Building a world without Building a world without wires! wires! October 6, 2000 October 6, 2000 Kichul Chang Kichul Chang Principal Engineer Principal Engineer LG Innotek Co., Ltd. LG Innotek Co., Ltd. [email protected][email protected]http://carpc.co.kr http://carpc.co.kr
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Building a world without wires! October 6, 2000 Kichul Chang Principal Engineer LG Innotek Co., Ltd. [email protected] .
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Building a world without wires!Building a world without wires!
Bluetooth IntroductionBluetooth Introduction Future of BluetoothFuture of Bluetooth Market OverviewMarket Overview Chipset & Module TrendChipset & Module Trend ConclusionConclusion
BluetoothBluetoothIntroduction Introduction
- 4 -
Personal Ad-hoc Personal Ad-hoc ConnectivityConnectivity
Cable Cable ReplacementReplacement
Landline
Data/Voice Data/Voice Access PointsAccess Points
Bluetooth VisionBluetooth Vision The best low-cost radio link technologyThe best low-cost radio link technology
Perfect for mobile devices – small, low power, and low cost, but good Perfect for mobile devices – small, low power, and low cost, but good performanceperformance
Bluetooth SIG HistoryBluetooth SIG History Ericsson Invented the Concept - '94Ericsson Invented the Concept - '94 Invited Other Industry Leaders to Help Develop the Concept - '97Invited Other Industry Leaders to Help Develop the Concept - '97 Technology Announced - May '98Technology Announced - May '98 Nine Lead Promoter CompaniesNine Lead Promoter Companies
- Ericsson, Nokia, Toshiba, Intel, IBM - Ericsson, Nokia, Toshiba, Intel, IBM
- Microsoft, Motorola, 3Com, Lucent (Dec '99) - Microsoft, Motorola, 3Com, Lucent (Dec '99) Unprecendented Industry Acceptance of the Bluetooth Wireless TechnologyUnprecendented Industry Acceptance of the Bluetooth Wireless Technology
- Over 2000 Adopter and Associate Companies Have Joined the SIG!- Over 2000 Adopter and Associate Companies Have Joined the SIG!
- Many Market Segments and Usage Models Have Been Defined- Many Market Segments and Usage Models Have Been Defined v1.0 Specification Published - July '99v1.0 Specification Published - July '99 v1.0b Update Published - Dec '99v1.0b Update Published - Dec '99 v1.1 Update will be Published - Nov '00v1.1 Update will be Published - Nov '00
- New Member Web-Site Opened (http://www.opengroup.org/bluetooth)- New Member Web-Site Opened (http://www.opengroup.org/bluetooth) Products Are Starting to Enter the Market NowProducts Are Starting to Enter the Market Now
- Mobile Phones, Headsets, Mobile PCs, Data Access Points- Mobile Phones, Headsets, Mobile PCs, Data Access Points
- 6 -
Korean SIG MembersKorean SIG Members
•Advanced Semiconductor Business Inc.Advanced Semiconductor Business Inc.•Belco International Co., LtdBelco International Co., Ltd•Bellwave, Inc.Bellwave, Inc.•C&S TechnologyC&S Technology•Commax.co.ltdCommax.co.ltd•CyberbankCyberbank•D.O.TelD.O.Tel•Dacom CorpDacom Corp•Daewoo Telecom LTDDaewoo Telecom LTD•DAIC MicrosystemsDAIC Microsystems•Doshin Electroniks Corp.Doshin Electroniks Corp.•DreamTelDreamTel•DSI Inc.DSI Inc.•EST(Embedded Solution Technology Inc.)EST(Embedded Solution Technology Inc.)•ETRIETRI•FlinstonFlinston•Gmate, Inc. / ASIC design Lab.Gmate, Inc. / ASIC design Lab.•Hanchang CorpHanchang Corp•Hansei UniversityHansei University•HASSNetHASSNet•HC Telecom Co., Ltd.HC Telecom Co., Ltd.•Hutel Inc.Hutel Inc.
•IWingzIWingz•JATY ELECTRONICS CO., LTDJATY ELECTRONICS CO., LTD•Joohong Information and communicationJoohong Information and communication•JTEL Co. LtdJTEL Co. Ltd•KetiKeti•KiRyung Electronics Co., LtdKiRyung Electronics Co., Ltd•Korea Electronics Technology InstituteKorea Electronics Technology Institute•Kortronics Enterprise Co., LtdKortronics Enterprise Co., Ltd•LG Electronics Inc./ Media-Communication Lab.LG Electronics Inc./ Media-Communication Lab.•LG Information & Communications,LtdLG Information & Communications,Ltd•LG Innotek Co., Ltd.LG Innotek Co., Ltd.•LG TelecomLG Telecom•Maxon ElectronicsMaxon Electronics•MiengineMiengine•MMC Technology, Inc.MMC Technology, Inc.•N3 Technologies IncN3 Technologies Inc•NavtronNavtron•Netnaru Ltd.Netnaru Ltd.•Nexcell Telecom CO, LtdNexcell Telecom CO, Ltd•Nong Shim Data System Co, Ltd.Nong Shim Data System Co, Ltd.•NuArk Co., Ltd.NuArk Co., Ltd.•Open SolutionOpen Solution
•Opentech Inc.Opentech Inc.•Powerlink Corp.Powerlink Corp.•Radionix Inc.Radionix Inc.•RFSSRFSS•S&S Technology, Inc.S&S Technology, Inc.•SamsungSamsung•SANION CO.,LTD.SANION CO.,LTD.•Sejin Electron Inc.Sejin Electron Inc.•SENA Technologies, Inc.SENA Technologies, Inc.•SEWON TELECOM LTDSEWON TELECOM LTD•Simplex InvestmentSimplex Investment•SK TelecomSK Telecom•SysOnChip, Inc.SysOnChip, Inc.•TeleTek Inc.TeleTek Inc.•Telian CorporationTelian Corporation•Tescom co. ltd.Tescom co. ltd.•UNO Systems Co., LtdUNO Systems Co., Ltd•Wide Telecom, Inc.Wide Telecom, Inc.
Total 62 Company/University/Institute (19/July/'00)Total 62 Company/University/Institute (19/July/'00) About 200+ Companies participate in Bluetooth Developments.About 200+ Companies participate in Bluetooth Developments. Main Application is Mobile Phone and AccessaryMain Application is Mobile Phone and Accessary
- 7 -
BQRB = Bluetooth Qualification Review Board
BTAB = Bluetooth Technical Advisor Board
BQA = Bluetooth Qualification Administrator
BQB = Bluetooth Qualification Body
Program ManagementBoard
(PM Board)
LegalCommittee
(LEGAL)
ManagementServices(ADMIN)
Marketing(MKTG)
QualificationReviewBoard
(BQRB)
Test andInterop(TEST)
ArchitectureReviewBoard
(BARB)
Regulatory(GOV)
TechnicalWorkingGroups
RFRegulations
AviationRegulations
SecurityRegulations
JapanRegulations
BTAB
BQA
BQB
ExpertGroups
Errata Owner and Review pool
Sub-groups
- Promoter- Associate- Early Adopter- Independent
ChinaRegulations
Bluetooth SIG StructureBluetooth SIG Structure
- 8 -
Application Framework and Support
Link Manager and L2CAP
Radio & Baseband
Host Controller Interface
RF
Baseband
AudioLink Manager
L2CAP
TCP/IP HID RFCOMM
Applications
Data
Con
trol
Spec OverviewSpec Overview
Test Specification
- 9 -
Frequency band & Channel Arrangement : ISM BandFrequency band & Channel Arrangement : ISM Band- USA 2.4000 - 2.4835 GHz f = 2402 + k MHz, k=0, …78- Europe 2.4000 - 2.4835 GHz f = 2402 + k MHz, k=0, …78- Spain 2.4450 - 2.4750 GHz f = 2449 + k MHz, k=0, …22- France 2.4465 - 2.4835 GHz f = 2454 + k MHz, k=0, …22
- Data channel + 3 Voice Channel - Data Rate : 723.2 kbps / 57.6 kbps (Asymmetric),
432.6 kbps / 432.6 kbps (Symmetric)- Voice : 64 kbps for each channel
FEC (Forward Error Correction)FEC (Forward Error Correction)- 1/3 Rate FEC, 2/3 Rate FEC- ARQ scheme for the data
SecuritySecurity- Robust Authentication and Encryption : Key Length up to 128 bits- Fast Frequency Hopping : 79 channels- Low transmission Power : Range typically 10 meters
AudioAudio- CVSD (Continuous Variable Slope Delta Modulation)- 64k samples /s linear PCM data
Support up to 8 devices / piconet, Max 10 piconet (71 devices)Support up to 8 devices / piconet, Max 10 piconet (71 devices)
- 11 -
SCO (Synchronous Connection Oriented) - 1 대 1 의 대향 Link 를 형성 . 1 Packet / 1 SlotACL (Asynchronous Connection-Less) - Packet 교환형 , 1,3,5 등 3 종류의 Slot 점유
Spec Overview (Link)Spec Overview (Link)
Forward ReverseDM1 1 17 2/3 yes 1 800 800 108.8 108.8 108.8DH1 1 27 no yes 1 800 800 172.8 172.8 172.8DM3 2 121 2/3 yes 3 400 267 258.1 387.2 54.4DH3 2 183 no yes 3 400 267 390.4 585.6 86.4DM5 2 224 2/3 yes 5 267 160 286.7 477.9 36.3DH5 2 339 no yes 5 267 160 433.9 723.2 57.6AUX 1 29 no no 1 800 800 185.6 185.6 185.6HV1 na 10 1/3 no 1 - 800 64.0HV2 na 20 2/3 no 2 - 400 64.0HV3 na 30 no no 3 - 267 64.0
DV- A na 10 no no 1 - 800 64.0DV- D 1 9 2/3 yes 1 - 800 57.6
Asymmetric
ACL
FEC CRC Max.Slot
MaxAsym
Packet Type PayloadHeader
UserPayload
SCO
Max SymSlot/sec
Symmetric
- 12 -
Piconets & ScatternetsPiconets & Scatternets
MasterMasterPiconet 1Piconet 1
Slave 3Slave 3Slave 1Slave 1
Slave 2Slave 2
MasterMasterPiconet 3Piconet 3
Slave 7Slave 7Slave 6Slave 6
Slave 8Slave 8
MasterMasterPiconet 2Piconet 2
Slave 5Slave 5Slave 4Slave 4
A master and up to 7 slaveA master and up to 7 slaves from a Piconets from a Piconet
Master controls the PiconetMaster controls the Piconet
Slaves only communicate wSlaves only communicate with the masterith the master
Up to 10 Piconets in a ScatUp to 10 Piconets in a Scatternet before performance ternet before performance starts to degradestarts to degrade
Total 71 devices can be coTotal 71 devices can be connected togethernnected together(= 7*9 + 8)(= 7*9 + 8)
- 13 -
Bluetooth ProfileBluetooth Profile Profiles provide a vertical slice through the protocol stackProfiles provide a vertical slice through the protocol stack
- Each profile defines mandatory and optional features of each protocol- Each profile defines mandatory and optional features of each protocol One profile defined per usage modelOne profile defined per usage model Profiles are the basis for interoperability and logo requirementsProfiles are the basis for interoperability and logo requirements Each Bluetooth device supports one or more profileEach Bluetooth device supports one or more profile
Bluetooth QualificationBluetooth QualificationGoal : To ensure interoperability between different Bluetooth devices even from differ
ent vendors
BQTF
BQBManufacturer
BQA
Product tested
Declaration and documentation
review
Qualified products lists
Documents pulled from web side
Test report checked by BQB
Qualification Program Documents
RF
EMC
SAR
RF
EMC
SAR
USAUSA
EUROPEEUROPE
ETS 300328
ETS 300826
ES 59005
ETS 300328
ETS 300826
ES 59005
Deliverry
: 5 Week
Cost :
: USD 15k
Deliverry
: 5 Week
Cost :
: USD 15k
FCC Part 15
FCC Part 15
FCC Part 2
FCC Part 15
FCC Part 15
FCC Part 2
Delivery
: 6 Week
Cost
: USD 10k
Delivery
: 6 Week
Cost
: USD 10k
RF
EMC
SAR
RF
EMC
SAR
- 16 -
DATE: 5 - 9th November 2000 (Sunday - Thursday).DATE: 5 - 9th November 2000 (Sunday - Thursday).
LOCATION: Bellevue, Washington, U.S.ALOCATION: Bellevue, Washington, U.S.A (located near Seattle on the North West coast of the USA. Hosted by (located near Seattle on the North West coast of the USA. Hosted by Microsoft). Microsoft).
WHO IS INVITED?WHO IS INVITED? Engineers who meet ALL of the following criteria: Engineers who meet ALL of the following criteria: - Are developing Bluetooth components, firmware or software - Are developing Bluetooth components, firmware or software - Have a unique implementation - Have a unique implementation - Are able to fix problems with the portion of the product that they are testing - Are able to fix problems with the portion of the product that they are testing - Are members of the Bluetooth SIG - Are members of the Bluetooth SIG
THOSE **NOT** INVITED:THOSE **NOT** INVITED: - System integrators who are bringing third party products for evaluation - System integrators who are bringing third party products for evaluation - Marketing Staff - Marketing Staff - Observers, Press, Sales Representatives, Students - Observers, Press, Sales Representatives, Students
HOW WILL TESTING BE CONDUCTEDHOW WILL TESTING BE CONDUCTED - Category-1 (RF, BB, LM), - Category-1 (RF, BB, LM), - Category-2 (L2CAP, SDP, RFCOMM, TCS)- Category-2 (L2CAP, SDP, RFCOMM, TCS) - Category-3 (Application profiles). - Category-3 (Application profiles).
Time to MarketTime to Market Q3, 2000Q3, 2000 ?? On MarketOn Market
Comparsion with Other Spec.Comparsion with Other Spec.
- 20 -
IEEE 802.15 WPANIEEE 802.15 WPAN Task Group 1 (TG1)Task Group 1 (TG1)
- Bluetooth - IEEE Standards making efforts- Bluetooth - IEEE Standards making efforts- To publish an approved standard early next year- To publish an approved standard early next year
Task Group 2 (TG2)Task Group 2 (TG2)- Coexistence between 802.11 and 802.15 Wireless Network- Coexistence between 802.11 and 802.15 Wireless Network- Target Completion Date : Mar 2001- Target Completion Date : Mar 2001
Task Group 3 (TG3)Task Group 3 (TG3)- High Rate Study Group (>20Mbps) - High Rate Study Group (>20Mbps) - Target Completion Date : Nov 2001- Target Completion Date : Nov 2001
MC (Marketing Committee)MC (Marketing Committee)
R2SG (Radio 2 Study Group)R2SG (Radio 2 Study Group)
LRSG (WPAN Low Rate Study Group) LRSG (WPAN Low Rate Study Group)
Fully backward interoperable with Bluetooth Specification 1.0Fully backward interoperable with Bluetooth Specification 1.0
To meet cost/power requirements, SIG did not want larger bandwidth applicationTo meet cost/power requirements, SIG did not want larger bandwidth application
Conflict with IEEE 802.15.3 (TG3)Conflict with IEEE 802.15.3 (TG3)
BluetoothBluetooth
802.15802.15
Radio 1Radio 1
2.4G, 1Mbps2.4G, 1Mbps
2.4G, 1Mbps2.4G, 1Mbps
Radio 2Radio 2
2.4G, 2~10Mbps2.4G, 2~10Mbps
2.4G, 20Mbps2.4G, 20Mbps
Radio 3Radio 3
5G(?), 20Mbps5G(?), 20Mbps
- 22 -
Developed by Philips, Sony, Toshiba, Ericsson and NokiaDeveloped by Philips, Sony, Toshiba, Ericsson and Nokia
Classes:Classes: Sound distribution: high quality audio to headphones and speaker setsSound distribution: high quality audio to headphones and speaker sets Surround distribution: wireless surround sound systemsSurround distribution: wireless surround sound systems Video distribution: observation camera, video projectorVideo distribution: observation camera, video projector Video conferencing: 3Video conferencing: 3rdrd generation mobile phones generation mobile phones Audio/video control: control signalsAudio/video control: control signals
Key aspects: Quality of service and choice of right codecsKey aspects: Quality of service and choice of right codecs
Audio Compression : MP3Audio Compression : MP3
Video Compression : MPEG4Video Compression : MPEG4
MPEG1(1.5Mbps) & MPEG2(>5Mbps) will realize in ver2.0 or higherMPEG1(1.5Mbps) & MPEG2(>5Mbps) will realize in ver2.0 or higher
A/V Profile W/G
- 23 -
Accessing the CarAccessing the Car Authorize for Car AccessAuthorize for Car Access Personalized SettingPersonalized Setting Authorize car embedded equipmentAuthorize car embedded equipment Authorize for ServiceAuthorize for Service
Vehicle Area LAN ExtensionVehicle Area LAN Extension
Public Access ProfilePublic Access Profile Authorized Workshop, Gas Station, Authorized Workshop, Gas Station,
etc.etc. Anonymous AccessAnonymous Access
AutomotiveAutomotive&&
BluetoothBluetooth
Automotive W/G
- 24 -
Car Hands Free 운전중 휴대폰 사용 금지 법제화 추진 운전중 휴대폰 사용 금지 법제화 추진 ('01('01 년 입법화 예정년 입법화 예정 )) Headset, Ear PieceHeadset, Ear Piece 의 사용 여부 미결정의 사용 여부 미결정 Navigation System, A/V System Navigation System, A/V System 등에 장착 예정등에 장착 예정
Open, Global MarketOpen, Global Market Over 2,000 Company Participate in Bluetooth BusinessOver 2,000 Company Participate in Bluetooth Business
- 27 -
Source : Cahners In-Stat Group, July 2000Source : Cahners In-Stat Group, July 2000
FAXFAX
Notebooks,Notebooks,HHPCsHHPCs
DesktopDesktopPCsPCs
Palm Palm ComputersComputers
VideoVideoProjectorsProjectors
HomeHomeNetworkingNetworking
AutomotiveAutomotiveCellularCellular
PhotoPhotoPrintersPrinters
Set TopSet TopBoxesBoxes
Cellular/PCSCellular/PCS
HeadsetsHeadsets
CordlessCordlessPhonesPhones
PBXPBX
PrintersPrinters
OfficeOfficeNetworksNetworks
DigitalDigitalCamerasCameras
Potential Bluetooth MarketsPotential Bluetooth Markets
- 28 -
PhonePhonePhonePhone
20032003200220022001200120002000
DongleType
BT Module을 내장
Baseband 기능을 Host Chip 에 내장하고 RF 부분만 Module 화
• 핸즈프리핸즈프리• 명함 교환명함 교환
• 데이터 교환데이터 교환• 3 in 1 Phone3 in 1 Phone
• 리모콘리모콘• 전자상거래전자상거래
NotebookNotebookPDAPDA
NotebookNotebookPDAPDA
USB DonglePCMCIA Card
본체내 Module 내장
• 인터넷연결인터넷연결• 화일교환화일교환
• WLANWLAN• 주소록교환주소록교환
• 주변기기연결주변기기연결 (Printer,(Printer, 카메라등카메라등 ))
Desktop-Desktop-PCPC
Desktop-Desktop-PCPC
PC CardUSB Adapter
본체내 Module 내장
• WLANWLAN• 주소록 교환주소록 교환
• 주변기기연결주변기기연결 (Printer(Printer 등등 ,,카메라카메라 ))
• 주변기기연결주변기기연결 (( 마우스마우스 ,, 키보드키보드등등 ))
AccessaryAccessary&&
Etc.Etc.
AccessaryAccessary&&
Etc.Etc.
휴대폰전용 H/F
차량용 /PC 용H/F
가정용H/F
PSTN GatewayLAN Access Point
마우스키보드
CNS,A/VREKES
가전 , 게임기장남감
BT 적용
RF 적용
Bluetooth Product TrendBluetooth Product Trend
- 29 -
0
200
400
600
800
1000
1200
1400
1999 2000 2001 2002 2003 2004 2005
Industrial & MedicalAutomotiveOther/MiscOutput EquipmentDigital Still CameraComputingCommunications
Source : Cahners In-Stat Group, July 2000Source : Cahners In-Stat Group, July 2000
Bluetooth Worldwide Market Growth Europe and Japanese Markets take off faster than in North America.Europe and Japanese Markets take off faster than in North America. Total 1,375Million Unit in 2005Total 1,375Million Unit in 2005
0.060.06 2.492.4930.630.6
166.7166.7
442.4442.4
811.0811.0
1,3751,375
Million UnitMillion Unit
- 30 -
MobileMobilePhonesPhones45.6%45.6%
PC Cards &PC Cards &AdaptersAdapters
32.9%32.9%
Printer &Printer &FaxFax
7.0%7.0%
Desktop PCsDesktop PCs6.4%6.4%
Notebook PCsNotebook PCs3.4%3.4%
CordlessCordlessPhonesPhones2.6%2.6%
OtherOther2.1%2.1%
2001 = 31M 2001 = 31M UnitsUnits
MobileMobilePhonesPhones73.2%73.2%
Desktop PCsDesktop PCs5.9%5.9%
HeadsetsHeadsets4.6%4.6%
Printer & FaxPrinter & Fax4.1%4.1%
Notebook PCsNotebook PCs3.8%3.8%
PC Cards &PC Cards &AdaptersAdapters
3.6%3.6%
OtherOther4.9%4.9%
2005 = 1,375M Units2005 = 1,375M Units
Top 6 Bluetooth Application Digital Mobile Phone's Bluetooth Market grows from 45.6% to 73.2%Digital Mobile Phone's Bluetooth Market grows from 45.6% to 73.2% As more products integrate Bluetooth, the percentage of PC Cards/Adapters will As more products integrate Bluetooth, the percentage of PC Cards/Adapters will
shrink.shrink.
Source : Cahners In-Stat Group, July 2000Source : Cahners In-Stat Group, July 2000
- 31 -
Semiconductor Revenue vs. ASP Total 6 year CAGR of 256% in revenueTotal 6 year CAGR of 256% in revenue 29% decline in average sales price, from 1999 to 200529% decline in average sales price, from 1999 to 2005
0
1,000
2,000
3,000
4,000
5,000
6,000
1999 2000 2001 2002 2003 2004 2005
0
5
10
15
20
25
30
Revenue
ASP
Source : Cahners In-Stat Group, July 2000Source : Cahners In-Stat Group, July 2000
Million US$Million US$ US$US$
- 32 -
Bluetooth Equipment Maker 3Com - Bluetooth Modem Card for Notebook PCs3Com - Bluetooth Modem Card for Notebook PCs Acer NeWeb - licensed WIDCOMM's dongle, PCMCIA, CFAcer NeWeb - licensed WIDCOMM's dongle, PCMCIA, CF Alcatel - OneTouch 500, 700 GSM PhoneAlcatel - OneTouch 500, 700 GSM Phone Axis Communications - Access PointAxis Communications - Access Point Compaq - Psion's PC Cards, USB DongleCompaq - Psion's PC Cards, USB Dongle Dell - Psion's PC Cards, USB DongleDell - Psion's PC Cards, USB Dongle Motorola/Digianswer A/S - PCMCIA, USB Adapter, Car-KitMotorola/Digianswer A/S - PCMCIA, USB Adapter, Car-Kit Ericsson - T36 GSM Phone, HeadsetEricsson - T36 GSM Phone, Headset Handspring - Acer Nweb's ProductHandspring - Acer Nweb's Product IBM - Motorola and TDK's PC CardIBM - Motorola and TDK's PC Card Socket Communication - CompactFlash CardSocket Communication - CompactFlash Card TDK - PC Cards, USB Adapter, CF, LAN Access PointTDK - PC Cards, USB Adapter, CF, LAN Access Point Toshiba - Note Book PCsToshiba - Note Book PCs Xircom - PC Cards, USB Dongle, CFXircom - PC Cards, USB Dongle, CF
Radio ModuleRadio Module Bluetooth ModuleBluetooth Module
- 35 -
Radio IC BiCMOS Technology - Low Power ConsumptionBiCMOS Technology - Low Power Consumption Low IF or Direct ConversionLow IF or Direct Conversion Qualcomm MSM InterfaceQualcomm MSM Interface BlueRF InterfaceBlueRF Interface VendorVendor
External Flash Memory for Firmware (2Mbits to 4Mbits)- To reduce riskExternal Flash Memory for Firmware (2Mbits to 4Mbits)- To reduce riskSpecification is not fixed!Specification is not fixed!
CMOS Technology - One ChipCMOS Technology - One Chip Package - BGA-96, TQFP-100/144, FPBGA-96Package - BGA-96, TQFP-100/144, FPBGA-96 Include Voice Codec Include Voice Codec Full 3 SCO SupportFull 3 SCO Support
- 38 -
RADIO ONLYRADIO ONLY
Portable phones! Phones contain powerful processors and memory capable of providing baseband and control functions
A cost-effective solution is often to provide a module containing only the radio function
RADIO + BASEBANDRADIO + BASEBAND
….if phone processor does not have excess capacity to support Bluetooth TX data formatting and RX synchronization.
AlcatelAlcatelFull ModuleFull Module(LTCC)(LTCC) 자사 자사 (One Chip)(One Chip) '01/Q1 '01/Q1 양산양산
JTDCJTDCFull ModuleFull Module(PCB)(PCB)
PhilsarPhilsar MitelMitel ??
미쯔미전기미쯔미전기 Full Module/RF ModuleFull Module/RF Module CSRCSR '01/Q1 '01/Q1 양산양산CSRCSR
Maker Module& PCB Type RF Chip BB Chip Status
Bluetooth Module Maker
- 41 -
10 mm 12 mm
PhilipsPhilipsEricssonEricsson MurataMurata
Radio Module
14mm
10.2
mm
Substrate : LTCC (Low Temperature Co-Substrate : LTCC (Low Temperature Co-Fired Ceramic)Fired Ceramic)
Flip-Chip, Wire BondedFlip-Chip, Wire Bonded BGA PackagingBGA Packaging Target Application : Mobile Phone, Full Target Application : Mobile Phone, Full
ModuleModule
(6mm x (6mm x
8mm)8mm)
- 42 -
BlueRFTM
Standard Interface for RF and BasebandStandard Interface for RF and Baseband BenefitsBenefits
- SoC designers need not to have expertise in RF design- SoC designers need not to have expertise in RF design- SoC vendors will have confidence there will be multiple RF parts- SoC vendors will have confidence there will be multiple RF parts- RF designers will have one design for multiple SoC applications- RF designers will have one design for multiple SoC applications
Receive Path - RxMode1,2,3Receive Path - RxMode1,2,3 Transmit Path - One ConfigurationTransmit Path - One Configuration Control Register Interface - JTAG, DBusControl Register Interface - JTAG, DBus Contact to [email protected] to get the specificationContact to [email protected] to get the specification