申報中等學校師資職前教育 專門課程規劃書 （機械群—機械科）cfte.web.nthu.edu.tw/ezfiles/20/1020/attach/22/pta_2133_6700490_69553.pdf · W. F. Smith and

清華大學師資培育中心

申報中等學校師資職前教育

專門課程規劃書

（機械群—機械科）

附錄

專門課程各科目課程大綱

附錄目錄

1. 材料科學導論........................................................................................................ 1

2. 材料科學導論一.................................................................................................... 2

3. 材料科學導論二.................................................................................................... 4

4. 材料科學與工程一................................................................................................ 5

5. 材料科學與工程二................................................................................................ 6

6. 應用力學一............................................................................................................ 7

7. 應用力學二............................................................................................................ 9

8. 工程力學.............................................................................................................. 10

9. 機動學.................................................................................................................. 11

10. 高等機構學 .......................................................................................................... 12

11. 工程圖學 .............................................................................................................. 13

12. 機械設計製圖 ...................................................................................................... 15

13. 工場實習 .............................................................................................................. 16

14. 機械製造 .............................................................................................................. 17

15. 材料力學 .............................................................................................................. 18

16. 機械設計 .............................................................................................................. 19

17. 機械元件設計 ...................................................................................................... 21

18. 精密機械設計一 .................................................................................................. 22

19. 精密機械設計二 .................................................................................................. 23

20. 機電整合控制程式設計 ...................................................................................... 24

21. 專題研究一 .......................................................................................................... 26

22. 專題研究二 .......................................................................................................... 27

23. 實作專題一 .......................................................................................................... 28

24. 實作專題二 .......................................................................................................... 30

25. 控制系統一 .......................................................................................................... 31

26. 控制系統二 .......................................................................................................... 32

27. 微處理機系統 ...................................................................................................... 33

28. 微算機導論 .......................................................................................................... 35

29. 嵌入式系統與實驗 .............................................................................................. 36

30. 電控實驗 .............................................................................................................. 37

31. 電腦輔助設計與製造 .......................................................................................... 38

32. 電機控制 .............................................................................................................. 40

33. 電動機械一 .......................................................................................................... 42

34. 電動機械 .............................................................................................................. 43

35. 應用電子學一 ...................................................................................................... 45

36. 應用電子學二 ...................................................................................................... 46

37. 電子學一 .............................................................................................................. 47

38. 電子學二 .............................................................................................................. 49

39. 電腦輔助製造專題 .............................................................................................. 50

40. 儀器與量測 .......................................................................................................... 52

41. 量測系統與實驗 .................................................................................................. 53

42. 光機電系統設計 .................................................................................................. 54

43. 電磁式微機電元件及應用 .................................................................................. 57

44. 射頻微機電元件及應用 ..................................................................................... 58

45. 材料實驗一 ......................................................................................................... 61

46. 材料實驗二 ......................................................................................................... 62

47. 材料實驗三 ......................................................................................................... 63

48. 固體力學與奈米材料實驗 ................................................................................. 64

附錄-1

1. 材料科學導論

課程說明

The course introduces materials science with the design-led

approach that is specifically developed to guide material selection

and manipulation.

To match materials to designs requires a persepctive of the range of

properties they offer and the other information that will be needed

about them to enable successful delection. The approach is

systematic, leading from design requirements to a prescription for

optimized material choice. From it, the improtance of material

properties is established, so is the momentum to understand the

fundamentals of materials.

指定用書 William D. Callister, "Materials Science and Engineering: An

Introduction," 7th ed., Wiley(2007).

教學方式 Class will be conducted mainly with slides and writing on

blackboard if necessary.

教學進度

Introduction to materials, process, and design

Stiffness and weight

the structure of metals

Plasticity, yield, and ductility

Fracture

Cyclic loading

Materials and heat

phase diagrams and transformations

metal alloys

ceramic materials

polymers

composite materials

Electrical materials

Magnetic materials

Optical materials

Durability

Material processing

成績考核 Homework 40%，midterm 30%，final 30%

講義位址 to be announced in the class

附錄-2

2. 材料科學導論一

課程說明

基礎結晶學、晶體缺陷、材料相變化之熱力學與動力學、工程材

料性質簡介、本課程著重於基礎材料科學觀念之建立與工程材料

原理之定性描述

指定用書 Materials Science and Engineering-An Introduction, 7th Edition

W.D. Callister, Jr., John Wiley Sons, Inc., 2007

參考書籍

(1) Elements of Materials Science and Engineering,6th Edition

L.H. Van Vlck, Addison-Wesley, Inc., 1989.

(2) Introduction to Materials Science for Engineers, 4th Ed., James

F. Shackelford, Prentice Hall, Inc. 1996.

(3) Foundations of Materials Science and Engineering, 2nd Edition

W.F. Smith, McGraw-Hill, Inc., 1993.

(4) The Science and Engineering of Materials, 3rd Edition

D.R.Askeland, PWS-KENT Inc., 1994.

教學方式 投影片教學

教學進度

第一週 Ch.1 Introduction

第二週 Ch.2 Atomic Structure and Interatomic Bonding

第三週 Ch.3 Crystal Structures

第四週 Ch.3 Crystal Structures

第五週 Ch.4 Defects in Crystals

第六週 Ch.4 Diffusion

第七週 Ch.5 Mechanical Behavior of Metals

第八週 Ch.5 Mechanical Behavior of Metals

第九週 Ch.6 Dislocations and Strengthening Mechanisms

第十週 Ch.6 Dislocations and Strengthening Mechanisms 1st

Mid-term Exam

第十一週 CH.7 Failure

第十二週 CH.7 Failure

第十三週 Ch.8 Phase Diagrams

第十四週 Ch.8 Phase Diagrams

第十五週 Ch.9 Phase Transformations

第十六週 Ch.9 Phase Transformations

第十七週 Ch.10 Applications and Processing Metal Alloys

第十八週 Ch.11 Applications and Processing Metal Alloys

第十九週 Final Exam

附錄-3

成績考核

作業 20%

第一次期中考 40%

期末考 40%

課堂點名加扣分

附錄-4

3. 材料科學導論二

課程說明

材料科學導論是材料學的入門課，分為上下學期。

本課程介紹材料科學的概要與基礎，內容涵蓋金屬熱處理與成

形，陶瓷材料，及複合材料，材料之劣化與腐蝕材料，電性，熱

性質，材料磁性，介電及光學材料等。

指定用書 Materials Science and Engineering-An Introduction, 7th Edition

W.D. Callister, Jr., John Wiley Sons, Inc., 2007.

參考書籍

(1) Elements of Materials Science and Engineering,6th Edition

L.H. Van Vlck, Addison-Wesley, Inc., 1989.

(2) Introduction to Materials Science for Engineers, 4th Ed., James

F. Shackelford, Prentice Hall, Inc. 1996.

(3) Foundations of Materials Science and Engineering, 2nd Edition

W.F. Smith, McGraw-Hill, Inc., 1993.

(4) The Science and Engineering of Materials, 3rd Edition

D.R.Askeland, PWS-KENT Inc., 1994.

(5) “工程材料科學”修訂版，劉國雄，林樹均，李勝隆，鄭晃忠，

葉均蔚著，全華公司出版。

教學方式 投影片教學及討論

教學進度

11. Metal Alloys-Applications and Processing

12. Ceramic Materials-Structure and Properties

13. Ceramic Materials-Applications and Processing

16. Composites Materials

17. Corrosion and Degradation

18. Electrical Properties of Materials

19. Thermal Properties

20. Magnetic Properties

21. Optical Properties

22. Materials Selection and Design Considerations

23. Economics, Environmental, and Societal Issues in Materials

Science and Engineering

成績考核

作業 20%

期中考 40%

期末考 40%

講義位址 www.wiley.com/college/wileyplus

上課時公佈

附錄-5

4. 材料科學與工程一

課程說明

The purpose of this course is to provide first-year engineering

students fundamental knowledge of materials science and

engineering.

指定用書 Lecture Notes (No Textbook)

參考書籍 W. F. Smith and J. Hashemi, "Foundations of Materials Science and

Engineering", 4th Ed., McGraw-Hill 2006

教學方式 Lectures

教學進度

1. Introduction to materials Science and engineering

2. Atomic structure and bonding

3. Crystal and amorphous structure in materials

4. Solidification and crystalline imperfections

5. Thermally activated processes and diffusion in solids

6. Mechanical properties of metals I

7. Mechanical properties of metals II

8. Phase diagrams

成績考核 Grade: Quiz (35%), Midterm x 2 (40%), Final (25%)

講義位址 http://www.mse.nthu.edu.tw/~cnliao/MSE-I.htm

附錄-6

5. 材料科學與工程二

課程說明

本課程介紹材料科學的概要與基礎，內容涵蓋相圖，相轉變與微

結構之改變，金屬熱處理，材料電性，熱性質，磁性質，介電及

光性質等。

指定用書 W. F. Smith and J. Hashemi, "Foundations of Materials Science and

Engineering", 4th Ed., McGraw-Hill 2006

參考書籍

J.F. Shackelford, "Introduction fo Materials Science for Engineers,"

6th ed.,

(Prentice Hall, New Jersey, 2005)

教學方式 以powerpoint為主

教學進度

1 Thermal behavior

3 Phase diagram

5 Kinetics – heat treatment

Midterm #1

7 Electrical behavior

9 Electrical behavior

11 Optical behavior

Midterm #2

13 Semiconductor materials

15 Semiconductor materials

17 Magnetic materials

19 Final Exam

成績考核 作業和小考25%，期中考二次共50%，期末考25%

講義位址 本課程以教科書為主

學期中的補充教材另行公佈

附錄-7

6. 應用力學一

課程說明

本課程為固體力學之基礎，它以質點或剛體探討靜力平衡問題，

也是下學期動力學之基礎。本課程 Lecture 1～6 為靜力學，

Lecture 7～8 為動力學。

Lecture 1

Rigid Bodies: Equivalent Systems of Forces (Textbook CH.3)

Lecture 2

Equilibrium of Rigid Bodies (Textbook CH.4)

Lecture 3

Distributed Forces: Centroids and Centers of Gravity

(Textbook CH.5)

Lecture 4

Analysis of Structures (Textbook CH.6)

Lecture 5

Friction (Textbook CH.8)

Lecture 6

Distributed Forces: Moments of Inertia (Textbook CH.9)

Lecture 7

Kinematics of Particles (Textbook CH.11)

Lecture 8

Kinetics of Particles: Newton’s Second Law (Textbook CH.12)

指定用書

F. P. Beer, E. R. Johnston, Jr. and E. R. Eisenberg, Vector Mechanics

for Engineers- Statics/Dynamics, 8th SI ed., McGraw-Hill,

Singapore, 2007

參考書籍 Hibbeler, R.C., Engineering Mechanics- Statics/Dynamics, 11th SI

ed., Pearson Prentice Hall, Singapore, 2007

教學方式

上課講解討論，配合作業、小考、及期中、期末考來評量教學效

果。

助教晚上協助學生解題或解答疑問。

教學進度 共8章，平均分配於整個學期，每教約1/3進行期中考，另有小考。

成績考核

分 2 次期中考，期末考，平常考及平時成績。

(1) 小考 15%

(2) 第一次期中考 25％ (約 10 月中，確實日期以上課時宣佈為

準)

(3) 第二次期中考 25％ (約 11 月下旬或中 12 月初，確實日期

以上課時宣佈為準)

附錄-8

(4) 期末考 30％ (約 1 月中，確實日期以上課時宣佈為準)

(5) 平時成績(或上課表現)5％

講義位址 To be anounced

附錄-9

7. 應用力學二

課程說明

To describe the motion of particles and rigid bodies under force is

applied. Kinematics and Kinetics of particles and rigid bodies are

introducted.

指定用書

Vector Mechanics for Engineers - Dynamics

by Beer, Johnston, Jr. and Clausen

8th Ed in SI Units

參考書籍 1. Engineering Mechanics - Dynamics by Meriam and Kraige

2. Dynamics by Tongue and Sheppard

教學方式 課堂講解

教學進度

1. Kinetics of Particles: Energy and Momentum Method

2. System of Particles

3. Kinematics of Rigid Bodies

4. Plane Motion of Rigid Bodies: Forces and Accelerartion

5. Plane Motion of Rigid Bodies: Energy and Momentum Mtehods

6. Kinetics of Rigid Bodies in Three Dimensions

成績考核

1. 1st Exam. (Topics 1 and 2): 30%

2. 2nd Exam. (Topics 3 and 4): 30%

3. Final Exam. (Topics 5 and 6): 30 %

4. Home Work: 10%

附錄-10

8. 工程力學

課程說明

介紹作用力的觀念，先從粒子共點力系統的平衡開始，其次再介

紹剛體力系的等效系統，以及剛體的平衡分析，也看特殊的剛體

例子如桁架、框架、機械等，最後會分析摩擦力，並介紹虛功原

理的應用。

指定用書

Engineering Mechanics, Statics

12th edition in SI unit

R. C. Hibbleler

Pearson Prentice Hall

教學方式 課堂授課，一週三小時。

教學進度

第一次考詴：

一般原理(Ch.1)、力及向量(Ch.2)，粒子平衡(Ch.3)、力系

合力(Ch.4)。

第二次考詴：

剛體平衡(Ch.5)，桁架分析(Ch.6)。

第三次考詴：

磨擦力(Ch.8)、重心與中心(Ch.9)、虛功原理(Ch.11)。

成績考核 三次大考， 不定時隨堂小考約七至八次，及作業等共佔20%。

附錄-11

9. 機動學

課程說明

機動學為純粹研究機構的運動，而不探討作用在該系統上的外力

動力學為研究物體與機構在外力與力矩作用下所產生的運動的

學問。

靜力學為研究靜態系統所受的外力與力矩而不考慮慣性效應的

學問。

指定用書 Kinematics and Dynamics of Machinery 3ed. by Wilson and Sadler

Prentice Hall

參考書籍 機構學，顏鴻森，二版，東華書局，1999

教學方式 以課堂講解為主

教學進度

1. Introduction 機構學介紹

2. Coordinate Transformation 座標轉換

3. Graphical Linkage Analysis 圖解法連桿分析

4. Analytical Linkage Analysis 解析法連桿分析

5. Linkage Design 連桿設計

6. Cam Design 凸輪設計

7. Gear and Gear Manufacture 齒輪及旗製造法

8. Gear Trains 齒輪組

9. Static Force Analysis 靜力分析

10. Dynamic Force Analysis 動力分析

11. Shaking Force and Balance. 顫抖力及平衡

成績考核

考詴三次佔 80%

作業佔 20%

每週一次演習課請儘量參加

作業不可遲交 上課依座位表坐

附錄-12

10. 高等機構學

課程說明

Prerequisites: 機構學或機動學 (Kinematics of Machinery,

Mechanism)

運動對與接頭、機構的自由度、倒置機構、等值連桿機構、機構

基本理論的相通性、類型合成、創造設計、數目合成、尺寸合成、

同族機構、曲率理論、軌跡生成、功能生成、運動生成。

Contents:

1. Introduction

2. Concepts and Notations Related to Mechanisms

3. Kinematic Models

4. Kinematic Analysis of Planar Motion

5. Type, Number, and Dimensional Synthesis

6. Four-Bar Coupler-Point Curves

7. The Euler-Savary Equation and the Cubic of Stationary Curvature

10. Algebraic Methods of Synthesis Using Displacement Equations

8*. Finite Displacements

指定用書

(1) Hartenberg, R. S., and J. Denavit, Kinematic Synthesis of

Linkages, McGraw Hill, New York, 1964.

(2) Hall, A. S., Jr., Kinematics and Linkage Design, Balt

Publishers, West Lafayette, Indiana, 1966.

參考書籍

(1) Hall, A. S., Jr., Notes on Mechanism Analysis, Balt Publishers,

Lafayette, Indiana, 1981.

(2) Sandor, G. N., and A. G. Erdman, Advanced Mechanism

Design: Analysis and Synthesis, Vol. 2, Prentice-Hall,

Englewood Cliffs, New Jersey, 1984.

(3) Robert L. Norton, Design of Machinery, An Introduction to the

Synthesis and Analysis of Mechanisms and Machines,

McGraw-Hill, New York, 1992.

(4) Mallik, A. K., Ghosh, A., and Dittrich, G., Kinematic Analysis

and Synthesis of Mechanisms, CRC Press, 1994.

(5) 其它講義及參考文獻於課堂中提供或說明。

教學方式 Lecture

成績考核

Grade Evaluation:

Examinations: 2*35%

Assignments: 30%

附錄-13

11. 工程圖學

課程說明

各位同學好:

歡迎您加入設計製圖的行列, 本課程的主要目標是建立傳統圖

學設計製圖基礎，學習電腦輔助繪圖工具的操作與應用，整合圖

學理論、繪圖軟體與設計實務。學習過程中將給各位相當的壓力,

相對的,一學期(年)下來,您將有更大的收獲,在您與學長學姐的家

聚時,不妨問問他(她)們的意見,意者趕緊接受老師的挑戰吧!

課程的撰寫重點在於：將工程實務、圖學理論、工具軟體三者結

合成為一體，以迎接新世代的電腦輔助設計與繪圖。傳統圖學介

紹著重基礎製圖規範與圖學理論之介紹，以及平面視圖與立體視

圖之理論解說及繪製，內容偏重製圖規範及理論傳授；而傳統之

電腦輔助設計繪圖軟體課程，多以強調軟體的操作為主，輔以圖

形範例進行繪圖之示範。然而，隨著電腦輔助設計繪圖軟體的日

趨成熟，如何將基礎圖學與電腦輔助設計繪圖軟體進行適切的整

合，已成為當務之急。因此，本課程特色將朝以下的目標發展：

從設計實務的觀點，進行圖學理論的介紹，清晰表達圖學的內

涵；從軟體應用的觀點，進行設計繪圖的操作，完整發揮軟體的

特色；並進一步加以整合構成電腦輔助設計圖學，並規劃實際之

計畫範例，進行整合的工作，期使本課程能夠成為兼具學術及工

程價值。

本課程由設計繪圖的實務觀點開始圖學的簡介；接著，對圖學的

規範進行系列的介紹，以建立深厚的圖學基礎；然後，便是電腦

輔助設計繪圖軟體AutoCAD的操作基礎培訓，此乃經由系統性

的分類及整理，從基本之繪圖編輯指令示範，發展到高階之應用

指令介紹；之後，便是應用幾何與投影幾何的解說，至此建立起

設計圖學與繪圖軟體之根基；緊接著，進行電腦輔助設計製圖的

整合，從平面的正投影圖繪製，一直到立體之等角圖、斜視圖，

以及透視圖的電腦輔助繪製；最後，並另以獨立之章節，透過實

際設計範例，展現項電腦輔助製圖觀念與技巧的應用成果，期使

能夠兼顧理論與實務。從91學年度開始,圖學教室導入參數式的

3D系統,因此,本學年度將教學的層級由2D提升到3D,也就是說,

本課程的學習將從Autodesk AutoCAD 2D/3D系統的學習應用,衍

生發展到Autodesk Inventor 3D/2D系統,此舉將會對大家有非常

正面的學習成效,期待與大家共同來完成這一學年的訓練。

參考書籍

1.劉俊賢, "AutoCAD 2002/2000 工程圖學實務導航 - 登堂入室

篇", 2002.10, 宏友圖書

2.劉俊賢, "AutoCAD 2002/2000工程圖學實務導航 - 進階應用

篇", 2002.10, 宏友圖書

附錄-14

教學方式 簡報檔說明、綜合討論、操作訓練、報告規劃與寫作、實務設計

製圖、創意與設計

教學進度 詳見第一堂課的課程簡介

成績考核

6.1 設計製圖報告：期中、期末報告.....

6.2 實習測驗：課堂測驗與競賽、課程作業與練習....

6.3 研究記錄：筆記、小組討論、會議.....

6.4 課堂參與：到課、學習、發問....狀況

6.5 課後參與：預習、複習、eLearning上線.....狀況

附錄-15

12. 機械設計製圖

課程說明

本課程的撰寫重點在於：將工程實務、圖學理論、工具軟體三者

結合成為一體，以迎接新世代的電腦輔助設計與繪圖。傳統圖學

介紹著重基礎製圖規範與圖學理論之介紹，以及平面視圖與立體

視圖之理論解說及繪製，內容偏重製圖規範及理論傳授；而傳統

之電腦輔助設計繪圖軟體課程，多以強調軟體的操作為主，輔以

圖形範例進行繪圖之示範。然而，隨著電腦輔助設計繪圖軟體的

日趨成熟，如何將基礎圖學與電腦輔助設計繪圖軟體進行適切的

整合，已成為當務之急。因此，本課程特色將朝以下的目標發展：

從設計實務的觀點，進行圖學理論的介紹，清晰表達圖學的內

涵；從軟體應用的觀點，進行設計繪圖的操作，完整發揮軟體的

特色；並進一步加以整合構成電腦輔助設計圖學，並規劃實際之

計畫範例，進行整合的工作，期使本課程能夠成為兼具學術及工

程價值。

課程所採用的軟體為Autodesk Inventor，是為3D參數式設計專

家，涵蓋層面計有電腦輔助繪圖(CAD)、電腦輔助設計製圖

(CADD)、電腦輔助工程(CAE)，從繪圖、設計、運動分析模擬、

動態分析模擬、彩現擬真動畫，甚至發展到電腦輔助工業設計

(CAID)，期待參與的同學能夠非常開心的來學習這門課程。

指定用書

(1) Autodesk Inventor 學習指引，大塚資訊科技，2006

(2) Autodesk Inventor 專業應用，大塚資訊科技，2006

(3) Autodesk Inventor 進階範例教學，大塚資訊科技，2006

(4) 歐特克股份有限公司，Autodesk Inventor 10 特訓教材基礎

篇，全華科技圖書公司，ISBN：957215236X. 2006/3/14

(5) 劉俊賢，AutoCAD 2002/2000 工程圖學實務導航 – 登堂入

室篇，宏友圖書開發股份有限公司，2002

(6) 劉俊賢，AutoCAD 2002/2000工程圖學實務導航 – 進階應

用篇，宏友圖書開發股份有限公司，2002

教學方式 授課, 實習, 作業, 考詴, 專題研究

教學進度 參考課程進度表

成績考核

工作記錄 (Daily work)：15 %

課堂參與 (Participation)：25 %

作業、活動與計畫 (Homework)：40 %

期末測驗 (Final test)：20 %

講義位址 參考課堂上的補充

附錄-16

13. 工場實習

課程說明

工廠安全

手工具

量具(游標卡尺，分厘卡，比測儀 )

尺寸公差與配合，幾何公差，表面加工符號

鋸床

鑽，沈，鏜，鉸孔

牛頭鉋床

車床(螺紋)

銑床

磨床

指定用書 工廠實習 蔡德藏編著 全華圖書公司出版

參考書籍 Technology of Machine Tools by Krar & Oswald McGraw Hill Co

教學方式 實習為主授課為輔

教學進度

玻璃加工----------------洪金法

焊接----------------------鄭春桐

水電配管裝修---------李春承

自行車保養修護------廖建發

數值控制銑床加工---潘百釗

數值控制車床加工---胡榮良

刀具研磨----------------曾維騶

銑床加工----------------錢忠騰

車床加工----------------王裕銘

鉗工加工----------------鍾旻錡

附錄-17

14. 機械製造

課程說明

課程目的

了解生產各種工業設備零組件可採用之加工法、所須之設備；以及

加工後成品之特性、生產成本等。

指定用書 Manufacturing Engineering and Technology, 5th edition, Kalpakjian and

Schmid, Addison Wesley.

參考書籍 Materials and Processes in Manufacturing, 9th edition, E.P. Degarmo

et.al., Wiley.

教學方式 課堂授課,實驗,工場參觀及報告

教學進度

(1) 材料及材料特性

了解材料之基本結構，物理特性如強度、比重，改善材質的方

法如熱處裡及其它特性如導電性等。

(2) 鑄造方法

了解各種鑄造方法製程之異同、優缺點；鑄造可能發生的問題，

解決的方法；鑄造的設備等。

(3) 成形方法

了解各種成形方法製程之異同、優缺點；成形可能發生的問題，

解決的方法；成形的設備等。

(4) 切削方法

了解各種切削方法製程之異同、優缺點；切削可能發生的問題，

解決的方法；切削的設備等。

(5) 結合方法

了解各種結合方法及其優缺點。

(6) 微電子元件的製造

介紹微電子元件製造的基本程序與設備

成績考核

期中考 (30%) 期末考 (30%) 參觀報告 (20%) 作業小考 (15%)

Lab(5%)

參觀報告格式:

一、工廠名稱、地址、聯絡電話及接待人員

二、員工人數、主要設備及主要生產產品、產量與營業額

三、產品規格製程、注意事項、及容易發生的問題

四、品管設備及品管措施

五、參觀心得及建議事項

報告需有工廠名片、照片或錄影輔助說明

考詴: 期中考、期末考(Close Book) / 作業小考(Open Book)

講義位址 http://maps.pme.nthu.edu.tw/Manufacturing%20processes/index.htm

附錄-18

15. 材料力學

課程說明

應力及應變之概念、軸向負載、圓棒扭轉、純撓曲、橫向負載、

應力及應變之轉換、樑與軸之強度設計、樑與撓度：積分法與彎

矩－面積法、能量方法、力柱。

指定用書

William F. Riley, Leroy D.Sturges, and Don H. Morris, "Mecahnics

of Materials", Sixth Edition, John Wiley & Sons, Inc., New York,

歐亞書局有限公司代理

教學方式

教材講授與討論

例題演算

習題習作

教學進度

1. Introduction

2. Stress and strain

3. Axial Deformation

4. Torsion

5. Stress in Beams

6. Deflection of Beams

7. Columes

8. Energy Methods and Theories of Failure

成績考核 20% (第一次期中考), 20%(第二次期中考), 30% (期末考)

作業10% 平時出席與小考20%

附錄-19

16. 機械設計

課程說明

Design of Machine Elements

This is the first course for ME undergraduate students to touch upon

the inside of machine design. The objective of this course is to teach

students to transfer their basic knowledge, which are learned from

the courses such as Engineering Material, Statics, Dynamics,

Strength of Materials, Thermodynamics, Fluid Mechanics,

Mechanism Design, into the tools of machine element design.

Therefore, this course is not mainly directed towards fostering

students with the capability of creative design, yet training them

how to design machine elements with adequate strength and rigidity

to prevent from failure under use.

機械元件設計

本課程是機械系學生接觸機械設計的第一門課，其目標在於教導

學生如何將應用力學、材料力學、熱力學、流體力學等基礎力學

之分析知識轉為機械裝置及元件的設計與選用工具，因此這門課

並非期望培養學生創新發明的能力，而是訓練學生紮實的設計功

夫，使其學會如何定義某一元件的形狀、尺寸、材料，而使該元

件在機械裝置中使用時不致因受力及環境因素而產生破壞。

由於這是一門三學分的課程，時間相當有限，無法將課本所有內

容詳細說明，本人乃摘取重要的且具代表性的章節作較詳細的講

授。首先，討論材料式元件破壞機制及設計原則，包括延性及脆

性材料之靜力及疲勞破壞，接著，探討彈簧設計，原因是彈簧的

破壞分為靜力及疲勞破壞，剛好可以將前面所學之破壞理論做一

實際的應用，以增進同學的了解深度。另外，將講授軸承及潤滑

設計及選用，包括滾動軸承、滑動軸承等，因其內容及用到的知

識除應用力學外，尚包括流體力學及熱傳學，且其應用範圍很

廣，可以擴展學生對機械設計了解的廣度。最後特講授離合器及

煞車器的設計，此為機械系學生耳熟能詳的機械裝置，講授內容

除包括數學模式建立、分析外，亦將對各式離合器及煞車器的選

用及設計作較為深入的探討。綜合而言，本課程的內容如下：

1. Static Failure Theories

2. Fatigue Failure Theories

3. Surface Failure

4. Spring Design

5. Bearings and Lubrication

6. Clutches and Brakes

指定用書 Essentials of Mechanical Engineering Design (first Edition)

附錄-20

by J. E. Shigley, C. R. Mischke, R. Budynas

高立圖書公司代理

教學方式 Lecture

教學進度

1. Steady Failure

2. Fatigue Failure

3. Mechanical Springs

4. Rolling Contact Bearings

5. Lubrication and Journal Bearings

6. Clutchs , Brakes , Couplings , and Flywheels

成績考核 Homework 10% Project 15% three Exams 25% each

講義位址 http://www.ptlab.pme.nthu.edu.tw/course/MED1.html

附錄-21

17. 機械元件設計

課程說明

本課程將以介紹機械元件的基本構造及選用機械元件的方法及

在設計時機械強度之設計的理論基礎。

指定用書 Shigley, Mischke and Budynas, " Essentials of Machanical

Engineering Design", Mc Graw Hill, 2004

教學方式 課堂課，並以習題為輔，以設計專題協助了解。

教學進度

1. The Failure prevention

2. Screws, fasteners, and the design of nonpermanent joints

3. welding, bonding, and design of perminent joints

4. Springs

4. Rolling contact bearingelement bearing

5. Brakes and Clutches

6. Shafts and axles

成績考核

15%第一次期中考

15%第二次期中考

20%期末考

30%專題

10%習題

10%平時表現

講義位址 edl.pme.nthu.edu.tw

附錄-22

18. 精密機械設計一

課程說明

課程內容

(1) Introduction to Precision Machine Design (宋震國教授)

(2) Principles of Accuracy,Repeatability,and Resolution(宋震

國教授)

(3) Analog Sensors (葉廷仁教授)

(4) Optical Sensor Systems (陳政寰教授)

(5) Sensor Mounting and Calibration (宋震國教授)

(6) Mapping Geometic and Thermal Errorsin a Turning

Center (宋震國教授)

學期實驗

(1) 精密主軸之運動誤差量測 (宋震國教授)

(2) 數值工具機之三次元加工誤差量測與循圓運動精度檢

測及補償（宋震國教授)

(3) 光碟機光學讀取頭頻率響應之量測(葉廷仁教授)

指定用書 Precision Machine Design, by A. H. Slocum,Prentice-Hall

International Editions.

教學進度 見http://www.ptlab.pme.nthu.edu.tw/course/PM1.html

成績考核 作業20%，實驗報告20分，專題20分，考詴40分

講義位址 http://www.ptlab.pme.nthu.edu.tw/course/PM1.html

附錄-23

19. 精密機械設計二

課程說明

(1) System Design Consideration (吳隆庸教授)

(2) Bearings with Mechanical Contact between Elements (吳隆庸

教授)

(3) Bearings without Mechanical Contact between Elements (宋震

國教授)

(4) Power Generation and Transmission (宋震國教授)

實驗項目:

(1) 工具機靜態精度量測 (宋震國教授)

(2) 精密機械之無背隙機構設計 (宋震國教授)

指定用書 Precision Machine Design by A.H.Slocum

PRENTICE HALL,Englewood Cliffs,New Jersey 07632

參考書籍

(1) Rolling Bearing Analysis, 3rd Edition,

by T.A. Harris, John-Wiley and Sons Inc.,1991.

(2) 2.Principle of Precision Engineering,

by HIROMU NAKAZAWA, Oxford University Press, 1994.

(3) 3.Ultraprecision Mechanism Design,

by S.T. Smith and D.C. Chetwynd, Gordon and Breach

Science Publishers, 1992.

教學方式 Lecture and Experiments

教學進度 請參照http://www.ptlab.pme.nthu.edu.tw/ 內的授課內容部分

成績考核 Exam once 30%, Experimental report 40%, Homework 30%.

講義位址 http://www.ptlab.pme.nthu.edu.tw/

附錄-24

20. 機電整合控制程式設計

課程說明

The motion control is a crucial know-how in precision machine

technology and has many applications in machine tools and

industrial machines.

All PME students have learned the C programming language in the

second semester. This course is designed to intensify your

large-scale logic thinking capability through the realization of a

complete CNC control system. Course attendents are requested to

write software for the control of three motors. The NC language is

defined by GM code. Main discussion topics include the

specification of interfaces between function modules and methodes

to design program modules via state machine. A good knowledge of

C-programming language is absolutely necessary.

The program blocks of the motion control software include

real-time operation system WINDOWS RTX manufacturing control

language system structure and data interface man-machine interface

using MS Visual 2005 C/C++ form decoder feed scheduling and

coordinate calculation (interpolator) position control and digital

motion filter hardware for motion control, motion card and driver,

wiring feed drive system design and kinematic transformation The

goal is clear: the developed software must drive a three-axis

machine correctly. It will be an unforgetable experience to see your

test machine moving according to the NC file or control bottons.

Projects:CNC software system for three-axis wafer manipulator or

robot

指定用書 manuscript

教學方式 Introduction of the functions of a motion control system in

classroom and followed by the realization.

教學進度

CNC motion control system:

real-time operation system WINDOWS RTX

control language

system structure and data interface

man-machine interface using MS Visual 2005 C/C++ form

decoder

feed scheduling and interpolator

position control, torque control and digital motion filter

system sequential function control

hardware for machine control, motion card and driver

附錄-25

feed drive system

kinematic transformation

成績考核 CNC motion control software 100%

附錄-26

21. 專題研究一

課程說明

選修，由教授與學生擬定研究題目，以進行專題研究，培養解決

問題的能力。

教學方式 學生在教授研究室學習各種研究技巧，解決研究上遭遇之問題。

教學進度 由教授指定

成績考核 由指導教授決定

附錄-27

22. 專題研究二

課程說明

選修，由教授與學生擬定研究題目，以進行專題研究，培養解決

問題的能力。

教學方式 學生在教授研究室學習各種研究技巧，解決研究上遭遇之問題。

教學進度 由教授指定

成績考核 由指導教授決定

附錄-28

23. 實作專題一

課程說明

This course will train the students to have hands-on experience on a

specific project under the guidance of a professor. The fields of

reseach project range from microelectronics, nanotechnology, VLSI

design, to biomedical engineering.

教學方式 It is up to the particular style of the professor.

教學進度

This is a one-year project course. At the end of the each semester,

the professor will hand in grades for his/her students under

guidance.

成績考核 Oral, written or project reports up to the professor in charge

講義位址

電機工程學系九十七學年度第一學期開設【實作專題一】課程之

指導教授及主題：

朱家齊

應用智慧型生物群集演算法求解電力系統之經濟調度

李夢麟：

生醫超音波及光聲造影實驗

李瑞光：

1+1 維非線性波傳問題 Nonlinear wave propagation in

1+1 dimension

高維度電磁波數值計算及其程式平行化 EM wave solver

in high-

dimensions and its parallel programming

晶體與半導體中的圖案形成模擬 Simulations of pattern

formation in crystals and semiconductors

林崇榮：

New CMOS Fuse/Anti-Fuse Device Design

New CMOS Mutiple-Time-Programmable (MTP) Memory

Cell Design

翁詠祿：

(1) Software implementation of BLAST (Bell Labs.

Layered Space-Time) communication systems.

(2) Software implementation of LDPC (low-density

parity-check) codec.

鄭 傑：

Constructions of optical queues (光佇列理論)

Performance analysis of wireless communication systems in

fading environments

附錄-29

Theoretical and practical aspects of some classes of source

codes

鄭博泰：

Power electronics converters for solar power

附錄-30

24. 實作專題二

課程說明

This course will train the students to have hands-on experience on a

specific project under the guidance of a professor. The fields of

reseach project range from microelectronics, nanotechnology, VLSI

design, to biomedical engineering.

教學方式 It is up to the particular style of the professor.

教學進度

This is a one-year project course. At the end of the each semester,

the professor will hand in grades for his/her students under

guidance.

成績考核 Oral, written or project reports up to the professor in charge

附錄-31

25. 控制系統一

課程說明

宗旨: 瞭解系統在暫態及穩態的反應，學習設計回授控制器改進

系統的反應

內容:

1. Introduction to Control Systems

2. Mathematical Models of Systems

3. Feedback Control System Characteristics

4. The Performance of Feedback Control Systems

5. The Stabilityof Linear Feedback Systems

6. The Root Locus Method

7. Frequency Response Methods

8. Stability in the Frequency Domain

9. The Design of Feedback Control Systems

課程所屬學術專長: 機械、電子、核工

指定用書 R. C. Dorf & R. H. Bishop,"Modern Control Systems", 11th ed.

Addison Wesley 2008

參考書籍

G. F. Franklin, J. D. Powell, and Abbas Emami-Naeini, " Feedback

Control of Dynamic Systems", 4th ed. 2002

M. Gopal,"Control Systems Principal and Design" 2nd edition, 2002

教學方式 上課講解

教學進度

Chap.1 (0.5wk), Chap.2 (0.5wk), Chap.4 (1.5wk), Chap.5 (2wk),

Chap.6 (2wk), 期中考， Chap.7 (2.5wk), Chap.8 (2.5wk), 期中考，

Chap.9 (2.5wk), Chap.10 (3wk)，期末考

成績考核

作業 20%

兩次期中考 45%

期末考35%

附錄-32

26. 控制系統二

課程說明

課程內容：

1. State space representation of system

2. Analysis of state equation

3. Controllability and obserability of linear system

4. Pole assigment of controllable system

5. Design of estimator for obserable system

6. Lyapunov stability criterion

7. Dynamic analysis of discrete system

8. Design of discrete system

9. Design of nonlinear system by describing function

指定用書

Feedback control of dynamic systems, 4th edition, Addision-Wesley,

1994,

by G.F.Franklin, J.D.Powell, and A.Emami-Naeini.

參考書籍 Automatic control systems, 7th edition, Prentice-Hall Inc., 1995, by

B.C.Kuo.

教學方式 投影片

教學進度

1. State space representation of system

2. Analysis of state equation

3. Controllability and observability of linear system

4. Pole assignment of controllable system

5. Design of estimator for obserable system

6. Lyapunov stabitity criterion

7. Dynamic analysis of discrete system

8. Design of discrete system

9. Design of nonlinear system by describing function

成績考核

第一次期中考(30%)

第二次期中考(30%)

期末考(30%)

上課表現及作業（10％）

講義位址 上課時發

附錄-33

27. 微處理機系統

課程說明

EE2401 微算機系統 Fall 2009

Class Hours: Tue. 15:20-17:10. Thr. 15:20-16:10

Class Room: EE/CS Building Rm. 207.

Practice Hours: To be arranged

Practice Room: Micro Lab.

Instructor: Tai-Lang Jong

Office: EE/CS Building Rm. 814 or CCC419

Tel/e-mail: 42577/[email protected]

Office Hour: Tue. 10:00~12:00.

Course Objectives:

*To introduce basic microprocessor, microcomputer & embedded

systems concept to students.

*Emphasize and encourage hands-on practices on both software

development and hardware board development.

*Provide students with experience of experimenting on and actually

building a microprocessor-based board.

指定用書 1. ARM System on Chip Architecture, Steve Furber, 2nd ed.,

Addison-Wesley, 2000.

參考書籍

(1) The 8051 Microcontroller, 4th ed., I. Scott MacKenzie &

Raphael C.-W. Phan, Pearson Internatonal Ed., 2007.

(2) ARM System Developer's Guide : Designing and Optimizing

System Software, Andrew Sloss, Dominic Symes, Chris Wright,

Morgan Kaufmann, 2004.

(3) ARM 原理與實作--以網路 SoC 為例, 探矽工作室編著 宏

友,2003.

(4) 2002 嵌入式系統開發聖經學貫,2002.

(5) 設計嵌入式硬體, John Catsoulis,蔣大偉編譯,

O'REILLY,2004.

(6) Using The MCS-51 Microcontroller, Han-Way Wang, Oxford,

2000.

(7) Related data sheet & Websites.

教學方式 Classroom preseentation with projection aid.

教學進度

Main Contents: (tentative)

(1) Introduction

(2) 8-bit 8051 microcontroller

-----Software hardware summary

附錄-34

-----Instruction set & assembly programming

-----I/O peripherals & examples

-----Microprocessor board/system development

(3) 32-bit ARM microprocessor

-----ARM hardware Architectures

-----ARM Instruction Set Summary & Assembly Programming

-----Exception Handling

-----ISR

-----I/O

-----Serial Communication

成績考核

Tentative Grading Policy:

About 5 homework assignments (50%), 1 small project (30%), and a

final exam (20%). Homeworks include hardware projects and

software design. (We will try to do all homework assignments if

time allows.) Note: This course is hardware and software

implementation intensive. It emphasizes hands-on and engineer

problem solving practices, and is intended for those who would like

to learn and practice microprocessor, microcontroller

hardware/software seriously. You need to consider your interests and

time management carefully before you decided to take this course.

Moreover, all components should be self-provided. The Department

is not responsible for providing free components to the students.

附錄-35

28. 微算機導論

課程說明

上課老師：洪健中教授 辦公室：工一629室

上課教室：工一210(上課) 與電控實驗室(工一323)

預修課程: C++ Programming

上課課程內容:

1. Introduction to Microprocessors and Embedded Systems

2. The ARM Architecture

3. ARM Instruction Set Architecture

4. C++ Programming

5. Operating Systems

6. ARM-Based Embedded Platforms

實驗部分

實驗項目：

一、 LED 實驗

二、 ADC 實驗

三、 期中專題演練

四、 UART 實驗

五、 DC Motor 控制實驗

六、 機械視覺實驗

七、 觸控式人機介面實驗

八、 期末專題實作

指定用書 實驗講義與實驗手冊

成績考核

期末考 10%, 期中專題演練 10%, 實驗報告 25%,

期末專題實作(包括投影報告,書面報告,海報) 50%, 平時成績

5%

附錄-36

29. 嵌入式系統與實驗

課程說明

In this course, we will use an ARM single board computer to

perform embedded software programming and hardware interfacing

design.

Goal of this course

* Understand the basics of microprocessor system hardware

* Understand the design of both hardware and software system

* Familiar with techniques of computer interfacing

* Learn basics of device driver programming

* Familiar with Linux and GNU tools

參考書籍

Linux Device Drivers 2nd Ed.

By Alessandro Rubini and Jonathan Corbet, Oreilly

Building Embedded Linux Systems

by Karim Yaghmour, Oreilly

Embedded Linux: Hardware, Software, and Interfacing

by Craig, Ph.D. Hollabaugh, Addison Wesley Professional; 1st

edition (March 7, 2002)

(中譯本)內嵌式 Linux 系統---硬體、軟體與介面

陳清豪 譯，培生教育出版集團

教學方式 Two hour lecture and two hour lab per week (plus assignments)

教學進度

1. Introduction to embedded systems

2. Build development workstation

3. Install cross-compiling tools and kernel recompile

4. Boot embedded Linux on local MTD devices and remote systems

5. Debug remote systems

6. Build root file system for an embedded system

7. 3-axis sensors and RS-232 interface

7. Device drivers

8. FPGA and Memory-mapped IO interface

9. interrupt-driven IO

10. System integration and final projects

成績考核

* Lab Demo 60%

* Lab Reports 20%

* Final Project 20%

講義位址 http://larc.ee.nthu.edu.tw/~jjliou/courses/ell/index.html

附錄-37

30. 電控實驗

課程說明

上課老師：洪健中教授 辦公室：工一629室

上課教室：工一215(上課) 與電控實驗室(工一323)

上課課程內容:

1. Introduction and Overview

2. Virtual Instrumentation System

3. DC Motor Control

4. RF Wireless Communication

5. Magnetic Sensing and Control

6. Measurement and Control of Pressure

7. Thermal Control

8. Measurement and Control of Fluid Flow

9. Measurement and Control of Optics

10. Measurement of Ultrasound

實驗部分

實驗項目：

一、 虛擬電控平台及基本電路複習

二、 直流馬達控制

三、 無線通訊

四、 無線控制系統實驗設計

五、 電磁感測與控制

六、 溫控系統

七、 水位控制與超音波量測

八、 期末專題實作或期末實驗考詴

指定用書 實驗講義與實驗手冊

成績考核 期中演練 10%, 實驗報告 35%, 期末專題實作或期末實驗考詴

55%

附錄-38

31. 電腦輔助設計與製造

課程說明

電腦的發展對機械設計與製造產生革命性的影響。

廣義的電腦輔助設計與製造包含甚廣，舉凡利用電腦進行與設計

或製造相關之工作都可視為電腦輔助設計與製造。

截至今日，其基本理論發展已相當完備。因此，本課程將對這些

基本理論做較為粗淺的介紹。課程的主要部分將較著重於實作部

分，會使用 CATIA 設計分析及製造軟體進行練習。由於電腦軟

體版本有限，為維持教學品質限收 25 名學生，以動機系學生優

先。

The development of computer had strong impact on machine design

and manufacturing. For any design or manufacture work involved

with the use of computer can be consider as CAD/CAM.

The fundamental theories for CAD/CAM had been well developed.

The course will give a review about the development of these

theories. And we will use the software CATIA to exercise these

theories. Due to the limitation of the software, only 25 students are

allowed to enroll this class and senior PME students had the highest

priority.

指定用書 P. N. Rao,"CAD/CAM Principles and Applications," McGraw Hill,"

高立圖書

參考書籍

1. Computer Control of Manufacturing Systems, Koren, McGraw

Hill

2. CADCAM, Mikell P.Groover and Emory W. Zimmers, Jr. 東南

書局

3. CADCAM, McMahon and Browne, Addison Wesley

教學方式 課堂講授,討論,實作

lecture, discussion, and project

教學進度

Introduction

Computer Graphics

Catia-sketch

Geometric Modelling

Catia-Part Design

Free Form Surface

Catia-Image and Shape

Catia-Assembly

Catia-Generative Drafting

Finite Element Analysis

附錄-39

Catia- Finite Element Analysis

Mid term exam.

Computer Numerical Control

Catia- Prismatic Machining, Advanced Part Programming Methods

Catia- Surface Machining, CNC Programming

Catia-Project

Final

成績考核

( 暫定 ) 考詴 (30-30%), 作業 (20%),Team Project(20%) (temp)

mid-term exam( 35%) final exam (35%) home work (20%)

project(10%)

附錄-40

32. 電機控制

課程說明

介紹一個工業控制系統之組成、操作原理與相關領域之整合實

務。

先修課程:電路學.電子學或電工學

主要內容:

(1) Introduction to industrial control system and mechatronics.

工業控制及機電整合簡介

(2) Introduction to power electronics. 電力電子簡介

(3) Static and dynamic specifications of sensors. 感測元件之靜

態及動態規格

(4) Sensors and transducers. 感測元件及換能元件

(5) Signal conditioners for sensors. 感測元件用信號處理電路

(6) Controller realization (Analog and digital). 控制器之實現

(類比及數位)

(7) AC/DC and DC/DC power converters. 各式 AC/DC 及

DC/DC 功率轉換器

(8) Inverters and PWM switching control strategies. 變頻器及

其 PWM 切換控制技巧

(9) DC motor drive. 直流馬達驅動系統

(10) Induction motor drive. 感應馬達驅動系統

(11) Synchronous motor drive and BDCM drive. 同步及直流無

刷馬達驅動系統.

(12) 其他馬達驅動系統.

(13) Control of power electronic systems using SOC ICs. 應用

SOC IC 之電力電子系統控制.

(14) Introduction to switching power supplies. 切換式電源供應

器簡介

(15) Experiments: Converter systems and motor speed control

systems. 實驗

指定用書

[1] 講義.

[2] G.K. Dubey, "Power Semiconductor Controlled Drives",

2002.(暫訂)

參考書籍

[1] R, Krishnan, "Electric Motor Drives: Modeling, Analysis and

Control",

Prentice Hall, 2001.

[2] J.M. Jacob, "Industrial Control Electronics: Applications and

Design".

教學方式 面授及實驗(搭配提供).

附錄-41

教學進度 第一次上課時仔細介紹.

成績考核 期中考, 期末考, 實驗報告.

講義位址 1.教材會於課中發放.

2. http://www.ee.nthu.edu.tw/cmliaw/

附錄-42

33. 電動機械一

課程說明

本課程先介紹基本的磁性材料及元件的特性；分析電能轉換的裝

置與原理；介紹多種電機的運轉原理、應用及特性，尤其是交流

電機及永磁無刷馬達。

課程內容實務性與理論觀念的建立，兩者並重。

指定用書 Electric Machinery and Transformers, THIRD EDITION , by

BHAG S.G RU、HUSEYIN R.HIZIRO LU

參考書籍 相關性資料提供

教學方式 投影片教學為主

教學進度

(1) 基本介紹

(2) 電路系統

-直流、交流電路分析

-三相電路

-功率與阻抗量測

(3) 基本電磁原理

-磁性元件特性與選用

-磁路分析

(4) 電能轉換裝置介紹

-電動機及變壓器結構

-運轉原理

(5) 直流有刷電動機

-操作原理、等效電路

-轉矩與轉速關係

-力矩、效率

(6) 同步電動機與直流無刷馬達

-操作原理、繞線因數、等效電路

-效率、有刷與無刷差別

(7) 感應電動機

-工作原理

-電動機啟動、速度控制、停止

成績考核

作業： 數次 30 %

筆詴： 兩次共 60 %

其他： 10 %

附錄-43

34. 電動機械

課程說明

介紹機電能量轉換原理,各式電機之結構'操作原理'運轉特性以

及固態控制.另外,亦介紹電力系統之組成.輸配.應用.用電安全.電

源品質.備用電源及一些特殊設備之電源系統等.

供同學通盤了解電力工程之有關事務.(與電動機械實驗配合進

行,欲修電動機械實驗者請修電動機械課程)

指定用書

1.P.C. Sen," Principles of Electric Machines and Power Electronics,"

2nd Edition.(暫定)

2.講義

參考書籍

[1] T.L. Skvarenina, W.E. DeWitt, Electrical Power and Controls,

2001.

[2] T. Wildi, Electrical Machines, Deives and Power Systems, 3rd

Edition, 2005.

[3] Ned Mohan, T.M. Undeland and W.P. Robbins, Power

Electronics: Converters, Applications and Design, 2003.

[4] J. J. Cathey, Electric Machines: Analysis and Design Applying

Matlab, McGraw, 2001.

[5] B. K. Bose, Modern Power Electronics and AC Drives,

Prentice Hall, New Jersey, 2002,.

[6] R. Krishnan, Electric Motor Drives Modeling, Analysis and

Control, Prentice Hall, New Jersey, 2001.

[7] A. E. Fitzgerald, Charles Kingsley, Jr. and Stephen D. Umans,

Electric Machinery,6/e, McGraw-Hill Higher Education,

2003

[8] John Chiasson, Modeling and high-performance control of

electric machines, John Wiley & Sons, 2005.

[9] S. E. Lyshevski, Nano- and Micro- Electromechanical

Systems. Fundamentals of Nano- and Microengineering,

CRC Press, 2005.

[10] Charles A. Gross, Electric machines, CRC Press, 2006.

教學方式 面授

教學進度

1. 機電能量轉換及機電整合簡介。(5%)

2. 電力系統概要：發電.輸配電、電力系統暫態、用電安全、備

用電源、特殊設備電源系統、電力品質等。(5%)

3. 電力電子概要：功率半導體概要、電源供應器概要、馬達驅

動器概要等。(5%)

4. 電動機械(85%)：

附錄-44

(1) 磁路分析、永久磁鐵磁路分析。

(2) 變壓器。

(3) 步進馬達之驅動及應用。

(4) 直流馬達及發電機。

(5) 同步馬達及發電機。

(6) 感應馬達。

(7) 直流無刷馬達及其於週邊設備之應用。

(8) 開關磁阻式馬達及其他特殊馬達。

(9) 馬達之SOC固態速度控制實作實驗。

成績考核 作業.期中考.期末考

講義位址 (1) 發放紙本講義.

(2) 進入系連結之個人網頁.

附錄-45

35. 應用電子學一

指定用書 Electronic Devices 7th , by Thomas Floyd

參考書籍 Microelectronic Circuits, Sedra / Smith

The Art of Electronics, Paul Horowitz,Winfield Hill

教學進度

Dates Class

Feb 18-21 Introduction, Ch1 Semiconductor Basics

Feb 25 Ch1-Ch2 Diode Applications

Mar 3-6 Ch2 - Ch3 Special-Purpose Diodes

Mar 10-13 Ch3 - Ch4 Bipolar Junction Transistors (BJTs)

Mar 17-20 Ch4 Bipolar Junction Transistors (BJTs)

Mar 24-27 Ch4, 3/27 Midterm exam I (Ch1 –Ch4)

Mar 31 Ch5 Transistor Bias Circuits

April 7-10 Ch6 BJTAmplifiers

April 14-17 Ch6 BJTAmplifiers

April 21-24 Ch6-Ch7 Field-Effect Transistors (FETs)

April 28-May 1 Ch7 Field-Effect Transistors (FETs)

May 5-8 Ch8 FETAmplifiers, 5/8 Midterm exam II (Ch4-Ch7)

May 12-15 Ch8-Ch9 Power Amplifiers

May 19-22 Ch9-Ch10 Amplifier Frequency Response

May 26-29 Ch10 Amplifier Frequency Response

June 2-5 Ch10-Ch11 Thyristors and Other Devices

June 9-12 Ch11 Thyristors and Other Devices

June 16

Final week

Final Exam(Ch7-Ch11)

The final exam date will be announced later.

1. Amakeup exam will be given only in documented cases of illness

or emergency.

2. Cheating is absolutely prohibitive.

3. I hope this class is inspiring and rewarding for you. If during the

semester you have any suggestion for how I can improve the class,

please let me know.

成績考核 Midterm ╳ 2 (30%), Final Exam (40%)

There will be weekly homework assignments throughout the course.

附錄-46

36. 應用電子學二

指定用書 Electronic Devices 8th , by Thomas Floyd

Digital Fundamentals 5th, by Thomas Floyd

參考書籍 Microelectronic Circuits, Sedra / Smith

The Art of Electronics, Paul Horowitz,Winfield Hill

教學進度

Dates Class

Sep 14-17 Active load / Differential amplifier

Sep 21-24 Differential amplifier / Ch12 The Operational Amplifier

Oct 1 Ch12-3~12-9 / Ch 13 Basic Op-Amp

Oct 5-8 Ch 13 Basic Op-Amp

Oct 12-15 Ch14 Special-purpose OP-Amp circuit

Oct 19-22 Oct 22 Mid Exam 30%

Oct 26-29 Ch 15 Active Filter

Nov 2-5 Ch16 Oscillators

Nov 9-12 Ch17 Communications Circuit

Nov 16-19 Ch18 Voltage regulators

Nov 23-26 Nov 26 Mid Exam 30%

Nov 30-Dec 3 Digital 1 Digital Circuit / Digital 2 Combination

Digital System

Dec 7-10 Digital 2 Combination Digital System

Dec 14-17 Digital 3 Sequential Digital System

Dec 21-24 Digital 4 Counter

De 28-31 Digital 5 Shift Register

Jan 4-7 Digital 6 Other Applications of Basic Gates

Jan 11 or 14 Final Exam 40% / The final exam date will be

announced later.

1. Amakeup exam will be given only in documented cases of illness

or emergency.

2. Cheating is absolutely prohibitive.

3. I hope this class is inspiring and rewarding for you. If during the

semester you have any suggestion for how I can improve the class,

please let me know.

成績考核 Midterm ╳ 2 (30%), Final Exam (40%)

Homework will be assigned and the solutions are included.

附錄-47

37. 電子學一

課程說明

What you should learn:

How is the basic circuits theory being applied to electronic devices?

What is solid-state electronics? How do the electrons being

controlled by the applied voltages or currents? What are the basic

semiconductor junctions being formed by semiconductor materials?

How many type of electronic devices have been developed in the

past years? What are the device models and their uses? How to use

computer tools with basic analysis skill?

Suggested Course Preparation:

(1) A loose-page notebook with binders.

(2) Go through the basic paragraphs before the class hours in fast

pace.

(3) Take notes when you are in the class.

(4) Write down the questions and ask the TAs or teacher.

(5) Workout homework problems as soon as the chapter is over.

指定用書 Adel S. Sedra and Kenneth Smith, Microelectronic Circuits, 5th Ed.,

ISBN-0195142519, 2003. Oxford University Press.

參考書籍

(1) Neamen, Donald, Electronic Circuits Analysis and Design,

McGraw-Hill Books Inc.,2001.

(2) Millman, J. and Grabel, A., Microelectronics, 2nd ed.,

McGraw-Hill, 1995.

教學方式

Lectures with help of computer PP files, PSpice will be used for

simulation problems.

主要是教室課，以黑板及投影片講解。配合PSpice軟體實施作業

及習題.

教學進度

授課大綱:

Course Content:

Chap. 1. Introductions to Electronics.

Chap. 2. Operational Amplifiers.

Chap. 3. Diode Circuits.

Chap. 4. MOSFET

Chap. 5. BJT

Chap. 6. Single Stage Amplifiers

成績考核

Homework 20 %

Midterm Exam 30%

Final Exam: 40%,

附錄-48

Extra Points: 10% (Attendance, …)

Scaled to normal distributions.

依原始成績之統計分佈及上課出席狀況,再調整總學期成績.

講義位址 http://www.maps.pme.nthu.edu.tw/net/pme320101

附錄-49

38. 電子學二

課程說明

Having learned the major electronics devices (MOSFET and BJT)

and their basic circuit applications in Electronics-I, more complex

analog circuits and systems will be lectured in this course. Both

MOSFET and BJT circuits will be studied and the emphasis will be

put on MOSFET since it is used in most integrated circuit.

指定用書 Sedra/Smith, "Microelectronic Circuits", Oxfrod, 5th Ed.

參考書籍 Neaman,"Electronic Circuit Analysis And Design,"Irwin.

教學方式 Powe-point handouts

教學進度

1. Single-stage integrated circuit amplifiers

2. Differential and multistage amplifiers

3. Feedback

4. Op-Amp and Data-Converter Circuits

成績考核

Homework: 10%

Midterm I: 30%

Midterm II 30%

Final: 30%

講義位址 http://mx.nthu.edu.tw/~yunhwu/Electronics-2.htm

附錄-50

39. 電腦輔助製造專題

課程說明

Special topics on Computer-Aided Manufacturing : The use of

computer systems to plan, manage and control the operations of a

manufacturing plant through either direct or indirect computer

interface with the plant's production resources.

a. Computer monitoring and control. The computer is connected

directly to the manufacturing system. Ex. NC, CNC.

b. Manufacturing support applications. The computer is used in

support of the production operations in the plant, there in no direct

interface between the computer and the manufacturing process. Ex.

APT. CAPP. MRP. Shop floor control.

Ten topics about computer-Aided Design and Manufacturing have

been selected in this class. Studens must put hand on some computer

software such Pro/E, MasterCam, etc. for their mid-term and final

project. Presentation and report are very important in this class.

指定用書 Computer-Aided Manufacturing IIed.

By T. C. Chang, R. A. Wysk, H. P. Wang Prentice Hall Co

參考書籍 Automation, Production System, and Computer-Integrated

Manufacturing By Mikell P. Groover Publish by : Prentice Hall Co.

教學方式 Lecture presentation and discussion.

教學進度

1. Introduction to Manufacturing (ch. 1)

2. Computer-Aided Design (ch. 2, 3)

3. Numerical Control and its Programming (ch. 9, 10)

4. CNC Machine Tools

5. Process Engineering (ch. 4)

6. Tooling Engineering (ch. 5)

7. Automation & Industrial Robotics (ch. 6, 11)

8. Flexible Manufacturing System (ch. 15)

9. Group Technology (ch.12)

成績考核

(1) Report of CNC Machine tools and Manufacturing Technology

Show (Mar. 2-7 南港世貿中心). (10%)

select one topic beforehand

(presentation-option for extra credit)

Report due and group discussion on 3/24

(2) Report of one specific topics (from papers) and presentation for

at least 20 minutes. (15%)

papers (CIRP for example) in the field of manufacturing

附錄-51

must be selected and turn in before 3/31

Up to 3 relate papers allowed

(3) Final Project (40%)

group of 1-4, but must turn in report and present

individually.

(4) Mid-term & Final Test (25%)

4/14 Mid-term test and project presentation.

6/9,6/16 Final project presentation

6/23 final test

附錄-52

40. 儀器與量測

課程說明

本課程為偏重應用的一門課，課程中會介紹包含電子學、機率與

統計、系統動態、與力學及熱傳等各方面的基本觀念。修課同學

若沒有足夠的相關基礎，通常就得靠課後自修才能跟上進度，另

外若實驗相關經驗不足也可能造成理解上的障礙。因此建議同學

們於三下或三上已具備一定基礎後再修習本課程，以避免內容太

多無法消化或觀念抽象無法產生共鳴等困擾。本課程另提供實驗

課程，歡迎修課同學選修。

指定用書 J.P. Holman, "Experimental Methods for Engineers" 7th ed. (2001),

McGraw-Hill

教學方式 課堂講解

教學進度

本課程在前八週將由李志浩老師介紹以下內容

Chap. 1: Introduction

Chap. 2: Basic Concepts

Chap. 3: Analysis of Experimental Data

Chap. 4: Sensing Devices

Chap. 12: Nuclear-Radiation Measurement

本課程在後八週將由蘇育全老師介紹以下內容

Chap. 5: Displacement and Area Measurements

Chap. 6: Pressure Measurement

Chap. 7: Flow Measurement

Chap. 8: Temperature Measurement

Chap. 10: Strain Measurement

成績考核 隨堂測驗、作業、期中考、與期末考

附錄-53

41. 量測系統與實驗

課程說明

上課老師：洪健中教授 辦公室：工一629室

上課教室：工一 216(上課) 與量測實驗室(工一 320)

上課課程內容:

1. Introduction and Overview

2. Strain and Stress: Measurement and Analysis

3. Measurement of Pressure

4. Measurement of Fluid Flow

5. Measurement of Temperature

6. Measurement of Motion

7. Experiment Starts (4/17)

8. Measurement of Optics

9. Measurement of Ultrasound

10. Presenting Data in a Statistical Approach

指定用書 Figliola and Beasley, Theory and Design for Mechanical

Measurements, 3rd ed., 2000, John Wiley and Sons, Inc.

參考書籍

(1) Beckwith, Marangoni, Lienhard, Mechanical Measurement, 5th

ed., 1993, Addision-Wesley, Co.

(2) Bentley, Principles of Measurement Systems, 3rd ed., 1995,

Longman Scientific & Technical.

(3) Doebelin, Measurement Systems: Application and Design, 4th

ed., 1990, McGraw-Hill, Inc.

附錄-54

42. 光機電系統設計

課程說明

The process of Opto-mechatronics system design is introduced in

this course. The design process included: specification, conceptual

design, and product design. In addition to design process, design of

the size tolerance and geometric tolerance are also introduce.

The objective of this course is:

(1) To learn about the organization of design within a company.

(2) To learn about the process of design in order to generate better

quality designs in less time.

(3) To learn how to be more creative in solving design problems.

(4) To learn how to design as part of group activity.

(5) To learn how a opto-mechatronics been designed.

指定用書

(1) D. G. Ullman " The mechanical design process" McGraw Hill

2010

(2) Clarence W. de Silva "Mechatronics" CRC Press 2004

(3) "光機電系統整合概論" 國家實驗研究院儀器科技研究中心

出版, 2005

參考書籍

“CAD/CAM” Chapter 16, By Zeid, McGraw Hill

“Mechanical Engineering Design” By Shegley. McGraw Hill

"創新的兩難" 吳凱琳譯 商周出版

教學方式 課堂講解及計畫

教學進度

(1) Introduction of opto mechatronics system design

(2) Design Process and product discovery

(3) Planning for the Design

(4) Understanding the problem and the development of

Engineering Specifications

(5) Concept Generation

(6) concept evaluation and selection

(7) product generation

(8) Product Evaluation for Performance and the effects of variation

(9) Product Evaluation: Design for Cost, Manufacture, Assembly,

and Other Measurement

(10) wrapping up the design process and supporting the product

(11) opto-mechatronics design (an example)

成績考核

1 Project report (specification) (10%)

2.Concepture design report (10%)

3. Concepture design evaluation report (10%)

附錄-55

4.Final report (40%)

5.Final Exame(30%).

計畫題目：一個我想買的光機電系統(一定要有光、機、電在系

統內)

1. Specification 第三週清大夢工場

2. 概念設計 第五週

3. 概念設計評估及修正結果 第六週

4. 概念圖及可行性計算 第十二週

5. 藍圖 及設計總報告 第十七週

必須參加清大夢工場競賽。

報告大綱

(1) Project Appraisal report (specification)

A. Description of customer.

B. Customer’s Requirements

C. Weighting of customer’s requirements.

D. Competition’s benchmarks versus customer’s

requirements.

E. Engineering Requirements.

F. Competition’s benchmarks versus engineering

requirements.

G. Task title.

H. Objectives of each task.

I. Personnel required for each task

J. Time requirement for each task

K. Schedule of tasks.

(2) Conceptual design report

A. Functional decomposition

B. Literature and patent search process and results.

C. Function-Concept mapping.

D. Sketches of overall concepts.

(3) Conceptual design evaluation report

A. Identification of failure modes.

B. Identification of critical parameters.

C. Decision matrices to determine best concepts.

D. Analysis, Experiments and model supporting evaluation.

(4) Final report

A. Usable off-shelf products

B. Shape development driven by Function.

附錄-56

C. Material selection.

D. Manufacturing process(s) selection

E. Comparison to engineering requirement.

F. Functional changes noted.

G. Design for assembly evaluation.

H. Cost evaluation.

I. Analysis, experiments and model supporting evaluation

J. Layout drawing.

K. Detail drawings of manufactured parts.

L. Parts list.

Following table should turn in individually when turn in the final

report:

Name of student:

Project involvement questionnaire

Name RequDev./ConceptDev. Analysis Communication

Work with Team Total

Every team member should evaluate himself and other

teammate.

講義位址 edl.pme.nthu.edu.tw

附錄-57

43. 電磁式微機電元件及應用

課程說明

(1) Fundamenals: Material, Dynamics, etc.

(2) Design Methodology

(3) Electrostatic, Magnetic & EM actuators

(4) Electrostatic, Magnetic & EM sensors

(5) Applications

OPTOINS:

(A) Introduction to MEMS

(B) Introduction to EM theory

指定用書 (1) Notes

(2) Textbook: TBA

成績考核

(1) 40%: 3-5 HW's

(2) 30%: Project – Circuit for Accelerometer Demonstration

(3) 30%: Final Project - Actuator Design and Layout for Spring

Term Test

附錄-58

44. 射頻微機電元件及應用

課程說明

Radio Frequency Micro Electro Mechanical Systems (RF MEMS)

are miniaturized devices that are created using micromachining

technologies similar to those used to manufacture integrated

circuits, and are capable of performing many tasks and functions,

such as frequency selection, frequency generation, and frequency

translation, that involve mechanical, electrical, and other types of

signals. RF MEMS and related Integrated Microsystems are

increasingly finding applications in many areas, especially in signal

processing and telecommunications. RF MEMS industry is also

ready to penetrate into wireless communication products (filters,

timing reference devices, switches, etc.).

This is an introductory and design course of RF MEMS components

with class lectures and hands-on design labs based on

ANSYS/Comsol Multiphysics/CoventorWare. This course

introduces students to this rapidly emerging multi-disciplinary and

exciting field. It will teach fundamentals of micromachining and

microfabrication techniques that are crucial to RF MEMS

fabrication. A designer of RF MEMS requires knowledge and

expertise across several different disciplines. Therefore, this course

will pay attention to teaching fundamentals necessary for the design

and analysis of RF MEMS devices and systems in mechanical and

electrical domains, and will teach basic techniques for multi-domain

analysis (e.g., electromechanical). Fundamentals of transduction

mechanism (i.e., conversion between mechanical signals and

electrical signals), including capacitive and piezoelectric techniques,

and design and analysis of micromachined miniature devices using

these techniques will be covered. Many examples of exciting

devices and their applications will be reviewed. Students with

electronic background and non-electronics are all welcome to study

such interdisciplinary subject. Successful project designs met

requirements will have opportunities to be made via foundry MEMS

process.

Prerequisite:

This course is intended for undergraduate seniors and graduate

students. It is a half-introductory-and-half-advanced course

designed for those students who are not familiar with RF MEMS,

microfabrication technologies, integrated circuits, or non-electrical

附錄-59

devices and systems. Therefore, the course prerequisites are selected

to allow students from MANY engineering and science disciplines,

including mechanical, electrical, chemical, aerospace, biomedical,

and material engineering to take the course. The course is organized

into lectures and computation labs. The lectures present material

that ALL students need to learn and the labs are intended to teach

students how to use simulators to facilitate the RF MEMS design

procedure. The following academic background is required for this

course: (a) college math, calculus, and differential equations; (b)

basic college-level physics and chemistry.

指定用書 Class Notes.

參考書籍

(1) Stephen D. Senturia, Microsystem Design, Kluwer Academic

Publishers, 2000

(2) Gregory T. A. Kovacs, Micromachined Transducers

Sourcebook, McGraw Hill, 1998

(3) R. S. Muller, R. T. Howe, S. D. Senturia, R. L. Smith, and R.

M. White, Microsensors, New York: IEEE Press, 1991

(4) M. Madou, Fundamental of Microfabrication, New York: CRC

Press, 1997

(5) M. Elwenspoek, H. Jansen, Silicon Micromachining, Kluwer

Academic Publishers, 2001

(6) J. W. Gardner, “Microsensors – Principles and Applications,”

John Wiley & Sons, 1994

References – Journals:

IEEE/ASME Journal of Microelectromechanical Systems (JMEMS)

IEEE Transactions on Ultrasonics, Ferroelectrics, and Frequency

Control (JUFFC)

IOP Journal of Micromechanics and Microengineering (JM&M)

Sensors and Actuators

Sensors and Materials

IEEE Sensors

IEEE Transactions on Electron Devices

References – Conference Proceedings:

IEEE Micro Electro Mechanical Systems Workshop (MEMS’XX,

every year)

International Conference on Solid-State Sensors and Actuators

(Transducers’XX, odd years)

Solid-State Sensor and Actuator Workshop (Hilton Head Island,

附錄-60

even years)

IEEE International Electron Devices Meeting (IEDM’XX, every

year)

IEEE International Solid-State Circuits Conference (ISSCC’XX,

every year)

IEEE Ultrasonics Symposium (Ultrasonics’XX, every year)

IEEE Frequency Control Symposium (IFCS’XX, every year)

教學進度

1 9/17 Introduction to RF MEMS Technologies

2 9/24 Applications in Wireless Communications

3 10/1 Microfabrication Technologies for RF MEMS

4 10/8 Capacitive Transduction

5 10/15 Vibration Theory and Resonator Modeling

6 10/22 Micromechanical Resonator Design

7 10/29 CAD/FEM Lab for Resonator Simulation

8 11/5 Micromechanical Filter Modeling and Design

9 11/12 CAD/FEM Lab for Filter Simulation

10 11/19 Midterm

11 11/26 Micromechanical Oscillator

12 12/3 CMOS-MEMS Technologies

13 12/10 Piezoelectric Transduction

14 12/17 Surface Acoustic Wave Devices (SAW)

15 12/24 Film Bulk Acoustic Wave Devices (FBAR)

16 12/31 Piezo-MEMS Resonators and Filters

17 1/7 RF MEMS Switches Technologies

18 1/14 Project Presentation

成績考核 Homework 20%, Midterm 20%, Final Project 50%, Class

Participation 10%

附錄-61

45. 材料實驗一

課程說明

材料實驗一是在驗證課堂所學的材料科學知識，選擇一些基本單

元實際操作，主要有金相製作與觀察、機械性質詴驗、黃銅冷加

工及退火、鋼鐵熱處理、材料鑑定分析儀器實習。實際操作驗證

製程、微結構、性質的關聯。

指定用書 "材料工程實驗與原理" 林樹均、葉均蔚、劉增豐、李勝隆，全

華圖書。

參考書籍 工程材料實驗(I)--金屬材料實驗，主編:洪敏雄，中國材料科學學

會，民國88年11月。

教學方式 實驗前，先上課講解實驗原理；實驗時，先講解儀器操作及實驗

過程，然後分組進行實驗；實驗後，每組繳交一份實驗報告。

教學進度

1.簡介與分組 1 週

2.材料鑑定分析儀器實習(SEM、TEM、X-Ray、AFM) 2 週

3.顯微組織觀察及暗房技術 3 週

4.機械性質測詴(硬度、拉伸、衝擊詴驗) 3 週

5.三七黃銅冷加工及退火 3 週

6.鋼之熱處理 3週

成績考核

1.實驗報告：60%

2.期末考：30%

3.實驗精神：10%

4.遲到、早退每次扣學期分數1分；無故曠課每次扣2分。

附錄-62

46. 材料實驗二

課程說明

本課程探討一般陶瓷的原料特性、各種不同陶瓷成型法及其相關

製程步驟與流程。其中陶瓷成型法包含粉末亁壓法、刮刀成型法

及注漿成型法，藉由上述三種常見的陶瓷製程，可讓學生了解到

相關的陶瓷成型方式以及成型前後的相關基本原理。

本課程依據此三種陶瓷成型方式,規劃三種陶瓷實驗,分別如下:

1. 陶瓷實驗(一): 粉末乾壓

2. 陶瓷實驗(二): 刮刀成型

3. 陶瓷實驗(三): 注漿成型

參考書籍 J. S. Reed, “Principles of Ceramics Processing, 2nd edition”, John

Wiley & Sons,1995.

教學方式 1. 以分組方式進行實驗操作

2. 實驗講解以投影片方式進行

教學進度

實驗規劃如下：

日期 實驗進度規劃

9/22(二)、9/25(五) 分組與陶瓷實驗（一）講解

9/23(三) ~ 10/26(一) 陶瓷實驗（一）實作

10/27(二)、10/30(五) 陶瓷實驗（二）講解

10/28(三) ~ 11/23(一) 陶瓷實驗（二）實作

11/24(二)、10/27(五) 陶瓷實驗（三）講解

11/25(三) ~ 12/31(四) 陶瓷實驗（三）實作

1/8(五) 期末考詴

註：實驗實作採分組進行，實作時間將視選課人數以及分組狀況

決定，故於開學後由各實驗負責助教另行公布。

成績考核

1. 出席率（10%）

2. 實驗報告（50%）

3. 期末考（40%）

附錄-63

47. 材料實驗三

課程說明

本課程探討與量測材料的基本物理性質，其中包括講解相關原理以

及量測標準樣品並引導學生思索

相關領域的議題。實驗內容主要包括有：

(1) 表面形貌：_-steper

(2) 光學特性：螢光光譜儀，傅立葉轉換紅外線光譜儀＆UV-Vis

光譜儀

(3) 電性：電流-電壓測量,Seebeck 係數測量,四點量測

(4) 磁性：VSM 測量 ＆ 霍爾效應

藉由以上實驗，可讓學生瞭解材料的基本物理性質以及相關觀念。

參考書籍

(1) L.Solymar and D. Walsh, “Electrical Properties of materials, 7th

edition”, Oxford, 2004

(2) Mark Fox, “Optical Properties of Solids”, Oxford 2001

(3) G. S. Nolas, J. Sharp and H. J. Goldsmid, “Thermoelectrics- Basic

Principles and New Materials Develoments”

教學方式 1. 以分組方式進行實驗操作

2. 實驗講解以投影片方式進行

教學進度

實驗時間初步規劃如下:

時間 實驗進度規劃

第一週至第二週 講解實驗

第三週至第八週 實驗一到實驗五

第九週 期中考週

第十週至第十三週 實驗六到實驗九

第十四週 考前複習

第十五週 期末考詴

成績考核

1. 出席率以及學習態度：（30 %）

2. 實驗報告及心得報告：（40 %）

3. 期中考＋期末考：（30 %）

附錄-64

48. 固體力學與奈米材料實驗

課程說明

以實驗方法讓同學瞭解機械系統固力與材料相關特性:

From many solid mechanics and materials interesting experiments,

you will find this course a very exciting experience for you to

explore and discover. Just remember to have fun under safety

conditions.

實驗項目

(1) 奈米材料拉伸實驗 (Tensile Test of Nanomaterials)

(2) 材料衝擊與硬度實驗 (Impact and Hardness Test)

(3) I 型樑應變量測 (Strain Measurement of an I-Beam)

(4) 樑振動模態分析 (Modal Analysis of a Beam)

(5) 扭轉振動 (Torsional Vibration)

(6) 動平衡測詴 (Dynamic Balance)

(7) 挫曲實驗(Bucking Experiment)

(8) 穿透式光彈實驗 (Transmission-Type Photoelastic

Experiment)

(9) 超音波非破壞性檢測 (Nondestructive Test Using Ultrasonic

Transducers)

指定用書 實驗教材 will be provided to cover the guidelines and procedures

for the experiments as well as safety procedures.

參考書籍 Solid mechanics related textbooks and references are listed in

descriptions of each experiment.

教學方式

上課方式:

[1] 每人在做實驗前先繳預習報告(A4 紙)乙份，內容包括(1)封

面、(2)實驗目的、(3)實驗原理、(4) 實驗設備、(5)量測項目

清單、及(6)預期結果。

Pre-Lab Report

(1) Cover, (2) Purpose of Experiment, (3) Principle, (4)

Equipment, (5) Table of Items to be Measured, (6) Expected

Results

[2] 每人在實驗完畢後一週，於上課時繳實驗報告(A4 紙)乙份，

內容包括(1)封面、(2)摘要、(3)實驗目的、(4) 實驗目的、(5)

實驗設備、(6)實驗結果與討論、(7) 結論、(8) 參考資料(所

有非自行繪製圖表需列出資料來源)、及(9)附錄(計算過程、

不準度分析及其他)。

Lab Report

(1) Cover, (2) Abstract, (3) Purpose of Experiment, (4)

Principle, (5) Equipment, (6) Results and Discussion, (7)

附錄-65

Conclusions, (8)References, (9)Appendix(Results Calculation,

Uncertainty Analysis, et al.)

分組方式: 共分九組。

實驗時間: 自 3 月 29 日當週起每週一、二、四

14:10-14:20 報到簽名、繳交預習報告及上週實驗報告

14:20 助教收走簽名單

14:20-14:30 助教示範講解及告知安全事項

14:30-16:00 實驗操作及數據初步分析

16:00-17:00 數據經值日助教檢查簽名後，方可離開，17:00前結

束

實驗講解: 講授實驗項目之原理、步驟及注意事項。

時間 (暫定):

3 月 22 日(星期一)19:00-21:30 實驗一、實驗二、實驗三、實驗

四、實驗五

3 月 23 日(星期二)19:00-21:30 實驗六、實驗七、實驗八、實驗

九

地點: 工程一館 107 階梯教室

實驗項目

(1) 奈米材料拉伸實驗 (Tensile Test of Nanomaterials)

(2) 材料衝擊與硬度實驗 (Impact and Hardness Test)

(3) I 型樑應變量測 (Strain Measurement of an I-Beam)

(4) 樑振動模態分析 (Modal Analysis of a Beam)

(5) 扭轉振動 (Torsional Vibration)

(6) 動平衡測詴 (Dynamic Balance)

(7) 挫曲實驗(Bucking Experiment)

(8) 穿透式光彈實驗 (Transmission-Type Photoelastic

Experiment)

(9) 超音波非破壞性檢測 (Nondestructive Test Using Ultrasonic

Transducers)

成績考核 成績計算方式: 預習報告(20%)、實驗報告(40%)、及期末考(40%)

期末考 時間: 6月第一週星期一19:00-21:00