Chipmatedossier

Van Haecke Stephanie 1

The technical-economical document.

Project by Van Haecke Stephanie

2011-2012

Van Haecke Stephanie 2

Contents Introduction. ............................................................................................................................................ 3

Optional information. .............................................................................................................................. 3

Project fiche. ............................................................................................................................................ 4

Current systems on the market. .............................................................................................................. 5

Panasonic ..................................................................................................................................... 5

Fuji ............................................................................................................................................... 6

Siemens ....................................................................................................................................... 7

Our system. ............................................................................................................................................. 8

Specifications. .......................................................................................................................................... 9

Working. ................................................................................................................................................ 10

Technical composition. .......................................................................................................................... 11

Stakeholders. ......................................................................................................................................... 11

1. Chipset manufracturers ......................................................................................................... 11

2. Computer manufracturers .................................................................................................... 11

Van Haecke Stephanie 3

Introduction.

The main purpose of this project is to blow fresh life in the EAP muscle foil,

developed by Bayer and Holst.

I’ve thought about many new uses, which are all found in the outers corners

of each category possible. In the end I’ve stumbled upon assembling tiny

particles which vary from constructing printed circuit boards to any other

design which needs high precision.

The Chip-Mate design is only here to optimize the current systems which are

high-end Chip-Shooters which costs massive amounts of money and

operating skills.

Optional information.

The positive side of the improved design is that the Chip-Mate can be

imported to third world countries where they can mass-produce their own

basic computer chipsets for basic education. There is already a design for this

where the chipset is only the length of your thumb. The design is based

around an ARM 700 MHz processor, VideoCore IV GPU, and 128 or

256 megabytes of memory. The design does not include a built-in hard disk or

solid-state drive, instead relying on a SD card for booting and long-term

storage and has one HDMI output and one keyboard input.

This board is intended to run Linux or RISC OS operating system which are both

open source. Also basic calculating programs, render programs, brain games

can be installed on this for kids to learn on. This parts of this mini-computer

only costs up to €20 for the whole set.

Products like this can be easily assembled by Chipmate.

Van Haecke Stephanie 4

Project fiche.

Van Haecke Stephanie 5

Current systems on the market.

Panasonic

Panasonic CM402-L, A-type

Year of Manufacture: 2006

Flow Direction: Left to Right

PCB DIMENSIONS: Min 50 mm × 50 mm

Max 510 mm × 460 mm

Number of nozzles - 4 x 8 nozzles

Maximum speed - 0.06 s/chip (60,000 cph)

Space productivity - 9,560 cph/m

Placement accuracy - ±0.05 mm/chip

Component dimensions - 0201 (0603) C, R to L 24 mm × W 24 mm

PCB Exchange Time: 0.9 s (board length: up to 240 mm)

Electric Source: 3-phase AC 200 V ±10 V / AC 400 V ±10 V, 2.5 kVA

Pneumatic Source: 490 kPa, 150 L/min (standard, machine body only)

Dimensions: W - 2,350 mm

D - 2,690 mm

H - 1,430 m

Mass: 3,000 kg (not including collective-exchange cart)

Comes with: 4 changeover tables on wheels

Van Haecke Stephanie 6

Fuji

Applicable Parts: 0603 (0201 in.) to 74 x 74 mm

Max Board Dimension: 705 x 587 mm (23" x 27")

Part Capacity: 80 slots; 160 part types with 8 mm double channel feeders

Allowable Board Warping: ± 1.0 mm

PCB Weight: 1 kg (std), 2 kg (option with roller conveyor)

Height of Pre-mounted Parts: Top: 25.4 mm, Bottom: 25.4 mm

Conveyor Height: 900 mm (std), 950 mm (option)

Board Flow: Left to Right

Voltage: 3-phase 200 V AC

Frequency: 50/60 Hz

Power Consumption: 4.5 kVA

Air Pressure: 0.5 MPa (5 kgf/cm2)

Air Consumption: 200 Nl/min

Environment Temperature (no condensation): 15 à 35°C

Environment Humidity (no condensation): 30 à 80%

Van Haecke Stephanie 7

Siemens

Siemens Siplace 80 S20

Left to Right Flow,

Placements 68.999.473

S/W ver. 407,04

Single conveyor,

2 RV12 heads, 2 Nozzle changers

Number of Placement Heads: 2 Revolver Heads (Vertical)

Number of Gantries: 2

Placement Rate: Max 20,000 components per hour

Placement Accuracy: 90 m, 4 Sigma, 67.5 m, 3 Sigma

Component Vision System: For component recognition.

PCB Vision System: For PCB and bad board marking recognition.

Range of Components: 0402 - LCC 44, inclusive DRAM, BGA, CSP

Component Height: Max. 6 mm

Component Feeder Capacity: 2 feeder stations at each side

Feeder Type: Tape feeders (8 - 32 mm), Stick feeders, Bulk feeders

PCB Changeover Time: 2.5 sec

PCB Transport:

- Inline transport

- Width adjust for PCB's

- 50mm x 50mm to 460mm x 460mmm

Van Haecke Stephanie 8

Our system.

Our developed system would only be a success if its capabilities and

functionality dominates the characteristics of its predecessors. The maximum

cap of this lays with the Siemens Siplace X4 at a fire rate of 20.000

components per hour.

Our technology is designed to beat those numbers. The vibrations cause

multiple particles to be aligned at once instead of the traditional one by one

placement. This way the particles don’t have to be presorted in previous

assembly-line processes and can be dumped right on the EAP muscle-foil.

Van Haecke Stephanie 9

But still, why would we care to beat those numbers? Simple: Because

technology creates better technology. We would be able to assemble

products at a higher rate, reducing the cost. It will improve the global

economy and the well-being of humanity by providing them with cheap

electronics. Education will be taken to a higher level and it will be available to

anyone, anywhere.

Specifications.

Our system will be provided with a 3 dimensional electronic eye with

recognition software. The connection between the recognition-software and

the EAP muscle foil will be real-time so Chipmate can make any adjustments

when needed to provide the highest precision possible.

The maximum width of the circuit-board to be injected with chips at once will

be 300mm, as this is the maximum width of the roll-to-roll production by Holst.

Although, the circuit board does not have any limits as the board can be

pressed on the electronics multiple times to cover larger areas.

The number of components aligned at once is determined by the frequency

the foil vibrates and the multiple points where the foil can vibrate. The more,

the better, and the more we can optimize our accuracy.

The different types of components that can be aligned are also determined

by the weight of the particle. The heavier a particle, the slower it will move,

but it will be aligned more accurate. Contrary to the lightweight objects, they

will move faster, but imprecise.

Prices will range between €20,000 and €30,000. As these prices are

completely negotiable and depending on different aspects such as size, it’s

hard to stick a steady price-tag on it. Today’s chipshooters cost between

€30,000 and €60,000, our goal is, again, to beat those.

Van Haecke Stephanie 10

Working.

On the start of the assembly of the

circuit board, all the components

are dropped at once on the

muscle foil.

The muscle foil will start vibrating in

such way it’s programmed to

match the specific design of the

circuit board.

The aid of a 3D camera adjusts the

position of a single piece where

needed to be aligned perfectly.

These signals are sent to the muscle

foil in real time.

When the particles are aligned in

the shape and position it should be,

the circuit board is then pressed on

the musclefoil with the components

on it. The pins of the particles are

now hooked in the printed circuit

board.

From this point the assembly

continues the traditional way by

going into a soldering bath and

melting the pieces and the circuit

board together.

Van Haecke Stephanie 11

Technical composition.

Stakeholders.

Of course we must consider the stakeholders. There must be courses needed

to follow to understand the machine and to operate it. Firms must be

interested in the Chipmate and be open for it.

1. Chipset manufracturers Intel

ATI

AMD

2. Computer manufacturers Dell

HP

Apple

Medion

…

Van Haecke Stephanie 12

Fin.

The concept of this product is still in development and not yet finalized until

real tests and experiments are done with the EAP musclefoil to check whether

this is possible. We must stay realistic and learn out of our mistakes and

upgrade or tweak where possible. As this will be a very large machine there

will be a lot of time, money and development needed to make this possible.

With the right know-how and specializations this beast could be an

immediate industry-hit.

I’ve enjoyed doing this project and therefore I would like to thank Bayer, Holst

and Howest for your time reading this concept and judging it on a fair way.