Certificate of Environmental Compliance 1389 Moffett Park Drive, Sunnyvale, CA 94089-1133, USA Page 1 of 21 www.finisar.com template ver: 2019-0920 20-Sep-2019 See included matrix The undersigned, an employee and authorized representative of Finisar Corporation, certifies that to the knowledge of Finisar Corporation, as of the date shown, the product listed on this certificate complies with the following environmental regulations. For a complete listing of the product material content, by component, sub-part, and homogenous material layer, refer to the product’s material declaration. RoHS: the Directive (EU) 2011/65/EU regarding the Restriction of Hazardous Substances and Annex II as amended by EU Commission decision 2015/863. Except as allowed by specific exemptions noted below, the substances listed in the directive are not intentionally added to Finisar products. The level of these substances is less than the allowable maximum concentration value of: 0.1% by weight in homogeneous materials for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr-6+), PBBs, PBDEs (including DecaBDE), Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP) and Diisobutyl phthalate (DIBP); and 0.01% by weight in homogeneous materials for Cadmium (Cd). 6a(i) Lead (Pb) as an alloying element in steel for machining purposes containing up to 0.35% lead by weight and in batch hot dip galvanized steel components containing up to 0.2% lead by weight 6c Copper (Cu) alloy containing up to 4% Lead (Pb) by weight 7a Lead (Pb) in high melting temperature type solders (lead-based alloys containing 85% by weight or more lead) 7c(i) Electrical and electronic components containing Lead (Pb) in a glass or ceramic other than dielectric ceramic in capacitors (piezoelectronic devices) or in a glass or ceramic matrix compound 13a Lead (Pb) in white glasses used for optical applications 15a Lead in solders to complete a viable electrical connection between the semiconductor die and carrier within integrated circuit flip chip packages where at least one of the following criteria applies: — a semiconductor technology node of 90 nm or larger; — a single die of 300 mm2 or larger in any semiconductor technology node; — stacked die packages with die of 300 mm2 or larger or silicon interposers of 300 mm2 or larger. None Other Substances: Additionally, none of the following generally banned materials are intentionally added to Finisar products or packing materials: • Asbestos • Azo compounds • CFCs or other Class 1 ozone depleting substances • Chlorinated paraffins (chlorine flame retarding materials/plasticizers) • Hexabromocyclododecane (HBCDD, CAS #25637-99-4 and #3194-55-6) • Organic tin compounds (tributyl tin category / triphenyl tin category) • Polychlorinated biphenyls (PCBs) or Polychlorinated naphthalenes • Radioactive substances Sincerely, Cecillia Loong Green Compliance Program Manager
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Certificate of Environmental Compliance
1389 Moffett Park Drive, Sunnyvale, CA 94089-1133, USA Page 1 of 21 www.finisar.com template ver: 2019-0920
20-Sep-2019
See included matrix The undersigned, an employee and authorized representative of Finisar Corporation, certifies that to the knowledge of Finisar Corporation, as of the date shown, the product listed on this certificate complies with the following environmental regulations. For a complete listing of the product material content, by component, sub-part, and homogenous material layer, refer to the product’s material declaration.
RoHS: the Directive (EU) 2011/65/EU regarding the Restriction of Hazardous Substances and Annex II as amended by EU Commission decision 2015/863. Except as allowed by specific exemptions noted below, the substances listed in the directive are not intentionally added to Finisar products. The level of these substances is less than the allowable maximum concentration value of: 0.1% by weight in homogeneous materials for Lead (Pb), Mercury (Hg), Hexavalent Chromium (Cr-6+), PBBs, PBDEs (including DecaBDE), Bis(2-ethylhexyl) phthalate (DEHP), Butyl benzyl phthalate (BBP), Dibutyl phthalate (DBP) and Diisobutyl phthalate (DIBP); and 0.01% by weight in homogeneous materials for Cadmium (Cd).
6a(i) Lead (Pb) as an alloying element in steel for machining purposes containing up to 0.35% lead by weight and in batch hot dip galvanized steel components containing up to 0.2% lead by weight
6c Copper (Cu) alloy containing up to 4% Lead (Pb) by weight 7a Lead (Pb) in high melting temperature type solders (lead-based alloys containing 85% by
weight or more lead) 7c(i) Electrical and electronic components containing Lead (Pb) in a glass or ceramic other
than dielectric ceramic in capacitors (piezoelectronic devices) or in a glass or ceramic matrix compound
13a Lead (Pb) in white glasses used for optical applications 15a Lead in solders to complete a viable electrical connection between the semiconductor die and
carrier within integrated circuit flip chip packages where at least one of the following criteria applies: — a semiconductor technology node of 90 nm or larger; — a single die of 300 mm2 or larger in any semiconductor technology node; — stacked die packages with die of 300 mm2 or larger or silicon interposers of 300 mm2 or
larger. None
Other Substances: Additionally, none of the following generally banned materials are intentionally added to Finisar products or packing materials:
• Asbestos • Azo compounds • CFCs or other Class 1 ozone depleting substances • Chlorinated paraffins (chlorine flame retarding materials/plasticizers) • Hexabromocyclododecane (HBCDD, CAS #25637-99-4 and #3194-55-6) • Organic tin compounds (tributyl tin category / triphenyl tin category) • Polychlorinated biphenyls (PCBs) or Polychlorinated naphthalenes • Radioactive substances
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