CERN PCB workshop activities Rui de Oliveira on behalf of PCB workshop team 29/11/20121.

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CERN PCB workshop activities

Rui de Oliveira on behalf of PCB workshop team

29/11/2012

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outline

• Activity• Technologies• Resistors• MPGD history• RD51 collaboration participation• Developments• Trainings• Gallery29/11/2012

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Activities 2013

PCB 30%MPGD 50%C-milling 5%Low-mass 4%embedded 1%

20 persons Building :1000 sqr metersMaking PCBs since 1960

-PCB-Rigid-Flex-Flex-rigid-Microvias -fine line (10um)-large size (up to 2m)-Thick film Hybrids-Thin film Hybrids

-Chemical milling-Cu, Fe, Al, Au, Ag, W, Mb, Ti, Cr, Ni

-MPGD-GEM/thinGEM/THGEM/RETHGEM-MSHP/Cobra-MICROMEGA/ Bulk/ Micro-BULK -RES BULK-Resistive MSGC -R&D on new structures

-Low mass circuits-Multilayer flexes with aluminum

strips-embedded heat sinks (carbon, graphite,metals, diamon)

-Embedded components-passive -Active

Activities

1.7 Mchf/year turnover + 10% in 2013

6 Mchf equipment

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Technologies• In house

– All processes related to Photolithography technics– Chemical and electrochemical plating– CNC dilling and milling for small pattern– Chemical etching of metals and dielectrics– Vacuum + high pressure gluing– Screen printing (metal , dielectrics and resistors)– Clean rooms ( class 100 , 1000 and 10000)

• Close collaboration with industry for:– Vacuum deposition ( Metal resistors dielectrics)– Laser drilling and milling– Plasma etching (RIE)– Large PCBs mass production– Large screen printing mass production

• In study – New generation Ink jet printers (metal resistors dielectrics)

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Resistors

13/04/2011

-A Resistor is define by:-Value Ohms-Precision %-TCR ppm/Deg C-max power W or W/m2-breakdown voltage V

-Resistivity in Ohm*m

-Sheet resistance or surface resistivity in Ohm/sqr

-TCR: Temperature coefficient of the resistor

-Cermet: is a composite material composed of ceramic (cer) and metallic (met) materials.

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Resistors for static dissipative application available at CERN

• Screen printed polymers • Filled cavity polymers• Screen printed RuO resistors• DLC vacuum deposited resistors• Resistive Kapton

• All of them can be paterned

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Resistors why carbon?

• @ 300 K in (Ω·m)– Silver 16·10-9 (Ω·m)– Ruthenium 71 10-9 (Ω·m)– Germanium 460·10-9 (Ω·m)– Ni/Cr 1000·10-9 (Ω·m)– Carbone 35 000·10-9 (Ω·m)

13/04/2011

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‘96: GEM 50 x 50mm with a gain of 10.‘97: GEM 100 x 100mm with gain of 1000.‘98: GEM 400 x 400mm; 1D and 2D readouts; micro-groove and micro-

well detectors.‘00: 3D GEM readout; 1D readout for Micromegas in COMPASS.‘01: PIXEL GEM readout; 2D Micromegas readout.‘03: PIXEL Micromegas readout. ‘04: Bulk Micromegas detector 100mm x 100mm. Micro BULK detectors‘06: Half cylindrical GEM detector.’08: first large GEM 1.2m x 0.4m. First spherical GEM‘09: first large BULK Micromegas 1.5m x 0.5m‘11: First resistive Bulk Micromegas 100mm x 100mm‘12: First 30cm x 30cm NS2 GEM detector‘12: First 1m2 Resistive Micromegas‘12: First 2m2 Resistive Micromegas ‘12: First NS2 GEM detector 1.2m x 0.5m‘12: Full cylindrical GEM detector‘14: GEM 2m x 0.5m ?? Micromegas 3.4m x 2.2m ??

MPGD history

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Participation in RD51

• WG1 :R&D on new structures, we have introduce:– Bulk Micromega ( with Saclay collaboration)– Resistive protections (with Atlas Collaboration)– Large GEM (with CERN GDD/CMS/INFN Frascati/TUM

Munich …)– GEM embedded stretching system NS2

• WG6 :Industrialisation, our contribution:– Companies visits (more than 10)– TT transfer with selected companies– Institutes trainings

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Passed developments

• Large size GEM

• Blind GEM / Micro well

• Chemical micro-vias

• Bulk Micromegas

• Resistive protections in Micromegas detectors

• Capacitive couplings to reduce electronic channel count

• Piggy Back Micromegas

• Micro BULK Micromegas

• PG and TPG thermal management devices

• Full Aluminium circuits

• Embedded active devices in flex

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Trainings and TT

29/11/2012

• GEM production training and TT:– Techtra 2 weeks at CERN + full technology transfer– Xiaomei Li (CIAE Beijing) 1 week at CERN– Tech-etch full technology transfer– Mecaronics full technology transfer – Close to 10 licenced companies

• Micromegas production training and TT:– CEA Saclay (BULK and resistive protection) many iterations @CERN – CEA Saclay : BULK facility review @ Saclay– CIREA and ELTOS (BULK and resistive) 2 Days @ CERN + 2 days @ ELTOS +

full TT– INFN Frascati (Large Micromegas detector) 2 months @CERN

• THGEM production– VECC KolKata (polyurethane protection) 1 day @CERN– Weissmann institute Israel (test and Cleaning) 2 days @CERN

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GEM Single mask examples

•KLOE – Cylindrical 3 GEM Detector•GEM 800mm x 500mm•Read-out 2D : 800mmx 500mm

•GEM 1.1m x 500mm•CMS GEM detector GE1/1

03/10/12

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CMS GE1/1 NS2 detector

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Bulk Micromegas examples

Largest size produced:2m x 1m

BULK TechnologyDUPONT PC 1025 coverlayBOPP MeshesSERITEC stretching

T2K ILC DHCAL

detector opened

detector closed

ATLAS NSW

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Thank you

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Thin film

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Thin film

13/04/2011

WEB SITE: http://www.ohmega.com

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Thick film

13/04/2011

Some supplier can build 100 Mohms/sqr pastes

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Polymer resistive pastes

13/04/2011

1 Mohms/Sqr seems to be the limit for these polymers

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Polymer Resistive foils

13/04/2011

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Other products

13/04/2011

Conductive TPEs - Thermoplastic Elastomer Plastic Compounds - RTP Company.url

AI Technology, Inc. - ESD Protection Coatings & Materials.url

ESD EMI Engineering Corporation.url

Thermoplastic compound conducts electrical charge, Cover Story, Jobwerx.url