General Description The MAX20010C/MAX20010D ICs are high-efficiency, synchronous step-down converters that operate with a 3.0V to 5.5V input voltage range and provide a 0.5V to 1.5875V output voltage range. The wide input/output voltage range and the ability to provide up to 6A load current make these ICs ideal for on-board point-of-load and post-regulation applications. The ICs achieve ±2% output error over load, line, and temperature ranges. The MAX20010D offers improved transient response. The ICs feature a 2.2MHz fixed-frequency PWM mode for better noise immunity and load-transient response, and a pulse-frequency modulation mode (skip) for increased efficiency during light-load operation. The 2.2MHz frequency operation allows the use of all-ceramic capacitors and minimizes the solution footprint. The programmable spread-spectrum frequency modulation minimizes radiated electromagnetic emissions. Integrated low R DS(ON) switches improve efficiency at heavy loads and make the layout a much simpler task with respect to discrete solutions. The ICs are offered with factory-preset output voltages (see the Ordering Information for options). The I 2 C inter- face supports dynamic voltage adjustment with program- mable slew rates. Other features include programmable soft-start, overcurrent, and overtemperature protections. Benefits and Features ● Fully Integrated, Synchronous 6A DC-DC Converter Enables Small Solution Size • 3.0V to 5.5V Operating Supply Voltage ● High-Precision Voltage Regulator for Applications Processors • ±2% Output-Voltage Accuracy • Differential Remote Voltage Sensing • I 2 C-Controlled Output Voltage of 0.5V to 1.27V in 10mV Steps, or 0.625V to 1.5875V in 12.5mV Steps • Excellent Load-Transient Performance ● Low-Noise Feature Reduces EMI • 2.2MHz Operation • Spread-Spectrum Option • Frequency-Synchronization Input/Output • Current-Mode, Forced-PWM, and Skip Operation ● Robust for the Automotive Environment • PGOOD Output • Overtemperature and Short-Circuit Protection • 20-Pin (4mm x 4mm) TQFN with an Exposed Pad • -40°C to +125°C Operating Temperature Range • AECQ-100 Qualified Ordering Information appears at end of data sheet. 19-100153; Rev 5; 3/19 AV PV EN PV PGND GND SYNC ADDR SCL SDA RS+ LX PGND RS- MAX20010C MAX20010D PG EP V OUT PV MAX20010C/MAX20010D Automotive Single 6A Step-Down Converters Typical Application Circuit EVALUATION KIT AVAILABLE Click here for production status of specific part numbers.
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General DescriptionThe MAX20010C/MAX20010D ICs are high-efficiency, synchronous step-down converters that operate with a 3.0V to 5.5V input voltage range and provide a 0.5V to 1.5875V output voltage range. The wide input/output voltage range and the ability to provide up to 6A load current make these ICs ideal for on-board point-of-load and post-regulation applications. The ICs achieve ±2% output error over load, line, and temperature ranges. The MAX20010D offers improved transient response.The ICs feature a 2.2MHz fixed-frequency PWM mode for better noise immunity and load-transient response, and a pulse-frequency modulation mode (skip) for increased efficiency during light-load operation. The 2.2MHz frequency operation allows the use of all-ceramic capacitors and minimizes the solution footprint. The programmable spread-spectrum frequency modulation minimizes radiated electromagnetic emissions. Integrated low RDS(ON) switches improve efficiency at heavy loads and make the layout a much simpler task with respect to discrete solutions.The ICs are offered with factory-preset output voltages (see the Ordering Information for options). The I2C inter-face supports dynamic voltage adjustment with program-mable slew rates. Other features include programmable soft-start, overcurrent, and overtemperature protections.
Benefits and Features Fully Integrated, Synchronous 6A DC-DC Converter
Enables Small Solution Size• 3.0V to 5.5V Operating Supply Voltage
High-Precision Voltage Regulator for ApplicationsProcessors• ±2% Output-Voltage Accuracy• Differential Remote Voltage Sensing• I2C-Controlled Output Voltage of 0.5V to 1.27V
in 10mV Steps, or 0.625V to 1.5875V in12.5mV Steps
Robust for the Automotive Environment• PGOOD Output• Overtemperature and Short-Circuit Protection• 20-Pin (4mm x 4mm) TQFN with an Exposed Pad• -40°C to +125°C Operating Temperature Range• AECQ-100 Qualified
Ordering Information appears at end of data sheet.
19-100153; Rev 5; 3/19
AV
PV
EN
PV
PGND
GNDSYNC
ADDR
SCL
SDA
RS+
LX
PGND
RS-
MAX20010CMAX20010D
PGEP
VOUTPV
MAX20010C/MAX20010D Automotive Single 6A Step-Down Converters
Typical Application Circuit
EVALUATION KIT AVAILABLE
Click here for production status of specific part numbers.
PV, AV to GND .......................................................-0.3V to +6VADDR, EN, PG, RS+, RS-, SYNC to GND ....-0.3V to VAV + 0.3VSDA, SCL to GND ...................................................-0.3V to +6VGND to PGND ......................................................-0.3V to +0.3VLX to PGND (Note 1) ................................. -0.3V to VPV + 0.3VOutput Short-Circuit Duration ....................................Continuous
Operating Temperature Range ......................... -40°C to +125°CJunction Temperature ......................................................+150°CStorage Temperature Range ............................ -65°C to +150°CLead Temperature (soldering, 10s) .................................+300°CSoldering Temperature (reflow) .......................................+260°C
Note 1: Self-protected against transient voltages exceeding these limits for ≤ 50ns under normal operation and loads up to the maximum rating output current.
Note 2: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial.
(VPV = VAV = 5.0V. TA = TJ = -40°C to +125°C, unless otherwise noted. Typical values are at TA = +25°C under normal conditions, un-less otherwise noted.) (Note 3)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITSSupply Voltage Range VIN Fully operational 3.0 5.5 V
Undervoltage Lockout UVLORising 2.85 3
VFalling 2.55
Shutdown Supply Current IIN EN = lowTA = +25°C 2.5 5
PACKAGE TYPE PACKAGE CODE OUTLINE NO. LAND PATTERN NO.20 TQFN-EP T2044+4C 21-100172 90-0409
20 SW TQFN-EP T2044Y+4C 21-100068 90-0409
MAX20010C/MAX20010D Automotive Single 6A Step-Down Converters
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Absolute Maximum Ratings
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
Package Thermal Characteristics
Electrical Characteristics
Package InformationFor the latest package outline information and land patterns (footprints), go to www.maximintegrated.com/packages. Note that a “+”, “#”, or “-” in the package code indicates RoHS status only. Package drawings may show a different suffix character, but the drawing pertains to the package regardless of RoHS status.
(VPV = VAV = 5.0V. TA = TJ = -40°C to +125°C, unless otherwise noted. Typical values are at TA = +25°C under normal conditions, un-less otherwise noted.) (Note 3)
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITSpMOS On-Resistance VPV = VAV = 5V, ILX = 1A 31 55 mΩnMOS On-Resistance VPV = VAV = 5V, ILX = 1A 18 31 mΩpMOS Current-Limit Threshold 7.76 9.70 11.64 AnMOS Zero Crossing Threshold 60 mA
LX Leakage CurrentVPV = VAV = 6V, LX = PGND or PV
TA = +25°C 0.5 5µA
TA = +125°C 4
Duty-Cycle Range PWM mode 100 %Minimum On-Time 36 75 nsTHERMAL OVERLOADThermal-Shutdown Temperature TJ rising 165 °CHysteresis 15 °CPOWER-GOOD OUTPUT (PG)
PG Overvoltage (OV) Threshold, Rising
Percentage of nominal output, output voltage rising, blanked during slewing
0.5V < VOUT < 0.79V 104 108 112
%0.8V < VOUT < 1.5875V 105 108 111
PG Undervoltage (UV) Threshold, Falling
Percentage of nominal output, output voltage falling, blanked during slewing
0.5V < VOUT < 0.79V 88 92 96
%0.8V < VOUT < 1.5875V 89 92 95
Active Timeout Period 256 ClocksUV/OV Propagation Delay 5 µsPG Output High-Leakage Current 1 µA
DIGITAL INPUTS (SYNC, EN, ADDR)Input High Level VIH 1.5 VInput Low Level VIL 0.5 VInput Hysteresis 0.1 V
EN Input Leakage Current 0V ≤ VPV ≤ 5.5V, 0V ≤ VAV ≤ 5.5V 0.1 mA
Enable Time Rising EN to beginning of soft-start 140 µs
SYNC Input Pulldown 100 150 kΩSYNC Input Frequency Range 1.8 2.6 MHz
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Electrical Characteristics (continued)
(VPV = VAV = 5.0V. TA = TJ = -40°C to +125°C, unless otherwise noted. Typical values are at TA = +25°C under normal conditions, un-less otherwise noted.) (Note 3)
Note 3: All units are 100% production tested at TA = +25°C. All temperature limits are guaranteed by design.Note 4: Guaranteed by design. Not production tested.
PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITSSYNC OUTPUTOutput Low VOL ISINK = 3mA 0.4 V
Output High VOHVPV = VAV = 5.0V, ISOURCE = 3mA 4.2 V
I2C INTERFACEClock Frequency fSCL 3.4 MHzSetup Time (Repeated) START tSU:STA (Note 4) 160 nsHold Time (Repeated) START tHD:STA (Note 4) 160 nsSCL Low Time tLOW (Note 4) 160 nsSCL High Time tHIGH (Note 4) 60 nsData Setup Time tSU:DAT (Note 4) 50 nsData Hold Time tHD:DAT (Note 4) 0 70 nsSetup Time for STOP Condition tSU:STO (Note 4) 160 nsSpike Suppression (Note 4) 20 ns
SDA Output Low VOL_SDA ISINK = 13mA 0.4 V
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Electrical Characteristics (continued)
(TA = +25°C, unless otherwise noted.)
200
220
240
260
280
300
320
340
360
380
400
3 3.5 4 4.5 5 5.5
INPU
T CU
RREN
T (μ
A)
INPUT VOLTAGE (V)
SUPPLY CURRENT vs. INPUT VOLTAGE (SKIP)toc04
CONFIG BIT3 = 0ILOAD = 0A
VOUT = 0.95V
0
10
20
30
40
50
60
70
80
90
100
0.001 0.01 0.1 1 10
EFFI
CIEN
CY (%
)
LOAD CURRENT (A)
PWMVIN = 3VVIN = 4VVIN = 5V
EFFICIENCY vs. LOAD CURRENT(VOUT = 0.95V)
toc01
SKIPVIN = 3VVIN = 4VVIN = 5V
2.00
2.05
2.10
2.15
2.20
2.25
2.30
2.35
2.40
-40 -25 -10 5 20 35 50 65 80 95 110 125
f SW(M
Hz)
TEMPERATURE (°C)
fSW vs. TEMPERATUREtoc07
VIN = 5VCONFIG BIT3=1NO LOAD
-1
-0.8
-0.6
-0.4
-0.2
0
0.2
0.4
0.6
0.8
1
0 1 2 3 4 5 6
REGU
LATI
ON (%
)
LOAD CURRENT (A)
VOUT LOAD REGULATION (PWM)
VIN = 5VVOUT = 0.95V
toc02
TA = -40°C
TA = +25°CTA = +125°C
2.10
2.12
2.14
2.16
2.18
2.20
2.22
2.24
2.26
2.28
2.30
0 1 2 3 4 5 6
f SW(M
Hz)
LOAD CURRENT (A)
fSW vs. LOAD CURRENTtoc08
VIN = 5VCONFIG BIT3=1
-1
-0.8
-0.6
-0.4
-0.2
0
0.2
0.4
0.6
0.8
1
3 3.5 4 4.5 5
REGU
LATI
ON (%
)
INPUT VOLTAGE (V)
VOUT LINE REGULATION (PWM)
VOUT = 0.95VNo Load
toc03
TA = -40°C
TA = +25°CTA = +125°C
5V/div
100V/div
5V/div
toc09
100μs/div
VEN
VOUT
3A LOADSTARTUP BEHAVIOR
IOUT
VPG
2A/div
27
28
29
30
31
32
33
-40 -25 -10 5 20 35 50 65 80 95 110 125
INPU
T CU
RREN
T (m
A)
TEMPERATURE (°C)
SUPPLY CURRENT vs. TEMPERATURE (PWM)toc05
CONFIG BIT3 = 1VIN = 5V
ILOAD = 0AVOUT = 0.95V
50mV/div(AC-COUPLED)
4.2A
0A
toc06
20μs/div
VOUT
LOAD-TRANSIENT RESPONSE (PWM)
ILOAD
MAX20010C/MAX20010D Automotive Single 6A Step-Down Converters
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Typical Operating Characteristics
(TA = +25°C, unless otherwise noted.)
2V/div
2V/div
toc10
200ns/div
VLX
SYNC FUNCTION
VSYNC
500mV/div
5A/div
toc11
2ms/div
VOUT
SHORT CIRCUIT(PWM MODE)
VPG
ILX
500mV/div
10mV/div (AC-COUPLED)
2A/div
toc12
400ns/div
VOUT
PWM WAVEFORM(NO LOAD)
VLX
ILX
5V/div
10mV/div (AC-COUPLED)
1A/div
toc13
400ns/div
VOUT
SKIP WAVEFORM(50mA LOAD)
VLX
ILX
2V/div
MAX20010C/MAX20010D Automotive Single 6A Step-Down Converters
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Typical Operating Characteristics (continued)
PIN NAME FUNCTION1–4 LX Inductor Connection. Connect LX to the switched side of the inductor. Connect all LX pins together.5–7 PGND Power Ground. Connect all PGND pins together.
12 PGOpen-Drain Power-Good Output. This output remains low for 120μs after the output has reached its regulation level (see the Electrical Characteristics table). To obtain a logic signal, pull up PG with an external resistor.
13 EN Active-High Enable Input. When EN is high, the device enters soft-start. When EN is low, the device enters soft-shutdown.
14 SYNC
SYNC I/O. When configured as an input, connect SYNC to GND or leave unconnected to enable skip-mode operation under light loads. Connect SYNC to AV or an external clock to enable fixed-frequency, forced-PWM (FPWM) mode operation. When configured as an output, connect SYNC to other devices’ SYNC inputs.
15 GND Analog Ground
16 AV Analog Input Supply. Filter AV using a 100Ω resistor from PV and a 1µF ceramic capacitor from AV to GND.
17 ADDR I2C Address Select. See the Ordering Information table for default I2C settings.
18–20 PV Power Input Supply. Connect a 4.7µF or larger ceramic capacitor from PV to PGND. Connect all PV pins together.
— EPExposed Pad. Connect EP to ground. Connecting the exposed pad to ground does not remove the requirement for proper ground connections to PGND. The exposed pad is attached with epoxy to the substrate of the die, making it an excellent path to remove heat from the IC.
MAX20010CMAX20010D
TQFN(4mm x 4mm)
TOP VIEW
+PGND
SCL
RS-
PGND
PV
ADDR
AV
PV
LX LX
SYNC
EN PG RS+
SDAPV
LX
GND
LX
10
9
8
7
6
1112131415
16
17
18
19
20
54321
PGND
MAX20010C/MAX20010D Automotive Single 6A Step-Down Converters
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Pin Configuration
Pin Description
Detailed DescriptionThe MAX20010C/MAX20010D ICs are high-efficiency, synchronous step-down converters that operate with a 3.0V to 5.5V input voltage range and provide a 0.5V to 1.5875V output voltage range. The ICs deliver up to 6A of load current and achieve ±2% output error over load, line, and temperature ranges. The MAX20010D offers improved transient performance.Optional spread-spectrum frequency modulation mini-mizes radiated electromagnetic emissions due to the switching frequency. The I2C-programmable I/O (SYNC) enables system synchronization.
Integrated low RDS(ON) switches help improve efficiency at heavy loads and make the layout a much simpler task with respect to discrete solutions. The ICs are offered with a factory-preset output voltage that is dynamically adjustable through the I2C interface. The output voltage can be set to any desired value between 0.5V and 1.27V in 10mV steps, and between 0.625V and 1.5875V in 12.5mV steps.Additional features include adjustable soft-start, power-good delay, DVS rate, overcurrent, and overtemperature protections (see Figure 1).
Figure 1. Internal Block Diagram
MAX20010CMAX20010D
SKIP CURRENTCOMP
PWM COMPCONTROL
LOGIC
CURRENT-SENSEAMP
PV
PGND
PV
LX
PGNDCURRENT-LIMIT
COMPFPWM
RAMPGENERATOR
CLK
7-BIT DAC
POK
PGOODCOMP
EAMP
RS+
I2C AND CONTROL
LOGIC
VOLTAGEREFERENCE
SSOSC
PG
VREF
AV
GND
AGND
PEAK CURRENT COMP
∑
COMPPV
PGND
CLK
VREF
VPVA
UVLO
P-OK
EN
SDASCL
ADDR
SYNCCLKCLK180FPWM
VSTEP
RS-
VID[6:0]
VID[6:0] VREF
MAX20010C/MAX20010D Automotive Single 6A Step-Down Converters
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I2C InterfaceThe ICs feature an I2C, 2-wire serial interface consisting of a serial-data line (SDA) and serial-clock line (SCL). SDA and SCL facilitate communication between the ICs and the master at clock rates up to 3.4MHz. The master, typically a microcontroller, generates SCL and initiates data transfer on the bus. Figure 2 shows the 2-wire inter-face timing diagram.A master device communicates with the ICs by transmit-ting the proper address followed by the data word. Each transmit sequence is framed by a START (S) or Repeated START (Sr) condition and a STOP (P) condition. Each word transmitted over the bus is 8 bits long and is always followed by an acknowledge clock pulse.The SDA line operates as both an input and an open-drain output. A pullup resistor greater than 500Ω is required on the SDA bus. The SCL line operates as an input only. A pullup resistor greater than 500Ω is required on SCL if there are multiple masters on the bus, or if the master in a single-master system has an open-drain SCL output.
Series resistors in line with SDA and SCL are optional. The SCL and SDA inputs suppress noise spikes to assure proper device operation even on a noisy bus.
Bit TransferOne data bit is transferred during each SCL cycle. The data on SDA must remain stable during the high period of the SCL pulse. Changes in SDA while SCL is high are control signals (see the START and STOP Conditions section). SDA and SCL idle high when the I2C bus is not busy.
START and STOP ConditionsA master device initiates communication by issuing a START condition. A START condition is a high-to-low transition on SDA with SCL high. A STOP condition is a low-to-high transition on SDA while SCL is high (Figure 3). A START (S) condition from the master signals the begin-ning of a transmission to the IC. The master terminates transmission, and frees the bus, by issuing a STOP (P) condition. The bus remains active if a Repeated START (Sr) condition is generated instead of a STOP condition.
Figure 2. I2C Timing Diagram
Figure 3. START, STOP, and Repeated START Conditions
SCL
SDA
STOPCONDITION
REPEATED START CONDITION
START CONDITION
tHD,STA
tSU, DAT
tLOW
tHIGH
tR tF
tHD,DAT
tSU,STA
tHD,DAT
tSP
STARTCONDITION
tSU,STO
tBUF
SCL
PSrS
SDA
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Early STOP ConditionThe ICs recognize a STOP condition at any point during data transmission, except if the STOP condition occurs in the same high pulse as a START condition.
Clock StretchingIn general, the clock-signal generation for the I2C bus is the responsibility of the master device. The I2C specifica-tion allows slow slave devices to alter the clock signal by holding down the clock line. The process in which a slave device holds down the clock line is typically called clock stretching. The ICs do not use any form of clock stretching to hold down the clock line.
I2C General Call AddressThe ICs do not implement the I2C specification’s “gen-eral call address.” If the IC sees the general call address (0b0000_0000), it does not issue an acknowledge.
Slave AddressOnce the device is enabled, the I2C slave address is set by the ADDR pin.The address is defined as the 7 most significant bits (MSBs) followed by the R/W bit. Set the R/W bit to 1 to configure the IC to read mode. Set the R/W bit to 0 to configure the device to write mode. The address is the first byte of information sent to the device after the START condition. See Table 1 for I2C slave addresses.
AcknowledgeThe acknowledge bit (ACK) is a clocked 9th bit that the ICs use to handshake receipt each byte of data (Figure 4). The device pulls down SDA during the master-generated 9th clock pulse. The SDA line must remain stable and low during the high period of the acknowledge clock pulse. Monitoring ACK allows for detection of unsuccessful data transfers. An unsuccessful data transfer occurs if a receiv-ing device is busy or if a system fault has occurred. In the
*See the Ordering Information for default settings.
MAX20010C/MAX20010D Automotive Single 6A Step-Down Converters
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event of an unsuccessful data transfer, the bus master can reattempt communication.
Write Data FormatA write to the device includes: Transmission of a START condition Slave address with the write bit set to 0 1 byte of data to the register address 1 byte of data to the command register STOP condition. .
(Figure 5 illustrates the proper format for one frame)Read Data FormatA read from the device includes: Transmission of a START condition Slave address with the write bit set to 0 1 byte of data to the register address Restart condition Slave address with the read bit set to 1 1 byte of data to the command register STOP condition
(Figure 5 illustrates the proper format for one frame)Writing to a Single RegisterFigure 6 shows the protocol for the I2C master device to write 1 byte of data to the ICs. This protocol is the same as the SMBus specification’s “write byte” protocol.The “write byte” protocol is as follows:
1) Master sends a START command (S).2) Master sends the 7-bit slave address followed by a
write bit (R/W = 0).3) Addressed slave asserts an acknowledge (A) by pull-
ing SDA low.4) Master sends an 8-bit register pointer.5) Slave acknowledges the register pointer.6) Master sends a data byte.7) Slave updates with the new data.8) Slave acknowledges or not acknowledges the data
byte. The next rising edge on SDA loads the data byteinto its target register and the data becomes active.
9) Master sends a STOP condition (P) or a RepeatedSTART condition (Sr).
Writing Multiple Bytes Using Register-Data PairsFigure 7 shows the protocol for the I2C master device to write multiple bytes to the ICs using register-data pairs. This protocol allows the I2C master device to address the slave only once and then send data to multiple registers in a random order. Registers can be written continuously until the master issues a STOP condition.The “multiple byte register-data pair” protocol is as follows:1) Master sends a START command.2) Master sends the 7-bit slave address followed by a
write bit.3) Addressed slave asserts an acknowledge by pulling
SDA low.4) Master sends an 8-bit register pointer.
Figure 5. Data Format of I2C Interface
S SLAVE WRITE ADDRESS A REGISTER
ADDRESS A DATA NA P
WRITE BYTE
DATA P
READ BYTE
Sr SLAVE READADDRESS A
WRITE MULTIPLE BYTES
A A P
P
READ SEQUENTIAL BYTES
. . . DATA N
. . . A DATA 2 S SLAVE WRITE ADDRESS A REGISTER
ADDRESS A DATA 1 A REGISTERADDRESS DATA 2 REGISTER
ADDRESS
S SLAVE WRITE ADDRESS A REGISTER
ADDRESS A NA
DATA 1Sr SLAVE READADDRESS AS SLAVE WRITE
ADDRESS A REGISTERADDRESS A NA
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5) Save acknowledges the register pointer.6) Master sends a data byte.7) Slave acknowledges the data byte. The next rising
edge on SDA loads the data byte into its target register and the data becomes active.
8) Steps 4–7 are repeated as many times as the master requires.
9) Master sends a STOP condition. During the rising edge of the stop-related SDA edge, the data byte that was previously written is loaded into the target register and becomes active.
PG OutputThe ICs feature an open-drain PGOOD output that asserts low when the output voltage exceeds the PG_OV and PG_UV thresholds. PG remains low for a fixed timeout period after the output is within the regulation window. Connect PG to a logic supply using a pullup resistor.
Soft-StartThe ICs include a programmable startup fixed soft-start rate. Soft-start time limits startup inrush current by forcing the output voltage to ramp up towards its regulation point.
ShutdownDuring shutdown, the output voltage is ramped down at the 5.5mV/µs slew rate. Once the controlled ramp is stopped, the output voltage is typically around 0.15V at no load.
Spread-Spectrum OptionThe ICs, featuring spread-spectrum (SS) operation, vary the internal operating frequency down by 3% relative to the internally generated operating frequency of 2.2MHz (typ). This function does not apply to externally applied oscillation frequency.
Synchronization (SYNC)SYNC is factory-programmable I/O (see Ordering Information for the available options). When SYNC is con-figured as an input, a logic-high on the FPWM bit enables SYNC to accept signal frequencies in the range of 1.8MHz < fSYNC < 2.6MHz. When SYNC is configured as an out-put, it outputs the internal PWM switching frequency.
Current-Limit/Short-Circuit ProtectionThe current-limit feature protects the ICs against short-circuit and overload conditions at the output. After soft-start is completed, if VOUT is less than 50% of the set value and the IC is in current limit, the IC shuts off for 4ms (at 2.2MHz switching frequency) and repeats soft-start. This cycle repeats until the short or overload condition is removed. See the short-circuit (PWM) waveform for an example.
Figure 6. Write Byte Format
MASTER TO SLAVE
LEGEND
0 ASLAVE ADDRESSS
1 7 1 1
AREGISTER POINTER A ORnA
DATA
8 81 1 1 NUMBEROF BITS
SDA
SCL
B1 B2
7 8 9
A
THE DATA IS LOADED INTO THE TARGET REGISTER
R/W
SLAVE TO MASTER
P ORSr
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Figure 7. Write Register (Data-Pair Format)
0 ASLAVE ADDRESSS
1 7 1 1
AREGISTER POINTER X DATA X
8 81 1
SDA
SCL
B1 B0
7 8 9
A
A • • •
AREGISTER POINTER n DATA n
8 81 1
A • • •
AREGISTER POINTER Z DATA Z
8 81 1
A P
1
SDA
SCL
B1 B0
7 8 9
A
1
B7
a
ß
a
DETAIL : a
MASTER TO SLAVE
LEGEND
SLAVE TO MASTER
R/W
NUMBEROF BITS
NUMBEROF BITS
NUMBEROF BITS
DETAIL : ß
THE DATA IS LOADED INTO THE TARGET REGISTER
THE DATA IS LOADED INTO THE TARGET REGISTER
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Table 2. Register Map
*Note: Reserved registers and bits are not used for readback; they are reserved for internal use.
Table 3. Identification Registers (ID)ID
BIT NO. BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0NAME DEV3 DEV2 DEV1 DEV0 R3 R2 R1 R0POR 0 0 0 0 0 0 0 0
BIT BIT DESCRIPTION
DEV[7:4] Device ID:MAX20010C/MAX20010D = 0x0
R[3:0] 0x3
REG BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 REGISTER ADDRESS R/W
VMAX[6:0]Maximum Voltage Setting:If VID[] > VMAX[], a fault is set and the actual voltage will be capped by VMAX[]. See Table 9 for voltage selections.
CONFIGBIT NO. BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0NAME VSTEP — — — FPWM SS SO1 SO0POR OTP OTP OTP OTP OTP OTP OTP OTP
BIT BIT DESCRIPTION
VSTEPVoltage Step Size—Sets the voltage step size for the LSB of SETVOUT:0 = 10mV1 = 12.5mV
FPWMForced-PWM Mode:0 = Mode controlled by SYNC pin. When SYNC is output device is always FPWM mode.1 = Forced-PWM Mode. Overrides SYNC skip mode setting when SYNC is an input.
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PWM/Skip ModesThe ICs feature a SYNC input that puts the converter either in skip mode or forced-PWM mode of operation. See the Pin Description table for mode details. In PWM mode, the converter switches at a constant frequency with variable on-time. In skip mode, the con-verter’s switching frequency is load-dependent until the output load reaches a certain threshold. At higher load current, the switching frequency does not change and the operating mode is similar to the PWM mode. Skip mode helps improve efficiency in light-load applications by transferring more energy to the output during each on cycle, so the converter does not switch MOSFETs on and off as often as is the case in PWM mode. Consequently, the gate charge and switching losses are much lower in skip mode.
Overtemperature ProtectionThermal-overload protection limits the total power dissipa-tion in the ICs. When the junction temperature exceeds 165°C (typ), an internal thermal sensor shuts down the internal bias regulator and the step-down controller, allow-ing the ICs to cool. The thermal sensor turns on the ICs again after the junction temperature cools by 15°C.
Applications InformationInput CapacitorThe input filter capacitor reduces peak currents drawn from the power source and reduces noise and voltage ripple on the input caused by the circuit’s switching.
The input capacitor RMS current requirement (IRMS) is defined by the following equation:
OUT PV_ OUTRMS LOAD(MAX)
PV_
V (V - V )I I
V=
IRMS has a maximum value when the input voltage equals twice the output voltage (VPV_ = 2VOUT), so IRMS(MAX) = ILOAD(MAX)/2.
Choose an input capacitor that exhibits less than +10°C self-heating temperature rise at the RMS input current for optimal long-term reliability:
ESRIN
LOUT
VESR II2
∆=
∆+
where:
PV_ OUT OUTL
PV_ SW
(V - V ) VI
V f L×
∆ =× ×
and:
OUTIN
Q SW
I D(1- D)CV f
×=
∆ ×
and: OUTPV_
VDV
=
IOUT is the maximum output current, D is the duty cycle.
Inductor SelectionThe ICs are optimized to use a nominal 0.22µH inductor value. 0.15µH to 0.33µH inductors can also be used.Inductors are rated for maximum saturation current. The maximum inductor current equals the maximum load current in addition to half the peak-to-peak ripple current:
INDUCTORPEAK LOAD(MAX)
II I2
∆= +
The actual peak-to-peak inductor ripple current is calcu-lated in the previous ΔIL equation.The saturation current should be > IPEAK, or at least in a range where the inductance does not degrade significantly.
Output CapacitorThe MAX20010C is stable with 2x47μF (typ) or more of X7R ceramic capacitance on the output, while the MAX20010D is stable with 3x47μF (typ). Phase and gain margin must be measured with the worst-case-derated output capacitance to ensure stability. Larger capacitance values can be used to minimize VSAG and VSOAR during load transients.
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Setting the Output Voltage ExternallyAn external resistive divider can be used to set the output voltage, or to change the voltage range that can be programmed through I2C. This should only be done with VSTEP = 0 (10mV steps). To set the output voltage, connect a resistive divider from the output (OUT) to RS+ to GND, as shown in Figure 8. Select RFB2 (RS+ to GND resistor) ≤ 100kΩ. Calculate RFBA (OUT to RS+ resistor) with the following equation:
where VRS+ = programmed VID voltage.Capacitor CFB1 can help improve the phase margin when using a resistive divider. Determine CFB1 from the following equation:
OUTFB1 FB2
RS
VR R ( ) 1V +
= −
= FB2FB1
FB1
RC 10 pFR
/V denotes an automotive qualified part.+Denotes a lead(Pb)-free/RoHS-compliant package.*EP = Exposed pad.
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Ordering Information
REVISIONNUMBER
REVISIONDATE DESCRIPTION PAGES
CHANGED0 9/17 Initial release —
1 3/18 Updated Table 7, Output Capacitor section, and Ordering Information 16, 18–19
2 4/18 Updated Package Information table and Table 7. Added MAX20010DATPR/V+ as a future product to the Ordering Information table. 2, 16, 19
3 8/18Updated equation in the Setting the Output Voltage Externally section. Added MAX-20010CATPE/V+** as a future product and removed future product designation from MAX20010DATPR/V+ in the Ordering Information table.
19
4 11/18Updated Package Information table. Added MAX20010DATPT/V+ and MAX20010DAT-PO/VY+ to the Ordering Information table. Added MAX20010CATPU/V+as a future product to the Ordering Information table.
2, 19
5 3/19Removed future-product notation from MAX20010CATPE/V+ and MAX20010CATPU/V+ in the Ordering Information table 19
Maxim Integrated cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Maxim Integrated product. No circuit patent licenses are implied. Maxim Integrated reserves the right to change the circuitry and specifications without notice at any time. The parametric values (min and max limits) shown in the Electrical Characteristics table are guaranteed. Other parametric values quoted in this data sheet are provided for guidance.
Maxim Integrated and the Maxim Integrated logo are trademarks of Maxim Integrated Products, Inc.
MAX20010C/MAX20010D Automotive Single 6A Step-Down Converters
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