CEO Welcome and NANIUM Overview - SEMI.ORG | CEO...CEO Welcome and NANIUM Overview JUNE 2015 Nanium · SEMI Tech Seminar, June 2015 - Confidential Located halfway between the US and

CEO Welcome and

NANIUM Overview

JUNE 2015

Nanium · SEMI Tech Seminar, June 2015 - Confidential

Located halfway between the US and Asia, we offer all

the European advantages at competitive cost

2

Located in the west coast of Portugal,

NANIUM is the largest OSAT in Europe


In-house services to enable products from concept

to market

3


Worldwide presence

4

NANIUM LOCATION

CUSTOMER BASE

NANIUM LOCATION

CUSTOMER BASE


Service offer and strengths

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THE WAFER-LEVEL

PACKAGE SOLUTION

PROVIDER

WLCSP

WL3D WLSiP

WLFO

Nanium · SEMI Tech Seminar, June 2015 - Confidential 6

WLP is growing faster than industry


An increasingly connected World


Key Diff.

factors Why Example of products

Feature Size

Wafer Level Package (both WLCSP and

WLFO) offers the smallest package form-factor

Frequency

Speed Capable of operating at Very High Frequency

Fab Location

Secure and Safe environment

Highest level of IP protection

Encryption, Biometric Validation…….

Integration

WLSiP, WL3D:

Heterogeneous integration (Silicon, GaN, GaAs)

Passives integration, die partitioning, sensors

NANIUM Differentiating in Target Markets

8


PAST 2014 2015 2016-18

WB-SD-wBGA

WLCSP

WLPOP/ WL3D-1

WB-MD-wBGA

WLCSP+

WLSIP/ WLPIP

WLMCM

WL3D-F2F

WLFO-POP

SS-ML-WLFO SS-SL-WLFO-BGA

SS-SL-WLFO-LGA WB-SD-BGA

WB-MD-BGA

DS-WLFO/ WLSIP

WLPOP/ WL3D-2

WB-RDL

WLSTACK

Fan-In WLP

Fan-Out WLP/ Embedding

NANIUM Package Roadmap

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9x8mm² 8x8mm²

5x5mm²

Sensor Integration

Embedded Wafer-Level System Integration

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The Worlds Largest WLCSP in Volume

Main Features:

- 25mm x 23mm, 28nm CMOS GF (5.5 bn transistors)

- ASIC, consumes in peak load hundreds of Watt

- 1,188 BGA I/O-Matrix 380um balls w/ 700um pitch

- Special TCoB optimized solder ball alloy

- Reliability tests w/ fully connected Daisy Chain, no UF

- Tested with 2 dielectric materials (PBO and PI)

- PBO: Passed 400 TCoB (IPC-9701 – TC2)

- PI: Passed 600 TCoB (IPC-9701 – TC2)

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Thank you for

your attention

NANIUM S.A.

Avenida 1º de Maio 801

4485-629 Vila do Conde

Portugal


DEVELOPMENT INNOVATION: Press Release

13

…………

“The idea of WLCSP+ was born at NANIUM already during the second half of 2012”, explained Steffen

Kroehnert, the company’s Director of Technology. “A customer with already singulated thick dies from so-

called Multi-Project-Wafers (MPW) approached us asking for single-die thickness reduction and, if possible,

also active surface cleaning and pad activation for the following wire bond process in a QFN package.”

…………


MEDICAL MARKET: Press Release

14

…………

“The ultra-compact, pocket-sized, Sonic Window is unlike any portable ultrasound device

available on the market today,” said Jim Green, Analogic’s president and chief executive

officer. “We are addressing an unmet need to bring clinicians better vascular access and

care to challenging patients in their practices. Integrating all this processing capacity in such

an extremely small space was a critical requirement. We were impressed with NANIUM’s

capabilities in core areas such as package research, development, test and manufacture.”

………..

http://www.sti-ultrasound.com/index.htm


…………

““We are investing significant resources and effort to advance our flagship packaging technology,” said

Armando Tavares, president and CEO of NANIUM. “Achieving this higher reliability level gives eWLB

technology access to new applications and markets, presenting us with a wide range of opportunities.”

………..

DEVELOPMENT INNOVATION: Press Release


Full 12”/300mm production capabilities

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Wafer-level services

including Wafer-

Prep, Recon,

Lithography, Solder

Ball Attach and

Wafer Test.

Our package offer

includes

WLCSP, WLFO,

WLSiP and WL3D.


WLP solutions beyond our customers’

expectations

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THE WAFER-LEVEL

PACKAGE SOLUTION

PROVIDER


WLCSP WLFO

WL3D WLSiP

WLCSP (WAFER-LEVEL CHIP SCALE PACKAGE)

WLCSP enable low-cost Manufacturing of

small die sizes, with low I/O density and high

performance. They cover a wide range of die

sizes, bump height and pitch and Si-die

thickness

Our offer includes WLCSP+, an application of

WLFO Technology know-how to WLCSP that

provides additional edge protection


expectations


WLCSP WLFO

WL3D WLSiP

WLFO (WAFER-LEVEL FAN-OUT)

> 550 MILLION UNITS SHIPPED

WLFO allows for system integration on

wafer-level with the highest integration

density, while also ensuring top

performance.


expectations


WLCSP

WL3D WLSiP

WLSIP (WAFER-LEVEL SYSTEM-IN-PACKAGE)

Our embedded integration solutions

include Multi-Chip Modules with or

without passives integration.

WLFO

Relevant markets for WLSiP

include Wearables and IoT


expectations


WLCSP

WL3D WLSiP

WL3D (WAFER-LEVEL 3D INTEGRATION)

Cutting-edge package solutions that

integrate several packages into a single one.

Includes Wafer-Level Package-on-Package

and Face-to-Face (F2F) package assembly

WLFO

Relevant markets for WL3D

include Wearables and IoT


expectations

CEO Welcome and NANIUM Overview - SEMI.ORG | CEO...CEO Welcome and NANIUM Overview JUNE 2015 Nanium · SEMI Tech Seminar, June 2015 - Confidential Located halfway between the US and

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