Company Overview - Optoscribe · Company Overview Formed in 2010, the Company uses its proprietary laser direct write technology to manufacture glass-based 3D photonic integrated

Company Overview

Formed in 2010, the Company uses its proprietary laser direct write technology to manufacture glass-based 3D photonic integrated circuits for the telecommunications and data communications markets.

In 2017 the Company opened a 7,400 square feet facility containing state-of-the-art manufacturing area including cleanrooms in Livingston, UK. Optoscribe has built a world class engineering and operations team with many years of experience in direct laser inscription and well-positioned for high volume manufacturing. The Company is ramping production and supplying major players in the fast-growing optical transceiver market.

Optoscribe’s Proprietary Technology

The Company has developed a fully integrated platform of optical and photonic capabilities combining a range of 3D waveguides, precise alignment features for fiber interconnects and micro-optic components. The Company’s technology uses laser based manufacturing to directly write optical waveguide circuits and micromachined structures within a block of glass. Integrating these micro-structures provides new levels of fiber coupling and significant relaxation of optical transceiver design constraints in terms of layout, assembly and packaging. Additionally, laser-based scribing simplifies manufacturing to a two-step process that delivers low signal loss, high density and scalable products. These compact glass-based 3D photonic integrated circuits are produced using the Company’s in-house fast wafer scale processing capabilities.

• Waveguides with full 3D flexibility (single mode fiber and multimode fiber)• Mirrors for 90° light turn• “V” grooves for precise passive alignment of fiber• Precise fiducial markersOther photonic components are under development and available in 2018, please contact Optoscribe to discuss.

Example of single mode VCSEL platform or SiPh with grating couplers (not to scale)

Passive fiber alignment with integrated “V” grooves

Single monolithic glass chip reducing assembly costs while enabling volume product ramp

Vertical alignment flexibility to alleviate packaging constraints

Accommodate varied and complex

fiber configurations

Perfect solution for automated assembly

processes

45 degree integrated mirror for 90 degree light turn for

coupling to VCSEL/PD arrays or SiPh to grating couplers

Transceiver Photonic PlatformThe datacom market is dominated by the explosive growth in cloud data centers, mostly belonging to internet giants such as Amazon, Microsoft and Google. This growth is required to meet consumer expectations of on-demand, high quality and real-time access to content via a multitude of applications across a wide range of devices such as smartphones, tablets, laptops, PCs and smart televisions. This huge demand has put pressure on data center operators for higher bandwidths, reduced footprints, increased integration and lower costs for optical transceivers. Optoscribe’s unique 3D glass-based photonic integrated circuit platform is ideally suited for creating custom transceiver fiber coupling and attaching solutions.

Optoscribe Limited Rosebank Technology ParkRosebank RoadLivingstonEH54 7EJUnited Kingdom

T: +44 (0) 1506 536000F: +44 (0) 1506 691280 E: [email protected]: www.optoscribe.com

For further information please contact us, details below

Optoscribe supplies state-of-the-art fiber to fiber coupling solutions designed to act as an interface between different types or configurations of optical fibers.Using Optoscribe’s 3D photonic integrated circuits, a wide range of complex interconnect geometries are now possible to manufacture. Low loss coupling between arbitrary configurations of one or two dimensional arrays can be achieved with ease, using industry standard assembly processes.

Suitable for use in spatial multiplexing and de-multiplexing, the 3D OptoFanTM series of products are a new class of glass components designed to interface multicore fibers (MCFs) and single mode fibers (SMFs) in a monolithic, scalable, compact solution with best-in-class core positioning accuracy.

Suitable for use in spatial multiplexing and de-multiplexing, the 3D OptoLanternTM series of products are a new class of glass components designed to interface few mode fibers (FMFs) and single mode fibers (SMFs) in a monolithic, scalable, compact solution with best-in-class core positioning accuracy.

Optoscribe Limited Sept 2017All specifications are correct at the time of production. We reserve the right to change our specifications without notice.

Fiber To Fiber Interconnects

3D OptoFanTM Multicore Fiber Fanout

3D OptoLanternTM Photonic Lantern

any fiber, any configuration