Ceprei march 2016

www.ecccorp.orgwww.iecq.org

• IECQ Annual Meeting Singapore April 2015.• Presented v.2.0 to IECQ Exec - then at MC.• At MC Dr Wan, CEPREI offers to be Convener WG.• IECQ Chairwomen states Product too mature for WG.• IECQ Secretary Links ECCC and BSI for AC Specification.• September 2015: IECQ Spec. e-Labelling Published.• June 2015: USNC Launches E-Label WG, Dell Convener.• Schrempp (Dell) and ECCC each present at USNC Council.• ITI published draft Standard. ECCC www.e-Labelling.com• Schrempp agrees ITI and ECCC should Harmonize efforts.

History of ECCC e-Labelling


Current List of ITI Members


National Interest: e-Labelling

Per ITI: These countries have e-Labelling initiatives• US• Canada• Malaysia• Australia• China• Taiwan• South Korea• EU

Most are following similar paths to the US.


What is E Label?

• E Label is:• Enhanced Labelling, Accessing, and Branding of Electronics Licenses Act of 2014

• “Directs FCC to provide (through rules or otherwise) that manufacturers of RF devices with electronic displays (i.e. Screens) have the option of using electronic labelling instead of physical labelling for their product”.

• E-LABEL Act’s stated purpose is to “provide for the non-exclusive use” of electronic labelling on RF devices.

• Its reach is not limited to devices subject to certification or DECLATATION OF CONFORMITY, so products currently subject to verification can now have the electronic labeling option as well.

• ECCC acquired Domains E-LABEL.UK and E-LABELLING.COM


E-Labelling Standard

E-Labelling may be affixed to or laser marked onto the surface of electronic devices or components


Two Ways to Produce E Labels

Two separate directions to the Specification:

1. Printing an e-Label

2. Laser Marking an e-Label


ECCC Created E-Labelling Standard

Scope of the new Standard:

“E-Labelling, may be affixed to, or laser etched into the surface of electronic devices and components.”

ECCC does not print the label. ECCC created the Standard and QMS that was audited by BSI for the knowledge to teach how to produce a label that is compliant.


Printed Label on a Dell Laptop

X 3

X 3

X 2

X 2

X 2

There is space for a 4th Label for a new market with different regulatory requirements


What Does e-Label Do?

Replaced this With this


Print e-Label View from ITI


Why is E-Label so Powerful From This

You Get All This

Because of Attachments!!!!!!


Key Elements of E-Labelling

• Affixable Printed Product or Laser Etched.• Requires Small Piece of Product real estate. • Replaces multiple regulatory marks with one.• Information never out-of-date - always real-time.• Tracks individual products not SKU’s or model #s• Customs (ICE) can decode label with Smartphone.


What is the E-Label Mark

Similar to QR Code – Except Safe and Secure – Every e-Label is unique


For a Printed e-Label

• ECCC has developed the requirements for producing and grading a printed e-label.

• ECCC & CTECCB are producing the auditor training materials.

• ECCC has produced the calibration tools and measurement methods.

• ECCC, CTECCB and IECQ will prepare the audit and testing materials


Requirement to Print an E-Label

• Minimum 600 DPI Printer• Minimum: Aven Mighty-Scope Digital Microscope (or equivalent)

with 1.3 M.P. resolution, 0 - 200 X with 6 co-axial LED’s.• E-Labelling software/App• Verifier Software.• ECCC E-Labelling Print Calibration Master

Aven Mighty-Scope


E-Labelling Calibration Master

24 x 24 mm 18 x 18 mm 12 x 12 mm

ECCC E-Labelling Print Calibration Master

Copyright © 2015 ECCC All Rights Reserved Version 1.0

8 x 8 mm

DO NOT LAMINATE

Serial # 0123456789

ECCC E-Labelling Print Calibration Masters are digitally printed by Memjet with1,600 DPI

Resolutions and will read 4.0 with the verifier if correctly positioned


Basic Principals Printed Label

• Products utilizing e-Labels must have a physical label on the product at the time of importation, marketing or sale. It shall be visible to purchaser at time of purchase.

• Access information in no more than 3 steps in a device’s menu

• Removable label must survive normal shipping and handling.

• For devices imported in individual packages ready for sale, the information may also be provided on the package. It shall contain:– FCC ID and DoC logo– Any other such information required by specific rule - unless it is permitted to be

included in user manual or packaging inserts - even if electronically displayed .


Marketing and Consumer View

Important Consumer Device Information:

• “user must be provided specific instructions on how to access the information”. [748748, II (b) (iii)]

• “required to have a physical Label on the product at the time of importation, marketing or Sales”. [748748, II (c)]

• “must clearly differentiate between the information required to be on the surface of the product and the information required for the User’s Manual”. [748748, II (d) (iv) (2)]


Requirement of the US Act

External Physical “Label” as required by Act

i-Phone e-Label accessible after 3 steps?


i-Phone e-Label : 3 Step Access

3 Click Access:Setting >General >

Regulatory

Mandatory FCC:Unique ID

FCC ID: DOC (Logo)


e-Label: 1st Step after Decode


Select FCC Regulatory Option


Select Packaging Label


Select FCC Statement


E-Labelling for Components• For past 3-years ECCC BOD members have

published at anti-counterfeiting conferences for mature IC’s.

• Efforts centered on Laser Marking to prove supply chain security.

• Connections were established with OEM’s.• After Singapore meeting. Programs with small

IC OEM’s for laser marking e-Label - concurrent with other marking.

•


Section of Laser Marked IC’s

https://www.google.com/url?sa=i&rct=j&q=&esrc=s&source=images&cd=&cad=rja&uact=8&ved=0ahUKEwjC6o_f6r3KAhWMuIMKHVpaDekQjRwIBw&url=https://commons.wikimedia.org/wiki/File:Ic-photo-intel-D80287-8.png&bvm=bv.112454388,d.amc&psig=AFQjCNHqf-bVw51-5ZW4kscIh7K1xceqlQ&ust=1453564505787781

http://www.google.com/url?sa=i&rct=j&q=&esrc=s&source=images&cd=&cad=rja&uact=8&ved=0ahUKEwifhav05L3KAhXJw4MKHZbYCZ0QjRwIBw&url=http://bells00085.en.ec21.com/Intel_FW82801CAM_HUB3_ICH3_M--3412076_3412452.html&bvm=bv.112454388,d.amc&psig=AFQjCNHqf-bVw51-5ZW4kscIh7K1xceqlQ&ust=1453564505787781


Date China Entity Announcement2Q14 Fuzhou Rockchip

Signed a product development agreement with Intel for x86 Atom Processors

3Q14 Tsinghua Unigroup Acquired RDA Microelectronics for $907 million.3Q14 Tsinghua Unigroup Intel acquired a 20% stake in Tsinghua for $1.5 Billion, which also

owns Spreadtrum and RDA Microelectronics3Q14 Xiamen Government & Fujian

ElectronicsFormed partnership with UMC to build a $2.6 billion 300nm fab in Xiamen, China

1Q15 SMIC As part of Qualcomm’s settlement with China’s NDRC, the company agreed to expand its partnership with SMIC

2Q15 Hua Capital Management & other Chinese investors

US based CMOS image sensor specialist Omnivision agreed to be purchased for $1.9 billion

2Q15 Uphill Investment U.S. based DRAM and SRAM specialist ISSI agreed to be purchased for $731 million

2Q15 JAC Capital NXP announced that it was selling its RF power business to the investment group for $1.8 billion

2Q15 SMIC & Huawei Announced that SMIC, Huawei, Qualcomm and IMEC would form a joint R & D company for 14nm technology

2Q15 Hefei Construction Investment and Holding

Formed a joint venture with Powerchip to construct a $2.2 billion LCD driver Fab in Hefei, China

2Q15 JCET-SC, SMIC Offered to purchase Singapore based OSAT STATS ChipPAC for $780 million

3Q15 Tsinghua Unigroup Made a $23 billion offer to purchase U.S. based memory giant Micron. Withdrawn – lack of political feasibility.

2015

Beijing IC Industrial Development Fund & Other

Chinese Investors

In 2014 Chinese Investors contributed $465 million to SMIC’s 300mm diameter wafer and a further $350 million in 2015

4Q15 TSMC & Potentially Chinese Investors

TSMC is expected to announce construction of a 300mm Fab in China for 20/28 nm product and may partner with Chinese Investors

1Q16 China Resources Holding and Hua Capital Management

Offer of $2.9 Billon for Fairchild Semiconductor International Blocked by CFIUS (Committee on Foreign Investment in US

4Q15 Nanchang Industrial Group, GO Scale Capital & other investors

Offer of $3.3 Billion for 80% of Lumileds Division of Phillips Electronics blocked by US CFIUS

China Entering IC’s Space


ECCC Request of CEPREI

• ECCC is seeking co-operation with CEPREI• Guidance from CEPREI • To work with designated clients• Establish training.• Harmonize efforts.• Produce a global standard for e-Labelling.

Ceprei march 2016

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