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4 and 8-Channel EMI FilterArrays with ESD Protection
Product DescriptionON Semiconductor CM1407 is an EMI filter array with ESD
protection, which integrates either four or eight pi filters (C−R−C).The CM1407 has component values of 7.5 pF − 200 � − 7.5 pF(fC = 210 MHz). The parts include ESD protection diodes on everypin, providing a very high level of protection for sensitive electroniccomponents that may be subjected to electrostatic discharge (ESD).The ESD diodes connected to the filter ports safely dissipate ESDstrikes of ±15 kV contact discharge, twice the specificationrequirement of the IEC 61000−4−2, Level 4 international standard.Using the MIL−STD−883 (Method 3015) specification for HumanBody Model (HBM) ESD, the pins are protected for contactdischarges at greater than ±30 kV.
This device is particularly well−suited for portable electronics(e.g. mobile handsets, PDAs, notebook computers) because of itssmall package and easy−to−use pin assignments. In particular,the CM1407 is ideal for EMI filtering and protecting data lines fromESD in wireless handsets.
The CM1407 is available in space−saving, low−profile, 8 and16−lead WDFN packages. It is fabricated with ON Semiconductor’sCenturion� process and available with optional lead−free finishing.
Features• Four and Eight Channels of EMI Filtering with ESD Protection
• Greater than 25 dB of Attenuation from 800 Mhz to 3 GHz
• Fabricated with Centurion� Advanced Low Capacitance ZenerProcess Technology
• Space Saving, Low Profile 8 and 16−lead 0.5 mm Pitch WDFNPackages
• These Devices are Pb−Free and are RoHS Compliant
Applications• I/O Port Protection for Mobile Handsets, Notebook Computers,
PDAs etc.• EMI Filtering for Data Ports in Cell Phones, PDAs or Notebook
Computers• EMI Filtering for LCD, Camera and Chip−to−Chip Data Lines
MARKING DIAGRAM
Device Package Shipping†
ORDERING INFORMATION
http://onsemi.com
CM1407−04DF WDFN8(Pb−Free)
3000/Tape & Reel
WDFN16(Pb−Free)
3000/Tape & ReelCM1407−08DF
†For information on tape and reel specifications,including part orientation and tape sizes, pleaserefer to our Tape and Reel Packaging SpecificationBrochure, BRD8011/D.
WDFN8DF/DE SUFFIXCASE 511BE
N07 4X = Specific Device CodeN78X = Specific Device Code
BLOCK DIAGRAM
FILTERn*200 �
1 of 4/8 EMI Filtering + ESD Channels
FILTERn*
GND
7.5 pF
*See Package/Pinout Diagrams for Expanded Pin Information.
N074X
WDFN16DF/DE SUFFIXCASE 511AU
N78X
7.5 pF
C C
CM1407−04DE WDFN8(Pb−Free)
3000/Tape & Reel
WDFN16(Pb−Free)
3000/Tape & ReelCM1407−08DE
CM1407
http://onsemi.com2
Top View(Pins Down View)
Bottom View(Pins Up View)
Pin 1Marking
Pin 1Marking
CM1407−08DE/DF16−Lead WDFN Packagewith Exposed End Pads
CM1407−04DE/DF8−Lead WDFN Package
GND PADN78X
GNDPAD
N074X
1 2 3 4
8 7 6 5
1 2 3 4
8 7 6 5
1 2 3 4 5 6 7 8
16 15 14 13 12 11 10 9
16 15 14 13 12 11 10 9
1 2 3 4 5 6 7 8
PACKAGE / PINOUT DIAGRAMS
Note: See Ordering Information section for device specific marking.
Table 1. PIN DESCRIPTIONS
Pins
Name Description
Pins
Name Description1406−04Dx 1406−08Dx 1406−04Dx 1406−08Dx
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above theRecommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affectdevice reliability.
*For additional information on our Pb−Free strategy and solderingdetails, please download the ON Semiconductor Soldering andMounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
DETAIL A
L1 −−− 0.15
DIMENSION: MILLIMETERS
RECOMMENDED
L1DETAIL A
L
ALTERNATE TERMINALCONSTRUCTIONS
L
ÉÉÇÇÇÇ
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATECONSTRUCTIONS
ÉÉÉÇÇÇÇÇÇA1
A3
DETAIL B
e/2
0.53
1.90
4.30
0.30
3X0.50
3.30
2X 0.35
0.50PITCH
F 0.25 REFK 0.30 REF
F
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regardingthe suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specificallydisclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor therights of others.
98AON48925EDOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
ASME Y14.5M, 1994.2. CONTROLLING DIMENSION: MILLIMETERS.3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN0.15 AND 0.30 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSEDPAD AS WELL AS THE TERMINALS.
ÇÇÇÇÇÇ
AD
E
B
C0.10
PIN ONE
2X
REFERENCE
2X
TOP VIEW
SIDE VIEW
BOTTOM VIEW
LD2
E2
C
C0.10
C0.10
C0.08A1
SEATINGPLANE
8X
NOTE 3
b8X
0.10 C
0.05 C
A BB
DIM MIN MAXMILLIMETERS
A 0.70 0.80A1 0.00 0.05
b 0.20 0.30D 2.00 BSCD2 1.50 1.70E 2.00 BSC
E2 0.80 1.00e 0.50 BSC
L 0.20 0.40
1 4
8
*For additional information on our Pb−Free strategy and solderingdetails, please download the ON Semiconductor Soldering andMounting Techniques Reference Manual, SOLDERRM/D.
SOLDERING FOOTPRINT*
0.50PITCH
1.00 2.30
1
DIMENSIONS: MILLIMETERS
0.508X
1
NOTE 4
0.308X
DETAIL A
A3 0.20 REF
A3
ADETAIL B
L1
DETAIL A
L
ALTERNATECONSTRUCTIONS
ÉÉÇÇA1
A3
L
ÇÇÇÉÉÉÉÉÉ
DETAIL B
MOLD CMPDEXPOSED Cu
ALTERNATECONSTRUCTIONS
L1 −−− 0.15
OUTLINEPACKAGE
e
RECOMMENDED
K 0.25 REF
5
1.70
K
GENERICMARKING DIAGRAM*
*This information is generic. Please refer todevice data sheet for actual part marking.Pb−Free indicator, “G” or microdot “ �”,may or may not be present.
XX = Specific Device CodeM = Date Code� = Pb−Free Package
XX M�
�
1
(Note: Microdot may be in either location)
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries.ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regardingthe suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specificallydisclaims any and all liability, including without limitation special, consequential or incidental damages. ON Semiconductor does not convey any license under its patent rights nor therights of others.
98AON48936EDOCUMENT NUMBER:
DESCRIPTION:
Electronic versions are uncontrolled except when accessed directly from the Document Repository.Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red.
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