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PE/TRD/CN/4273 14.00/EN April, 2003 BSC e3 and TCU e3 Local Maintenance OML14 Course Course #1596AEN Copyright 2003Nortel Networks, All Rights Reserved Printed in France NORTEL NETWORKS CONFIDENTIAL: The information contained in this document is the property of Nortel Networks. Except as specifically authorized in writing by Nortel Networks, the holder of this document shall keep the information contained herein confidential and shall protect same in whole or in part from disclosure and dissemination to third parties and use for evaluation, operation and maintenance purposes only. You may not reproduce, represent, or download through any means, the information contained herein in any way or in any form without prior written consent of Nortel Networks. The following are trademarks of Nortel Networks Corporation: *NORTEL NETWORKS, the NORTEL NETWORKS corporate logo, the NORTEL Globemark, HOW THE WORLD SHARES IDEAS, UNIFIED NETWORKS, BSC6000. GSM is a trademark of France Telecom. All other brand and product names are trademarks or registered trademarks of their respective holders.
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  • PE/TRD/CN/4273 14.00/EN April, 2003

    BSC e3 and TCU e3 Local Maintenance

    OML14 Course

    Course #1596AEN

    Copyright 2003Nortel Networks, All Rights Reserved

    Printed in France

    NORTEL NETWORKS CONFIDENTIAL:

    The information contained in this document is the property of Nortel Networks. Except as specifically authorized in writing by Nortel Networks, the holder of this document shall keep the information contained

    herein confidential and shall protect same in whole or in part from disclosure and dissemination to third parties and use for evaluation, operation and maintenance purposes only.

    You may not reproduce, represent, or download through any means, the information contained herein in any way or in any form without prior written consent of Nortel Networks.

    The following are trademarks of Nortel Networks Corporation: *NORTEL NETWORKS, the NORTEL NETWORKS corporate logo, the NORTEL Globemark, HOW THE WORLD SHARES IDEAS, UNIFIED

    NETWORKS, BSC6000. GSM is a trademark of France Telecom.

    All other brand and product names are trademarks or registered trademarks of their respective holders.

  • BSC e3/TCU e3 Local Maintenance

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    PE/TRD/CN/4273 14.00/EN April, 2003 ii

    Publication History

    Version Date mm/dd/yy

    Comments

    PE/TRD/CN/4273

    13.01/EN Mars 2001 Creation

    13.02/EN July 2001 Updating of the section 7: BSC e3 and TCU e3 Troubleshooting (TML part)

    14.00/EN April 2003 Update

  • BSC e3/TCU e3 Local Maintenance

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    OML14 Course

    Introduction 1

    BSC e3 and TCU e3 Architecture 2

    BSC e3 and TCU e3 Board Description 3

    Thermic, Energetic and Cabling Aspects 4

    Hardware Features and Configuration 5

    BSC e3 and TCU e3 Startup 6

    BSC e3 and TCU e3 Troubleshooting 7

    BSC e3 and TCU e3 Module Replacement 8

    Glossary 9

  • BSC e3/TCU e3 Local Maintenance

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    Volume Composition

    No. Title Reference Version/Edition

    1 OML14 BSC e3 and TCU e3 Local Maintenance

    PE/TRD/CN/4273 14.00/EN

  • BSC e3/TCU e3 Local Maintenance

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    Course Presentation

    This course covers the BSC e3 and TCU e3 local maintenance.

    It describes how to use the TML e3 equipment to troubleshoot a BSC e3/TCU e3 on site.

    It describes also fault finding and software upgrading.

    Course Objectives Upon completion of this course, you will be able to:

    Describe the architecture of the BSC e3 and TCU e3. Describe all board functions and interfaces. Use the TML e3 equipment to interpret events coming from the BSC e3 and TCU e3 to perform tests and upgrades.

    Identify, with leds and panel displays, the faulty modules and replace them.

    Prerequisites This course is designed for people who maintain the BSS on site (Operator Field Technicians, Supervisors). Before attending this course, you need to have a good understanding of the Telecommunication systems (hardware and software) or equivalent systems. This knowledge is provided by the following course:

    SY1ven: GSM System and Products Overview.

    Scope

    This course applies to the BSC e3 and TCU e3 V14 version.

  • BSC e3/TCU e3 Local Maintenance

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    Table of Contents

    COURSE NOTES CONTENTS

    PUBLICATION HISTORY ii

    OML14 COURSE iii

    VOLUME COMPOSITION iv

    COURSE INTRODUCTION v

    TABLE OF CONTENTS vii

    1. INTRODUCTION 1-1

    GSM/GPRS/UMTS TRAINING CURRICULUM 1-2

    BSS NORTEL TECHNICAL PUBLICATIONS 1-3

    CONTENTS 1-4

    OBJECTIVES 1-5

    2. BSC E3 AND TCU E3 FUNCTIONAL ARCHITECTURE 2-1

    OBJECTIVES 2-2

    CONTENTS 2-3

    BSS IN THE GSM NETWORK 2-4

    BSS ARCHITECTURE 2-5

    BSC E3 AND TCU E3 EXTERNAL LINKS 2-6

    BSC E3 AND TCU E3 MIXED SYSTEM ARCHITECTURE 2-7

    BSC E3 AND TCU E3 PRESENTATION 2-8

    BSC E3 ARCHITECTURE 2-9

    DESCRIPTION 2-9

    FUNCTIONAL ARCHITECTURE 2-10

    TCU E3 ARCHITECTURE 2-11

    DESCRIPTION 2-11

    FUNCTIONAL ARCHITECTURE OF A TRANSCODING NODE 2-12

  • BSC e3/TCU e3 Local Maintenance

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    3. BSC E3 AND TCU E3 BOARD DESCRIPTION 3-1

    OBJECTIVES 3-2

    CONTENTS 3-3

    CONTROL NODE 3-5

    ARCHITECTURE 3-6

    HARDWARE MODULES 3-7

    THE CN SLICES 3-8

    TM FUNCTIONS 3-9

    MEMORY MASS STORAGE 3-10

    OMU 3-11

    ATM-SW 3-12

    TMU 3-13

    MINIMAL CONFIGURATION FOR THE CN 3-14

    INTERFACE NODE 3-15

    ARCHITECTURE 3-16

    BOARD LAYOUT 3-17

    CEM 3-18

    8K-RM 3-19

    ATM-RM 3-20

    LSA-RC 3-21

    MINIMAL CONFIGURATION FOR THE IN 3-24

    TRANSCODING NODE 3-25

    ARCHITECTURE 3-26

    BOARD LAYOUT 3-27

    TRM 3-28

    MINIMAL CONFIGURATION FOR THE TN 3-29

  • BSC e3/TCU e3 Local Maintenance

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    4. THERMIC, ENERGETIC AND CABLING ASPECTS. 4-1

    OBJECTIVES 4-2

    CONTENTS 4-3

    POWER SUPPLY AND ALARMS SYSTEMS 4-4

    PCIU MODULES 4-4

    SIM MODULE 4-5

    COOLING SYSTEM 4-6

    LOCATION OF THE COOLING & FAN UNITS 4-6

    COOLING & FAN UNITS 4-7

    BSC E3/TCU E3 CABLING 4-8

    SAI FRAME 4-8

    BSC E3 OPTICAL FIBER CABLING 4-9

    PCM CABLING BETWEEN SAI & LSA-RC 4-10

    PCM CABLING: CONNECTION LAS-RC/CTU 4-11

    PCM CABLING: CTU CONNECTIONS 4-12

    OPTIONAL HUB 4-13

    48 V DC & ALARMS CABLING 4-14

    BSC E3 ALARM CABLING 4-15

    TCU E3 ALARM CABLING 4-16

    BSC E3/TCU E3 FUSES 4-17

    5. HARDWARE FEATURES, CONFIGURATION & DIMENSIONING 5-1

    OBJECTIVES 5-2

    CONTENTS 5-3

    HARDWARE FEATURES 5-4

    MAIN CHA RACTERISTICS 5-4

    FILLER MODULE 5-5

    BSC E3 &TCU E3 CONFIGURATIONS 5-6

    MIN & MAX CONFIGURATIONS 5-6

    BSC E3 & TCU E3 TYPICAL CONFIGURATIONS 5-7

    BSC E3 CONFIGURATION EXAMPLES 5-8

  • BSC e3/TCU e3 Local Maintenance

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    6. BSC E3/TCU E3 STARTUP 6-1

    OBJECTIVES 6-2

    CONTENTS 6-3

    EQUIPMENT STARTUP 6-4

    PRINCIPLE 6-4

    LED DISPLAY 6-5

    BSC STARTUP AT THE OMC-R 6-7

    HOT STARTUP (MIB BUILT) 6-7

    COLD STARTUP (MIB NOT BUILT) 6-8

    CONTROL NODE STARTUP 6-9

    MAIN PRINCIPLES 6-10

    BOARD RECOVERY 6-11

    SLICE RECOVERY 6-12

    DEAD OFFICE RECOVERY 6-13

    CN COMPLETE STARTUP SEQUENCE 6-14

    CN STARTUP T IMER 6-15

    INTERFACE NODE & TRANSCODING NODE STARTUP 6-17

    IN STARTUP: PRINCIPLES 6-18

    IN STARTUP: CEM/RM MODULES STATES 6-19

    TN STARTUP 6-20

    FAULT TOLERANCE 6-21

    SOFTWARE 6-22

    CELLGROUP CONCEPT 6.23

    SWACT ON TMU FAILURE 6-24

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    7. BSC E3 AND TCU E3 TROUBLESHOOTING 7-1

    OBJECTIVES 7-2

    CONTENTS 7-3

    MAINTENANCE OVERVIEW 7-4

    TML/RACE HARDWARE ARCHITECTURE 7-5

    REMOTE ACCESS EQUIPMENT 7-7

    ENVIRONMENT 7-8

    OVERVIEW 7-9

    LOGIN WINDOW 7-10

    TML E3 7-11

    ENVIRONMENT 7-12

    OVERVIEW 7-13

    CONNECTIONS 7-14

    TML E3 MAN MACHINE INTERFACE 7-15

    LOGIN WINDOW 7-16

    CONNECTION W INDOWS 7-17

    STARTING WINDOWS 7-18

    MAIN WINDOWS: INTERFACE NODE 7-19

    CONFIGURATION MENU 7-20

    TEST MENU (1/2) 7-21

    TEST MENU (2/2) 7-22

    DISK MENU (1/2) 7-23

    DISK MENU (2/2) 7-24

    MISCELLANEOUS MENU 7-25

    VIEW MENU 7-26

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    8. BSC E3 & TCU E3 MODULE REPLACEMENT 8-1

    OBJECTIVES 8-2

    CONTENTS 8-3

    SAFETY INSTRUCTIONS 8-4

    EXTRACTION/INSERTION OF A MODULE 8-5

    LOCATION OF MODULES 8-6

    MODULE R EPLACEMENT PROCEDURE 8-8

    GENERAL PRINCIPLES 8-8

    OMU MODULE 8-9

    PRIVATE MMS MODULE 8-10

    SHARED MMS MODULE 8-11

    ATM-SW MODULE 8-12

    ATM-RM MODULE 8-13

    TRM MODULE 8-14

    TMU MODULE 8-15

    CEM MODULE 8-16

    8K-RM MODULE 8-17

    BOARDS OF THE LSA-RC MODULE 8-18

    SIM MODULE 8-19

    FAN UNIT 8-20

    AIR F ILTER 8-21

    9. GLOSSARY 9-1

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    The copyright of this document is the property of Nortel Networks. Without the written consent of Nortel Networks, given by contract or otherwise, this document must not be copied, reprinted or reproduced in any material form, either wholly or in part, and the contents of this document, or any methods or techniques available therefrom, must not be disclosed to any other person whatsoever.

    BSCe3 BSCe3 andand TCUe3 Local TCUe3 Local MaintenanceMaintenance

    Course #1596Course #1596

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    The copyright of this document is the property of Nortel Networks. Without the written consent of Nortel Networks, given by contract or otherwise, this document must not be copied, reprinted or reproduced in any material form, either wholly or in part, and the contents of this document, or any methods or techniques available therefrom, must not be disclosed to any other person whatsoever.

    Section 1Section 1

    IntroductionIntroduction

  • BSCe3 and TCUe3 Local Maintenance

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    2NORTEL NETWORKS CONFIDENTIAL

    BSS, NSS and GPRS Courses

    1 dayV14 BSS Operation & Maintenance for V12 Experts

    OMV14

    2 daysBSCe3 and TCUe3 Local Maintenance

    OML14

    5 daysBSC, TCU and BTS S8000Local Maintenance

    OM363 daysBSC and TCU Local MaintenanceOM314 daysBSS Operation and Fault HandlingOM92 daysS8000 BTS Local MaintenanceOM64 daysOMC-R AdministrationOM410 daysBSS Operation and MaintenanceOM1/2

    BSS Operation & Maintenance Courses

    3 daysBSCe3 and TCUe3 Installation and Commissioning

    PIC13

    BSS Installation & Commissioning

    5 daysNetwork and RF Engineering Course

    NETRF12 daysCell Planning FundamentalsCP13 daysRF BasicsRF01 dayCellular Network Engine. ProcessCNE

    Radio and Network Engineering Courses

    1 dayATM OverviewTL42 daysTCP/IP OverviewTL31 dayFrame Relay OverviewTL22 daysTelecommunications OverviewTL1

    3 daysGSM System OverviewSYS

    5 daysGSM System and Products Overview

    SY12 daysGSM General OverviewSY0

    System Courses

    2 daysGSM GPRS SYSTEM RELEASE V14

    SR14.22 daysBSS DimensioningSY2

    2 daysBSCe3 and TCUe3 AdvancedDescription

    PR42 daysBSS Products OverviewPR3

    2 daysS8000 BTS FamilyAdvanced Description

    PR1

    2 daysNetwork Monitoring and Optimization

    NMO3 daysBSS Optimization ParametersNE2

    2 daysBSC 12000 and TCUAdvanced Description

    BS21

    3 daysAdvanced Radio Interface Description

    ARI

    BSS System Courses

    5 daysGSM CCS7 Transl. and Operations

    9745 daysGSM HLR Service Datafill97210 daysGSM-MSC/VLR Translations9702 daysSDM/FT Maintenance95510 daysGSM DMS Maintenance Part 29515 days GSM DMS Maintenance Part 19502 daysOMC-S Overview & Operation937

    3 days GSM HLR-PS (Provisioning Server)

    9352 daysGSM NSS Overview9313 daysGSM DMS Overview930

    4 daysGSM Intelligent Networks Overview

    9003 daysDMS XA-CORE Maintenance487

    NSS System Courses

    GP0 GPRS General Overview 1 dayGP1 GPRS Technical Description 3 daysGP3 SGSN Configuration and Operation 3 daysGP20 PCUSN Description and Configuration 4 daysGP21 PCUSN performance Management 2 daysGP22 PCUSN Integration and

    Fault Management 3 daysGP5 OMC-D Operation 5 daysGP6 Charging Gateway Operation 1 dayGP8 SIG Operation 1 dayGP100 PCUSN Local Maintenance 4 days

    GPRS Courses

    GSM/GPRS Training Curriculum

    The BSS and NSS training courses are split into several families according to the different skills required to deal with GSM networks:

    System: general knowledge about GSM, as well as a general view of the different Telecom technologies.

    BSS System: general knowledge of the BSS system: products, dimensioning, optimization.

    BSS Operation and Maintenance: how to operate and maintain a telecommunication network by using the OMC-R facilities fully. It gives an in-depth understanding of BSS functions and equipment.

    NSS System: knowledge of the operation and maintenance of the NSS part of the system.

    Radio and Network Engineering: cell planning, BSS network topology, field tests, data fill or BSS parameter optimization.

    BSS Installation and Commissioning: how to install, cable, and run on-site tests.

    GPRS: an overview of this new system and an advanced description of the new nodes.

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    3NORTEL NETWORKS CONFIDENTIAL

    UMTS Training CurriculumUMTS Courses

    2 daysSBAUM957

    3 daysWireless DMS XA-Core Maintenance

    UM956

    5 daysUMTS GPP IWFUM938

    5 daysWireless DMS HLR ServicesDatafill

    UM972

    10 daysWireless DMS MSC/VLR Translations

    UM970

    2 daysUMTS01/GSM 14 Delta ReleaseUM966

    2 daysWireless SDM-FT MaintenanceUM955

    10 daysWireless DMS Maintenance Part 2UM951

    5 daysWireless DMS Maintenance Part 1UM950

    2 daysWireless Circuit Core Network Overview

    UM9313 daysWireless DMS OverviewUM930

    5 daysWireless DMS Intelligent Networks Operation and Datafill

    UM900

    Circuit Core Networks Courses

    5 daysUMTS Radio Network Planning Project

    UM42

    3 daysUMTS Radio Network Planning Fundamentals

    UM41

    2 daysUMTS RF Engineering Fundamentals

    UM40

    Radio and Network Engineering Courses3 daysGGSN Configuration and

    OperationUM642

    3 daysUMTS Passport 7K & 15KOperation

    UM640

    5 daysWireless Gateway Configurationand Troubleshooting

    UM641

    1 dayShasta GGSN First LineMaintenance

    UM101

    4 daysWireless Gateway First LineMaintenance

    UM100

    Operation & Maintenance Courses

    1 dayShasta GGSN Detailed Description

    UM31

    2 daysWireless Gateway Detailed Description

    UM302 daysiBTS Detailed DescriptionUM222 daysiRNC Detailed DescriptionUM21

    2 daysUMTS Radio Access Network Description

    UM20

    ProductCourses

    5 daysPractical Implementation of a UMTS Access Network

    UM801

    1 dayiBTS Indoor Physical InstallationUM53

    1 dayiBTS Outdoor Physical Installation

    UM52

    1 dayiRNC Physical InstallationUM51

    Installation & Commissioning Courses

    2 daysUMTS General OverviewUM193 daysAdvanced UMTS Radio InterfaceUM12

    5 daysUMTS System & Products Description

    UM113 daysUMTS System DescriptionUM101 dayUMTS IntroductionUM0

    System Courses

    UMTS: an overview of this new system and an advanced description of the new nodes.

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    4NORTEL NETWORKS CONFIDENTIAL

    BSS Nortel Technical Publications

    OperationsManuals

    MaintenanceManuals

    ReferenceManuals

    OMC-RArchitecture

    and Reference

    TCU

    BSC

    S4000Outdoor

    BTS

    S2000/S2000E

    BTSS8000/S8002

    BTS

    16

    06

    S4000/S4000C

    IndoorBTS03

    22

    23

    53

    63

    S2000H/LBTS 35

    34

    BSS OperatingProcedures

    Fault Number Description

    103

    S8000/S8002BTS

    104

    S2000H/Le-cellBTS

    CT1000/Instal .Manual

    38105

    AdvancedMaintenanceProcedures

    101

    BSC/TCU

    36

    BSS ParametersUser Guide

    32

    OMC-RPreventive& Corrective

    Maintenance

    S4000Smart

    BTS43

    102

    S2000/S2000ES4000BTS

    ROT 14

    BSC Maintenance Procedures

    TCU Maintenance Procedures

    MaintenancePrinciples

    S2000/S2000E BTSMaintenanceProceduresS4000 BTSMaintenanceProceduresS8000 BTSMaintenanceProcedures

    TML (BSC/TCU)User Manual

    50

    41

    39

    42

    46

    47

    48

    S2000 H/L BTSMaintenanceProcedures

    49

    TML (BTS)User Manual

    51

    S8002 BTSMaintenanceProcedures

    84

    29

    CT1000User

    Manuale-cell

    BTS 92

    e-cell BTSMaintenanceManual

    90

    PE/CDC/DD/0004CD-ROM of

    GSM BSS NTPs

    PE/CDC/DD/0026CD-ROM of

    BSS Parameters User Guide+

    PE/CDC/DD/0083CD-ROM of

    GPRS Access NetworkParameters User Guide

    CT Tools (optional)

    V11/ V12O&M

    Evolutions

    52

    60

    Call Trace/Call Path Trace

    AnalyzerUser Manual

    20

    CT7100User

    Manual(BSS)

    121

    CT7100User

    Manual(NSS)

    S8006 BTSMaintenanceProcedures

    85

    106

    PCUSN

    SecurityAdministration

    SMS-CBand Help

    130

    BSS OperatingPrinciples

    07

    Objectsand

    Faults

    128

    ConfigurationPerformance

    andMaintenance

    129

    BSSParametersDictionary

    124

    ObservationsCounters

    Dictionary

    125

    PCUSN 91

    BSC e3and

    TCU e3126

    BSC e3 andTCU e3

    132131

    BSC e3and

    TCU e3

    BSS NetworkInventoryTool

    123

    GeneralInformation

    BSSOverview

    01

    BSS ProductDocumen-

    tationOverview

    00

    Whats newin the

    BSS V12NTP suite

    88

    GPRSOverview

    117

    The BSS product documentation or BSS Nortel Technical Publications comprises 53 manuals. The BSS NTPs (except optional NTPs) are available in the CD-ROM of GSM BSS NTPs (PE/CDC/DD/0004).

    Main kinds of manual:

    General information

    BSS Product Documentation Overview (00) is a general manual thatintroduces all the manuals of BSS NTPs and includes the glossary.

    BSS Overview (01) is an overview of the digital cellular network and of its division into subsystems.

    Reference manuals detail each subsystem or equipment in terms of the architecture, hardware and software of its modules and indicate general dimensioning rules.

    Maintenance manuals include both preventive and corrective maintenance and details of the various maintenance procedure. BSS Maintenance Principles describes the principles of maintenance and gives the list of faults.

    Operating manuals

    BSS Operating Principles gives the general principles of operation and a dictionary of GSM parameters and observation counters.

    BSS parameters User Guide (optional) aims at describing BSS GSM and Nortel Networks parameters, formulae and engineering issues for algorithm parameters; this manual is available in the CD-ROM (PE/CDC/DD/0026).

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    5NORTEL NETWORKS CONFIDENTIAL

    Contents

    Introduction BSC e3 and TCU e3 Functional Architecture BSC e3 and TCU e3 Board Description Thermic, Energetic and Cabling Aspects Hardware Features, Configuration and Dimensioning. BSC e3 and TCU e3 Startup BSC e3 Troubleshooting BSC e3 and TCU e3 Module Replacement Annex: ATM Reminders Glossary

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    6NORTEL NETWORKS CONFIDENTIAL

    Upon completion of this course, you will be able to:

    Describe the hardware and functional architecture of the BSC e3 and the TCU e3

    Describe the boards functions and interfaces

    Identify with leds the equipment status

    Troubleshoot the Equipment with the TML.

    Objectives

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    The copyright of this document is the property of Nortel Networks. Without the written consent of Nortel Networks, given by contract or otherwise, this document must not be copied, reprinted or reproduced in any material form, either wholly or in part, and the contents of this document, or any methods or techniques available therefrom, must not be disclosed to any other person whatsoever.

    Section 2Section 2BSC e3 and TCU e3 BSC e3 and TCU e3

    Functional ArchitectureFunctional Architecture

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    8NORTEL NETWORKS CONFIDENTIAL

    Objectives

    After completion of this section, the students will be able to:

    Recognize the BSC e3 and TCU e3 Cabinets

    Describe the internal architecture of the BSC e3 and TCU e3

    Describe the different functions handled by each Node.

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    9NORTEL NETWORKS CONFIDENTIAL

    Contents

    BSS in the GSM Network

    BSS Architecture

    BSC e3 and TCU e3 External Links

    BSC e3 and TCU e3 Presentation

    BSC e3 Architecture

    TCU e3 Architecture

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    10NORTEL NETWORKS CONFIDENTIAL

    BSS in the GSM Network

    TCU

    BSC

    OMC-R

    MSC

    RadioInterface

    A Interface

    Ater Interface

    Abis Interface

    NSS

    BSS

    OMN Interface

    Public TelephoneNetwork

    MS

    MS

    S2000H&LBTS

    S8000Indoor

    BTS

    S8000Outdoor

    BTSSun StorEdge A5000

    RadioInterface

    E-CellBTS

    PCUSN

    Agprs Interface

    GPRS Core Network

    Internet Gb Interface

    The Base Station Subsystem includes the equipment and functions related to the management of the connection on the radio path.

    It mainly consists of one Base Station Controller (BSC), and several Base Transceiver Stations (BTSs), linked by the Abis interface.

    An equipment, the Transcoder/Rate Adapter Unit (TRAU) so called TransCoder Unit (TCU) within Nortel Networks BSS products, is designed to reduce the number of PCM links.

    These different units are linked together through specific BSS interfaces:

    each BTS is linked to the BSC by an Abis interface,

    the TCUs are linked to the BSC by an Ater interface,

    the A interface links the BSC/TCU pair to the MSC.

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    11NORTEL NETWORKS CONFIDENTIAL

    BSS Architecture

    BSC e3

    AterA

    MS

    AirTCU e3

    TCU 1

    TCU 0

    ServiceAreaInterface

    TCP/IPEthernet

    MSC/HLR

    DMS

    Remote RACE client

    PSTN

    ServiceAreaInterface

    Control

    Node

    Interface Node

    ServiceAreaInterface

    BTS

    Abis

    OMC-R

    Optical InterfaceATM

    PCUSN

    OMN Interface

    Agprs

    GPRS CoreNetwork

    Internet

    Gb Interface

    The hardware architecture of the BSC e3 is based on 2 platforms:

    The Control Node is a multi-application platform (computing and signaling) built around an ATM -based switch (CC1 boards). It performs:

    Call Processing

    BSS OAM functions.

    The Interface Node (as well as the TCU) is based on the Spectrum platform. It provides dense PCM connectivity on the Abis and Ater interfaces and an optional optical fiber interface (SONET = Synchronous Optical NETwork) towards external equipment. It includes:

    a 64 kbit/s time switch for DS0 path switching

    a 8 kbit/s time switch for Voice path switching.

    Maximum Capacity

    The highest configuration of the BSC e3 and TCU e3 is able to handle up to 3000 Erlangas maximum traffic load.

    Note

    DS0 = Digital Signal level 0 : digital signal transmitted at the nominal rate of 64 kbps (PCM 30).

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    12NORTEL NETWORKS CONFIDENTIAL

    BSC e3 and TCU e3 External Links

    BTS BSC TCU MSC

    OMC-R

    Ethernet

    LAPDOML

    LAPDRSL

    LAPDOML

    SS7

    PCUSN

    LAP

    D O

    ML

    GPRS

    VoiceData

    Dat

    a

    LAPDGSL

    LAP

    D R

    SL

    LAP

    D G

    SL

    Agprs

    Abis Ater

    Three types of signaling are transported over the Abis Interface:

    LAPD/OML related to Operation and Maintenance,

    LAPD/RSL related to Radio Signaling Link,

    LAPD/GSL related to GPRS Radio Signaling Link.

    The BSC can be connected to the OMC-R through an Ethernet network or through the A Interface.

    Two types of signaling can be transported over the Ater Interface:

    the LAPD/OML for control of the TCU transcoders by the BSC,

    the SS7 going to the MSC.

    Three types of GPRS signaling can be transported over the Agprs Interface:

    the LAPD/OML for control of the PCUSN by the BSC,

    the LAP/RSL for control of Radio Signaling Link,

    the LAPD/GSL for control of GPRS Radio Signaling Link.

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    BSC e3 and TCU e3 Mixed System Architecture

    TCU 2GV12.4

    (TCB2)

    BSC 2GV12.4 BSC e3

    V14.3BSC e3V14.3

    TCU e3V14.3

    BTSsV12.4

    BTSsV12.4

    BTSsV14.3

    X.25

    Ethernet

    OMC-RV14.3

    PCU SNV14.3

    TCU 2GV12.4(TCB2)

    The BSC e3 and TCU e3 are intended to interwork with current BSC 2G (12000), BTS and OMC-R products.

    Note that BSC e3 is able to support TCU 2G as well, but only with TCB2 boards (EFR).

    The OMC-R - BSC e3 link is TCP/IP over Ethernet, instead of native X.25 for BSC 2G.

    The OMC-R BSC e3 link over A/Ater Interface is not available in the V14.3 release (V15 candidate feature).

    Either TCU 2G and/or TCU e3 can be used to recover the synchronizing clock and to carry SS7 links.

    Each TCU (2G and e3) requires LAPD link to communicate with BSC e3.

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    BSC e3 and TCU e3 Presentation

    BSC e3 TCU e3

    The BSC e3 and the TCU e3 are one-cabinet equipment, composed of two Nodes and one Service Area Interface.

    These Nodes are each housed in a sub rack comprising two shelves.

    The cabinet is designed for indoor applications.

    The design allows front access to the equipment.

    External cabling from below or above is supported.

    The Service Area Interface or SAI is installed on the left side of the cabinet:

    It provides front access to the PCM cabling.

    It contains the electrical equipment to interface the BSC or the TCU and the customer cables.

    The product is EMC compliant. No rack enclosure is required for this reason, as EMC compliance is achieved at the sub rack level (Control and Interface Node).

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    ServiceArea

    Interface ControlNode

    InterfaceNode

    BSC (doors closed) BSC (one door open)

    ServiceArea

    Interface

    Power Supplies

    Fans

    BSC e3 Architecture

    1 - Description

    Fans

    ControlNode

    InterfaceNode

    The BSC e3 is a one-cabinet equipment, composed of 3 frames:

    The Control Node (one upper dual-shelf assembly located above the Interface Node). It is ATM-based and ensures:

    GSM call & signaling processing

    Operation, Administration & Maintenance of the BSS.

    It is connected to the Interface Node by two optical fiber cables (one for Transmission and one for Reception) with a standard ATM interface.

    The Interface Node (one lower dual shelf). It is also ATM-based and provides:

    PCM connectivity (and an optional fiber interface in the future) towards the TCU, BTS and PCU

    Circuit switching functions.

    The Service Area Interface is installed on the left side of the cabinet. It provides:

    Front access to the PCM cabling

    An interface between the BSC e3 and the customer cables.

    The BSC e3 supports major GSM features, such as GPRS, the new vocoder AMR (Adaptive Multi-Rate FR) and the new modulation scheme EDGE

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    BSC e3 Architecture

    2 - Functional Architecture

    Optical Interface

    AterInterface

    TCU

    AbisInterface

    BTS

    OMU

    OAM

    Control Node

    ATM SW

    Interface NodeATM RM

    LSA RC

    PCM Interfac

    e

    CEM

    64 kbps

    LSA RC

    PCM Interfac

    e

    Switching Unit

    8 kbps

    8K RM

    TMU

    TrafficMgt

    TMU

    TrafficMgt

    TMU

    TrafficMgt

    BSC e3

    The Control Node is a computing and signaling platform built around an ATM Switch.

    It contains the BSC processing core that handles overall BSC operations including Interface Node operations, and enables communication with the OMC-R.

    It is composed of the following three functional modules:

    the ATM SW (Asynchronous Transfer Mode Switch)

    the OMU (Operation and Maintenance Unit)

    the TMU (Traffic Management Unit).

    The Interface Node is a circuit switch platform which provides dense PCM connectivity.

    It is made up of the following four major hardware modules:

    the ATM-RM (Asynchronous Transfer Mode Resource Module)

    the CEM (Common Equipment Module)

    the 8K RM (8K subrate matrix Resource Module)

    the LSA RC (Low Speed Access Resource Complex).

    NB: The BSC e3 cabinet is powered by four SIMs (Shelf Interface Module).

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    ServiceArea

    Interface TranscodingNode

    TranscodingNode

    ServiceArea

    Interface

    Power Supplies

    Fans

    TCU e3 Architecture

    1 - Description

    Fans

    TCU (doors closed) TCU (one door open)

    TranscodingNode

    TranscodingNode

    The TCU e3 is a one-cabinet equipment, composed of 3 frames:

    Two Transcoding Nodes (one dual-shelf per transcoder node) is designed to reduce the number of PCM links needed to convey radio speech and data channels in the BSS. It provides:

    Switching: the TCU e3 manages a multiplexer connecting the BSC and MSC.

    PCM link management: using the configuration data provided by the BSC e3, the TCU e3 configures and monitors the PCM links on the A and Ater interfaces.

    Transcoding and rate adaptation: coding/decoding of speech frames and rate adaptation.

    TCU e3 equipment management: OAM functions: initialization, startup, clock synchronization from A interface links, supervision, faultmanagement, software and configuration management.

    The Service Area Interface is installed on the left side of the cabinet. It provides:

    Front access to the PCM cabling

    An interface between the TCU e3 and the customer cables.

    The TCU supports the new vocoder AMR, allowing half-rate and enhanced voice quality full rate communications.

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    TCU e3 Architecture

    2 - Functional Architecture of a Transcoding Node

    AterInterface

    BSC

    Transcoding Node

    TRM12

    2

    TRM1

    S links

    LSA RC

    PCM Interfac

    e

    LSA RC

    PCM Interfac

    e

    AInterface

    MSCS linksS links

    CEM

    64 kbps

    The Transcoding Node performs the following main tasks related to communication, switching and transcoding.

    The TCU e3 cabinet is made of two Transcoding nodes.

    It is composed of the following three major hardware modules:

    The CEM (Common Equipment Module)

    The TRM (Transcoding Resource Module)

    The LSA RC (Low Speed Access Resource Complex).

    NB: The TCU e3 cabinet is powered by four SIMs (Shelf Interface Module).

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    The copyright of this document is the property of Nortel Networks. Without the written consent of Nortel Networks, given by contract or otherwise, this document must not be copied, reprinted or reproduced in any material form, either wholly or in part, and the contents of this document, or any methods or techniques available therefrom, must not be disclosed to any other person whatsoever.

    Section Section 33BSC e3 BSC e3 andand TCU e3 TCU e3 BoardBoard DescriptionDescription

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    Objectives

    After completion of this section, the students will be able to:

    Understand how each module interacts with the other ones within the BSC e3 and TCU e3.

    Know the physical characteristics of the BSC e3 and TCUe3.

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    Contents

    Control Node Boards

    Interface Node Boards

    Transcoding Node Boards

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    Control NodeControl Node

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    Control Node

    1 - Architecture

    ATM links 25 Mb/s

    ATM li

    nks

    25Mb

    /s

    ATM links25 Mb/s

    ATM links25 Mb/s

    TMUTMU1 14

    TrafficMgt

    TMU

    TrafficMgt

    TrafficMgt

    1 2

    Private Disk

    Private Disk

    Mirrored Shared Disks

    PassiveOMU

    ActiveOMU

    OAM

    Ethernet Link

    ATM SW ATM SW25Mb/s

    TowardsInterface Node

    TowardsInterface Node

    ATM Links155 Mb/s

    ATM Links155 Mb/s

    The Control Node is the processing unit of the BSC e3. It is an ATM-based engine that handles the following functions:

    OAM

    Traffic Management

    Call & Signaling processing.

    These main functions are performed by three sub-assemblies:

    OMU = Operation and Maintenance Unit (OA&M + Disk Management)

    ATM-SW = ATM Switch (Interconnection between OMUs and TMUs with Communication Controller boards and optical connection with the Interface Node)

    TMU = Traffic Management Unit (Traffic Management + Signaling Processing).

    The platform is full ATM inside: the links between the different modules inside the CN are ATM links at 25 Mb/s, they are all redundant for safety reasons.

    The Control Node is connected to the Interface Node by an optical fiber cable based on a standard ATM interface at 155 Mb/s.

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    Control Node

    2 - Hardware ModulesS

    hel

    f 01

    Sh

    elf

    00

    ATM

    SW

    ATM

    SW

    7 8O

    MU

    OM

    U

    1095 6

    SIM

    BS

    IM A

    15

    15

    MM

    SP

    riva

    te

    10M

    MS

    Sh

    ared

    9

    MM

    SP

    riva

    te

    5

    MM

    SS

    har

    ed

    6

    BSC e3 Control NodeDual Shelf 01 Shelf

    00

    Dual Shelf 01 Shelf 01

    TMU

    141

    TMU

    TMU

    TMU

    TMU

    TMU

    TMU

    TMU

    TMU

    TMU

    TMU

    TMU

    TMU

    TMU

    13 1411 123 41

    1311 123 4

    Fill

    er

    Fill

    er

    Fill

    er

    Fill

    er

    7 82

    2

    The OMU (Operation & Maintenance Unit) controls all the BSC e3 elements (both Control and Interface Nodes) and TCU e3 elements, is responsible for Operation, Administration and Maintenance (OA&M) of the BSS, deals with disk management, and ensures Ethernet access to the OMC-R and TML.

    The MMS (Mass Memory Storage) are the 4 storage disks (2 private disks for OMUs and 2 shared disks; one of these shared disk only is mandatory). If the private MMS is in default state, the whole BSC e3 is in Exposure state.

    The ATM SW is the ATM switch that provides the interconnexion between the OMU and the TMU modules. It also provides connectivity with the Interface Node through an OC-3c link.

    The TMU (Traffic Management Unit) is in charge of GSM traffic and signaling processing (LAPD and SS7).

    The SIM (Shelf Interface Module) is the power supply for both shelves and the alarm interface between the dual-shelf and the PCIU. It provides 48 V dc to the Control Node. For redundancy purposes, there are 2 SIMs per equipment: each SIM contributes to supply each shelf (at 50% level).

    Filler Boards are empty containers which occupy any unused slots to ensureEMC shielding.

    Duplication schemes:

    1 + 1 redundancy = 1 active element + 1 passive (or active) element.

    N + P redundancy = N active elements to provide the targeted performance. P means that P boards can be in default state, without loosing any established communication.

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    Control Node

    3 - The CN Slices

    The CN Slices: OMU MMS ATM-SW TMU

    Common Architecture inside each CN module

    Generic Module View

    1

    2 3

    A slice is the name given to a set of boards plugged into a slot on a shelf.

    The Control Node is composed of the following slices:

    OMU, MMS, TMU and ATM-SW

    Plus SIM and Fillers.

    The OMU, TMU and ATM -SW slices have a common hardware architecture and are divided into 3 parts:

    A Single Board Computer board (SBC) = Computer Board.

    A PCI Mezzanine Card (PMC) = Front Panel Board.

    A Transition Module board (TM) = Interface Adapter Board.

    To identify each part of the slice, suffixes have been added to the board names:

    xxx SBC Single Board Computer

    xxx TM Transition Module

    xxx PMC PCI Mezzanine Card

    Each module has two visual indicators on the top of the front panel, which indicate its status:

    A red LED with a triangular shape,

    A green LED with a rectangular shape.

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    Control Node

    4 - TM Functions

    MAIN FUNCTION: ATM ADAPTATION

    TMU

    VME & SC-Bus

    to

    ATM

    conversion

    OMUVME

    Interface with SBC

    + ATM 25

    Interface with ATM-SW.

    ATM-SWSBC

    Interface with CN

    backplane +

    OC-3c Optical

    Interface

    The TM (Transition Module) is mainly an ATM Adapter.

    All communication between modules on the ATM subsystem uses ATM Adaptation Layer (AAL) protocols.

    The TM is responsible for:

    Adapting the VME-64 Bus to ATM variable bit-rate:

    IP packets carrying internal BSC communications are translated over ATM using the AAL5 protocol.

    AAL5 is routed by the CPU to / from the SBC board via a VME bus.

    The TM carries traffic between each module inside the CN and the IN.

    Adapting the SC-Bus to the ATM constant bit-rate:

    LAPD & SS7 links carried on PCM TS (DS0) are translated over ATMusing the AAL1 protocol.

    AAL1 is routed to / from the PMC board via an SC-Bus.

    It carries messages between the BSC and MSC and OAM information for the entire BSS.

    Board Location: in the OMU, TMU and ATM -SW modules.

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    Control Node

    5 - Memory Mass Storage

    Mirrored Shared Disks

    Always available

    When OMU 1 active

    When OMU 2 active

    Private DiskFor OMU 2

    O.S.

    Private DiskFor OMU 1

    O.S.

    OMU 1

    Active OMU

    OMU 2

    Spare OMU

    Front

    Panel

    ViewSCSI-bus

    BSS

    BSS

    Removal Request Push

    Button

    Mirrored Shared Disks

    MMS MAIN FUNCTION: DATA STORAGE

    Ethernet Link

    The MMS (Memory Mass Storage) modules are SCSI 9 Gbytes Hard Disks in the Control Node.

    These 4 MMS are linked to the OMU modules through 4 SCSI-buses.

    They are split as follows:

    Two mirrored shared hard disks for both OMU modules. They contain the data that must be secured and still be accessible in the event of an OMU failure or a disk failure (BSS data).

    Two private disks (one for each OMU). These disks hold all the private data for the module (Operating System data).

    External Interfaces on the Front Panel:

    Two LEDs,

    One removal request push button

    Redundancy scheme: 1 + 1 operating simultaneously for the mirrored shared disks.

    Board Location: Dual Shelf 01, Shelf 00, slots 5 & 6 & 9 & 10.

    LED Status:

    Disk operational and UpdatedLit Unlit

    StatusGreen LEDRed LED

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    Control Node

    6 - OMU

    Front

    Panel

    View

    RJ45

    Unused

    Removal Request

    Push-button

    D-sub 9-pins For RS 232 debug

    OMU Module

    TML

    OMC-R

    OMU MAIN FUNCTION: MANAGEMENT OF ALL THE BSC RESOURCES

    Disk Management

    MMS

    Private

    OMU

    TM

    Board

    VME

    Board

    Ethernet Link

    SCSI Buses

    RS 232 Debug Bus

    ATM 25 link with

    ATM-SW

    Ethernet linkwith OMU

    BACKPLANE

    MTM Bus

    (Board Reset and LED commands)

    MMS

    Private

    2 MMS

    Shared

    For D

    uplica

    tion

    The OMU (Operation and Maintenance Unit) manages all the BSC resources.

    It does the following:

    Disk management (Private and Shared MMS; private disk duplication),

    Interface with the OMC-R or TML through an Ethernet access.

    System maintenance (by using the TML) and OAM of the BSS.

    External Interfaces on the Front Panel:

    Two LEDs,

    One RJ45 connector for one 10/100 base T Ethernet OMC-R + TML port,

    One 9-pin D-sub connector for the RS 232 debug port,

    One removal request push button (shut down and SWACT of the OMU)

    Redundancy scheme: 1 + 1 Hot Stand-by.

    Board Location: Dual Shelf 01, Shelf 01, slots 5+6 & 9+10.

    LED Status:

    ATM layers: OMU -TM board.

    Base Operating System: AIX Module active and Unlocked

    Lit Unlit

    StatusGreen LEDRed LED

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    Control Node

    7 - ATM SWitch

    Towards / FromATM-RM

    Interface Node

    OMU

    Active

    OMUOAM

    TMU

    TrafficMgt

    Front

    Panel

    View

    TX OC-3c Connector

    To RX on the IN

    RX OC-3c ConnectorFrom TX

    On the IN

    ATM-SW MAIN FUNCTION: BOARDS INTERCONNEXION

    OC-3 LinkATM 155 Mb/s

    ATM SWitch

    Utopia Bus

    AT

    M 1

    55 I

    nt.

    Op

    tica

    l In

    terf

    ace

    6 x ATM 25

    3x ATM 25 Interface

    ATM SW

    BACKPLANE

    The ATM SW (ATM Switch) provides a backplane board interconnection with live insertion capabilities.

    It provides:

    interconnection between the OMU and TMU modules,

    ATM switching, adaptation and interface on an OC-3 optical multimode fiber towards the Interface Node. The TX connector on the ATM-SW is linked to the ATM-RM RX connector; the RX connector on the ATM -SW is linked to the ATM-RM TX connector.

    External Interfaces on the Front Panel:

    Two LEDs,

    1 TX OC-3 (upper) + 1 RX OC-3 (lower) optical connectors

    Redundancy Scheme: 1+ 1 simultaneous work

    Board Location: Dual Shelf 01, Shelf 01, slot 7 & 8.

    LED Status:

    Base Operating System: Vx Works Module active and Unlocked

    Lit Unlit

    StatusGreen LEDRed LED

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    Control Node

    8 - TMU

    Front

    Panel

    View

    TMU Module

    ATM 25 link with

    ATM-SW

    VME

    BoardTMU

    TM

    Board

    SCSI Buses+ VME Buses

    VME link with OMU

    BACKPLANE

    The TMU (Traffic Management Unit) manages traffic. It is equivalent to a set of three boards in the 2G release (SICD + CCS7 + BIFP).

    It is in charge of:

    GSM & GPRS traffic management,

    GSM signaling processing (LAPD & SS7)

    GPRS signaling processing

    BTS OAM (software downloading, BTS configuration).

    External Interfaces on the Front Panel:

    Two LEDs

    Redundancy Scheme: N + P load sharing.

    Board Location: Dual Shelf 01, Shelves 00 & 01, slots 1 & 3 & 4 & 11 to 14.

    LED Status:

    Base Operating System: Vx Works

    ATM layers: TMU TM board.

    Note: Each TMU provides: 62 LAPD links + 2 SS7 links.

    Module active and UnlockedLit Unlit

    StatusGreen LEDRed LED

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    Control Node

    9 - Minimal Configuration for the CN

    1 OMU

    The corresponding Private MMS

    1 shared MMS

    1 ATM-SW (+ the corresponding ATM-RM in the IN)

    n TMUs (according to the traffic load)

    1 SIM

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    Interface NodeInterface Node

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    Interface Node

    1 - ArchitectureATM RM

    LSA RC

    PCM Interface

    LSA RC

    PCM Interface

    S links

    S links S links

    AterAbisTOWARDS

    TCU

    TOWARDS

    BTS

    Switching Unit

    CEM

    64 kbps

    8K RM

    8 kbps

    TOWARDS CN

    The Interface Node is based on the Nortel Networks SPECTRUM platform.

    The Interface Node provides:

    Network connectivity on the Abis & Ater interfaces.

    Communications with the Control Node.

    16 kbps or 8 kbps circuit switching for the bearer speech / data channels between the BTSs and the MSC via the TCU e3.

    It shares some major hardware modules with the Transcoding Node, such as the CEM and LSA-RC boards.

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    Interface Node

    2 - Board Layout

    SIM

    S

    IM

    15

    15

    Fill

    er

    Fill

    er

    Fill

    er

    Fill

    er

    1471

    11

    CE

    M

    CE

    M

    7 8

    8K-R

    M

    8K-R

    M

    109

    5 6

    AT

    M R

    M

    AT

    M R

    M

    BSC e3 Interface Node

    Dual Shelf 00 Shelf 00

    Dual Shelf 00 Shelf 01

    SH

    EL

    F 0

    0S

    HE

    LF

    01

    2 3 4

    LS

    A R

    C

    N1

    LS

    A R

    CN

    2

    108 9

    LS

    A R

    CN

    3

    1311 12

    4 5 6

    LS

    A R

    CN

    0

    LS

    A R

    CN

    5

    31 2 13 1412

    LS

    A R

    CN

    4

    Synchronization

    The Interface Node is the connectivity component of the BSC e3, after the SAI.

    It is responsible for:

    establishing all the connections between the BSC and the other entities of the network

    supervising the physical links.

    The Interface Node is divided into the following hardware modules:

    The CEM (Common Equipment Module), which controls the resource modules of the IN, provides system maintenance, clock synchronization and traffic switching.

    The ATM RM (ATM - Resource Module), which adapts Time Slots (DS0) based voice and data channels of S-links to ATM cells for transmission over a Synchronous Optical NETwork (SONET), OC-3c interface,

    The 8K RM (8K subrate matrix Resource Module), which adds subrate switching capability to the IN, as the CEM is only capable of switching at a TS (DS0) level (64 kbps).

    The LSA RC (Low Speed Access Resource Complex), which is the PCM interface module, used to interface the BSC to both the TCU and BTS, providing modularity (up to 21 E1 or 28 T1 links). Each LSA-RC block consists of 3 boards. They must be inserted in ordered steps.

    The SIM (Shelf Interface Module) is the power supply for both shelves and the alarm interface between the dual-shelf and the PCIU. It provides 48 V dc to the Interface Node. For redundancy purposes, there are 2 SIMs per equipment: each SIM contributes to supply each shelf (at 50% level).

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    Interface Node

    Alarmsprocessing

    Switching Unit

    ClockSynchronization

    OAMInterface

    TML

    Ethernetlink

    Front

    Panel

    View

    3 - CEM

    Unused

    RJ45

    ATM RM

    PCM Interface

    LSA RC

    3 S-links3 S-links

    SWITCHING

    CEM

    9 S-links

    CEM MAIN FUNCTION: MASTER BOARD FOR THE IN

    Caution: only rescue way of

    connection

    The CEM (Common Equipment Module) is the master board of the Interface Node.

    It provides the following features:

    64K Traffic Switching Matrix,

    OA&M interface,

    Control of the Resource Modules (8K RM, ATM -RM and LSA RC),

    Clock synchronization,

    Alarm processing,

    External Interfaces on the Front Panel:

    Two LEDs,

    RJ45 connector (Ethernet Link) for TML ( rescue connection only)

    4 unused connectors.

    Redundancy scheme: 1 + 1 Hot Stand-by

    Board Location: Dual Shelf 00, Shelf 00, slots 7 & 8

    LED Status:

    Module active and Unlocked

    LitUnlit

    StatusGreen LEDRed LED

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    Interface Node

    4 - 8K RM

    Front

    Panel

    View

    Unused

    Switching Unit

    CEM

    9 S-links

    8K-RM MAIN FUNCTION: SUB RATE SWITCHING

    SUB RATE

    SWITCHING

    8K RM

    The 8K RM (8K Resource Module) is also named SubRate Time Switch.

    Its role is to provide a subrate switching capability, as the CEM module only switches at the DS0 level (64 kbps). The 8K RM switching activity is controlled by the CEM Module.

    The 8K RM can switch at DS0 sublevels: 8 kbps and 16 kbps, and its total switching capacity is 2268 DS0 channels.

    It performs the following functions:

    Transmits and receives data to / from both CEM modules through 9 S-links,

    Provides 8 kbps time-switching.

    External Interfaces on the Front Panel:

    Two LEDs,

    4 unused connectors.

    Redundancy scheme: 1+ 1 Hot Stand-by.

    Board Location: Dual Shelf 00, Shelf 00, slots 9 & 10

    LED Status:

    Module active and UnlockedLitUnlit

    StatusGreen LEDRed LED

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    Interface Node

    ControlNode

    InterfaceNode

    ATM RM

    AAL1LAPD, SS7

    AAL5OAM, CallP

    RedundantOptical

    Connection

    OC-3c Link155 Mb/s

    5 - ATM RM

    ATM SW

    CEMCEM

    3 S-links(768 TS)

    3 S-links(768 TS)

    ATM-RM MAIN FUNCTION: ATM RESOURCES FOR IN APPLICATIONS

    Front

    Panel

    View

    TX OC-3c ConnectorTo RX on the CN

    RX OC-3c ConnectorFrom TX

    On the CN

    TX

    RX

    The ATM RM (ATM Resource Module) provides the centralized resources required to support the Interface Node applications.

    It performs:

    A SONET OC-3c physical interface, that allows direct connection to the ATM network located in the Control Node. Caution an optical attenuator must be inserted on the TX connector output.

    adaptation between the ATM cells of the Control Node (high bitrate: 155 Mbps) and the DS0 circuits of the Interface Node (low bitrate: 64 kbps):

    AAL1 adaptation for LAPD and SS7 channels

    AAL5 adaptation for OAM and Call Processing Signaling.

    External Interfaces on the Front Panel:

    Two LEDs

    1 TX OC-3 (upper) + 1 RX OC-3 (lower) optical connectors.

    Redundancy scheme: 1+ 1 (simultaneous work).

    Board Location: Dual Shelf 00, Shelf 01, slots 5 & 6.

    LED Status:

    Operating System: VRTX

    Module active and Unlocked

    Lit Unlit

    StatusGreen LEDRed LED

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    Interface Node

    6 - LSA-RC Module 1/3

    LSA RC MAIN FUNCTION: PCM INTERFACE MODULE

    Backplane

    To SAI

    IEM

    TIM

    IEM

    Active Passive

    From SAI

    LSA RC Module

    The LSA RC (Low Speed Access Resource Complex) is the PCM Interface module. All external communications run through this board.

    Each LSA RC can manage up to 21 E1 or 28 T1 PCM links.

    It provides the electrical interface for the signal on the PCM links.

    This module is common to the Interface Node and the Transcoding Node.

    In the IN, it is used to interface the BTS and the TCU.

    In the Transcoding Node, it is used to interface the MSC and the BSC.

    Each LSA block is a 3-slot slice made of:

    2 IEM boards (Interface Electronic Module), which are in charge of the PCMs.

    1 TIM board (Terminal Interface Module) which is a passive board that routes the PCM towards the active IEM board.

    Redundancy scheme:

    for IEM: 1 + 1 Hot Stand-by

    For TIM: no redundancy (only connecting and filtering functions).

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    Interface Node

    6 - LSA-RC Module 2/3

    Front Panel View for PCM

    T1 links

    Signal Failure Indication

    Red LED blinks

    Up and down Buttons

    2

    1

    3

    4

    5

    Signal Failure Indication

    Red LED blinks

    Up and down Buttons

    Front Panel View for PCM

    E1 links

    62-pin Sub D Connector

    to SAI

    62-pin Sub D Connectorfrom SAI

    External Interfaces on the Front Panel:

    IEM board.

    1) Two status LEDs

    2) One multiple Span Failure Red LED

    3) Signal Failure Indication head LEDs

    4) Visual Display unit for span number

    5) Up and Down arrow buttons.

    TIM board.

    Two LEDs

    1 TX Sub D 62-pin (upper) + 1 RX Sub D 62-pin (lower) connectors.

    Board Location:

    Dual Shelf 00, Shelf 00, slots 1 & 2 & 3 + slots 4 & 5 & 6 + slots 12 & 13 & 14.

    Dual Shelf 00, Shelf 01, slots 2 & 3 & 4 + slots 8 & 9 & 10 + slots 11 & 12 & 13.

    LED Status

    Module active and Unlocked

    LitUnlit

    StatusGreen LEDRed LED

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    Interface Node

    6 - LSA-RC Module 3/3

    LSA RC FAILURE INDICATORS

    * NO information is displayed when there is NO problem to report.

    * Only the highest severity signal failure is displayed on the front panel LEDs.

    FRONT PANELS DETAILS

    Front Panel View for PCM

    T1 links

    Front Panel View for PCM

    E1 links

    Signal Failure Indication

    Red Multiple Span Alarms

    Up and Down Buttons

    PCM Failure Indication

    The interactive portion of the faceplate consists of the following elements:

    Multiple span failure indication red LED:

    LED OFF: zero or one PCM failure

    LED BLINKS: two or more PCM failures.

    Signal failure indication LEDs (transparent text cover), same behavior for all the alarms: LED ON: when the fault is the highest ranking fault

    LED OFF: when the fault is no longer the highest ranking fault.

    LOS: Loss of Signal

    AIS: Alarm Indication Signal

    LFA (for E1): Loss of Frame Alignment = LOF (for T1): Loss Of signal Frame alignment

    RAI: Remote Alarm Indicator.

    PCM failure indicator:

    BLANK if IEM module not in service, and for the inactive IEM module.

    Text OK if there is NO provisioned PCM link failure.

    Text XX: problem with copper connection between the IEM and the SAI.

    Number from 1 to 21 for E1 links, and from 1 to 28 for T1 links.

    Increment / decrement control to show alarms for multiple failed spans: pressing the Up or Down arrow key will increment or decrement the information displayed to the next fault alarm.

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    Interface Node

    7 - Minimal Configuration for the IN

    1 ATM-RM (+ the corresponding ATM-SW in the CN)

    1 CEM

    1 8K RM

    n LSA-RC (= 1 TIM + 1 IEM, but always the LSA n0)

    1 SIM

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    TranscodingTranscoding NodeNode

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    Transcoding Node

    1 - Architecture

    LSA RC

    PCM Interfac

    e

    LSA RC

    PCM Interfac

    e

    AterInterface

    AInterfaceS linksS links

    S links

    CEM

    64 kbps

    TOWARDS MSC

    TOWARDS BSC

    TRMTRM

    TRMTRM

    1

    The Transcoding Node is based on the Nortel Networks SPECTRUM platform.

    Each TCU cabinet consists of 2 Transcoding Node shelves and 1 SAI (Cabling InterfaceUnit) providing front access to the PCM cabling.

    The Transcoding Node does the following:

    Provides network connectivity with the BSC e3 and the MSC.

    Converts LAPD channels into DS0 links.

    Transports SS7 signaling links via DS0 links.

    Allows communication between the Transcoding Node and the Control Node via LAPD channels over DS0 links and via the Interface Node.

    Manages GSM vocoding of the speech / data channels.

    Reduces of the number of PCM links required.

    N.B: The Transcoding Node shares some major hardware modules with the Interface Node, such as the CEM and the LSA-RC boards.

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    Transcoding Node

    2 - Boards Layout

    CE

    M

    CE

    M

    7 8F

    iller

    Fill

    er

    71

    SIM

    S

    IM

    15

    15

    2

    LS

    A R

    CN

    2

    108 93 4

    LS

    A R

    CN

    1

    LS

    A R

    CN

    3

    1311 12

    4 5 6

    LS

    A R

    CN

    0

    TR

    M

    14

    TR

    M

    6

    TR

    M

    TR

    M

    TR

    M

    11109

    TR

    M

    TR

    M

    TR

    M

    TR

    M

    141312TR

    M (

    op

    t)

    TRM

    (o

    pt)

    TR

    M

    5

    321

    Transcoding Node no. 01

    Dual Shelf 01 Shelf 00

    Dual Shelf 01 Shelf 01

    Transcoding Node no. 00

    Dual Shelf 00 Shelf 00

    Dual Shelf 00 Shelf 01

    Synchronization

    SH

    EL

    F 0

    0S

    HE

    LF

    01

    The main function of the TCU (TransCoder Unit) is to perform the main tasks related to communication, switching and transcoding.

    The following hardware modules are part of the Transcoding Node:

    The CEM (Common Equipment Module), which controls the BSC Interface Node Resource Modules, and provides system maintenance, clock synchronization, and traffic switching.

    The TRM (Transcoder Resource Module), which performs the GSM transcoding functions. Each shelf of the TCU can contain up to 12 TRMs (the boards located in the slots 1 and 2 are optional).

    The LSA RC (Low Speed Access Resource Complex), which is used to interface the TCU to both the MSC and BSC using PCM links (E1 or T1). Theymust be inserted in ordered steps.

    The SIM (Shelf Interface Module) is the power supply for both shelves and the alarm interface between the dual-shelf and the PCIU. It provides 48 V dc to the TCU. For redundancy purposes, there are 2 SIMs per equipment: each SIM contributes to supply each shelf (at 50% level).

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    Transcoding Node

    3 - TRM

    Front

    Panel

    ViewTRM MAIN FUNCTION: VOCODING OF SPEECH / DATA

    CHANNELS

    PPQUICC

    Mail Box

    PPU SPU

    SPU

    SPU

    SPU

    PPU SPU

    SPU

    SPU

    SPU

    PPU SPU

    SPU

    SPU

    SPU

    Mail Box

    PPU SPU

    SPU

    SPU

    SPU

    PPU SPU

    SPU

    SPU

    SPU

    PPU SPU

    SPU

    SPU

    SPU

    Mail Box

    PPU SPU

    SPU

    SPU

    SPU

    PPU SPU

    SPU

    SPU

    SPU

    PPU SPU

    SPU

    SPU

    SPU

    #3#2

    #1

    1 DSP Archipelago

    CEM

    3 S-links

    1 Island

    TRM Module

    The TRM (Transcoder Resource Module) performs the GSM vocoding of the speech / data channels. Up to 12 TRMs boards can be housed in one single TCU shelf.

    The TRM provides:

    Voice coding / decoding in Full Rate (FR), Enhanced Full Rate (EFR) and AMR.

    Physical Organization: 9 Islands (1 island = 1 PPU (Pre Processing Unit) + 4 SPU (Signal Processing Unit))

    3 Archipelagoes = TRM module (1 archipelago = 1 MLB (Mail Box ) + 3 Islands)

    1 TRM = 216 voice channels in normal mode 1 TRM = 180 voice channels in TTY (US specific)

    External Interfaces on the Front Panel:

    Two status LEDs . Redundancy scheme: N + P load sharing

    Board Location:

    For both Dual Shelf 00 & 01, Shelf 00, slots 1 to 3 + slots 9 to 14

    Shelf 01, slots 5 & 6 & 14

    LED Status:

    Module active and Unlocked

    LitUnlit

    StatusGreen LEDRed LED

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    Transcoding Node

    4 - Minimal Configuration for the TN

    1 CEM

    n TRM (according to the traffic load)

    n LSA-RC (= 1 TIM + 1 IEM, but always the LSA n0)

    1 SIM

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    The copyright of this document is the property of Nortel Networks. Without the written consent of Nortel Networks, given by contract or otherwise, this document must not be copied, reprinted or reproduced in any material form, either wholly or in part, and the contents of this document, or any methods or techniques available therefrom, must not be disclosed to any other person whatsoever.

    Section 4Section 4

    ThermicThermic, , EnergeticEnergetic andand CablingCabling AspectsAspects

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    Objectives

    After completion of this section, the students will be able to:

    Describe the power supply, alarms and cooling system

    Understand the role of the SAI

    Identify BSC e3/TCU e3 cabinet cables.

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    Contents

    Power Supply & Alarm Systems

    Cooling System

    BSC e3/TCU e3 Cabling

    Fuses

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    Power Supply & Alarms Systems

    1 - PCIU Module

    The Power Supply and the Alarm Systems of the BSC e3/TCU e3 are composed of:

    One PCIU (Power Cabling Interface Unit): provides central distribution and gathering of all power and alarm cabling used inside the BSC e3/TCU e3 frames.

    4 SIMs (Shelf Interface Module): used to transfer the -48 V dc and the alarms to and from each module via the PCIU.

    The PCIU is located in a frame power distribution tray and is mounted on the top of the BSC e3/TCU e3 frame. It contains the following modules:

    ALM (Alarm Module): monitors the SIM modules, the cooling units and the fuse failures, provides control for each LED on the fan units, reports alarms on each dualshelf, reports the PCIU fail function.

    2 FMU (Fan Management Unit): softstart used to limit capacitor inrush current, capacitor fault alarm, 48V / 60V at 30 A input capability, input transient protection alarm.

    When the frame summary indicator (amber lamp) located on the front cover is:

    OFF: there is no active alarm in the BSC e3 or TCU e3 frame,

    ON: there is an active alarm in the BSC e3 or TCU e3 frame.

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    Power Supply & Alarms Systems 2 - Shelf Interface Module

    Front

    Panel

    View

    Switch On / Off

    Alarm Indicators

    -48 V dc / alarms Connector

    To / from PCIU

    SIM MAIN FUNCTION: POWER SUPPLY

    SIM means Shelf Interface Module. It is the power supply of the BSC e3/TCU e3 frames. The input voltage is -48 V dc. It transmits also alarms notifications.

    The SIM boards are the dc power conditioner for each Dual-shelf.

    The SIM board manages the following functions:

    Current limiting during Startup

    Alarms

    Filtered 48 V dc and Power conditioning.

    External Interfaces on the Front Panel:

    Two status LEDs,

    One Switch On/Off,

    Amber LEDs Alarm Indicators,

    A 48 V dc/alarms connector (7 pins).

    Redundancy scheme: 1 + 1, simultaneous work.

    Board Location: Dual Shelf 00 & 01, Shelves 00 & 01, slot 15.

    LED Status:

    Module active and UnlockedLitUnlit

    StatusGreen LEDRed LED

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    Cooling System 1 - Location of the Cooling & Fan Units

    Upper grill

    assembly

    Lowergrill

    assembly

    The BSC e3/TCU e3 frames are cooled by two cooling units.

    A cooling unit dedicated to the upper dual-shelf and including:

    The upper grill assembly

    The upper air filter

    The upper fan units.

    A cooling unit dedicated to the lower dual-shelf and including:

    The lower grill assembly

    The lower air filter

    The lower fan units.

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    Cooling System

    2 - Cooling & Fan UnitsCOOLING UNIT FAN UNIT

    State of the LEDs located on the front panel of the Fan Unit:

    Note

    The Test Lamp button re-lights (during 20 seconds) all the LEDs which have turnedto sleep mode, to detect any eventual LED malfunction.

    YES---

    NOPress the lamp test: if both LEDs turn on, then

    YESIf both LEDs remain on after the end of the self-test, then

    NOPress the lamp test: if both LEDs turn on, then

    Faulty Module

    ActionRed LEDGreen LED

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    BSC e3/TCU e3 Cabling 1 - SAI Frame

    (*) the optional HUBs can be installed inside or outside the SAI.

    SAI BSC e3 Cabinet

    HARDWARE OVERVIEW

    The SAI (Service Area Interface) is a 30 cm-wide auxiliary frame attached at the left side of the BSC e3/TCU e3 frame. It enables front access to the PCM cabling.

    The SAI cabinet can host:

    in the TCU e3: up to 8 CTUs (Cable Termination Unit)

    In the BSC e3: up to 6 CTUs + 2 optional HUBs.

    The CTU module is a frame assembly which provides the physical interface (PCM E1/T1 links) between the TIM module of the LSA-RC and the other BSS products (copper concentration).

    It is split as follows:

    1 x CTB (Cable Transition Board) which is the backplane,

    7 x CTMx (Cable Transition Modules) that are either:

    CTMP, E1, twisted pair, Z=120 Ohms: processes 3 spans.

    CTMC, E1, coax, Z=75 Ohms: processes 3 spans.

    CTMD, T1, twisted pair, Z=100 Ohms: processes 4 spans.

    For local maintenance purposes, the TML can be plugged into a HUB of the BSC e3.

    Note

    The CTU provides the ability for each E1 or T1 PCM to be set in loopback mode, in order to help the diagnostic of PCM faults.

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    BSC e3/TCU e3 Cabling

    2 - BSC e3 Optical Fiber CablingZoom on optical Cabling

    Opt

    ical

    Mul

    timod

    e Fi

    bers

    ATM-SW

    Modules

    In the CN

    ATM-RM

    Modules

    In the IN

    TX

    RX

    RX

    TX

    This figure shows how to connect the OC-3c optical multi-mode fibers.

    They are used to connect the ATM backplane in the Control Node via the ATM -SW module to the S-links backplane in the Interface Node via the ATM-RM module.

    Notes

    The optical link goes from the TX (ATM -SW in the CN) to the RX (ATM-RM in the IN),

    The RX (ATM -SW in the CN) goes to the TX (ATM-RM in on the IN).

    An optical attenuator must be inserted on the optical fiber at the output of the ATM -SW module.

    Reference of the Optical Fiber: NTQE0607.

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    BSC e3/TCU e3 Cabling 3 - PCM Cabling between SAI and LSA-RC

    CTMXCTMXCTMXCTMXCTMXCTMXCTMX

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    pri

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    TM

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    -SW

    AT

    M-S

    W

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    UT

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    UT

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    SIM

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    Control node

    Cooling unit

    Air f ilter

    IEM

    TIM

    IEM

    IEM

    TIM IE

    MC

    EM

    CE

    M8K

    -RM

    8K-R

    MF

    ILL

    ER

    IEM

    TIM IEM

    SIM

    FIL

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    RIE

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    FIL

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    RIE

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    IEM

    TIM IE

    MF

    ILL

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    SIM

    Interface node

    Cooling unit

    Air f ilter

    PCIU

    CTMXCTMXCTMXCTMXCTMXCTMXCTMX

    CTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMX

    AT

    M-R

    MA

    TM

    -RM

    TIM IEM

    LSA-RC5

    LSA-RC0

    LSA-RC4

    LSA-RC1

    LSA-RC2

    LSA-RC3

    BSC e3

    5

    4

    3

    2

    1

    0

    1 3

    405

    2

    Upper NodeLower Node

    CTMXCTMXCTMXCTMXCTMXCTMXCTMX

    PCIU

    CTMXCTMXCTMXCTMXCTMXCTMXCTMX

    CTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMX

    CTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMX

    Transcoder node

    Cooling unit

    Air f ilter

    TR

    MT

    RM

    TR

    MIE

    MT

    IM IEM

    CE

    MC

    EM

    TR

    MT

    RM

    TR

    MT

    RM

    TR

    MT

    RM

    SIM

    LSA-RC0

    FIL

    LE

    RIE

    MT

    IM IEM

    FIL

    LE

    RIE

    M

    IEM

    TIM IE

    MT

    RM

    SIM

    TR

    MT

    RM

    TIM IEM

    LSA-RC1

    LSA-RC2

    LSA-RC3

    Transcoder node

    Cooling unit

    Air f ilter

    TR

    MT

    RM

    TR

    MIE

    MT

    IM IEM

    CE

    MC

    EM

    TR

    MT

    RM

    TR

    MT

    RM

    TR

    MT

    RM

    SIM

    LSA-RC0

    FIL

    LE

    RIE

    MT

    IM IEM

    FIL

    LE

    RIE

    M

    IEM

    TIM

    IEM

    TR

    MS

    IM

    TR

    MT

    RM

    TIM

    IEM

    LSA-RC1

    LSA-RC2

    LSA-RC3

    TCU e3

    5

    4

    3

    2

    1

    0

    6

    7

    1 2 3

    0

    1 2 3

    0

    Note: For both BSC e3 and TCU e3, all the cables linking the CTUs and the LSA-RCshave the same length (1.66 meter).

    BSC e3

    In the case of a BSC e3, the SAI includes a maximum of 6 CTUs which are numbered from the top to the bottom: 0, 1, 2, 3, 4, 5.

    Each CTU must be connected to the relevant LSA-RC as follows:

    CTU 0 < -- > LSA 1

    CTU 1 < -- > LSA 2

    CTU 2 < -- > LSA 3

    CTU 3 < -- > LSA 5

    CTU 4 < -- > LSA 0

    CTU 5 < -- > LSA 4.

    TCU e3

    In the case of a TCU e3, the SAI includes a maximum of 8 CTUs; the 4 upper CTUs are dedicated to the upper transcoder node dual-shelf, the 4 lower CTUs are dedicated to the lower transcoder node dual-shelf. They are numbered from the top to the bottom: 0, 1, 2, 3, 4, 5, 6, 7.

    Each CTU must be connected as follows:

    CTU 0 < -- > LSA 1-up CTU 4 < -- > LSA 1-down

    CTU 1 < -- > LSA 2-up CTU 5 < -- > LSA 2-down

    CTU 2 < -- > LSA 3-up CTU 6 < -- > LSA 3-down

    CTU 3 < -- > LSA 0-up CTU 7 < -- > LSA 0-down.

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    BSC e3/TCU e3 Cabling

    Tx

    Rx

    CTU

    Tx signals62-pin connector

    Rx signals62-pin connector

    M u l t i p l e

    Span

    Alarms

    IEMTIM

    M u l t i p l e

    Span

    Alarms

    IEM

    LSA-RC

    4 - PCM Cabling: connection LSA-RC/CTU

    Both cables are identical. Each of them is symmetrical (its two connectors are identical -62-pin connectors).

    Both cables have to be connected as follows:

    Tx signals: upper connector of the CTU with the upper connector of the front panel of the TIM module.

    Rx signals: lower connector of the CTU with the lower connector of the front panel of the TIM module.

    Note

    The Rx cable must be connected before the Tx cable.

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    BSC e3/TCU e3 Cabling

    CTMXCTMXCTMXCTMXCTMXCTMXCTMX

    TM

    UF

    ILL

    ER

    TM

    UT

    MU

    MM

    S p

    riva

    teM

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    sha

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    hare

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    TM

    UT

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    OM

    U

    Control Node

    Cooling unit

    Air filter

    IEM

    TIM

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    IEM

    TIM IEM

    CE

    MC

    EM

    8K-R

    M8K

    -RM

    FIL

    LE

    RIE

    MT

    IM IEM

    SIM

    FIL

    LE

    RIE

    MT

    IM IEM

    FIL

    LE

    RIE

    M

    IEM

    TIM IEM

    FIL

    LE

    RS

    IM

    Interface Node

    Cooling unit

    Air filter

    PCIU

    CTMXCTMXCTMXCTMXCTMXCTMXCTMX

    CTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMXCTMX

    AT

    M-R

    MA

    TM

    -RM

    TIM IEM

    LSA-RC5

    LSA-RC0

    LSA-RC4

    LSA-RC1

    LSA-RC2

    LSA-RC3

    BSC e3

    CTMx5CTMx4

    CTMx6

    CTMx1CTMx0

    CTMx2CTMx3

    CTU 4

    PCM

    5 - PCM Cabling: CTU connections

    The number of the CTM in the SAI depends on the number of the given LSA-RC in the shelf.

    The numbering of the CTM ports goes from the left to the right and from the bottom to the top: from 0 to 20 for E1 and from 0 to 27 for T1.

    Example:

    The PCM nb 0 from the LSA-RC nb 0 is linked to the CTU nb 0, CTM nb 0, port nb 0

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    BSC e3/TCU e3 Cabling

    6 - Optional Hub: Bay Stack 250

    A Hub is an active node which regenerates the Ethernet signal: it is the central switch in a twisted pair network.

    The equipment that is used is the BayStack 250 (Nortel Equipment).

    BayStack 250 Series

    The BayStack 250 is a standard stackable Ethernet Hub that contains:

    12 RJ45 ports for twisted pair 10/100 Base T conductors. It is possible to connect up to 5 Hubs together obtaining a 60-port logical Hub.

    One LED display: Each port has two LEDs to indicate its port status.

    One switch for connection to an Ethernet switch or another Hub.

    Notes

    Each port is a repeater.

    The ports can be active simultaneously.

    A slot is available for a management module. Two chained Hubs make a logical Hub.

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    BSC e3/TCU e3 Cabling 7 - BSC e3 and TCU e3 Alarms & - 48 V dc Cabling

    For the BSC e3.

    The figure shows how to connect the internal 48 V dc and alarm cables between:

    the PCIU

    and the four SIM modules located in the Control Node and the Interface Node.

    The internal 48 V dc and the alarm links are distributed:

    for the Control Node: from the SIM modules to the OMU modules and the other modules via the ATM backplane.

    for the Interface Node: from the SIM modules to the CEM modules and the other modules via the Slink backplane.

    For the TCU e3.

    The figure shows how to connect the internal 48 V dc and alarm cables between:

    the PCIU

    and the four SIM modules located on both Transcoder Nodes.

    The internal 48 V dc and the alarm cables are distributed on each Transcoder Node from the SIM modules to the CEM modules and each RM via the S-link backplane.

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    BSC e3/TCU e3 Cabling 8 - BSC e3 Alarm Cabling

    The bold lines show the alarm external way.

    The regular lines show

    the alarm internal ways on the back panel.

    Alarm links

    For the BSC e3 Frame.

    The figure shows the internal and external alarm links for the frame assembly of the BSC e3 cabinet.

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    BSC e3/TCU e3 Cabling 9 - TCU e3 Alarm Cabling

    The bold lines show the alarm external way.

    The regular lines show

    the alarm internal ways on the back panel.

    Alarm links

    For the TCU e3 Frame.

    The figure shows the internal and external alarm links for the frame assembly of the TCU e3 cabinet.

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    BSC e3/TCU e3 Fuses

    FOR THE POWER SUPPLY BOX

    1 main breaker (32 A) for the whole site

    4 breakers or fuses (32 A) per cabinet.

    FOR EACH BOARD

    1 fixed fuse

    Fuses

    The power supply box is equipped with:

    1 main breaker for the whole site

    and 4 breakers or fuses (32 A) for the cabinet.

    The general breaker/fuse value is the general value on the clients site, which depends on the on-site equipments.

    The following boards house a fixed fuse to protect each component:

    OMU,

    TMU,

    MMS,

    CEM,

    ATM-RM,

    8K-RM,

    IEM (from the LSA-RC),

    TRM.

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    The copyright of this document is the property of Nortel Networks. Without the written consent of Nortel Networks, given by contract or otherwise, this document must not be copied, reprinted or reproduced in any material form, either wholly or in part, and the contents of this document, or any methods or techniques available therefrom, must not be disclosed to any other person whatsoever.

    Section 5Section 5

    BSC e3 BSC e3 andand TCU e3 Hardware TCU e3 Hardware FeaturesFeatures andand ConfigurationsConfigurations

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    Objectives

    After completion of this section, the students will be able to:

    Describe the hardware features of the BSC e3 and TCU e3

    Know about BSC e3 and TCU e3 configuration.

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    Contents

    Hardware Features

    Configurations

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    Hardware Features

    Operating Temperature(long term)

    + 40 C

    + 5 C

    Maximum Relative humidity

    85%

    5%

    570 kgMaximum Weight

    Weight

    NB: dimensions are given in mm

    1 - Main Characteristics

    960

    600

    2200

    BSC e3

    Control Node

    Interface Node

    Service Area

    Interface

    2200

    TCU e3

    Transcoding Node

    Transcoding Node

    960

    600

    Transcoding Node

    Transcoding Node

    Service Area

    Interface

    The BSC e3 cabinet is a one-cabinet equipment made of 3 parts:

    2 main frames hosting the Control Node and the Interface Node

    a PCM cabling frame, called SAI (Service Area Interface).

    The TCU e3 cabinet is a one-cabinet equipment made of 3 parts:

    the 2 main frames hosting the Transcoding Nodes

    a PCM cabling frame, called SAI (Service Area Interface).

    The hardware design allows a complete front access to the equipment (SAI), including fans, power supplies, and PCM cabling.

    External cabling from below and above are supported.

    There are 2 cooling units in each cabinet. Each cooling unit consists of 4 replaceable fans and air filter, and a grill assembly.

    The BSC e3/TCU e3 is designed to operate in clean rooms. It must be anchored to the floor, not to the wall. The minimum floor resistance must be 1000 kg/m2.

    The cabinet complies with ETSI standards.

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    Hardware Features

    2 - Filler Module

    Front

    Panel

    View

    Filler Module MAIN FUNCTION: FILL IN THE UNUSED SLOTS

    The Filler Module is an empty module container which can be used inside all the Nodes of the BSC e3/TCU e3 which are not filled with any other module.

    It manages the following functions:

    To maintain Electro Magnetic Interference (EMI) integrity,

    To maintain shelf airflow patterns to ensure proper cooling.

    External Interfaces on the Front Panel: NA

    Board Location: the Filler Module can occupy any slot that does not house a module.

    Note

    Caution: If one or more slots remain empty on a powered shelf, then TCU e3 or BSC e3 frames may be damaged. These fillers ensure:

    A good equipment cooling

    A proper EMI shielding.

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    BSC e3 and TCU e3 Configurations

    1 - Min and Max Configurations

    BSC e3 and TCU e3 dimensioning

    Erlang

    TRX

    BTS

    Cells

    LAPD links

    E1 / T1 PCM (BSC e3)

    E1 / T1 PCM (TCU e3)

    A interface circuits (TCU e3)

    A interface circuits (BSC e3)

    SS7 links

    Max

    3000

    1000

    500

    600

    600

    126 / 168

    84 / 112

    1944

    3112

    16

    Min

    600

    360

    120

    360

    120

    42 / 56

    21 / 28

    200

    620

    3

    This table gives the minimum and maximum possible configurations for the BSC e3 and TCU e3 cabinets.

    BSC e3 configuration:

    The minimum is a 600 Erlang BSC e3 with 3 TMU modules (2+1 for redundancy) and 2 LSAs (42 E1 or 56 T1 PCMs).

    The maximum is a 3000 Erlang BSC e3 with 14 TMU modules (12+2 for redundancy) and 6 LSAs (126 E1 or 168 T1 PCMs). In this case, the BSC e3 requires 2 TCU e3 cabinets .

    TCU e3 configuration:

    The minimum is a 200 Erlang TCU e3 (in the case of EFR) with 2 TRM modules (1+1 for redundancy), 1 LSA (21 E1 or 28 T1 PCMs).

    The maximum is a 1800 Erlang TCU e3 with 10 TRM modules (9+1 for redundancy) and 4 LSAs (84 E1 or 112 T1 PCMs) in each TCU e3 shelf.

    Notes

    Between these minimum and maximum configurations, different configurations can be offered. Nevertheless, in the TCU e3 cabinets, the number of TRMs and LSAs is directly linked to the A Interface capacity.

    Moreover, some product engineering rules have been defined to avoid inconsistency between the number of TMUs and the number of LSAs.

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    BSC e3 and TCU e3 Configurations

    Typical Configurations

    BSC e3 600 E 1500 E 2400 E 3000 ETMU 2+1 5+1 8+2 10+2LSA 2 3 5 6

    Nb of LAPD 120 300 480 600Nb of E1 42 63 105 126Nb of T1

    56 84 140 168

    TCU e3 600 E 1200 E 1800 ETRM 3+1 6+1 9+1LSA 2 3 4

    200 E1+11

    42 63 84Nb of E1 21

    56 84 112Nb of T1 28

    X (active) + X (redundant) = Total Number of Boards

    2 - BSC e3 & TCU e3 Typical Configurations

    Nortel Networks has defined some market model configurations (rural, semi-urban, urban), and optional extension kits (comprised of TMU, TRM & LSA) in order to help the operators select the appropriate number of modules.

    A rural type of configuration with

    a relatively low number of TMUs (low traffic capacity)

    a maximum number of LSAs (because many small BTSs used for coverage need to be connected).

    An urban type of configuration with

    a high number of TMUs (high traffic capacity)

    a relatively low number of LSAs (because BTSs have many TRXs per cell, and there are relatively few BTSs to be connected to the BSC).

    Note: The BSC can have a maximum of 14 TMU modules (12+2) for very tough traffic profiles.

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    BSC e3 and TCU e3 Configurations

    3 - BSC e3 Configuration Examples

    BSS Configuration

    Nb of BTSsBSC capacity (Erl)Nb of TRXsTMULSAAbis E1 / T1

    Ater E1 / T1

    Agprs E1 / T1

    S111

    2001300600

    66

    115 / 150

    11 / 18

    10 / 14

    S222

    1253000750126

    100 / 126

    26 / 42

    7 / 10