Comppyany Profile of 2016 - UnisonicComppyany Profile of 2016 公司簡介公司簡介 UUSOC C OOGSCO,NISONIC TECHNOLOGIES CO., LTD. 友順科技股份有限公司友順科技股份有限公司

Company Profile of 2016Company Profile of 2016p y公司簡介

p y公司簡介

UNISONIC TECHNOLOGIES CO., LTD.UNISONIC TECHNOLOGIES CO., LTD.UNISONIC TECHNOLOGIES CO., LTD.UNISONIC TECHNOLOGIES CO., LTD.U SO C C O OG S CO ,U SO C C O OG S CO ,

友順科技股份有限公司友順科技股份有限公司

U SO C C O OG S CO ,U SO C C O OG S CO ,

友順科技股份有限公司友順科技股份有限公司

http://www.unisonic.com.tw

Company Snapshotp y p

Founded: Jan 1990

T i i T i (HQ)

Global Operations:

Taipei, Taiwan (HQ)ChinaJapanJapanKorea

C it l US$ 10 illi (TWN)Capital : US$ 10 millions(TWN)

Employees: Headquarters: 230 persons,50 R&DEmployees: q pWorldwide: 2,200 persons, 200 R&D

2013 Revenue: US$ 256 Million2013 Revenue: US$ 256 Million

Milestone

1990 U i i T h l i C Ltd t bli h d1990 - Unisonic Technologies Co., Ltd was established.

1993 - Hong Kong Office : Union Win Enterprise Co., Ltd. was established.- Affiliated Company : YouWang Electronic Co., Ltd was established.Affiliated Company : YouWang Electronic Co., Ltd was established.

1995 - FuZhou Factory : FuShun Microelectronics Co., Ltd was established.

1996 D D F t A Sh Mi l t i C Ltd t bli h d1996 - DanDong Factory : AnShun Microelectronics Co., Ltd was established.

1999 - ShenZhen Branch : Unisonic Technologies Co., Ltd was established.- DaLian Branch : LianShun Electronics Co., Ltd was established.,

2000 - Korea Branch : Unisonic Technologies Co., Ltd was established

2001 - WuXi Branch : YouLi Electronics Co., Ltd was established.- FuZhou Factory : HeShun Microelectronics Co., Ltd was established.

2002 - XiaMen Branch : YuanShun Technologies Co., Ltd. Was established.2002 XiaMen Branch : YuanShun Technologies Co., Ltd. Was established.- UTC ISO9001:2000 Certification- Beijing Branch : LianShun Electronics Co., Ltd was established.

Milestone

2003 G Zh B h t bli h d2003 - GuangZhou Branch was established.

2004 - TienJing Branch : LianShun Electronics Co., Ltd was established.

2005 - SuZhou Branch, QingDao Branch was established.

2006 - FuShun Semiconductor Manufacturing, assembly line was established.

2007 - UTC ISO14001:2004 Certification.

2011 - XiaMen wafer fab put into pilot run.

2012 Xi M f f b t M P d ti2012 - XiaMen wafer fab put Mass Production.

2013 – WuXi & Shenzhen design center was established.

2014 – XIAn & ChengDu design center was established.

Corporate Structurep

DA LIAN BRANCH / R&D CENTER

DAN DONG FACTORY

BEIJINGBEIJING

QINGDAU

KOREA

WUXI

SUZHOU

.

CHENGDU

FU ZHOU FACTORYHE SHUN FACTORYFU SHUN SEMI MFG

JAY SHUN FACTORY

GUANGZHOU

JAY SHUN FACTORYYUAN SHUN BRANCHR&D CENTER

SHENZHEN

Organization Structure of UTC

Unisonic Technologies Co Ltd (TPE HQ)

O ga at o St uctu e o U C

Design

Unisonic Technologies Co., Ltd. (TPE HQ)

LianShun Electronics Co., Ltd. (DaLian)Design

YuanShun Technologies Co., Ltd. (XiaMen)

WuXi/Shenzhen/ChengDu/XiAn Design center.

UTC GWafer Fab

FuShun Microelectronics Co., Ltd. (FuZhou)

UTC Group JaySun Microelectronics Co., Ltd (XiaMen)

Packaging & Testing FuShun Semiconductor MFG Co., Ltd. (FuZhou)Testing

Marketing &

Unisonic Technologies Co., Ltd. (TPE HQ)

i i h l i C td (Sh h )Marketing &Sales Unisonic Technologies Co., Ltd. (ShenZhen)

Unisonic Technologies Co., Ltd. (QuanZhou)

OrganizationO ga at o

President Office CEO Business Operation Center

Wafer Business Wafer Business DivisionDivision

International International Business DivisionBusiness Division

Greater China Greater China DivisionDivision

General General ManagerManager

Marketing Korea Business

Sales Dept.1 R&D Finance

Engineering Oversea Dept.1

Sales Dept.2 TMD MIS

Oversea Dept. 2

Sales Dept.3 PC/MC QRA

DistyBusiness

Human Resource Marketing

RevenueRevenue

O ( O S S )##

##

## 256 682 261 816

301,088300,000

AM OU N T ( T H OU SAN D U SD )

##

225,225243,243

255,405 256,682 261,816

240,198

200,000

250,000

143,400 150,000

165,000150,150

180,180

150,000

200,000

50 000

100,000

0

50,000

2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016(F)2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016(F)

Core CompetenciesCo e Co pete c es

IDM Provider

Competitive Hi h Q lit

Customer’sSatisfaction

pCost High Quality

Satisfaction

Short Lead-Time Strong R&D

Turn-Key SolutionSolution

Production Flow

Yes

No

R&D Center

Location: Location: Taipei Headquarters (UNISONIC TECHNOLOGIES CO., LTD.) Da-Lien Lien-Shun Electronics CO., LTD) W Xi Y Li Mi l t i CO LTD Wu-Xi Yu-Li Microelectronic CO., LTD Xia-Men Yuan-Shun Technologies CO., LTD

- Xia-Men Yuan-Shun Technologies CO., LTD- Xi-An Branch, Xia-Men Yuan-Shun Technologies CO., LTD- Cheng-Du Branch, Xia-Men Yuan-Shun Technologies CO., LTD

Staff: Staff: above 250 persons

Capability: Circuits Design(BCD/BiCMOS/CMOS/DMOS) Circuits Design(BCD/BiCMOS/CMOS/DMOS) Pattern Layout Process Development(CMOS 0.35um/Bipolar 0.8um…)

New Product Development Flowp

Wafer Fabs

Fu Zhou Factory- Fu Shun Microelectronics Co.,Ltd.- 4”/6” with CMOS/Bipolar/BiCMOS- 50,000 for 4”, 50,000 for 6”/max, , , /

Xia Men Factory- Jaysun Semiconductor Manufacturing CO., Ltd.6” CMOS/BiCMOS/DMOS- 6” CMOS/BiCMOS/DMOS

- 0.35um process0 000 f /- 50,000 wafers/max

Wafer Process RoadmapWafer Process Roadmap

Discrete TR

SS

SS Bipolar IC

OC

ESO

CES BiCMOS

BCD

PRO

PRO

CMOS

2um 1.2um 1.0um 0.8um 0.5um 0.35um 0.25um

IC Packagingg g

FuZhou Factory:- Fushun Semiconductor Manufacturing Co LtdFushun Semiconductor Manufacturing Co., Ltd.- 300M units produced per month

CP/Assembly/Final Test- CP/Assembly/Final Test- THD/Leaded SMD/Leadless packages

Process:- Process:* Die attach: Epoxy/Eutectic/Solder

* Wire Bonding: Au/Cu/Al/Ag wire* Wire Bonding: Au/Cu/Al/Ag wire* Halogen free* ISO9000/ISO14000 C tifi ti* ISO9000/ISO14000 Certification.

Package Portfoliog

Through Through Hole Hole

DIP SDIP H/SIP

TO-3PxHole Hole Device Device ZIP

TO-220-x

O 26/S

TO-230

TO-202

TO-220FxTO-262

TO-247

TO-126C

SIP-3/SIP-4

SOP

TO-251

H/SSOP

TO-92 family

H/TSSOP

TO-126/S

age

Size

TO 202

MSOP

TO 126C

QFN

Surface Surface Mount Mount

TO-263

TO-252x

SOT-223 SON

Pack

aMSOP

SO 23SMB

SMC

TO-277A

ou ou DeviceDevice

Tiny DFNSOT-23/5/6

SOT-89

SOT-7x3SOT-5x3

VSOT

VSONSOT-3x3

WLCSP

SOD-523

SOD-323

SOD-123SMA

SMB

SOT-113/s

Thin/Shrink/Leadless

QRA SystemQ y

Quality Reliability & Assurance

Quality Control Quality Assurance

IQC OQCIPQC QS VQMQEIQC

▪ ISO system▪ RoHS▪ DCC

OQCIPQC QS VQMQE

▪ Reliability▪ FA▪ Calibration

▪ RMA▪ Supplier

management

▪ OQC- Visual

Mech

▪ In Process Control1st Shot

▪ Wafer▪ ICs

Visual ▪ DCC▪ Customer

Audit Support

▪ Self Audit

▪ Calibration▪ Correlation▪ Customer

Sample▪ SPC

management-Qualification-Audit

- Mech.- Electrical▪ SPC

- 1st Shot- Visual- Mech.- Electrical▪ Final QC

SPC & C k

- Visual- Mech.- Electrical▪ Taping▪ SPC

▪ SPC & Cpk

Quality Assurance FlowQ y

Customer Sales Dept. Planning Dept. R&D Dept. EngineeringDept.

Manufacturing Dept. QA Dept.

Needs Market Product Planning

Planning Stage

Design Stage

Product Planning Review

Determination of target specifications

Development Plan

Development Design

Prototype Manufacture

Stage

Design Review

Prototype Manufacture

Characteristics EvaluationReliability

Evaluation

Stage

Mass

Quality Certification

Design Verification

Order Reception

Sales Plan

Materials Purchasing

Production Plan

Shi i Pl

Material Incoming

Wafer ProcessMass Production

Stage

Shipping Plan Wafer Process

Assembly Process IPOC

Final InspectionQAT

OQC

Inventory

ShippingAcceptance by

customer

18Usage Stage

customer

Trouble

Response

Complaint Reception

Reception

Investigation, Analysis and Corrective Action

Reliability Capability

Test Item Test Condition Reference S S Criteria

y p y

Test Item Test Condition Reference S.S Criteria

Pre-ConditionBake 125oC / 24 hrsSoak 60oC/ 60% RH/ 40 hrsIR Reflow 3 cycles

J-STD-020 180 0-Acc1 Rejy

High Temp Storage Life Test (HSLT) 150oC , 168(500/1000) hrs JESD22-A103 45 0-Acc1 Rej

121oC RH: 100% 2 ATM 96 (168) 0 AccPressure Cooker Test (PCT) 121oC, RH: 100%, 2 ATM, 96 (168) hrs JESD22-A102 45 0-Acc

1 Rej

Temperature Cycle Test (TCT) -65oC ~150oC / 30min, 100(500/1000) cycles JESD22-A104 45 0-Acc

1 Rej

High Temp High Hum. Storage Test (HTHH)

85oC, 85% RH,168(500 /1000) hrs JESD22-A101 45 0-Acc

1 Rej

0 AccSoldering Heat Test (SHT) 260±5oC, 10 sec JESD22-B10 45 0-Acc1 Rej

Solderability Test (SOT) 245±5oC, 5±0.5 sec JESD22-B102 10 0-Acc1 Rej

Electrostatic Discharge Test (ESD) HBM Mode≧ 2000 VMM Mode≧ 200 V

JESD22-A115JESD22-A114 3 0-Acc

1 Rej

Reliability Capability y p y

Test Item Test Condition Reference S.S Criteria

For IC -High Temp Operation Life Test (HTOL)

VCC(Max) x 1.1Temperature：85 or 125oC 168 (500/1000) h

JESD22-A108 22 0-Acc1 RejHigh Temp Operation Life Test (HTOL) (500/1000) hrs 1 Rej

For MOSFET / HV BJT -High Temperature Reverse Bias

BV(Max) x 80%Temperature：125oC JESD22-A108 45 0-Acc

1 Rejg p(HTRB)

p168 (500/1000) hrs 1 Rej

For TR or MOSFET -i i i

85oC, 85% RH,( ) % ( ) 0-AccHigh Temp High Hum. Reverse Bias

Test (H3TRB)BV(Max) x 80% (Max 100V)168 (500 /1000) hrs

JESD22-A101 45 0 Acc1 Rej

Product Tree

i IC

IGBT MOSFETPWM

C t llLow-Dropout

R l t

Discrete IC

IGBT

BJT

MOSFET

JFET

Controller

DC/DC Converter

Regulator

Li-Battery ProtectionBJT

SCR

JFET

Diode

Converter

Power Factor Corrector

Protection

Reset / Supervisory IC

TRIAC TVS

Corrector

LED Driver

Supervisory IC

Voltage / CurrentControl

Hall Sensor Logic Family

Op Amp / Audio Amp Other (ASIC…)

Product - IC

Linear Regulator Low Dropout Linear Regulator

Power Management

High-Speed MOSFET Driver AC-DC/DC-DC LED Lighting Driver Low Dropout Linear Regulator

DDR Termination Regulator Shunt Reference Regulator Step Down DC-DC Converter and Controller

AC DC/DC DC LED Lighting Driver Supervisory Circuit Voltage Detection and System Reset IC Power Switch

Step-Up DC-DC Converter and Controller Voltage mode PWM Controller Current Mode PWM Controller Green Mode PWM Controller (SSR/PSR)

Power Factor Control Li-Battery Protection or Charger IC FET Bias Controller Combo IC (CC+CV) Green Mode PWM Controller (SSR/PSR)

Green Mode PWM Power Switcher (SSR/PSR) FET Bias Controller

Combo IC (CC+CV) Inverting DC-DC Converter

Amplifier / Comparator

Audio Amplifier Audio Related Controller

Analog Switch

Video Signal Switch Analog Multiplexers, Demultiplexer IC

Operational Amplifier Voltage Comparator

g p p

Product - ICProduct IC

Motor Controller IC U74 HC/HCT Family

LogicSpecial Special Application ICIC

Interface and Driver Circuit Telecommunication Circuit Darlington Driver Melody IC

/ y U74 AC/ACT/AHC/AHCT Family U74 LV/LVC Family U74 AUP/AUC Familyy

Alarm /Sound Generator IC Timer IC Remote Controller IC Mouse & Keyboard Controller

U74 CBT/CBTLV Family High Voltage UCD40xx series

Mouse & Keyboard Controller Christmas Lamp Controller Television Circuit Leakage Current Detector

Hall IC

Unipolar Automotive IC A-D or D-A Converter Miscellaneous Radio and Cassette Recorder Circuit

Bipolar Omnipolar Linear Single/Two Phase Radio and Cassette Recorder Circuit Single/Two Phase

Product - DiscretesProduct Discretes

POWER MOSFET Combo Power MOSFET Planar Punch Through IGBT

IGBT

Trench: 12-100V Planar: 60-600V

Power MOSFET

Planar Punch Through IGBT Non-Punch Through IGBT(600V/1200V) Strobe Flash IGBT Trench PT IGBT

Trench: 10-200V Planar: 30-1000V

Super Junction Power MOSFET 500-1000V

Trench FS IGBT(600V/1200V)

Bipolar Transistor

TRANSISTOR

500 1000V

JFET JFET for Condenser MICp

Darlington Transistor Dual Chip Bipolar/Digital Transistor Built-in Bias Resistor Transistor Di it l T i t D i ti S t

JFET for General Purpose Application

Digital Transistors Designation System Complex Bipolar Transistor

Product - Discretes

MOS Gated Barrier Rectifier (MGBR)

DIODEDIODE TVSTVS

Transient Voltage Suppressors MOS Gated Barrier Rectifier (MGBR) Trench MOS Schottky (TGBR) Schottky Diode Bridge Diode

Transient Voltage Suppressors TVS-ESD Protection

Rectifier (SuperFast/UltraFast/HyperFast/Fast/ General/Glass-passivated)

Zener Diode/ Dual Zener Diode

TRIAC/SCRTRIAC/SCR

TRIAC： 400V-900V SCR：40V-1000V

Small Signal Schottky Diode Small Signal Switching Diode Current Regulator Diode Varactor Diode

PhotocouplerPhotocoupler

SCR：40V 1000V

Varactor Diode Low-Input-Current Transistor-

Output Photocoupler

Famous Customer - TaiwanFamous Customer Taiwan

Famous Customer – China

Famous Customer - Oversea

EUROPE

Certification AwardCe ca o a d

ISO 9000:2008 ISO 14001:2004ISO 9000:2008 ISO 14001:2004

Certification Award - Customer

Sony PlayStation Sony PlayStation 2 100Million Units2 100Million Units

ADDA ADDA Supplier AwardSupplier Award

ADDAADDASupplier AwardSupplier Award

ASUS GreenASUS GreenManagementManagement

MTI BestMTI Best LG Green LG Green LINPOLINPOSupplier AwardSupplier Award ProgramProgramLongLong--term Supportterm Support

Philosophy and Visionp y

By the Philosophy,“Q lit Fi t d C t O i t ti “ “Quality First and Customer Orientation“ ,

our challenge is to become a leading semiconductor company recognized by peers, trusted by customers. We will devote ourselves to create popular products and services, accordingly contributing to a better global society.

K. H. KaoPresident & CEO

Thank YouThank YouUNISONIC TECHNOLOGIES CO., LTD.UNISONIC TECHNOLOGIES CO., LTD.UNISONIC TECHNOLOGIES CO., LTD.UNISONIC TECHNOLOGIES CO., LTD.U SO C C O OG S CO ,U SO C C O OG S CO ,

友順科技股份有限公司友順科技股份有限公司

U SO C C O OG S CO ,U SO C C O OG S CO ,

友順科技股份有限公司友順科技股份有限公司

http://www.unisonic.com.tw