V, 3.3V 1.2V, 1.8V

AFE

Audio In 3 Mics, 3 ADCs ADC for VSensor

Audio Out 1 Headphone AMP, DAC Digital

12 13

TECHNOLOGIESTECHNOLOGIES

CAT-iqDSP Group has been deeply involved in all stages of defining CAT-iq since its inception, including participating in the DECT Forum and defining ETSI DECT NG specifications. DSP Group is also an active member of the Home Gateway Initiative (HGI), and supports CableLabs’ specification activities.

VoIP DSP Group is recognized for its worldwide leadership in VoIP, maintaining the fastest growing market share in this domain and offering the advantage of seamless scalability to DECT. DSP Group provides best-in-class audio quality and cost-effective solutions for low-to-mid-range VoIP applications, which can be seamlessly extended to high-end applications.

VideoDSP Group’s embedded video technology addresses the latest video requirements for multimedia devices, applying multi-format decode, encode, pre- and post-video processing for video up to 1080p. Our comprehensive high-end video solution provides state-of-the-art video quality.

Wi-Fi DSP Group’s XpandR®, the only SoC solution that supports both Wi-Fi and DECT, showcases our extensive experience in both traditional and emerging wireless technologies. XpandR is certified for 802.11a/b/g/n, including WPS, WPA2, WMM-PS, enabling connections among Wi-Fi devices anywhere and anytime, whether or not they connect to a traditional Wi-Fi network.

Radio Frequency (RF)DSP Group is a leading provider of RF chips, covering all RF bands used in cordless and wireless applications. These bands include 1.7 GHz-1.9 GHz (DECT for the EU, US, LATAM Japan-DECT and Korea), 2.4 GHz (EDCT/WDCT and FHSS DECT), 5.8 GHz (EDCT/WDCT), and Wi-Fi (2.4 GHz and 5 GHz). Designed with CMOS technology, DSP Group’s new generation of chips incorporates all required RF functionality on a single chip, including RF transceiver, LNA, PA and channel filters.

TECHNOLOGIESDSP Group offers a broad portfolio of integrated technologies for diverse voice, audio, data and multimedia applications. Maintaining extensive expertise and a leading position in DECT/DECT6.0/JDECT, CAT-iq 1.0/2.0/2.1/3.0 (SOUTA), 2.4GHz, PSTN, Wi-Fi, and VoIP. We also leverage 25 years of audio processing experience to an array of new technologies that are shaping converged communications at home, in the office, and in mobile devices. These advanced technologies include a revolutionary HDClear algorithm for the mobile devices and Ultra Low Energy (ULE) and VoIP.

Voice and AudioProviding the wireless industry’s most advanced chipset solutions, DSP Group offers innovative voice/audio technologies and advanced algorithms that extend the effective range of clear voice communications for CAT-iq/DECT and worldwide DECT cordless telephones - without increasing power and emission levels. In addition, we implement noise-reduction, acoustic echo cancellation and voice-enhancement algorithms that enhance voice intelligibility and provide a markedly better overall user experience.

ULE (Ultra Low Energy)DSP Group is spearheading development of ULE for home area network (HAN) applications, including home automation & security, safety, energy management, climate control and healthcare. Responsible for designing the ULE architecture that implements Hibernation features, we are driving ULE’s adoption by the DECT Forum, ETSI and the ULE Alliance.

Voice Intelligibility and Noise ReductionHDClear™ technology eliminates the traditional tradeoff between voice intelligibility and noise reduction. It delivers measurably higher and more consistent voice quality and intelligibility to mobile users, even in noisy surroundings. HDClear low power and small footprint enable easy integration in mobile and wearable devices.

HDClear technology extends voice data acquisition from multi microphones. After the combined input is processed, our Vocal algorithm is applied to the acquired data to enable diverse voice processing tasks such as: echo and background noise cancellation, maximized effectiveness of automatic speech recognition (ASR) engines, loudness equalization, and general voice enhancement.

Cordless TelephonyThe world leader in cordless telephony for over two decades, DSP Group promotes both traditional and next-generation cordless technologies. The company is an active member of the DECT Forum, holding a position on the board and chairing a number of key working groups (WGs), including WG USA, WG Marketing, WG Japan and WG Ultra Low Energy. This involvement is complemented by our active participation in other relevant Forum working groups, as well as in the ETSI Technical Committee for DECT (TC DECT).

14

CUSTOMERS

CUSTOMER ADVANTAGES AND BENEFITS

Advantages Benefits

Reflecting DSP Group’s two decades of leadership in wireless semiconductor development, our offering features a number of advantages for CE manufacturers and OEMs:

• Comprehensive product portfolio of complete reference designs of HW, SW and System

• Mature, field-proven chipset solutions Highly integrated SoCs

• Operational excellence and outstanding customer support

• Broad international standards compliance and support

• Green, low-power offering

DSP Group’s chipset solutions offer CE manufacturers and OEMs a range of benefits to help them better compete in today’s rapidly-evolving residential communications market:

• Low development effort, risk and cost• Fast time to market• Small design footprint • Easy customization and integration of features• Supply reliability• Innovative revenue-generating applications• Expanded market opportunities

CustomersDSP Group is a customer-centric company that proactively partners with our consumer electronics (CE) manufacturer customer base. We also team with service providers who are focused on bringing innovative residential and enterprise converged communications solutions to market. Based on a deep understanding of market needs, we encourage customer involvement in our roadmap development, and offer customers access to our internal R&D resources. A reliable long-term industry supplier, DSP Group maintains a proven track record of operational excellence and successful delivery. With offices across Asia, Europe and North America, we provide our customers with outstanding local service and support worldwide.

Key Customers Key Operators

16

DSP Group®, Inc. (NASDAQ: DSPG) is a leading global provider of wireless chipset solutions for converged communications. Delivering semiconductor system solutions with software and reference designs, DSP Group enables OEMs/ODMs, consumer electronics (CE)

manufacturers and service providers to cost-effectively develop new revenue-generating products with fast time to market. At the forefront of semiconductor innovation and operational excellence for over two decades, DSP Group provides a broad portfolio

of wireless chipsets integrating DECT/CAT-iq, ULE, Wi-Fi, PSTN, HDClear™, video and VoIP technologies. DSP Group enables converged voice, audio, video and data connectivity across diverse mobile, consumer and enterprise products – from mobile devices, connected multimedia screens, and home automation & security to cordless phones, VoIP systems, and home gateways. Leveraging industry-leading experience and expertise, DSP Group partners with CE manufacturers and service providers

to shape the future of converged communications at home, office and on the go.

For more information, visit www.dspg.com.

Copyright © 2014, DSP Group, Inc. All rights reserved. DSP Group, Inc. and DSP Group Logo are trademarks of DSP Group, Inc. Other third party trademarks are property of their respective owners. All product information, dates and figures are not warranted as accurate or complete, and may be revised based on further information without notice.

D S P G r o u p , I n c . 1 6 1 S S a n A n t o n i o R d , S u i t e 1 0 , L o s A l t o s C A 9 4 0 2 2T e l : + 1 - 4 0 8 - 9 8 6 - 4 3 0 0 | F a x : + 1 - 4 0 8 - 9 8 6 - 4 3 2 3 | w w w . d s p g . c o m | i n f o @ d s p g . c o m