Chapter 12

© Digital Integrated Circuits2nd Memories

Digital Integrated Digital Integrated CircuitsCircuitsA Design PerspectiveA Design Perspective

SemiconductorSemiconductorMemoriesMemories

Jan M. RabaeyAnantha ChandrakasanBorivoje Nikolic

December 20, 2002


Chapter OverviewChapter Overview

Memory Classification Memory Architectures The Memory Core Periphery Reliability Case Studies


Semiconductor Memory ClassificationSemiconductor Memory Classification

Read-Write MemoryNon-VolatileRead-Write

Memory

Read-Only Memory

EPROM

E2PROM

FLASH

RandomAccess

Non-RandomAccess

SRAM

DRAM

Mask-Programmed

Programmable (PROM)

FIFO

Shift Register

CAM

LIFO


Memory Timing: DefinitionsMemory Timing: Definitions

Write cycleRead access Read access

Read cycle

Write access

Data written

Data valid

DATA

WRITE

READ


Memory Architecture: DecodersMemory Architecture: Decoders

Word 0

Word 1

Word 2

WordN22

WordN21

Storagecell

M bits M bits

S0

S1

S2

SN22

A0

A1

AK 21

K 5 log2N

SN21

Word 0

Word 1

Word 2

WordN22

WordN21

Storagecell

S0

Input-Output(M bits)

Intuitive architecture for N x M memoryToo many select signals:

N words == N select signals K = log2NDecoder reduces the number of select signals



Ro

w D

eco

de

r

Bit line2L 2 K

Word line

AK

AK1 1

AL 2 1

A0

M.2K

AK2 1

Sense amplifiers / Drivers

Column decoder


Array-Structured Memory ArchitectureArray-Structured Memory ArchitectureProblem: ASPECT RATIO or HEIGHT >> WIDTH

Amplify swing torail-to-rail amplitude

Selects appropriateword


Hierarchical Memory ArchitectureHierarchical Memory Architecture

Advantages:Advantages:1. Shorter wires within blocks1. Shorter wires within blocks2. Block address activates only 1 block => power savings2. Block address activates only 1 block => power savings

Globalamplifier/driver

Controlcircuitry

Global data bus

Block selector

Block 0

Rowaddress

Columnaddress

Blockaddress

Blocki BlockP 2 1

I/O


Block Diagram of 4 Mbit SRAMBlock Diagram of 4 Mbit SRAMClock

generator

CS, WEbuffer

I/Obuffer

Y-addressbuffer

X-addressbuffer

x1/x4controller

Z-addressbuffer

X-addressbuffer

Predecoder and block selectorBit line load

Transfer gateColumn decoder

Sense amplifier and write driver

[Hirose90]


Contents-Addressable MemoryContents-Addressable Memory

Ad

dre

ss D

eco

de

r

Data (64 bits)

I/O

Bu

ffe

rs

Comparand

CAM Array29 words3 64 bits

Mask

Control LogicR/W Address (9 bits)

Co

mm

an

ds

29 Va

lid

ity

Bit

s

Prio

rity

En

cod

er


Memory Timing: ApproachesMemory Timing: Approaches

DRAM TimingMultiplexed Adressing

SRAM TimingSelf-timed

Addressbus

RAS

RAS-CAS timing

Row Address

AddressBus

Address transitioninitiates memory operation

Address

Column Address

CAS


Read-Only Memory CellsRead-Only Memory Cells

WL

BL

WL

BL

1WL

BL

WL

BL

WL

BL

0

VDD

WL

BL

GND

Diode ROM MOS ROM 1 MOS ROM 2


MOS OR ROMMOS OR ROM

WL[0]

VDD

BL[0]

WL[1]

WL[2]

WL[3]

Vbias

BL[1]

Pull-down loads

BL[2] BL[3]

VDD


MOS NOR ROMMOS NOR ROM

WL[0]

GND

BL [0]

WL [1]

WL [2]

WL [3]

VDD

BL [1]

Pull-up devices

BL [2] BL [3]

GND


MOS NOR ROM LayoutMOS NOR ROM Layout

Programmming using theActive Layer Only

Polysilicon

Metal1

Diffusion

Metal1 on Diffusion

Cell (9.5 x 7)


MOS NOR ROM LayoutMOS NOR ROM Layout

Polysilicon

Metal1

Diffusion

Metal1 on Diffusion

Cell (11 x 7)

Programmming usingthe Contact Layer Only


MOS NAND ROMMOS NAND ROM

All word lines high by default with exception of selected row

WL [0]

WL [1]

WL [2]

WL [3]

VDD

Pull-up devices

BL[3]BL [2]BL [1]BL [0]


MOS NAND ROM LayoutMOS NAND ROM Layout

No contact to VDD or GND necessary;

Loss in performance compared to NOR ROM

drastically reduced cell size

Polysilicon

Diffusion

Metal1 on Diffusion

Cell (8 x 7)

Programmming usingthe Metal-1 Layer Only


NAND ROM LayoutNAND ROM LayoutCell (5 x 6)

Polysilicon

Threshold-alteringimplant

Metal1 on Diffusion

Programmming usingImplants Only


Equivalent Transient Model for MOS NOR ROMEquivalent Transient Model for MOS NOR ROM

Word line parasitics Wire capacitance and gate capacitance Wire resistance (polysilicon)

Bit line parasitics Resistance not dominant (metal) Drain and Gate-Drain capacitance

Model for NOR ROM VDD

Cbit

rword

cword

WL

BL


Equivalent Transient Model for MOS NAND ROMEquivalent Transient Model for MOS NAND ROM

Word line parasitics Similar to NOR ROM

Bit line parasitics Resistance of cascaded transistors dominates Drain/Source and complete gate capacitance

Model for NAND ROMVDD

CL

rword

cword

cbit

rbit

WL

BL


Decreasing Word Line DelayDecreasing Word Line Delay

Metal bypass

Polysilicon word lineK cells

Polysilicon word lineWL

Driver

(b) Using a metal bypass

(a) Driving the word line from both sides

Metal word line

WL

(c) Use silicides


Precharged MOS NOR ROMPrecharged MOS NOR ROM

PMOS precharge device can be made as large as necessary,but clock driver becomes harder to design.

WL [0]

GND

BL [0]

WL [1]

WL [2]

WL [3]

VDD

BL [1]

Precharge devices

BL [2] BL [3]

GND

pref


Non-Volatile MemoriesNon-Volatile MemoriesThe Floating-gate transistor (FAMOS)The Floating-gate transistor (FAMOS)

Floating gate

Source

Substrate

Gate

Drain

n+ n+_p

tox

tox

Device cross-section Schematic symbol

G

S

D


Floating-Gate Transistor ProgrammingFloating-Gate Transistor Programming

0 V

25 V 0 V

DS

Removing programming voltage leaves charge trapped

5 V

22.5 V 5 V

DS

Programming results in higher VT.

20 V

10 V 5 V 20 V

DS

Avalanche injection


A “Programmable-Threshold” TransistorA “Programmable-Threshold” Transistor

“0”-state “1”-state

DVT

VWL VGS

“ON”

“OFF”


FLOTOX EEPROMFLOTOX EEPROM

Floating gate

Source

Substratep

Gate

Drain

n1 n1

FLOTOX transistorFowler-Nordheim I-V characteristic

20–30 nm

10 nm

-10 V

10 V

I

VGD


EEPROM CellEEPROM Cell

WL

BL

VDD

Absolute threshold controlis hardUnprogrammed transistor might be depletion 2 transistor cell


Flash EEPROMFlash EEPROM

Control gate

erasure

p-substrate

Floating gate

Thin tunneling oxide

n1source n1drainprogramming

Many other options …


Cross-sections of NVM cellsCross-sections of NVM cells

EPROMFlashCourtesy Intel


Basic Operations in a NOR Flash Memory―Basic Operations in a NOR Flash Memory―EraseErase

S D

12 VG

cell arrayBL0 BL1

open open

WL0

WL1

0 V

0 V


Basic Operations in a NOR Flash Memory―Basic Operations in a NOR Flash Memory―WriteWrite

S D

12 V

6 VG

BL0 BL1

6 V 0 V

WL0

WL1

12 V

0 V


Basic Operations in a NOR Flash Memory―Basic Operations in a NOR Flash Memory―ReadRead

5 V

1 VG

S D

BL0 BL1

1 V 0 V

WL0

WL1

5 V

0 V


NAND Flash MemoryNAND Flash Memory

Unit Cell

Word line(poly)

Source line(Diff. Layer)

Courtesy Toshiba

Gate

ONO

FGGateOxide


NAND Flash MemoryNAND Flash Memory

Word linesSelect transistor

Bit line contact Source line contact

Active area

STI

Courtesy Toshiba


Characteristics of State-of-the-art NVMCharacteristics of State-of-the-art NVM


Read-Write Memories (RAM)Read-Write Memories (RAM) STATIC (SRAM)

DYNAMIC (DRAM)

Data stored as long as supply is appliedLarge (6 transistors/cell)FastDifferential

Periodic refresh requiredSmall (1-3 transistors/cell)SlowerSingle Ended


6-transistor CMOS SRAM Cell 6-transistor CMOS SRAM Cell

WL

BL

VDD

M5M6

M4

M1

M2

M3

BL

QQ


CMOS SRAM Analysis (Read)CMOS SRAM Analysis (Read)WL

BL

VDD

M 5

M 6

M 4

M1VDDVDD VDD

BL

Q = 1Q = 0

Cbit Cbit


CMOS SRAM Analysis (Read)CMOS SRAM Analysis (Read)

0

0

0.2

0.4

0.6

0.8

1

1.2

0.5 1 1.2 1.5 2Cell Ratio (CR)

2.5 3

Vo

ltage

Ris

e (

V)


CMOS SRAM Analysis (Write) CMOS SRAM Analysis (Write)

BL = 1 BL = 0

Q = 0

Q = 1

M1

M4

M5

M6

VDD

VDD

WL


CMOS SRAM Analysis (Write)CMOS SRAM Analysis (Write)


6T-SRAM — Layout 6T-SRAM — Layout

VDD

GND

QQ

WL

BLBL

M1 M3

M4M2

M5 M6


Resistance-load SRAM CellResistance-load SRAM Cell

Static power dissipation -- Want RL largeBit lines precharged to VDD to address tp problem

M3

RL RL

VDD

WL

Q Q

M1 M2

M4

BL BL


SRAM CharacteristicsSRAM Characteristics


3-Transistor DRAM Cell3-Transistor DRAM Cell

No constraints on device ratiosReads are non-destructiveValue stored at node X when writing a “1” = VWWL-VTn

WWL

BL1

M1 X

M3

M2

CS

BL2

RWL

VDD

VDD 2VT

DVVDD 2VTBL2

BL1

X

RWL

WWL


3T-DRAM — Layout3T-DRAM — Layout

BL2 BL1 GND

RWL

WWL

M3

M2

M1


1-Transistor DRAM Cell1-Transistor DRAM Cell

Write: CS is charged or discharged by asserting WL and BL.Read: Charge redistribution takes places between bit line and storage capacitance

Voltage swing is small; typically around 250 mV.

M1

CS

WL

BL

CBL

VDD2 VT

WL

X

sensing

BL

GND

Write 1 Read 1

VDD

VDD /2 V

V BL VPRE– VBIT VPRE–CS

CS CBL+------------= =V


DRAM Cell ObservationsDRAM Cell Observations 1T DRAM requires a sense amplifier for each bit line, due to charge redistribution read-out. DRAM memory cells are single ended in contrast to SRAM cells.The read-out of the 1T DRAM cell is destructive; read and refresh operations are necessary for correct operation. Unlike 3T cell, 1T cell requires presence of an extra capacitance that must be explicitly included in the design. When writing a “1” into a DRAM cell, a threshold voltage is lost. This charge loss can be circumvented by bootstrapping the word lines to a higher value than VDD


Sense Amp OperationSense Amp Operation

DV(1)

V(1)

V(0)

t

VPRE

VBL

Sense amp activatedWord line activated


1-T DRAM Cell1-T DRAM Cell

Uses Polysilicon-Diffusion Capacitance

Expensive in Area

M1 wordline

Diffusedbit line

Polysilicongate

Polysiliconplate

Capacitor

Cross-section Layout

Metal word line

Poly

SiO2

Field Oxiden+ n+

Inversion layerinduced byplate bias

Poly


SEM of poly-diffusion capacitor 1T-DRAMSEM of poly-diffusion capacitor 1T-DRAM


Advanced 1T DRAM CellsAdvanced 1T DRAM Cells

Cell Plate Si

Capacitor Insulator

Storage Node Poly

2nd Field Oxide

Refilling Poly

Si Substrate

Trench Cell Stacked-capacitor Cell

Capacitor dielectric layerCell plateWord line

Insulating Layer

IsolationTransfer gate

Storage electrode


Static CAM Memory CellStatic CAM Memory Cell

CAM

Bit

Word

Bit

••• CAM

Bit Bit

CAM

Word

Wired-NOR Match Line

Match M1

M2

M7M6

M4 M5M8 M9

M3int

SWord

••• CAM

Bit Bit

S


CAM in Cache MemoryCAM in Cache Memory

CAM

ARRAY

Input Drivers

Tag HitAddress

SRAM

ARRAY

Sense Amps / Input Drivers

DataR/W


PeripheryPeriphery

Decoders Sense Amplifiers Input/Output Buffers Control / Timing Circuitry


Row DecodersRow DecodersCollection of 2M complex logic gatesOrganized in regular and dense fashion

(N)AND Decoder

NOR Decoder


Hierarchical DecodersHierarchical Decoders

• • •

• • •

A2A2

A 2A3

WL 0

A2A3A2A 3A2A3

A3 A3A 0A0

A0A 1A 0A1A0A1A0A1

A 1 A1

WL 1

Multi-stage implementation improves performance

NAND decoder usingNAND decoder using2-input pre-decoders2-input pre-decoders


Dynamic DecodersDynamic Decoders

Precharge devices

VDD

GND

WL3

WL2

WL1

WL0

A0A0

GND

A1A1

WL3

A0A0 A1A1

WL 2

WL 1

WL 0

VDD

VDD

VDD

VDD

2-input NOR decoder 2-input NAND decoder


4-input pass-transistor based column 4-input pass-transistor based column decoderdecoder

Advantages: speed (tpd does not add to overall memory access time) Only one extra transistor in signal pathDisadvantage: Large transistor count

A0S0

BL 0 BL 1 BL 2 BL 3

A1

S1

S2

S3

D


4-to-1 tree based column decoder4-to-1 tree based column decoder

Number of devices drastically reducedDelay increases quadratically with # of sections; prohibitive for large decoders

buffersprogressive sizingcombination of tree and pass transistor approaches

Solutions:

BL 0 BL 1 BL 2 BL 3

D

A 0

A 0

A1

A 1


Decoder for circular shift-registerDecoder for circular shift-register

VDD

VDD

R

WL0

VDD

f

ff

f

VDD

R

WL1

VDD

f

ff

f

VDD

R

WL2

VDD

f

ff

f• • •


Sense AmplifiersSense Amplifiers

tpC V

Iav----------------=

make V as smallas possible

smalllarge

Idea: Use Sense Amplifer

outputinput

s.a.smalltransition


Differential Sense AmplifierDifferential Sense Amplifier

Directly applicable toSRAMs

M4

M1

M5

M3

M2

VDD

bitbit

SE

Outy


Differential Sensing ― SRAMDifferential Sensing ― SRAMVDD

VDD

VDD

VDD

BL

EQ

Diff.SenseAmp

(a) SRAM sensing scheme (b) two stage differential amplifier

SRAM cell i

WL i

2xx

VDD

Output

BL

PC

M3

M1

M5

M2

M4

x

SE

SE

SE

Output

SE

x2x 2x


Latch-Based Sense Amplifier (DRAM)Latch-Based Sense Amplifier (DRAM)

Initialized in its meta-stable point with EQOnce adequate voltage gap created, sense amp enabled with SEPositive feedback quickly forces output to a stable operating point.

EQ

VDD

BL BL

SE

SE


Charge-Redistribution AmplifierCharge-Redistribution Amplifier

0.5

1.0

1.5

2.0

2.5

0.0

0.0 1.00 2.00time (nsec)

V

Vin

Vref5 3V

VL

VS

(b) Transient response

3.00

Concept

M2 M3

M1VL VS

Vref

CsmallClarge

Transient Response


Charge-Redistribution Amplifier―Charge-Redistribution Amplifier―EPROMEPROM

SE

VDD

WLC

Load

Cascodedevice

Columndecoder

EPROMarray

BL

WL

Vcasc

Out

Cout

Ccol

CBLM1

M2

M3

M4


Single-to-Differential ConversionSingle-to-Differential Conversion

How to make a good Vref?

Diff.S.A.Cell

2xx

Output

WL

Vref

BL

12


Open bitline architecture with Open bitline architecture with dummy cellsdummy cells

CS CS CS CS

BLL

L L1 L0 R0

CS

R1

CS

L

… …

BLR

VDD

SE

SE

EQ

Dummy cell Dummy cell


DRAM Read Process with Dummy CellDRAM Read Process with Dummy Cell3

2

1

00 1 2 3

BL

BL

t (ns)

reading 03

2

1

00 1 2 3

SE

EQ WL

t (ns)

control signals

3

2

1

00 1 2 3

BL

BL

t (ns)

reading 1


Voltage RegulatorVoltage Regulator

-

+

VDD

VREF

Vbias

Mdrive

Mdrive

VDL

VDL

VREF

Equivalent Model


Charge PumpCharge Pump

CLK

VDD

A BM1

M2Vload

Cload

Cpump

2VDD 2 VT

VDD 2 VT

0 V

VB

Vload

0 V


DRAM TimingDRAM Timing


RDRAM ArchitectureRDRAM Architecture

memoryarray

Databus

Clocks

Column

Rowdemux packet dec.

packet dec.

Bus

k k3 l

demux


Address Transition DetectionAddress Transition Detection

DELAYtdA0

DELAYtdA1

DELAYtdAN2 1

VDD

ATD ATD

…


Reliability and YieldReliability and Yield


Sensing Parameters in DRAMSensing Parameters in DRAM

From [Itoh01]

4K

10

100

1000

64K 1M 16M256M 4G 64GMemory Capacity (bits/chip)

CD(1F)

CS(1F)

QS(1C)

Vsmax(mv)

VDD(V)

QS 5 CS VDD/2Vsmax 5 QS/(CS 1 CD)


Noise Sources in 1T DRamNoise Sources in 1T DRam

Ccross

electrode

a-particles

leakage CS

WL

BL substrate Adjacent BL

CWBL


Open Bit-line Architecture —Cross CouplingOpen Bit-line Architecture —Cross Coupling

SenseAmplifierC

WL1

BL

CBL

CWBL CWBL

CC

WL0

CCBL

C C

WLD WLD WL0 WL1

BL

EQ


Folded-Bitline ArchitectureFolded-Bitline Architecture

SenseAmplifier

C

WL1

CWBL

CWBL

C

WL0 WL0 WLD

CC

WL1

CC

WLD

BL CBL

BL CBL

EQ

x

x

y


Transposed-Bitline ArchitectureTransposed-Bitline Architecture

SA

Ccross

(a) Straightforward bit-line routing

(b) Transposed bit-line architecture

BL9

BL

BL

BL99

SA

Ccross

BL9

BL

BL

BL99


Alpha-particles (or Neutrons)Alpha-particles (or Neutrons)

1 Particle ~ 1 Million Carriers

WL

BL

VDD

n1

a-particle

SiO21

111

11

22

22

22


YieldYield

Yield curves at different stages of process maturity(from [Veendrick92])


RedundancyRedundancy

MemoryArray

Column Decoder

Redundantrows

Redundantcolumns

RowAddress

ColumnAddress

FuseBank:


Error-Correcting CodesError-Correcting Codes

Example: Hamming Codes

with

e.g. B3 Wrong

1

1

0

= 3


Redundancy and Error CorrectionRedundancy and Error Correction


Sources of Power Dissipation in Sources of Power Dissipation in MemoriesMemories

PERIPHERY

ROWDEC

selected

non-selected

CHIP

COLUMN DEC

nCDEV INTf

mCDEV INTf

CPTV INTf

IDCP

ARRAY

m

n

m(n21)ihld

miact

VDD

VSS

IDD 5 SCiDV if1S IDCP

From [Itoh00]


Data Retention in SRAMData Retention in SRAM1.30u

1.10u

900n

700n

500n

300n

100n

0.00 .600 1.20 1.80

Factor 7

0.13 m CMOSm

0.18 m CMOSm

VDD

I lea

kag

e

SRAM leakage increases with technology scaling


Suppressing Leakage in SRAMSuppressing Leakage in SRAM

SRAMcell

SRAMcell

SRAMcell

VDD,int

VDD

VDD VDDL

VSS,int

sleep

sleep

SRAMcell

SRAMcell

SRAMcell

VDD,int

sleep

low-threshold transistor

Reducing the supply voltageReducing the supply voltageInserting Extra ResistanceInserting Extra Resistance


Data Retention in DRAMData Retention in DRAM101

100

102 1

102 2

102 3

102 4

102 5

102 6

15M 64M 255M 1G 4G 15G 64G

Capacity (bit)

Curr

ent

(A)

3.3 2.5 2.0 1.5 1.2 1.0 0.8

Operating voltage (V)

0.53 0.40 0.32 0.24 0.19 0.16 0.13

Extrapolated threshold voltage at 25 C (V)

IACT

IAC

IDC

Cycle time : 150 nsT 5 75 C,S

From [Itoh00]


Case StudiesCase Studies

Programmable Logic Array SRAM Flash Memory


PLA versus ROMPLA versus ROM Programmable Logic Array

structured approach to random logic“two level logic implementation”

NOR-NOR (product of sums)NAND-NAND (sum of products)

IDENTICAL TO ROM!

Main differenceROM: fully populatedPLA: one element per minterm

Note: Importance of PLA’s has drastically reduced1. slow2. better software techniques (mutli-level logic

synthesis)But …


Programmable Logic ArrayProgrammable Logic Array

GND GND GND GND

GND

GND

GND

VDD

VDD

X0X0 X1 f0 f1X1 X2X2

AND-plane OR-plane

Pseudo-NMOS PLA


Dynamic PLADynamic PLA

GND

GNDVDD

VDD

X0X0 X1 f0 f1X1 X2X2

ANDf

ANDf

ORf

ORf

AND-plane OR-plane


Clock Signal Generation Clock Signal Generation for self-timed dynamic PLAfor self-timed dynamic PLA

f

tpre teval

f AND

f

f AND

f AND

fOR

fOR

(a) Clock signals (b) Timing generation circuitry

Dummy AND row

Dummy AND row


PLA LayoutPLA LayoutVDD GNDAnd-Plane Or-Plane

f0 f1x0 x0 x1 x1 x2 x2

Pull-up devices Pull-up devices


4 Mbit SRAM4 Mbit SRAMHierarchical Word-line ArchitectureHierarchical Word-line Architecture

Global word line

Sub-global word line

Block groupselect

Blockselect

Blockselect

Memory cell

Localword line

Block 0

•••

Localword line

Block 1

•••

Block 2...

•••


Bit-line CircuitryBit-line Circuitry

Bit-lineload

Blockselect ATD

BEQ

Local WL

Memory cell

I/O lineI/O

B/T

CD

Sense amplifier

CD CD

I/O

B/T


Sense Amplifier (and Waveforms)Sense Amplifier (and Waveforms)

BS

I /O I /O

DATA

Blockselect ATD

BSSA SA

BS

SEQ

SEQ

SEQ

SEQSEQ

Dei

I/O Lines

Address

Data-cut

ATD

BEQ

SEQ

DATA

Vdd

GND

SA, SA

Vdd

GND


1 Gbit Flash Memory1 Gbit Flash Memory

Sense Latches(10241 32)3 8

Data Caches(10241 32)3 8

Sense Latches(10241 32)3 8

Data Caches(10241 32)3 8

Wo

rd L

ine

Dri

ver

Wo

rd L

ine

Dri

ver

Wo

rd L

ine

Dri

ver

Wo

rd L

ine

Dri

ver

512Mb Memory Array 512Mb Memory Array

BL0 BL1 ····· BL16895 BL16996 BL16897··· BL33791

SGDWL31

WL0SGS

Block0

BLT0

Block1023

Block0

Block1023

Bit Line Control CircuitBLT1

I/O

From [Nakamura02]


Writing Flash MemoryWriting Flash MemoryN

um

be

r of

me

mo

ry c

ell

s

0V 1V 2V

Vt of memory cells

Verify level5 0.8 V Word-line level5 4.5 V

(a)

3V 4V

Result of 4 timesprogram

100

0V 1V 2V

Vt of memory cells

3V 4V

102

104

106

108

Evolution of thresholds Final Distribution

From [Nakamura02]


125125mmmm22 1Gbit NAND Flash Memory 1Gbit NAND Flash Memory

10.7

mm

11.7mm

2kB

Pa

ge b

uffe

r &

ca

che

Ch

arg

e p

ump

16896 bit lines

32 word lines x 1024 blocks

From [Nakamura02]


125125mmmm22 1Gbit NAND Flash Memory 1Gbit NAND Flash Memory

Technology 0.13m p-sub CMOS triple-well 1poly, 1polycide, 1W, 2Al Cell size 0.077m2 Chip size 125.2mm2 Organization 2112 x 8b x 64 page x 1k block Power supply 2.7V-3.6V Cycle time 50ns Read time 　 25s Program time 200s / page Erase time 2ms / block

Technology 0.13m p-sub CMOS triple-well 1poly, 1polycide, 1W, 2Al Cell size 0.077m2 Chip size 125.2mm2 Organization 2112 x 8b x 64 page x 1k block Power supply 2.7V-3.6V Cycle time 50ns Read time 　 25s Program time 200s / page Erase time 2ms / block

From [Nakamura02]


Semiconductor Memory TrendsSemiconductor Memory Trends(up to the 90’s)(up to the 90’s)

Memory Size as a function of time: x 4 every three years


Semiconductor Memory TrendsSemiconductor Memory Trends(updated)(updated)

From [Itoh01]


Trends in Memory Cell AreaTrends in Memory Cell Area

From [Itoh01]


Semiconductor Memory TrendsSemiconductor Memory Trends

Technology feature size for different SRAM generations

Chapter 12

Documents

wl bl wl bl wl bl

memory cells wl bl wl

rom wl

word n

r word c word wl bl

gnd bl

dd wl bl gnd diode rom

bias bl